CN101359636A - Encapsulation construction of electronic component and encapsulation method thereof - Google Patents
Encapsulation construction of electronic component and encapsulation method thereof Download PDFInfo
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- CN101359636A CN101359636A CN 200710138205 CN200710138205A CN101359636A CN 101359636 A CN101359636 A CN 101359636A CN 200710138205 CN200710138205 CN 200710138205 CN 200710138205 A CN200710138205 A CN 200710138205A CN 101359636 A CN101359636 A CN 101359636A
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- support plate
- chip
- housing
- sealing
- routing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
- H01L2224/45124—Aluminium (Al) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Abstract
The invention relates to an enclosure for an electric element and an encapsulating method thereof. An outer frame surrounding a chip is arranged on a carrier plate to limit the flow and distribution range of fluid sealant, and the thicknesses of the areas covered by the fluid sealant are equalized, thus avoiding that the pull to the enclosure after the fluid sealant in the areas is solidified is uneven and thereby preventing the enclosure from deforming due to uneven pull and improving the reliability of the enclosure.
Description
Technical field
The present invention relates to a kind of encapsulating structure and its method for packing of electronic component, particularly relevant for encapsulating structure and its method for packing made with chip directly placed technology (Chip On Board is called for short COB).
Background technology
Electronic product on the market is most of for reducing packaging cost now, all adopts chip directly placed technology (Chip On Board is called for short COB) to encapsulate, and reduces the expenditure of packaging cost to reduce required potted element.Generally speaking, the direct mounting technology of current chip is applicable to machine product, and the product that has shell to coat.
With reference to Fig. 1, be present general chip directly placed encapsulating structure, it comprises black glue 110, chip 120, aluminum steel 130, anoxic glue 140, printed circuit board (PCB) 150.In this encapsulating structure, chip 120 sticks together by anoxic glue 140 and is fixed on the printed circuit board (PCB) 150, covers chip 120 and printed circuit board (PCB) 150 and electrically connect chip 120 with aluminum steel 130 with printed circuit board (PCB) 150 and with black glue 110.
This chip directly placed COB method for packing uses anoxic glue 140 that chip 120 is attached on the printed circuit board (PCB) 150 earlier, makes 140 sclerosis of anoxic glue through high-temperature baking again, and chip 120 is fixed on the PCB150.Then, use wire bonder, chip routing contact 121 is attached on the printed circuit board (PCB) routing contact 151 with aluminum steel 130.After routing finishes, after the more black glue 110 of chip 120 usefulness (COB glue is called for short black glue) directly being covered, pass through long high-temperature baking again, and black glue 110 is hardened and finish this chip directly placed encapsulation.
Yet this a chip directly placed encapsulating structure and a method, when encapsulation, after covering black glue 110, tend to cause the inhomogeneous of the black glue thickness in each zone and black glue amount because of black glue skewness,, can be rectangle because of chip, and the sealing scope be semicircle for example with Plane Angle (depression angle), the glue amount of both sides (being the long limit of chip) is less up and down, and the glue amount of the right and left (being the minor face of chip) is more; And with angle (side-looking angle) highly, central authorities are thick and thin all around, these two factors, after black glue sclerosis, can produce because of black glue skewness cause after the black glue sclerosis in each zone the pulling force inequality of encapsulating structure, cause the printed circuit board (PCB) bent plate, further can cause this element with surface mount technology (surface mount technology, be called for short SMT) purchase in the process of dress, can cause the empty weldering of element because of the printed circuit board (PCB) bent plate.
In addition, this element is when the reliability experiment test of high low temperature, when chip and colloid expand with heat and contract with cold according to its physical characteristic, it can distribute unequal because of the black glue amount of element integral body, cause the black glue in each zone to expand inequality with the amount of dwindling, easily cause the element crooked radian excessive, and make chip slight crack occur or routing comes off, and cause element fault.
Moreover the amount of the black glue of envelope need be bigger than 50% of package area, and this dress envelope can be because of top and periphery, the skewness of black glue and need to use the black glue of more amount to cover identical package area.As shown in Figure 1, because the black glue that the element top covers is half arc, therefore, when carrying out surface mount (SMT), board is difficult for accurate grasping element, and causes problems such as element material casting, displacement, short circuit easily.
Secondly, finish the back concerning the angle that element is impressed with encapsulation, also because of black glue sclerosis back forms half arc, but not a plane, no matter cause is to impress with printing ink or laser, all be difficult for printing know attractive in appearance.Problems such as if with the angle of memory modules, this encapsulating structure is because of presenting half arc, but not a plane causes fin to be difficult for installation, or less with the fin contact area, and it is bad to cause dispelling the heat.In addition, this encapsulating structure is with respect to present existing encapsulation, and to present half arc also poor on the overall appearance of finished product because of it.Therefore, need badly and will a kind ofly can overcome the problems referred to above, and have preferable overall appearance and the chip directly placed encapsulating structure and the method for packing that hang down packaging cost.
Summary of the invention
Goal of the invention of the present invention is to overcome the deficiencies in the prior art and defective, also the problem of i.e. desire solution is in chip directly placed encapsulating structure and method, inhomogeneous because of each regional sealing thickness and black glue amount in the encapsulating structure, the sclerosis pulling force inequality that causes, cause that the empty weldering of printed circuit board (PCB) bent plate, element, chip occur that slight crack, routing come off, element material casting, displacement, short circuit, fin is difficult for installing or cause dispelling the heat bad etc. with the fin contact area is too small, solves the problem that existing encapsulating structure and method for packing can produce.
According to above-mentioned purpose, the invention provides a kind of technological means that solves problem, the encapsulating structure that the invention provides an electronic component can make the encapsulating structure of sealing homogenizing to address the above problem.This encapsulating structure comprises support plate, that a chip, with at least one chip routing contact has the corresponding chip routing of part support plate routing contact contact and is arranged at adhesion layer, an electrical support plate routing contact and the lead that is connected chip routing contact, the housing of inner edge encirclement entire chip and the sealing of a coating chip and support plate part surface between this chip and this support plate.In this encapsulating structure, chip sticks together by adhesion layer and is fixed on the support plate, housing is arranged on the support plate, and the inner edge of housing can surround entire chip, but outer rim is no more than support plate and protrudes in support plate, the present invention utilizes this housing that surrounds chip to limit flowing and distribution of sealing, and the thickness of each sealing overlay area of homogenizing is avoided in each regional sealing sclerosis back the pulling force inequality of encapsulating structure.
In addition, the present invention also provides the method for packing of an electronic component, as another technological means that addresses the above problem and reach the object of the invention.This method for packing comprises: at first, one support plate that is provided with several support plate routing contacts is provided, then, joint one has the chip and the support plate of the chip routing contact of at least one corresponding support plate routing contact, again routing joint chip routing contact with corresponding to the support plate routing contact of chip routing contact, then, fix a housing on support plate and surround entire chip with the inner edge of housing, at last, fill the part surface of a sealant covers chip and support plate.This method for packing utilization is provided with a housing earlier and surrounds chip on support plate and with the housing inner edge before filling sealing, and makes can limit flowing and distribution of sealing when filling sealing, and then the thickness and the pulling force of each sealing overlay area of homogenizing.
Therefore, the effect that the present invention in contrast to prior art is, the invention provides the encapsulating structure and the method for packing of an electronic component, utilize the mobile and distribution that the restriction sealing is set of a housing, and then the thickness and the pulling force of each sealing overlay area of homogenizing, make the support plate can the Yin Lali inequality and bent plate or distortion cause chip rupture or routing to come off, and then increase its reliability, the also not empty weldering of generating device when surface mount processing procedure (SMT).In addition, because flowing and distribution of this housing restriction sealing, sealing sclerosis back is formed according to the block structure that has than flat top surface, but not be half arc as prior art, be not difficult for accurate grasping element so do not have board, cause the element material casting easily, displacement, problems such as short circuit, also not having impresses be difficult for clear attractive in appearance, fin is difficult for installing, or with the too small problem such as bad that causes dispelling the heat of fin contact area, and because add housing, so the amount that can limit sealing within the specific limits, so the sealing amount is obviously reduced, reduce the cost of encapsulation.
Description of drawings
Fig. 1 is the vertical view and the fragmentary cross-sectional view of existing encapsulating structure;
Fig. 2 is the vertical view and the fragmentary cross-sectional view of a preferred embodiment of encapsulating structure of the present invention;
Fig. 3 A is the profile of the encapsulating structure of Fig. 2;
Fig. 3 B is the profile of other preferred embodiment of encapsulating structure of the present invention;
Fig. 4 A to Fig. 4 C is a preferred embodiment of method for packing of the present invention, and it is respectively the profile of the encapsulating structure of this each step of method for packing;
Fig. 5 A to Fig. 5 C is an in addition preferred embodiment of method for packing of the present invention, its be respectively this each step of method for packing encapsulating structure profile.
Symbol description among the figure
10 sealings
20 chips
21 chip routing contacts
30 leads
40 adhesion layers
50,50 ' support plate
51 support plate routing contacts
52 support plate element pins
53 engaging mechanisms
60,60 ' housing
61 fixed mechanisms
110 black glue
120 chips
121 chip routing contacts
130 aluminum steels
140 anoxic glue
150 printed circuit board (PCB)s
151 printed circuit board (PCB) routing contacts
152 printed circuit board component pins
Embodiment
Some embodiments of the present invention are described in detail as follows.Yet except this was described in detail, the present invention can also be widely implements at other embodiment.That is scope of the present invention is not subjected to the restriction of the embodiment that proposed, and the scope of the claims that propose with the present invention is as the criterion.Secondly, when each element in the embodiments of the invention icon or structure during with single element or structrual description explanation, should be with this as the cognition that qualification is arranged, promptly following explanation not during the restriction on the lay special stress on number spirit of the present invention and range of application can spread on a plurality of elements or structure and structure of depositing and the method.Moreover in this manual, the different piece of each element is not drawn according to size fully, and some yardstick is compared with other scale dependent or had and exaggerated or simplify, to provide clearer description to promote the understanding of the present invention.And the prior art that the present invention continued to use is only done quoting of emphasis formula at this, to help elaboration of the present invention.
With reference to shown in Figure 2, it is a preferred embodiment of encapsulating structure of the present invention, and this encapsulating structure comprises a chip 20, a support plate 50, an adhesion layer 40, at least one lead 30, a housing 60 and a sealing 10.Chip 20 is provided with at least one chip routing contact 21, the circuit that it can expose for a connection pad, a weld pad or, and support plate 50 is provided with several support plate routing contacts 51, wherein corresponding with the chip routing contact 21 on the chip 20 to small part support plate routing contact 51, it can be a connection pad, a weld pad, a golden finger (gold finger) or a circuit that exposes.Support plate 50 is the substrate that a printed circuit board (PCB) or is manufactured with circuit or patterned circuit and support plate routing contact 51, and this support plate 50 can be provided with several in order to electrically connect the element pin 52 of external circuitry or other element.
In encapsulating structure shown in Figure 2, adhesion layer 40 is arranged between chip 20 and the support plate 50, in order to being sticked together, chip 20 is fixed on the support plate 50, and lead 30 electrically connects the support plate routing contact 51 of chip routing contacts 21 and corresponding chip routing contact 21, as the online medium between chip 20 and this support plate 50.Moreover, housing 60 is arranged on the support plate 50, form a ccontaining chip 20 and can supply to fill the space of sealing 10 with support plate 50, the inner edge of housing 60 can surround chip 20, but do not cover and seal chip 20, even the inner edge of housing 60 can adapt to different package requirements and surround lead 30 and support plate routing contact 51, the surface that its outer rim does not then exceed or protrude support plate 50 horizontal directions less than support plate 50.Yet in other embodiments of the invention, housing can adapt to different package requirements and equal the surface that the support plate size does not exceed or protrude the support plate horizontal direction.
Secondly, sealing 10 is filled in the accommodation space of housing 60 and support plate 50 formation, coat entire chip 20 and support plate 50 surfaces partly, even coated wire 30 and support plate routing contact 51, this sealing is behind the accommodation space that pours into or be packed into housing 60 and support plate 50 formation, because of sealing 10 still is fluid state or liquid condition at this moment, and by housing 10 limit its flow or distribution in this accommodation space, can cause sealing 10 to be poured into and form a horizontal plane in the container as liquid, and in the accommodation space that housing 60 and support plate 50 form, form a horizontal plane, make that the sealing that each zone covered is all contour.Therefore, after the sealing sclerosis, its top surface can form a smooth plane, and can not form half arc as the sealing of the encapsulating structure (as Fig. 1) of prior art, and each zone the sealing that covered is all contour has identical thickness, and then the thickness and the pulling force of each sealing overlay area of homogenizing make the support plate can the Yin Lali inequality and bent plate or distortion, cause chip rupture or routing to come off, and then increase its reliability.
In encapsulating structure of the present invention, adhesion layer 40 can engage and fixing material it with support plate for an anoxic glue, resin bed, epoxy resin (epoxy), elargol or its can stick together chip.30 in lead is a metal wire, and this metal wire can have the metal wire of satisfactory electrical conductivity for gold thread, aluminum steel or other.Sealing 10 is COB glue or black glue, can be used in when encapsulation adhesive material in order to the protection packaging structure for other.
With reference to Fig. 3 A, be the profile of a preferred embodiment of encapsulating structure of the present invention, it is the profile of Fig. 2.In this embodiment, housing 60 of the present invention can directly be arranged on the support plate 50, the present invention does not limit the shape and the material of this housing 60, but can take different shapes and material according to the demand of encapsulation, it can stick together the material (not shown) and housing 60 sticked together and be fixed on the support plate 50 by one, and do not need other mechanism or structure to carry out the setting of housing 60, even, housing can be formed in one with support plate in other embodiments of the invention, is the part of support plate itself.
With reference to Fig. 3 B, it is the profile of another preferred embodiment of encapsulating structure of the present invention, the encapsulating structure that the encapsulating structure that it is showed and Fig. 3 A are showed is roughly the same, different places be that the housing 60 of the encapsulating structure that Fig. 3 A is showed is directly to be arranged at support plate 50, do not need other mechanism or structure to carry out the setting of housing 60, and in the encapsulating structure that Fig. 3 B is showed, housing 60 ' combines with support plate 50 ', is to reach by at least two fixed mechanisms 61 and at least two engaging mechanisms 53.In the encapsulating structure that Fig. 3 B is showed, be provided with at least two fixed mechanisms 61 in housing 60 ' bottom, then be provided with the engaging mechanism 53 of at least two fixed mechanisms 61 on the corresponding housing 60 ' at support plate 50 ', engage with engaging mechanism 53 on the support plate 50 ' by the fixed mechanism on the housing 60 ' 61, and housing 60 ' firmly is fixed on the support plate 50 '.
In the present embodiment, shown in Fig. 3 B, fixed mechanism 61 on the housing 60 ' is a location trip or a fastening screw, engaging mechanism 53 on the support plate 50 ' then is a location hole or a fastening screw hole 53 corresponding to location trip on the housing 60 ' or fastening screw 61, housing 60 ' inserts support plates 50 ' corresponding location hole or fastening screw hole 53 by locating trip or fastening screw 61, and housing 60 ' is fixed on the support plate 50 '.Yet, the present invention does not limit fixed mechanism 61 1 and is decided to be locator card tenon or fastening screw, do not limit engaging mechanism 53 yet and be location hole or fastening screw hole, in other embodiments of the invention, fixed mechanism on the housing can be certain hole, position or fastening screw hole, and the engaging mechanism on the support plate then is the location hole on the corresponding housing or the location trip or the fastening screw in fastening screw hole.
In addition, in another embodiment of the present invention, the fixed mechanism on the housing is to be housing itself, and the engaging mechanism on the support plate then is the anchor clamps or the slot of a corresponding housing, by the clamp clamps housing on the support plate, or outer frame bottom inserted in the slot and fixedly housing on support plate.
The present invention also provides a kind of method for packing, is a preferred embodiment of method for packing of the present invention with reference to Fig. 4 A to Fig. 4 C, and it is all showed with profile, the production method of the encapsulating structure that the content of its displaying is showed for Fig. 3 A.This method for packing, at first, with reference to Fig. 4 A, one support plate 50 and a chip 20 that is provided with several support plate routing contacts 51 is provided, and joint chip 20 and support plate 50, and chip 20 is fixed on the support plate 50, and chip 20 is provided with the chip routing contact 21 that corresponds to small part support plate routing contact 51, then, with the chip routing contact 21 on the lead 30 routing joint chips 20, with on the support plate 50 corresponding to the support plate routing contact 51 of chip routing contact 21, and electrically connect chip 20 and support plate 50.
Then, with reference to Fig. 4 B, fix a housing 60 on support plate 50, form a ccontaining chip 20 and can supply to fill the space of sealing 10 with support plate 50, the inner edge of housing 60 can surround chip 20, but do not cover sealing chip 20, even the inner edge of housing 60 can adapt to different package requirements and surround lead 30 and support plate routing contact 51, its outer rim then is less than or equal to support plate 50 and the surface that do not exceed or protrude support plate 50 horizontal directions.Housing 60 can directly be arranged on the support plate 50, the present invention does not limit the shape and the material of this housing 60, but can take different shapes and material according to the demand of encapsulation, it can stick together the material (not shown) and housing 60 sticked together and be fixed on the support plate 50 by one, and does not need other mechanism or structure to carry out the setting of housing 60.
At last,, fill a sealing 10 in the accommodation space that housing 60 and support plate 50 form, coat entire chip 20 and support plate 50 surfaces partly with reference to Fig. 4 C, even coated wire 30 and support plate routing contact 51.Pour into or be packed into the accommodation space of housing 60 and support plate 50 formation in sealing just after, because of sealing 10 still is fluid state or liquid condition, and housing 60 limit its flow or distribution in this accommodation space, can cause sealing 10 to be poured into and form a horizontal plane in the container as liquid, and in the accommodation space that housing 60 and support plate 50 form, form a horizontal plane, make that the sealing that each zone covered is all contour.Therefore, wait sealing sclerosis after, each zone the sealing that covered is all contour has identical thickness, and its top surface can form a smooth plane, but not half arc, and then the thickness and the pulling force of each sealing overlay area of homogenizing.
In addition, in the embodiment that Fig. 4 A to Fig. 4 C is showed, engaging between chip 20 and the support plate 50 is by an adhesion layer 40 is arranged between chip 20 and the support plate 50, is fixed on the support plate 50 and chip 20 sticked together.Adhesion layer 40 can be an adhesion material that does not need high-temperature baking, for example resin bed, epoxy resin (epoxy) or elargol etc. can be directly in order to stick together fixing adhesion material, or one need high-temperature baking and the adhesion material of fixed chip 20 on support plate 50, for example need high-temperature bakings such as anoxic glue or the thermosetting resin adhesion material that just can solidify.Therefore, when adhesion layer 40 is the adhesion material that need high-temperature bakings such as anoxic glue or thermosetting resin just can solidify, adhesion materials such as anoxic glue or thermosetting resin for example, at adhesion chip 20 after on the support plate 50, need to its carry out high-temperature baking with curing fixed chip 20 on support plate 50.
Moreover, filling a sealing 10 in the accommodation space that housing 60 and support plate 50 form, coat in the step on entire chip 20 and support plate 50 surfaces partly, sealing 10 can be filled up the accommodation space that housing 60 and support plate 50 form, and trim with the top of housing, or sealing 10 do not fill up the accommodation space that housing 60 and support plate 50 form, and coats support plate 50 surfaces of entire chip 20, lead and part, and the height of sealing is lower than the height of housing 60 and does not trim with housing 60.After filling a sealing, can look the adhesive material that it adopts, if sealing material COB glue, black glue or other thermosetting material then need be carried out high-temperature baking step usefulness so that sealing is solidified, if sealing then need be carried out about 8 hours high-temperature baking for black glue.Secondly, though with above-mentioned method for packing can obtain a sealing top be a flat surfaces and non-be the encapsulating structure of half arc, but, can after fill sealing 10 and sealing 10 curing, carry out one and grind processing procedure in order to make sealing have a more smooth top surface.
With reference to Fig. 5 A to Fig. 5 C, it is another preferred embodiment of method for packing of the present invention, and it is all represented with profile, the production method of the encapsulating structure that the content of its displaying is showed for Fig. 3 B.The method for packing that Fig. 5 A to Fig. 5 C is showed is different from the method for packing part that Fig. 4 A to Fig. 4 C showed and is, the support plate 50 ' that method for packing provided that Fig. 5 A to Fig. 5 C is showed is except having several support plate routing contacts 51, wherein at least partly support plate routing contact 51 corresponding to the chip routing contact 21 on the chip 20, also have at least two coupling devices 53, and housing 60 ' has at least two fixtures 61, and housing 60 ' is to go up with fixture on the housing 60 ' 61 and support plate 50 ' to combine with fixture 61 corresponding engagement devices 53 with 50 ' juncture, housing 60 ' is fixed on the support plate 50 ' firmly, and other step is roughly identical with the method for packing that Fig. 4 A to Fig. 4 C is showed.At first, with reference to Fig. 5 A, one support plate 50 ' and a chip 20 that is provided with several support plate routing contacts 51 and at least two coupling devices 53 is provided, and joint chip 20 and support plate 50, chip 20 is fixed on the support plate 50, and chip 20 is provided with the chip routing contact 21 that corresponds to small part support plate routing contact 51, then, with on the chip routing contact on the lead 30 routing joint chips 20 21 and the support plate 50 corresponding to the support plate routing contact 51 of chip routing contact 21.
Then, with reference to Fig. 5 B, go up and fixture 61 corresponding engagement devices 53 in conjunction with fixture on the housing 60 ' 61 and support plate 50 ', and be fixed in housing 60 ' on the support plate 50 ' firmly, form a ccontaining chip 20 and can supply to fill the space of sealing 10 with support plate 50 ', the inner edge of housing 60 ' can surround chip 20, but do not cover and seal chip 20, even the inner edge of housing 60 ' can adapt to different package requirements and surround lead 30 and support plate routing contact 51, and its outer rim then is less than or equal to support plate support plate 50 ' and the surface that do not exceed or protrude support plate support plate 50 ' horizontal direction.Housing 60 ' can directly be arranged on the support plate support plate 50 ', the present invention does not limit the shape and the material of this housing 60 ', but can take different shapes and material according to the demand of encapsulation, it can stick together the material (not shown) and housing 60 ' sticked together and be fixed on the support plate support plate 50 ' by one, and does not need other mechanism or structure to carry out the setting of housing 60 '.
At last,, fill a sealing 10 in the accommodation space that housing 60 ' and support plate 50 ' form, coat entire chip 20 and support plate 50 ' surface partly with reference to Fig. 5 C, even coated wire 30 and support plate routing contact 51.Pour into or be packed into the accommodation space of housing 60 ' and support plate 50 ' formation in sealing just after, because of sealing 10 still is fluid state or liquid condition, and housing 60 ' limit its flow or distribution in this accommodation space, can cause sealing 10 to be poured into and form a horizontal plane in the container as liquid, and in the accommodation space that housing 60 ' and support plate 50 ' form, form a horizontal plane, make that the sealing that each zone covered is all contour.Therefore, wait sealing sclerosis after, each zone the sealing that covered is all contour has identical thickness, and its top surface can form a smooth plane, but not half arc, and then the thickness and the pulling force of each sealing overlay area of homogenizing.
In addition, the method for packing of being showed with Fig. 4 A to Fig. 4 C is identical, in the method for packing that Fig. 5 A to Fig. 5 C is showed, engaging between chip 20 and the support plate 50 ', by with an adhesion material that does not need high-temperature baking, for example resin bed, epoxy resin (epoxy) or elargol etc. can be directly in order to stick together fixing adhesion material, or one need high-temperature baking and the adhesion material of fixed chip 20 on support plate 50 as adhesion layer 40, be arranged between chip 20 and the support plate 50 ', be fixed on the support plate 50 ' and chip 20 sticked together.
In this embodiment, the method for packing of being showed with Fig. 4 A to Fig. 4 C is identical, fill a sealing 10 in the accommodation space that housing 60 ' and support plate 50 ' form, sealing 10 can be filled up the accommodation space of housing 60 ' and support plate 50 ' formation, trim with the top of housing 60 ', or sealing 10 do not fill up the accommodation space that housing 60 ' and support plate 50 ' form, and the height of sealing 10 is lower than the height of housing 60 ' and does not trim with housing 60 '.After filling a sealing, can look the adhesive material that it adopts, if sealing material COB glue, black glue or other thermosetting material then need be carried out high-temperature baking step usefulness so that sealing is solidified, if sealing then need be carried out about 8 hours high-temperature baking for black glue.Secondly, though with above-mentioned method for packing can obtain a sealing top be a flat surfaces and non-be the encapsulating structure of half arc, but, can after fill sealing 10 and sealing 10 curing, carry out one and grind processing procedure in order to make sealing have a more smooth top surface.
In addition, in the method for packing that method for packing that Fig. 5 A to Fig. 5 C is showed and Fig. 4 A to Fig. 4 C are showed, support plate routing contact 51 is corresponding with the chip routing contact 21 on the chip 20, and it can be a connection pad, a weld pad, a golden finger (gold finger) or a circuit that exposes.Support plate 50 is the substrate that a printed circuit board (PCB) or is manufactured with circuit or patterned circuit and support plate routing contact 51, and this support plate 50 can be provided with several in order to electrically connect the element pin 52 of external circuitry or other element.
From the above, the method for packing of electronic component of the present invention and encapsulating structure can make sealing in the process of solidifying by housing, obtain preferable profile.Thus, not only the outward appearance to element is more attractive in appearance, and being marked with of surface mount processing procedure (SMT) and element, provides the user better application.And the present invention and by housing restriction sealing flowing and distributing in sclerosis, make chip all around the glue amount in four directions equate and element above smooth, comparatively average at the hardening process pulling force of sealing, and produce less support plate bent plate, and it is average in black glue amount all around, expand with heat and contract with cold evenly, so deformed element is less, relatively on reliability, improve a lot, because of adding housing,, obviously reduce so deceive the glue amount so the amount that can limit black glue within the specific limits.
Claims (13)
1. an encapsulating structure is characterized in that, comprises:
One chip, this chip are provided with at least one chip routing contact;
One support plate, this support plate are provided with several support plate routing contacts, and wherein this support plate routing contact correspondence of part is arranged at this chip routing contact on this chip;
One adhesion layer, this adhesion layer are arranged between this chip and this support plate, fix this chip on this support plate in order to stick together;
One lead, this lead in order to electrically connect this chip routing contact with corresponding to this support plate routing contact of this chip routing contact, and as the online medium between this chip and this support plate;
One housing, this housing is arranged on this support plate, and its inner rim can surround entire chip, and outer rim is no more than this support plate; And
One sealing, it coats the part surface of this chip and this support plate, and wherein this housing is in order to limiting this sealing distributed areas, and this sealing thickness of homogenizing is to avoid causing this support plate bending because of the sealing skewness causes to this support plate pulling force is uneven.
2. encapsulating structure as claimed in claim 1, wherein, this housing has at least two fixed mechanisms, and this support plate more comprises at least two engaging mechanisms to this fixed mechanism on should housing, in order to engage with this fixed mechanism and to fix this housing in this support plate.
3. encapsulating structure as claimed in claim 2, wherein, this fixed mechanism is a location trip or a location latch, and this engaging mechanism is a location hole or a location pin hole.
4. encapsulating structure as claimed in claim 1, wherein, this support plate is a printed circuit board (PCB) or the substrate that is manufactured with circuit on it.
5. encapsulating structure as claimed in claim 1, wherein, this adhesion layer is an anoxic glue.
6. encapsulating structure as claimed in claim 1, wherein, this lead is aluminum steel or gold thread.
7. encapsulating structure as claimed in claim 1, wherein, this sealing is COB glue or black glue.
8. a method for packing is characterized in that, comprises:
One support plate is provided, and this support plate is provided with several support plate routing contacts;
Engage a chip and this support plate, this chip is provided with the chip routing contact of at least one corresponding support plate routing contact;
Routing engage this chip routing contact with corresponding to the support plate routing contact of this chip routing contact;
Fix a housing on this support plate, the inner edge of this housing surrounds entire chip, and outer rim is no more than this support plate; And
Fill a sealing to coat the part surface of this chip and this support plate, limit this sealing distributed areas, and this sealing thickness of homogenizing is to avoid because of the sealing skewness causes this support plate pulling force inequality being caused this support plate bending by this housing.
9. method for packing as claimed in claim 8, wherein, this engages a chip and this support plate step, more comprise be provided with an adhesion layer between this chip and this support plate so that this chip be attached on this support plate.
10. method for packing as claimed in claim 8, wherein, this engages a chip and this support plate step, more comprises this adhesion layer of high-temperature baking, makes its curing and fixes this chip on this support plate.
11. method for packing as claimed in claim 8, wherein, this support plate has at least two engaging mechanisms, and this housing has at least two fixed mechanisms corresponding to this engaging mechanism, and this housing is fixed on this support plate with combining of engaging mechanism by this fixed mechanism.
12. method for packing as claimed in claim 11, wherein, this fixed mechanism is a location trip or a location latch, and this engaging mechanism is a location hole or a location pin hole.
13. method for packing as claimed in claim 8 wherein, more comprises one and grinds the top surface of this sealing, so that the level and smooth more and uniform step of this top surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200710138205 CN101359636A (en) | 2007-07-31 | 2007-07-31 | Encapsulation construction of electronic component and encapsulation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200710138205 CN101359636A (en) | 2007-07-31 | 2007-07-31 | Encapsulation construction of electronic component and encapsulation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101359636A true CN101359636A (en) | 2009-02-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200710138205 Pending CN101359636A (en) | 2007-07-31 | 2007-07-31 | Encapsulation construction of electronic component and encapsulation method thereof |
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| Country | Link |
|---|---|
| CN (1) | CN101359636A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102339811A (en) * | 2010-07-27 | 2012-02-01 | 埃派克森微电子(上海)股份有限公司 | Circuit board with COB (Chip On Board) packaged power device |
| CN102832142A (en) * | 2011-06-14 | 2012-12-19 | 弘凯光电股份有限公司 | Manufacturing method for packaging structure |
| CN103258934A (en) * | 2012-04-09 | 2013-08-21 | 东莞市久祥电子有限公司 | Method for preventing glue overflowing in packaging process of wafer-type light-emitting diode (LED) circuit board by brushing printing ink |
| CN104538316A (en) * | 2014-12-03 | 2015-04-22 | 深圳安博电子有限公司 | COB soft packaging method based on multi-chip ultrathin flexible circuit board |
| CN108171299A (en) * | 2017-12-19 | 2018-06-15 | 中电智能卡有限责任公司 | A kind of processing technology of smart card |
| CN115600542A (en) * | 2022-11-28 | 2023-01-13 | 飞腾信息技术有限公司（Cn） | Chip packaging structure and design method and related equipment thereof |
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2007
- 2007-07-31 CN CN 200710138205 patent/CN101359636A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102339811A (en) * | 2010-07-27 | 2012-02-01 | 埃派克森微电子(上海)股份有限公司 | Circuit board with COB (Chip On Board) packaged power device |
| CN102832142A (en) * | 2011-06-14 | 2012-12-19 | 弘凯光电股份有限公司 | Manufacturing method for packaging structure |
| CN103258934A (en) * | 2012-04-09 | 2013-08-21 | 东莞市久祥电子有限公司 | Method for preventing glue overflowing in packaging process of wafer-type light-emitting diode (LED) circuit board by brushing printing ink |
| CN103258934B (en) * | 2012-04-09 | 2017-03-22 | 东莞市久祥电子有限公司 | Method for preventing glue overflowing in packaging process of wafer-type light-emitting diode (LED) circuit board by brushing printing ink |
| CN104538316A (en) * | 2014-12-03 | 2015-04-22 | 深圳安博电子有限公司 | COB soft packaging method based on multi-chip ultrathin flexible circuit board |
| CN104538316B (en) * | 2014-12-03 | 2017-02-22 | 深圳安博电子有限公司 | COB soft packaging method based on multi-chip ultrathin flexible circuit board |
| CN108171299A (en) * | 2017-12-19 | 2018-06-15 | 中电智能卡有限责任公司 | A kind of processing technology of smart card |
| CN115600542A (en) * | 2022-11-28 | 2023-01-13 | 飞腾信息技术有限公司（Cn） | Chip packaging structure and design method and related equipment thereof |
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