JPH04306865A - Semiconductor device and manufacture thereof - Google Patents

Abstract

PURPOSE:To provide a semiconductor device and a manufacturing method thereof where the device is remarkably enhanced in heat dissipating property and formed thin free from the movement of a semiconductor device, the occurrence of air bubbles, and resin non-filled sections at the package of the semiconductor device. CONSTITUTION:A lead frame 1 mounted with a semiconductor device 10 is placed on a heat dissipating board or a synthetic resin board 20 provided with resin introducing holes 21, and the lead frame 1 mounted with the semiconductor device 10 is packaged together with the heat dissipating board or the synthetic resin board 20 into one piece. At this point, the lead frame 1 mounted with the semiconductor device 10 is placed on the heat dissipating board or the synthetic resin board 20, and the heat dissipating board or the synthetic resin board 20 is pinched between a cope 31 provided with a recess 32 where the semiconductor device 10 and the like are housed and a drag 35 provided with resin inlets 37 coincident with the resin introducing holes 21 provided to the heat dissipating board or the synthetic resin board 20, and resin is injected into the recess 32 provided to the cope 31 through the resin inlets 37 through the intermediary of the resin introducing holes 21.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device and a method for manufacturing the same, and more particularly to a package for a semiconductor device.

0002

2. Description of the Related Art Semiconductor devices are packaged with ceramic or synthetic resin in order to prevent deterioration, increase reliability, and facilitate connection of electronic components with external terminals.

FIG. 8 is a cross-sectional view of a typical semiconductor device, in which 2 is a die pad provided at the center of a lead frame 1;
are a large number of inner leads provided around the die pad 2 and connected to each electrode of the semiconductor element 10 by wires 11, respectively. These die pad 2, inner lead 3
, the semiconductor element 10 and the wire 11 are packaged with a synthetic resin 40 such as ceramic or epoxy resin (in the following description, a case where they are packaged with a synthetic resin will be described).

[0004] In order to apply the above-mentioned package, FIG.
As shown in the figure, recesses 32, 3 corresponding to the shape of the package
The lead frame 1 on which the semiconductor element 10 is mounted is sandwiched between the upper mold 31 and the lower mold 35 on which the semiconductor elements 6 are provided.
Synthetic resin (hereinafter simply referred to as resin) is injected into the recesses 32, 36 from the resin inlet 37 provided in the recesses 32, 36, and after drying and solidifying, the upper mold 31 and the lower mold 35 are opened, and the package is completed. The semiconductor device that has been removed is being removed. Note that 33 is an air vent hole.

[0005]

[Problems to be Solved by the Invention] In the conventional packaging method as described above, only one resin injection port 37 is provided in the lower mold 35.
As shown in FIG. 2, the die pad 2 tends to move and a so-called floating phenomenon occurs, and there are various problems such as the generation of air bubbles and the formation of unfilled areas with resin.

Therefore, as shown by the broken line in FIG.
In an attempt to solve the above problem, a second resin injection port 37a is provided in the die pad 2, but although the floating phenomenon of the die pad 2 has been improved to some extent, the problems such as the generation of air bubbles and unfilled resin have not been solved. .

[0007] Furthermore, as is well known, semiconductor elements become high in temperature as they are used, but because the surrounding area is completely packaged, the heat dissipation effect is low, and for this reason, various measures have been taken during mounting, such as attaching heat sinks. Despite the troublesome installation of the heat sink, the heat dissipation effect was not always sufficient.

The present invention has been made to solve the above problems. The object of the present invention is to provide a semiconductor device and a method for manufacturing the same, which are free from the risk of movement of semiconductor elements or the formation of air bubbles or unfilled areas of resin during packaging, significantly improve heat dissipation effects, and can be made thinner. .

[0009]

[Means and effects for solving the problems] A semiconductor device according to the present invention includes a lead frame having a semiconductor element mounted thereon mounted on a heat sink having a plurality of resin introduction holes. Packaged integrally with a heat sink.

A semiconductor device is mounted on a heat sink having a plurality of resin introduction holes, and the electrodes of this semiconductor element are respectively connected to the inner leads of a lead frame placed on the heat sink, thereby forming a lead frame including the semiconductor element. integrated package with a heat sink.

[0011] TA is placed on a heat sink having a plurality of resin introduction holes.
A type B semiconductor device is mounted and this semiconductor device is packaged integrally with a heat sink.

Furthermore, in the above-mentioned semiconductor device, a synthetic resin plate is used instead of the heat sink, a heat sink or synthetic resin plate is provided with a recess for accommodating at least a part of the semiconductor element, and a heat sink or synthetic resin plate is provided. This is a resin plate with a heat sink attached to it.

[0013] Furthermore, in the method for manufacturing a semiconductor device, a lead frame on which a semiconductor element is mounted is placed on a heat sink having a plurality of resin introduction holes, and a recessed portion in which the semiconductor element, etc. is accommodated is placed on the heat sink. The resin is sandwiched between an upper mold having a heat dissipation plate and a lower mold having a resin injection port that is aligned with the resin introduction hole of the heat dissipation plate, and resin is injected from the resin injection port into the recessed part of the upper mold through the resin introduction hole. The present invention is characterized in that a TAB type semiconductor device is used instead of a lead frame on which a semiconductor element is mounted.

[0014] Also, a semiconductor element is mounted on a heat sink having a plurality of resin introduction holes, a lead frame having an inner lead is placed on the heat sink, and wire bonding is performed, and the semiconductor element, etc. is mounted on the heat sink. It is sandwiched between an upper mold having a recess to be accommodated and a lower mold having a resin injection port that is aligned with the resin introduction hole of the heat sink, and the resin is injected from the resin injection port into the recess of the upper mold through the resin introduction hole. I decided to inject it.

Furthermore, in each of the above manufacturing methods, an insulating film is provided on both sides of the inner lead of the lead frame, a synthetic resin plate is used in place of the heat sink, and at least one of the semiconductor elements is attached to the heat sink or the synthetic resin plate. The present invention is characterized in that a recess is provided to accommodate a portion of the heat dissipation plate or the synthetic resin plate, and a recess is provided in the lower mold to accommodate at least a portion of the heat dissipation plate or the synthetic resin plate.

[0016]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is an explanatory diagram for explaining an embodiment of a method for manufacturing a semiconductor device according to the present invention. In the figure, 1
is a lead frame, as shown in FIG. 3, which includes a die pad 2 supported by four arms 4 provided at the center, and a number of inner leads 3 formed around the die pad 2 at predetermined intervals. and a through hole 5 provided in each arm 4 and serving as a resin passage.

A semiconductor element 10 is mounted on the die pad 2 of this lead frame 1, and each electrode of the semiconductor element 10 and the corresponding inner lead 3 are connected by wires 11, respectively. Dam bars 6 are provided on both sides of the inner lead 3, excluding the connection portion of the wire 11, and are formed of an insulating film coated with a resin such as polyimide resin or epoxy resin.

20 is the inner lead 3 of the lead frame 1
The heat dissipation plate is large enough to reach the lower surface of the lead frame 1, and is made of a material with good thermal conductivity such as a copper plate, and has resin introduction holes 21 at positions corresponding to the through holes 5 of the lead frame 1. In addition, in the example, the thickness of the heat sink 20 was 1 mm.

Reference numeral 31 designates an upper mold provided with, for example, a trapezoidal recess 32 that matches the shape of the package, and 33 designates an air vent hole. A lower mold 35 has a recess 36 into which the heat sink 20 fits, and resin injection ports 37 are provided corresponding to the resin introduction holes 21 of the heat sink 20, respectively.

In such a packaging device, first, the heat sink 20 is inserted into the recess 36 of the lower mold 35, and then
Next, the lead frame 1 on which the semiconductor element 10 is mounted is placed on the heat sink 20. At this time, lead frame 1
each through hole 5 of , each resin introduction hole 21 of substrate 20 and lower mold 3
The resin injection ports 37 of 5 are aligned with each other, and the heat sink 2
A dam bar 6 is interposed between each inner lead 3 and each inner lead 3 to provide insulation. Then, the upper mold 31 is lowered to clamp the lead frame 1.

In this state, the resin injection ports 37 provided at four locations
When a packaging resin such as epoxy resin is injected into the resin, the resin 40 passes through the resin introduction hole 21 and the through hole 5, and is completely filled into the recess 32 of the upper mold 31, thereby sealing the semiconductor element 1.
0, wires 11, die pads 2 and inner leads 3 are completely packaged. After the resin 40 is dried and solidified, the upper mold 31 and the lower mold 35 are removed, and a semiconductor device as shown in FIG. 2 is obtained.

When packaging, the dam bar 6 provided on the surface of the inner lead 3 is made of resin.
Prevent leakage along the Furthermore, since the resin introduction hole 21 of the heat sink 20 is also filled with the resin 40, the resin 40
It is possible to improve the adhesion between the heat dissipation plate 20 and the heat dissipation plate 20, and further strengthen the bond between the two. Note that the semiconductor device manufactured in this manner is usually mounted on a substrate or the like with the heat sink 20 facing upward.

In the above description, the lead frame 1 on which the semiconductor element 10 is mounted and wire bonded is placed on the heat sink 20 placed in the recess 36 of the lower die 35. After placing the lead frame 1 thereon, the semiconductor element 10 is placed on the die pad 2 and wire bonding is performed, or the semiconductor element 10 is placed on the die pad 2 and placed on the heat sink 20, and then wire bonding is performed. Bonding may be carried out, or these operations may be performed before the heat sink 20 is placed in the recess 36 of the lower mold 35, or after the heat sink 20 is placed in the recess 36, or other changes may be made as appropriate. Furthermore, although the case has been described in which the heat dissipation plate 20 is inserted into the recess 36 of the lower mold 35, the recess 36 of the lower mold 35 may be omitted and formed flat, and the heat dissipation plate 20 may be placed on top of it. .

According to the manufacturing method described above, the semiconductor element 10 is placed on the heat sink 20 via the die pad 2, and the resin 40 is injected from all sides of the die pad 2. There is no fear that the semiconductor element 2 or the semiconductor element 10 will move, and no air bubbles or unfilled resin will occur. Moreover, since the package is provided only on one side of the heat sink 20, the height can be reduced and the thickness can be reduced. Further, one surface of the semiconductor element 10 is in contact with the heat sink 20 via the die pad 2, and the heat sink 20 is exposed to the atmosphere during use, so that the heat radiation effect can be greatly enhanced.

FIG. 4 is an explanatory diagram of another embodiment of the present invention. In this embodiment, the semiconductor element 10 is directly connected to the heat sink 20.
A lead frame 1 without a die pad 2 is placed thereon, bonded to the inner leads 3, and packaged with resin 40 in the same manner as in the embodiment shown in FIG.

According to this embodiment, since the semiconductor element 10 is directly mounted on the heat sink 20, its height can be further reduced, and the heat radiation effect can be further enhanced.

In the embodiment shown in FIG. 5, a recess 22 is formed in the heat sink 20, and a part or all of the semiconductor element 10 is buried in the recess 22, so that the height can be further reduced and the heat radiation effect can be improved. Can be done.

In each of the above embodiments, the case where the semiconductor element is bonded to the lead frame 1 and packaged is shown, but as shown in FIG. The present invention can also be practiced. That is,
The semiconductor element 10 bonded to the finger 13 is accommodated in the recess 22 provided in the heat sink 20, and packaged in the same manner as in the embodiment shown in FIG. In this case, the heat sink 20
In order to further improve the adhesion between the heat dissipation plate 20 and the resin 40, a part of the lower surface of the heat dissipation plate 20 may be packaged.

As described above, in the present invention, the semiconductor element 10 is mounted directly or via the die pad 2 on the heat dissipation plate 20 made of a material with good thermal conductivity and exposed to the atmosphere, so that the heat dissipation effect is significantly improved. However, depending on the type of the semiconductor element 10 and the mounting state on the substrate, there may be cases where it is desired to further increase the heat dissipation effect. FIG. 7 shows an example of such a case, in which a screw hole 23 is provided in the heat sink 20, and a second heat sink 50 having a male screw 51 at one end and made of a material with high thermal conductivity is inserted into the screw hole 23. It is screwed into. With this configuration, the heat dissipation effect can be further improved. Note that instead of screwing the second heat sink 50 to the heat sink 20, other means such as bonding with an adhesive may be used.

In the above explanation, an example was explained in which a semiconductor device is manufactured using the heat sink 20 made of a material with good thermal conductivity. However, depending on the type and application of the semiconductor element, a thermosetting resin may be used instead of the heat sink. A synthetic resin plate made of, for example, may also be used.

[0031]

Effects of the Invention As is clear from the above description, the present invention provides a method for mounting a semiconductor element directly or via a die pad on a heat sink or synthetic resin plate having a plurality of resin inlet ports.
Alternatively, a TAB type semiconductor device is placed and resin is injected into the upper mold from the resin injection port of the lower mold through the resin introduction hole, and these are packaged integrally with the heat sink or synthetic resin plate. , the following effects can be obtained.

(1) Since the resin is injected through multiple resin introduction holes, there is no risk of the semiconductor element moving, air bubbles, or unfilled areas of the resin, and the package is reliably packaged. can be done.

(2) When a heat sink is used, since the heat sink is exposed to the atmosphere, the heat dissipation effect of the semiconductor element can be greatly improved during use.

(3) Since the package is applied only to one side of the heat sink or synthetic resin plate, the overall thickness can be made thinner. In particular, by providing a recess in the heat sink or synthetic resin plate, If a semiconductor element is housed in the
The thickness can be further reduced.

(4) Since insulating films are provided on both sides of the inner leads of the lead frame, the insulating film on the bottom side ensures insulation between the heat sink and the inner leads, and the insulating film on the top side prevents resin from flowing out during packaging. can be prevented.

(5) The resin of the package formed thereon infiltrates the resin introduction holes provided in the heat sink or synthetic resin plate, so that the bond between the heat sink or synthetic resin plate and the package is strengthened. Can be done.

(6) If another heat sink is attached to the heat sink or synthetic resin plate, the heat radiation effect can be further enhanced.

[Brief explanation of drawings]

FIG. 1 is an explanatory diagram for explaining an embodiment of a method for manufacturing a semiconductor device according to the present invention.

FIG. 2 is a cross-sectional view showing a part of the semiconductor device manufactured according to FIG. 1;

FIG. 3 is a plan view of an example of a lead frame used in the present invention.

FIG. 4 is a sectional view of another embodiment of the semiconductor device according to the present invention.

FIG. 5 is a sectional view of another embodiment of the semiconductor device according to the present invention.

FIG. 6 is a sectional view of another embodiment of the semiconductor device according to the present invention.

FIG. 7 is a sectional view of another embodiment of the semiconductor device according to the present invention.

FIG. 8 is a cross-sectional view showing an example of a conventional semiconductor device.

9 is an explanatory diagram showing an example of a method for manufacturing the semiconductor device of FIG. 8; FIG.

[Explanation of symbols]

1 Lead frame 2 Die pad 3 Inner lead 5 Through hole 6 Dam bar 10 Semiconductor element 11 Wire 12 TAB type semiconductor device 20 Heat sink 21 Resin introduction hole 22 Recess 31 Upper mold 32 Recess 35 Lower mold 36 Recess 37 Resin injection port 40 Synthetic resin 50 Heat sink

Claims (13)

[Claims] 1. A lead frame having a semiconductor element mounted on a die pad and each connected to an inner lead is placed on a heat sink having a plurality of resin introduction holes, and the lead frame containing the semiconductor element is connected to the heat sink. A semiconductor device characterized by being integrally packaged. 2. A semiconductor element is mounted on a heat sink having a plurality of resin introduction holes, electrodes of the semiconductor element are respectively connected to inner leads of a lead frame placed on the heat sink, and the semiconductor element is mounted on a heat sink having a plurality of resin introduction holes. What is claimed is: 1. A semiconductor device characterized in that a lead frame including a lead frame is integrally packaged with the heat sink. 3. A semiconductor device characterized in that a TAB type semiconductor device is mounted on a heat sink having a plurality of resin introduction holes, and the semiconductor device is packaged integrally with the heat sink. 4. The semiconductor device according to claim 1, wherein a synthetic resin plate is used in place of the heat sink. 5. The semiconductor device according to claim 1, wherein the heat sink or the synthetic resin plate is provided with a recess for accommodating at least a portion of the semiconductor element. [Claim 6] Claim 1, 2, 3, 4 or 5, characterized in that another heat sink is attached to the heat sink or the synthetic resin plate.
The semiconductor device described. 7. A lead frame having a die pad on which a semiconductor element is mounted and each connected to an inner lead is placed on a heat sink having a plurality of resin introduction holes, and the heat sink is placed on a heat sink in which the semiconductor element and the like are housed. The resin is sandwiched between an upper mold having a concave portion and a lower mold having a resin injection port that is aligned with the resin introduction hole of the heat sink, and the resin is inserted into the recess of the upper mold from the resin injection port through the resin introduction hole. A method for manufacturing a semiconductor device, characterized by injecting resin. 8. The method of manufacturing a semiconductor device according to claim 7, wherein a TAB type semiconductor device is used in place of the lead frame on which the semiconductor element is mounted. 9. A semiconductor element is mounted on a heat sink having a plurality of resin introduction holes, and a lead frame having an inner lead is placed on the heat sink and wire bonded, and the heat sink is attached to the semiconductor element. etc., and a lower mold having resin injection holes aligned with the resin introduction holes of the heat dissipation plate, and the upper A method for manufacturing a semiconductor device, comprising injecting a resin into a recessed part of a mold. 10. The method of manufacturing a semiconductor device according to claim 7, wherein an insulating film is provided on both sides of the inner lead of the lead frame. 11. The method of manufacturing a semiconductor device according to claim 7, wherein a synthetic resin plate is used in place of the heat sink. 12. The method of manufacturing a semiconductor device according to claim 7, wherein the heat sink or the synthetic resin plate is provided with a recess for accommodating at least a portion of the semiconductor element. 13. Manufacture of a semiconductor device according to claim 7, 8, 9, 10, 11 or 12, characterized in that the lower mold is provided with a recess in which at least a part of the heat sink or the synthetic resin plate is accommodated. Method.