JPH025553A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPH025553A
JPH025553A JP15658288A JP15658288A JPH025553A JP H025553 A JPH025553 A JP H025553A JP 15658288 A JP15658288 A JP 15658288A JP 15658288 A JP15658288 A JP 15658288A JP H025553 A JPH025553 A JP H025553A
Authority
JP
Japan
Prior art keywords
substrate
formed
frame
light transmissive
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15658288A
Inventor
Hiroyuki Kitasako
Original Assignee
Fujitsu Ltd
Kyushu Fujitsu Electron:Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd, Kyushu Fujitsu Electron:Kk filed Critical Fujitsu Ltd
Priority to JP15658288A priority Critical patent/JPH025553A/en
Publication of JPH025553A publication Critical patent/JPH025553A/en
Application status is Pending legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73251Location after the connecting process on different surfaces
    • H01L2224/73265Layer and wire connectors

Abstract

PURPOSE: To prevent an ultraviolet transmissive resin from leaking out and a connection failure of a bonding wire from occurring at a heat cycle test by a method wherein a lid section is bonded to a substrate covering a semiconductor chip to form a cavity, a lead is connected to a conductor wiring formed on the rear of the substrate, and the surface of the lid section and the substrate other than a light transmissive window section is covered with a molding resin.
CONSTITUTION: A substrate 3 is placed on an inner lead 6a of a lead frame so as to make the rear region of its copper foil 3a confront the inner lead 6a of the load frame, the rear region of the copper foil 3a is connected with the inner lead 6a of the lead frame using silver paste or the like, which is solidified by heating. Lastly, a metal frame 1 formed of 42 alloy or cobalt, which seals up a light transmissive window formed of borosilicate glass or alumina sintered substance, is fixed to the peripheral part of the substrate 3 through a bonding agent 8, and a cavity 7 surrounded with the substrate 3, the light transmissive window 2, and the metal frame 1 is formed, which is mold-formed with a molding resin 9 of plastic material such as epoxy resin.
COPYRIGHT: (C)1990,JPO&Japio
JP15658288A 1988-06-24 1988-06-24 Semiconductor device Pending JPH025553A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15658288A JPH025553A (en) 1988-06-24 1988-06-24 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15658288A JPH025553A (en) 1988-06-24 1988-06-24 Semiconductor device

Publications (1)

Publication Number Publication Date
JPH025553A true JPH025553A (en) 1990-01-10

Family

ID=15630913

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15658288A Pending JPH025553A (en) 1988-06-24 1988-06-24 Semiconductor device

Country Status (1)

Country Link
JP (1) JPH025553A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009506553A (en) * 2005-08-31 2009-02-12 マイクロン テクノロジー, インク. Microelectronic device packages, stacked microelectronic device packages, and methods of manufacturing a microelectronic device
US8030748B2 (en) 2005-08-26 2011-10-04 Micron Technology, Inc. Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices
US9640458B2 (en) 2005-08-19 2017-05-02 Micron Technology, Inc. Stacked microelectronic devices

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9640458B2 (en) 2005-08-19 2017-05-02 Micron Technology, Inc. Stacked microelectronic devices
US10153254B2 (en) 2005-08-26 2018-12-11 Micron Technology, Inc. Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices
US8030748B2 (en) 2005-08-26 2011-10-04 Micron Technology, Inc. Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices
US8519523B2 (en) 2005-08-26 2013-08-27 Micron Technology, Inc. Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices
US9299684B2 (en) 2005-08-26 2016-03-29 Micron Technology, Inc. Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices
US9583476B2 (en) 2005-08-26 2017-02-28 Micron Technology, Inc. Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices
JP2009506553A (en) * 2005-08-31 2009-02-12 マイクロン テクノロジー, インク. Microelectronic device packages, stacked microelectronic device packages, and methods of manufacturing a microelectronic device

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