CN107968077A - A kind of flip chip packaging structure and technique and camera module encapsulating structure - Google Patents
A kind of flip chip packaging structure and technique and camera module encapsulating structure Download PDFInfo
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- CN107968077A CN107968077A CN201711224417.6A CN201711224417A CN107968077A CN 107968077 A CN107968077 A CN 107968077A CN 201711224417 A CN201711224417 A CN 201711224417A CN 107968077 A CN107968077 A CN 107968077A
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- substrate
- mounting groove
- circuit board
- flexible circuit
- sensor
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 70
- 238000000034 method Methods 0.000 title claims abstract description 19
- 239000000758 substrate Substances 0.000 claims abstract description 99
- 239000004033 plastic Substances 0.000 claims abstract description 44
- 239000000919 ceramic Substances 0.000 claims abstract description 10
- 230000003287 optical effect Effects 0.000 claims description 13
- 238000007731 hot pressing Methods 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 8
- 238000002347 injection Methods 0.000 claims description 5
- 239000007924 injection Substances 0.000 claims description 5
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 238000009434 installation Methods 0.000 abstract description 12
- 238000010586 diagram Methods 0.000 description 14
- 238000005538 encapsulation Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 238000012536 packaging technology Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Solid State Image Pick-Up Elements (AREA)
Abstract
The invention discloses a kind of flip chip packaging structure and technique and camera module encapsulating structure, wherein, flip chip packaging structure includes substrate, sensor, flexible circuit board and plastic packaging layer, wherein, substrate back offers mounting groove, sensor is arranged in mounting groove, the complete or partial empty avoiding installation trough of flexible circuit board is arranged at substrate back, sensor and flexible circuit board are electrically connected with substrate, plastic packaging layer plastic packaging parcel mounting groove, sensor and the part of flexible circuit board and substrate connection；Above-mentioned encapsulating structure; the complete or partial empty avoiding mounting groove of flexible circuit board; gap between flexible circuit board and mounting groove is molded into mounting groove forms plastic packaging layer; effective support and protection are formed to the junction of sensor and flexible circuit board and substrate with plastic packaging layer, the reliability of encapsulating structure is improved, reduces installation difficulty; therefore substrate is no longer limited to ceramic substrate; so as to reduce encapsulating structure cost, shorten delivery cycle, enterprise economic benefit.
Description
Technical field
The present invention relates to chip encapsulation technology field, more particularly to a kind of flip chip packaging structure and technique and shooting mould
Group encapsulating structure.
Background technology
Flip-chip (Flip-Chip) encapsulation technology has many obvious excellent compared with traditional lead key closing process
Point, including superior electricity and thermal property, high I/O number of pins, package dimension reduce etc., be widely used at present LED,
The fields such as mobile phone manufacture.
By taking the camera module in mobile phone as an example, in the prior art, using the camera module of Flip-chip techniques, it is typically
Sensor, i.e. photo-sensitive cell is mounted on below ceramic substrate, is then bonded below ceramic substrate by ACF hot pressing modes soft
Property wiring board (FPC), since FPC is more soft, it is impossible to sensor back provide effectively support, module back is easily by external force
Influence causes sensor degradation；Since ACF viscosity is weaker, so being compared using the anti-pull power of FPC that ACF hot pressing modes are bonded
It is weak, cause module to be pullled by external force, module is easily damaged during installation, the module that Flip-chip techniques make
Reliability is good without conventional Rigid Flex module；And to provide good attachment reliability, Flip-chip techniques are general
Using ceramic substrate, but since the whole world only has a small number of several companies to make ceramic substrate, and often make a ceramic base
Plate needs the die cost of both expensive, and very long delivery cycle, so that cause the production cycle of camera module to extend, into
Originally it is substantially increased, is unfavorable for the economic benefit of enterprise.
Therefore, how to improve the encapsulation technology of flip-chip, effective support and protection can be provided for sensor,
With good reliability, cost is reduced, becomes those skilled in the art's important technological problems urgently to be resolved hurrily.
The content of the invention
In view of this, first purpose of the invention is to provide a kind of flip chip packaging structure, to be carried for sensor
For effective support and protection, there is good reliability, reduce cost, second object of the present invention is to provide a kind of base
In the Flip-Chip Using technique and camera module encapsulating structure of above-mentioned flip chip packaging structure.
To achieve the above object, the present invention provides following technical solution：
A kind of flip chip packaging structure, including substrate, sensor, flexible circuit board and plastic packaging layer, the substrate back of the body
Face offers mounting groove, and the sensor is arranged in the mounting groove, described in the complete or partial empty avoiding of flexible circuit board
Installation trough is arranged at the substrate back, and the sensor and the flexible circuit board are electrically connected with the substrate, described
Plastic packaging layer plastic packaging wraps up the part of mounting groove, the sensor and the flexible circuit board and the substrate connection.
Preferably, the substrate is ceramic substrate or resin substrate.
Preferably, the plastic packaging layer is made of epoxy resin.
Preferably, the plastic packaging layer includes the filling part full of the mounting groove and is consistent with the substrate back shape
Supporting part.
A kind of Flip-Chip Using technique, including step：
The substrate that one back offers mounting groove is provided；
Sensor is mounted in the mounting groove, and seals the sensor；
In the substrate back hot pressing flexible circuit board, and make installation described in the complete or partial empty avoiding of the flexible circuit board
Groove；
It is molded at the substrate back, injection bottom material is full of the mounting groove, and wraps up the sensor and described
The part of flexible circuit board and the substrate connection.
A kind of camera module encapsulating structure, including substrate, photo-sensitive cell, flexible circuit board and plastic packaging layer, the substrate
The back side offers mounting groove, and the photo-sensitive cell is arranged in the mounting groove, the complete or partial empty avoiding of flexible circuit board
The installation trough is arranged at the substrate back, and the photo-sensitive cell and the flexible circuit board are electrically connected with the substrate
Connect, the plastic packaging layer plastic packaging wraps up mounting groove, the photo-sensitive cell and the flexible circuit board and the substrate connection
Part.
Preferably, stent and the optical filter being arranged on the stent, the optical filter and the stent shape are further included
The substrate front side is buckled in into cover body cover and forms seal cavity, and the substrate front side offers the hollow out connected with the mounting groove
Hole, the optical filter are opposite with the photo-sensitive cell by the hollow hole.
Preferably, the lens assembly being arranged on the stent is further included.
To realize above-mentioned first purpose, flip chip packaging structure provided by the invention, including it is substrate, sensor, soft
Property wiring board and plastic packaging layer, wherein, substrate back offers mounting groove, and sensor is arranged in mounting groove, flexible circuit board
Complete or partial empty avoiding installation trough is arranged at substrate back, and sensor and flexible circuit board are electrically connected with substrate, plastic packaging layer
Plastic packaging parcel mounting groove, sensor and the part of flexible circuit board and substrate connection；It is soft in above-mentioned flip chip packaging structure
Property the complete or partial empty avoiding mounting groove of wiring board, i.e., do not providing support as sensor using soft flexible circuit board, but soft
Gap between property wiring board and mounting groove is molded into mounting groove forms plastic packaging layer, using plastic packaging layer tight sensor with
And the junction of flexible circuit board and substrate, effective support is formed to the junction of sensor and flexible circuit board and substrate
And protection, avoid during installation, flexible circuit board is damaged with sensor, improves the reliability of encapsulating structure, reduces installation
Difficulty；Due to plastic packaging layer being bundled together sensor and substrates into intimate, the reliability of attachment can be significantly increased, because
On the premise of ensureing that performance is constant, the selectable range of substrate is also significantly increased, and is no longer limited to ceramic substrate for this, so as to
The cost of encapsulating structure is enough reduced, shortens delivery cycle, the economic benefit of enterprise.
To realize above-mentioned second purpose, present invention also offers a kind of Flip-Chip Using technique and camera module to seal
Assembling structure, the Flip-Chip Using technique are used to manufacture flip chip packaging structure as described above, camera module encapsulating structure
It is the encapsulating structure of a kind of specific sensor of proposition, due to the Flip-Chip Using based on flip chip packaging structure
Structure has above-mentioned technique effect, and therefore, Flip-Chip Using technique and camera module encapsulating structure should also have accordingly
Technique effect.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is attached drawing needed in technology description to be briefly described, it should be apparent that, drawings in the following description are only this
Some embodiments of invention, for those of ordinary skill in the art, without creative efforts, can be with
Other attached drawings are obtained according to these attached drawings.
Fig. 1 is the structure diagram of substrate provided in an embodiment of the present invention；
Fig. 2 is the A-A views in Fig. 1；
Fig. 3 is that substrate provided in an embodiment of the present invention mounts the structure diagram after sensor；
Fig. 4 is the B-B views in Fig. 1；
Fig. 5 is the structure diagram after substrate hot pressing flexible circuit board provided in an embodiment of the present invention：
Fig. 6 is the structure diagram after flip chip packaging structure plastic packaging provided in an embodiment of the present invention；
Fig. 7 is that camera module encapsulating structure provided in an embodiment of the present invention carries the structure diagram after optical filter；
Fig. 8 is the structure diagram after camera module encapsulating structure plastic packaging provided in an embodiment of the present invention；
Fig. 9 is that camera module encapsulating structure provided in an embodiment of the present invention carries the structure diagram after camera lens.
In figure：
1 is substrate；1a is mounting groove；1b is hollow hole；2 be sensor；2 ' be photo-sensitive cell；3 be flexible circuit board；4
For plastic packaging layer；5 be stent；6 be optical filter；7 be lens assembly.
Embodiment
First purpose of the present invention is to provide a kind of flip chip packaging structure, the knot of the flip chip packaging structure
Structure design can provide for sensor effectively to be supported and protects, and is had good reliability, is reduced cost, and of the invention second
A purpose is to provide a kind of Flip-Chip Using technique and camera module encapsulation based on above-mentioned flip chip packaging structure
Structure.
Below in conjunction with the attached drawing in the embodiment of the present invention, the technical solution in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other without making creative work
Embodiment, belongs to the scope of protection of the invention.
- Fig. 6 is please referred to Fig.1, Fig. 1 is the structure diagram of substrate provided in an embodiment of the present invention, and Fig. 2 is the A-A in Fig. 1
View, Fig. 3 are that substrate provided in an embodiment of the present invention mounts the structure diagram after sensor, and Fig. 4 is the B-B views in Fig. 1,
Fig. 5 is the structure diagram after substrate hot pressing flexible circuit board provided in an embodiment of the present invention, and Fig. 6 provides for the embodiment of the present invention
Flip chip packaging structure plastic packaging after structure diagram.
A kind of flip chip packaging structure provided in an embodiment of the present invention, including substrate 1, sensor 2, flexible circuit board 3
And plastic packaging layer 4.
Wherein, 1 back side of substrate offers mounting groove 1a, and sensor 2 is arranged in mounting groove 1a, and flexible circuit board 3 is complete
Or part empty avoiding mounting groove 1a be arranged at 1 back side of substrate, sensor 2 and flexible circuit board 3 are electrically connected with substrate 1, plastic packaging
The part that layer 4 plastic packagings parcel mounting groove 1a, sensor 2 and flexible circuit board 3 are connected with substrate 1.
Compared with prior art, flip chip packaging structure provided by the invention, 3 complete or partial empty avoiding of flexible circuit board
Mounting groove 1a, i.e., be not the offer support of sensor 2 with soft flexible circuit board 3, but flexible circuit board 3 and mounting groove 1a
Between gap be molded into mounting groove 1a and form plastic packaging layer 4, utilize 4 tight sensor 2 of plastic packaging layer and soft circuit
The junction of plate 3 and substrate 1, forms effective support to the junction of sensor 2 and flexible circuit board 3 and substrate 1 and protects
Shield, avoids during installation, and flexible circuit board 3 is impaired with sensor 2, improves the reliability of encapsulating structure, and it is difficult to reduce installation
Degree；Since sensor 2 and substrate 1 can be closely bundled together by plastic packaging layer 4, the reliability of attachment can be significantly increased,
Therefore on the premise of ensureing that performance is constant, the selectable range of substrate 1 is also significantly increased, and is no longer limited to ceramic substrate 1, from
And the cost of encapsulating structure can be reduced, shorten delivery cycle, the economic benefit of enterprise.
As noted previously, as the bond strength of sensor 2 and substrate 1 greatly improved in plastic packaging layer 4, therefore, substrate 1 is no longer
It is limited to ceramic material, in embodiments of the present invention, can be packaged using resin substrate 1, or the substrate 1 of other materials carries out
Encapsulation, so as to effectively reduce production cost, shortens delivery cycle.
Further, in embodiments of the present invention, plastic packaging layer 4 is made of epoxy resin, in encapsulation process, by molten
The liquid epoxy material of state is filled into 1 surface of substrate, it is flowed into from the gap of flexible circuit board 3 and mounting groove 1a and pacifies
Tankage 1a, certainly, material is not limited only to epoxy resin used in injection, can also be other resin materials that can be heated,
Do not limit herein.
Further, in embodiments of the present invention, install for ease of flip chip packaging structure, make its appearance looks elegant, and
More uniform support is provided for sensor 2, in embodiments of the present invention, plastic packaging layer 4 includes the filling part full of mounting groove 1a
And the supporting part being consistent with 1 back shape of substrate.
Based on above-mentioned flip chip packaging structure, the present invention provides a kind of camera module encapsulating structure, it is mainly used for hand
The encapsulation of camera module on machine, including substrate 1, photo-sensitive cell 2 ', flexible circuit board 3 and plastic packaging layer 4,1 back side of substrate open up
There is mounting groove 1a, photo-sensitive cell 2 ' is arranged in mounting groove 1a, is set the complete or partial empty avoiding mounting groove 1a of flexible circuit board 3
In 1 back side of substrate, photo-sensitive cell 2 ' and flexible circuit board 3 are electrically connected with substrate 1,4 plastic packaging of plastic packaging layer parcel mounting groove 1a, sense
The part that optical element 2 ' and flexible circuit board 3 are connected with substrate 1.
Further optimize above-mentioned technical proposal, refer to Fig. 7 and Fig. 8, Fig. 7 is camera module provided in an embodiment of the present invention
Encapsulating structure carries the structure diagram after optical filter, and Fig. 8 is camera module encapsulating structure plastic packaging provided in an embodiment of the present invention
Structure diagram afterwards, the optical filter 6 that above-mentioned camera module encapsulating structure further includes stent 5 and is arranged on stent 5, filters
Piece 6 forms cover body cover with stent 5 and is buckled in the front of substrate 1 formation seal cavity, to protect the photosurface of photo-sensitive cell 2 ', substrate 1
Front offers the hollow hole 1b connected with mounting groove 1a for exposing the photosurface of photo-sensitive cell 2 ', for ease of photo-sensitive cell
2 ' installation, the bore of hollow hole 1b is less than the bore of mounting groove 1a, so as to form step surface, photosensitive member in mounting groove 1a bottoms
Part 2 ' is installed on the step surface, and optical filter 6 is opposite by hollow hole 1b and photo-sensitive cell 2 '.
Further, referring to Fig. 9, Fig. 9 for camera module encapsulating structure provided in an embodiment of the present invention carry camera lens after
Structure diagram, above-mentioned camera module encapsulating structure further includes the lens assembly 7 being arranged on stent 5.
Based on above-mentioned flip chip packaging structure, present invention also offers a kind of Flip-Chip Using technique, including step：
S101：The substrate 1 that one back offers mounting groove 1a is provided；
S102：Sensor 2, and seal sensor 2 are mounted in mounting groove 1a；
S103：In 1 back hot pressing flexible circuit board 3 of substrate, and make the complete or partial empty avoiding mounting groove of flexible circuit board 3
1a；
S104：It is molded at 1 back of substrate, injection bottom material is full of mounting groove 1a, and wrap up sensor 2 and soft circuit
The part that plate 3 is connected with substrate 1.
Certain above-mentioned steps are only a kind of basic packaging technology, when being packaged to different types of sensor 2,
Above-mentioned steps according to the characteristics of packaged sensor 2 and can require to carry out appropriate adjustment, be encapsulated with above-mentioned camera module
Exemplified by structure.
Camera module packaging technology includes step：
S201：One back is provided and offers mounting groove 1a, front is offered with the mounting groove 1a hollow hole 1b's connected
Substrate 1；
S202：Photo-sensitive cell 2 ' is mounted in mounting groove 1a, and seals photo-sensitive cell 2 '；
S203：The sense of hollow hole 1b and photo-sensitive cell 2 ' is buckled in the positive mounting bracket 5 of substrate 1 and optical filter 6, cover
On smooth surface, as shown in Figure 7；
S204：In 1 back hot pressing flexible circuit board 3 of substrate, and make the complete or partial empty avoiding mounting groove of flexible circuit board 3
1a；
S205：It is molded at 1 back of substrate, injection bottom material is full of mounting groove 1a, and wrap up sensor 2 and soft circuit
The part that plate 3 is connected with substrate 1, as shown in Figure 8；
S206：Lens assembly 7 is installed on stent 5, as shown in Figure 9.
Each embodiment is described by the way of progressive in this specification, what each embodiment stressed be and other
The difference of embodiment, between each embodiment identical similar portion mutually referring to.
The foregoing description of the disclosed embodiments, enables professional and technical personnel in the field to realize or use the present invention.
A variety of modifications to these embodiments will be apparent for those skilled in the art, as defined herein
General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, it is of the invention
The embodiments shown herein is not intended to be limited to, and is to fit to and the principles and novel features disclosed herein phase one
The most wide scope caused.
Claims (8)
1. a kind of flip chip packaging structure, it is characterised in that including substrate, sensor, flexible circuit board and plastic packaging layer, institute
State substrate back and offer mounting groove, the sensor is arranged in the mounting groove, and the flexible circuit board is complete or partial
Trough is installed described in empty avoiding and is arranged at the substrate back, the sensor and the flexible circuit board are electrically connected with the substrate
Connect, the plastic packaging layer plastic packaging wraps up mounting groove, the sensor and the flexible circuit board and the substrate connection
Part.
2. flip chip packaging structure according to claim 1, it is characterised in that the substrate is ceramic substrate or resin
Substrate.
3. flip chip packaging structure according to claim 1 or 2, it is characterised in that the plastic packaging layer is by epoxy resin
It is made.
4. flip chip packaging structure according to claim 1 or 2, it is characterised in that the plastic packaging layer includes being full of institute
The supporting part stated the filling part of mounting groove and be consistent with the substrate back shape.
5. a kind of Flip-Chip Using technique, it is characterised in that including step：
The substrate that one back offers mounting groove is provided；
Sensor is mounted in the mounting groove, and seals the sensor；
In the substrate back hot pressing flexible circuit board, and make mounting groove described in the complete or partial empty avoiding of the flexible circuit board；
It is molded at the substrate back, injection bottom material is full of the mounting groove, and wraps up the sensor and described soft
Wiring board and the part of the substrate connection.
A kind of 6. camera module encapsulating structure, it is characterised in that including substrate, photo-sensitive cell, flexible circuit board and plastic packaging layer,
The substrate back offers mounting groove, and the photo-sensitive cell is arranged in the mounting groove, the flexible circuit board completely or
Trough is installed described in the empty avoiding of part and is arranged at the substrate back, the photo-sensitive cell and the flexible circuit board with the base
Plate is electrically connected, and the plastic packaging layer plastic packaging wraps up mounting groove, the photo-sensitive cell and the flexible circuit board and the base
The part of plate connection.
7. camera module encapsulating structure according to claim 6, it is characterised in that further include stent and be arranged at described
Optical filter on stent, the optical filter form cover body cover with the stent and are buckled in the substrate front side formation seal cavity, institute
State substrate front side and offer the hollow hole connected with the mounting groove, the optical filter passes through the hollow hole and the photosensitive member
Part is opposite.
8. camera module encapsulating structure according to claim 7, it is characterised in that further include and be arranged on the stent
Lens assembly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711224417.6A CN107968077A (en) | 2017-11-29 | 2017-11-29 | A kind of flip chip packaging structure and technique and camera module encapsulating structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711224417.6A CN107968077A (en) | 2017-11-29 | 2017-11-29 | A kind of flip chip packaging structure and technique and camera module encapsulating structure |
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| Publication Number | Publication Date |
|---|---|
| CN107968077A true CN107968077A (en) | 2018-04-27 |
Family
ID=61998135
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711224417.6A Pending CN107968077A (en) | 2017-11-29 | 2017-11-29 | A kind of flip chip packaging structure and technique and camera module encapsulating structure |
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| CN (1) | CN107968077A (en) |
Cited By (5)
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| CN108922855A (en) * | 2018-07-12 | 2018-11-30 | 信利光电股份有限公司 | The production method and camera module base of chip-scale micro-plastic seal camera module base |
| CN110839124A (en) * | 2018-08-16 | 2020-02-25 | 三赢科技（深圳）有限公司 | Lens module and assembling method thereof |
| WO2020103744A1 (en) * | 2018-11-20 | 2020-05-28 | 苏州晶方半导体科技股份有限公司 | Chip packaging structure and method |
| CN111371970A (en) * | 2018-12-26 | 2020-07-03 | 中芯集成电路（宁波）有限公司 | Packaging method of camera shooting assembly |
| CN111646783A (en) * | 2020-06-12 | 2020-09-11 | 南昌欧菲晶润科技有限公司 | Composite ceramic substrate, camera module and preparation method of composite ceramic substrate |
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Application publication date: 20180427 |