CN103050613A - LED (Light Emitting Diode) packaging structure and manufacturing method thereof - Google Patents
LED (Light Emitting Diode) packaging structure and manufacturing method thereof Download PDFInfo
- Publication number
- CN103050613A CN103050613A CN2012104509685A CN201210450968A CN103050613A CN 103050613 A CN103050613 A CN 103050613A CN 2012104509685 A CN2012104509685 A CN 2012104509685A CN 201210450968 A CN201210450968 A CN 201210450968A CN 103050613 A CN103050613 A CN 103050613A
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- runner
- led
- base board
- board unit
- encapsulation structure
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 23
- 238000004806 packaging method and process Methods 0.000 title abstract description 4
- 239000000758 substrate Substances 0.000 claims abstract description 28
- 239000000084 colloidal system Substances 0.000 claims abstract description 21
- 238000005538 encapsulation Methods 0.000 claims description 44
- 239000002390 adhesive tape Substances 0.000 claims description 35
- 238000000034 method Methods 0.000 claims description 19
- 230000015572 biosynthetic process Effects 0.000 claims description 6
- 239000003292 glue Substances 0.000 abstract description 6
- 238000007789 sealing Methods 0.000 abstract 2
- 239000000463 material Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 230000004308 accommodation Effects 0.000 description 1
- 239000011469 building brick Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses an LED (Light Emitting Diode) packaging structure and a manufacturing method thereof. A runner groove is arranged on an LED substrate and an annular runner is correspondingly arranged on a mould, and then the LED substrate and the mould are assembled for injecting colloid, so that a sealing glue ring is formed by each substrate unit of the LED substrate, the time for manufacturing the sealing glue ring is greatly reduced and the time for constructing the LED packaging structure is reduced.
Description
Technical field
The present invention relates to a kind of encapsulation structure of LED and manufacture method thereof, particularly relate to a kind of encapsulation structure of LED and the manufacture method thereof of using mould to form sealed rubber ring.
Background technology
Light-emitting diode (Light-Emitting Diode, LED) is the luminous semi-conductor electricity sub-component of a kind of energy.This electronic building brick occurred as far back as 1962, can only send in early days the ruddiness of low-light level, developed afterwards other monochromatic versions, and the light that can send has even to this day spreaded all over visible light, infrared ray and ultraviolet ray, and suitable brightness is also brought up in brightness.And purposes is also by at the beginning as indicator light, display panel etc.; Along with the appearance of white light emitting diode, continuous gradually being developed to is used as illumination in recent years.
In the manufacturing process of semi-conductive encapsulation structure of LED, generally can encapsulate the light-emitting diode on the substrate with transparent colloid, to protect described light-emitting diode.Be filled in smoothly the upper area of described light-emitting diode and the glue that do not overflow for the ease of described transparent adhesive tape physical efficiency, around generally need to using in advance the light-emitting diode of point gum machine on described substrate a sealed rubber ring (Dam) is set, yet, in existing manufacture method, one light emitting diode base plate is arranged by a plurality of base board units and is formed, and the sealed rubber ring of each base board unit must use single point gum machine to make one by one, not only increased the activity duration, and point gum machine is also not enough because of glue or too much cause defective products easily.Perhaps, the mode of using mould a plurality of base board units of one light emitting diode base plate to be made simultaneously sealed rubber ring is also arranged, but because runner is formed on the mould, therefore after the demoulding, on the surface of light emitting diode base plate, can stay many runner adhesive tape, remove one by one the runner adhesive tape, not only expend time in and manpower, also damage easily sealed rubber ring simultaneously.
So, be necessary to provide a kind of encapsulation structure of LED and manufacture method thereof, to solve the existing problem of prior art.
Summary of the invention
Main purpose of the present invention is to provide a kind of encapsulation structure of LED and manufacture method thereof, by in a light emitting diode base plate flow path groove being set, and in a mould correspondence annular runner is set, again with described light emitting diode base plate and described mould matched moulds to inject colloid, so that each base board unit of described light emitting diode base plate forms a sealed rubber ring, runner adhesive tape in the while flow path groove is direct some as substrate then, therefore can omit the existing step of removing the runner adhesive tape, the time of making less described sealed rubber ring with letter significantly, and then the efficient of improve making described encapsulation structure of LED.
For reaching aforementioned purpose of the present invention, one embodiment of the invention provides a kind of encapsulation structure of LED, and it comprises: a base board unit, a light-emitting diode chip for backlight unit, a sealed rubber ring (Dam), and two runner adhesive tape.Described base board unit has a upper surface and two runner grooves; Described light-emitting diode chip for backlight unit is located on the upper surface of described base board unit; Described sealed rubber ring is located on the upper surface of described base board unit and around described light-emitting diode chip for backlight unit; Reach described two runner adhesive tape and be formed in the described two runner grooves, described runner adhesive tape connects described sealed rubber ring.
For reaching aforementioned purpose of the present invention, another embodiment of the present invention provides a kind of manufacture method of encapsulation structure of LED, it comprises step: a substrate is provided, it is arranged by a plurality of base board units and forms, each base board unit comprises two runner grooves, and each flow path groove communicates with a sprue on the described substrate respectively; One mould is provided, and the described base board unit of each of corresponding described substrate is provided with an annular runner; With described substrate and described mould matched moulds, make each annular runner correspondence be communicated to two interior runner grooves of each base board unit; Sprue to described substrate injects colloid, with formation two runner adhesive tape in described two runner grooves, and forms a sealed rubber ring in each described annular runner, and described runner adhesive tape connects described sealed rubber ring; And dividing mould with described substrate and described mould, described sealed rubber ring is formed on the surface of each base board unit of described substrate.
Description of drawings
Fig. 1 is the stereogram of the encapsulation structure of LED of one embodiment of the invention.
Fig. 2 is the substrate vertical view of the encapsulation structure of LED of one embodiment of the invention.
Fig. 3 is the mould upward view of the encapsulation structure of LED of one embodiment of the invention.
Fig. 4 A-4G is the step schematic diagram of the encapsulation structure of LED manufacture method of one embodiment of the invention.
Embodiment
For allowing above-mentioned purpose of the present invention, feature and advantage become apparent, preferred embodiment of the present invention cited below particularly, and cooperation accompanying drawing are described in detail below:
Please refer to shown in Figure 1ly, Fig. 1 is the stereogram of the encapsulation structure of LED of one embodiment of the invention.A kind of encapsulation structure of LED 1 comprises: a base board unit 10, a light-emitting diode chip for backlight unit 20, a sealed rubber ring (Dam) 31, two runner adhesive tape 32 and a transparent enclosure colloid 40.Base board unit 10 has a upper surface 10a and two runner grooves 11, and light-emitting diode chip for backlight unit 20 is located on the upper surface 10a of described base board unit 10, and it can be a plurality of and with the arrangement of square or circular array; It is upper and around described light-emitting diode chip for backlight unit that described sealed rubber ring 31 is located at the upper surface 10a of described base board unit 10; Described two runner grooves 11 be arranged with in described base board unit and at described sealed rubber ring 31 between the edge of described base board unit 10; And described two runner adhesive tape 32, be formed in the described two runner grooves 11, one upper surface of wherein said runner adhesive tape 32 (not indicating) is copline with the upper surface 10a of described base board unit 10, the one Side surface (not indicating) of described runner adhesive tape 32 is copline with the Side surface 10b of described base board unit 10, described runner adhesive tape 32 connects described sealed rubber ring 31, and the material of described runner adhesive tape 32 is same as the material of described sealed rubber ring 31.
As shown in Figure 1, described transparent enclosure colloid 40 is located at described sealed rubber ring 31 inside, in order to encapsulate described light-emitting diode chip for backlight unit 20.In the present embodiment, described transparent enclosure colloid 40 for example is take described sealed rubber ring 31 peaks as the edge, forms one dome-shaped.In addition, described two runner grooves 11 are for the mold use of arranging in pairs or groups (as mentioned below), its role is to make the colloidal materials of described sealed rubber ring 31 to pass through, therefore after described encapsulation structure of LED 1 is finished, still have described two runner adhesive tape 32 to residue within the described two runner grooves 11, the sectional area of wherein said two runner grooves 11 is different, the flow path groove 11 that sectional area is larger can be entered the solation road as one, the less flow path groove 11 of sectional area can be as a grate flow channel, but all has separately a runner adhesive tape 32 behind filler.Details are as follows for the manufacture method of described encapsulation structure of LED 1:
Please be simultaneously with reference to shown in Fig. 2, Fig. 3 and Fig. 4 A-4G, Fig. 2 is the substrate vertical view of the encapsulation structure of LED of one embodiment of the invention; Fig. 3 is the mould upward view of the encapsulation structure of LED of one embodiment of the invention; And Fig. 4 A-4G is the step schematic diagram of the encapsulation structure of LED manufacture method of one embodiment of the invention.What specify is, Fig. 4 A-4G is that the mode with partial schematic diagram presents.
At first, shown in Fig. 4 A, in a step (a), one light emitting diode base plate 100 (as shown in Figure 2) is provided, described light emitting diode base plate 100 is to arrange the substrate strip (substrate strip) that forms by a plurality of base board units 10, each base board unit 10 comprises two runner grooves 11, and each flow path groove 11 communicates with a sprue 110 on the described light emitting diode base plate 100 respectively.Described sprue 110 is groove columnar structure also, and described flow path groove 11 can be considered the branch runner with described sprue 110.In step (a) afterwards, can comprise: (a1) at each base board unit 10 light-emitting diode chip for backlight unit 20 is set, another of described light-emitting diode chip for backlight unit 20 arranges and will give in addition explanation in following opportunity.
Shown in Fig. 4 B, in a step (b), one mould 200 (as shown in Figure 3) is provided, each base board unit 10 of described mould 200 corresponding described light emitting diode base plates 100 is provided with an annular runner 210, and each annular runner 210 can corresponding be communicated to two runner grooves 11 in the base board unit 10 of each light emitting diode base plate 100.Moreover light-emitting diode chip for backlight unit 20 regions of described mould 200 corresponding each base board unit 10 are provided with an accommodation space 220, with temporary accommodating and protect described light-emitting diode chip for backlight unit 20.
Shown in Fig. 4 C, in a step (c), with described light emitting diode base plate 100 and described mould 200 matched moulds, make each annular runner 210 correspondence of described mould 200 be communicated to two runner grooves 11 in each base board unit 10.
Shown in Fig. 4 D, in a step (d), sprue 110 to described light emitting diode base plate 100 injects colloid, described colloid sequentially by described sprue 110, described flow path groove 11 to each annular runner 210, in described two runner grooves, 11 interior formation two runner adhesive tape 32, and in each described annular runner 210 interior formation one sealed rubber ring 31, described runner adhesive tape 32 is that one connects described sealed rubber ring 31.When injecting glue, the flow path groove 11 that sectional area is larger can be entered the solation road as one, the flow path groove 11 that sectional area is less can be as a grate flow channel, the larger flow path groove 11 (entering the solation road) of sectional area is relatively to locate near the glue source that enters of described sprue 110 simultaneously, so colloid can sequentially enter the less flow path groove 11 (grate flow channel) of the larger flow path groove of sectional area 11 (entering the solation road), described annular runner 210 and sectional area.The colloidal materials that described sealed rubber ring 31 uses can be lighttight resin material, for example for being added with light tight epoxy resin or other resins of reflective particles (such as titanium dioxide granule).
Shown in Fig. 4 E, in a step (e), with described light emitting diode base plate 100 and 200 minutes moulds of described mould, described sealed rubber ring 31 is formed on the surface of each base board unit 10 of described light emitting diode base plate 100, in case of necessity, can carry out baking (curing) process with the described sealed rubber ring 31 that hardens to described light emitting diode base plate 100 again.In addition, be set opportunity is in step (e) afterwards, also to comprise to another of described light-emitting diode chip for backlight unit 20: (e1) at each base board unit 10 at least one light-emitting diode chip for backlight unit 20 is set.Described step (a1) and (e1) only need select one and implement to get final product.
Shown in Fig. 4 F, in a step (f), with another transparent colloid the sealed rubber ring 31 in each base board unit 10 is carried out encapsulating, to form a transparent enclosure colloid 40, described transparent enclosure colloid 40 is in order to the described light-emitting diode chip for backlight unit 20 of packaging protection.Described transparent enclosure colloid 40 is take described sealed rubber ring 31 peaks as the edge, forms one dome-shaped.
Shown in Fig. 4 G, in a step (g), cut each encapsulation unit 10 of described light emitting diode base plate 100, to form several independent encapsulation structure of LEDs 1.Preferably, a upper surface 10a of described base board unit 10 and a upper surface of described runner adhesive tape 32 (not indicating) are copline, and a side surface 10b of described base board unit 10 and a side surface of described runner adhesive tape 32 (not indicating) are copline.Have described light-emitting diode chip for backlight unit 20, described sealed rubber ring 31 and described transparent enclosure colloid 40 on the base board unit 10 of each encapsulation structure of LED 1, and still remain with described runner adhesive tape 32 in the flow path groove 11 of described base board unit 10.
In sum, the manufacture method of described encapsulation structure of LED 1 comprises step:
(a) provide a light emitting diode base plate 100;
(b) provide a mould 200;
(c) with described light emitting diode base plate 100 and described mould 200 matched moulds;
(d) inject colloid in each annular runner 210 interior formation one sealed rubber ring 31, simultaneously in described two runner grooves, 11 interior formation two runner adhesive tape 32;
(e) with described light emitting diode base plate 100 and 200 minutes moulds of described mould;
(f) with the described light-emitting diode chip for backlight unit 20 of transparent enclosure colloid 40 encapsulation; And
(g) the described light emitting diode base plate 100 of cutting is to form independent encapsulation structure of LED 1.
Wherein, in step (a) or (e) afterwards, also comprise: (a1) or (e1) at each base board unit 10 interior light-emitting diode chip for backlight unit 20 that arrange.
Therefore, in the manufacturing process of existing encapsulation structure of LED, for the ease of filling encapsulation LED with the transparent adhesive tape physical efficiency, generally need to set in advance a sealed rubber ring (Dam), but this sealed rubber ring must use single point gum machine to make one by one; The mode of perhaps using mould that a plurality of base board units are made sealed rubber ring simultaneously, but can after the demoulding, stay the essential runner adhesive tape of removing at substrate surface.Encapsulation structure of LED 1 of the present invention and manufacture method thereof, by in a light emitting diode base plate 100 flow path groove 32 being set, and in a mould 200 correspondences annular runner 210 is set, again with described light emitting diode base plate 100 and described mould 200 matched moulds to inject colloid, so that each base board unit 10 of described light emitting diode base plate 100 forms a sealed rubber ring 31, runner adhesive tape in the while flow path groove is direct some as substrate then, therefore can omit the existing step of removing the runner adhesive tape, the time of making less described sealed rubber ring 31 with letter significantly, and then the efficient of improve making described encapsulation structure of LED 1.
The present invention is described by above-mentioned related embodiment, yet above-described embodiment is only for implementing example of the present invention.Must be pointed out that published embodiment does not limit the scope of the invention.Opposite, be contained in the spirit of claims and modification and impartial setting of scope and be included in the scope of the present invention.
Claims (10)
1. encapsulation structure of LED, it is characterized in that: described encapsulation structure of LED comprises:
One base board unit has a upper surface and two runner grooves;
One light-emitting diode chip for backlight unit is located on the upper surface of described base board unit;
One sealed rubber ring is located on the upper surface of described base board unit and around described light-emitting diode chip for backlight unit; And
Two runner adhesive tape are formed in the described two runner grooves, and described runner adhesive tape connects described sealed rubber ring.
2. encapsulation structure of LED as claimed in claim 1, it is characterized in that: described encapsulation structure of LED comprises a transparent enclosure colloid in addition, and it is inboard to be located at described sealed rubber ring, to encapsulate described light-emitting diode chip for backlight unit.
3. encapsulation structure of LED as claimed in claim 1, it is characterized in that: described two runner grooves are respectively one and advance solation road and a grate flow channel, wherein saidly advance the sectional area in solation road greater than the sectional area of described grate flow channel.
4. encapsulation structure of LED as claimed in claim 1 is characterized in that: a upper surface copline of the upper surface of described base board unit and described runner adhesive tape.
5. encapsulation structure of LED as claimed in claim 1, it is characterized in that: described base board unit has a side surface, a side surface copline of the side surface of described base board unit and described runner adhesive tape.
6. the manufacture method of an encapsulation structure of LED, it is characterized in that: described manufacture method comprises step:
One substrate is provided, and it is arranged by a plurality of base board units and forms, and each base board unit comprises two runner grooves, and each flow path groove communicates with a sprue on the described substrate respectively;
One mould is provided, and the described base board unit of each of corresponding described substrate is provided with an annular runner;
With described substrate and described mould matched moulds, make each annular runner correspondence be communicated to two interior runner grooves of each base board unit;
Sprue to described substrate injects colloid, with formation two runner adhesive tape in described two runner grooves, and forms a sealed rubber ring in described annular runner, and described runner adhesive tape connects described sealed rubber ring; And
Divide mould with described substrate and described mould, described sealed rubber ring is formed on the surface of each base board unit of described substrate.
7. the manufacture method of encapsulation structure of LED as claimed in claim 6, it is characterized in that: also comprise: one light-emitting diode chip for backlight unit is set and carries out encapsulating with a transparent colloid in to the sealed rubber ring of each base board unit at each base board unit, to encapsulate described light-emitting diode chip for backlight unit.
8. the manufacture method of encapsulation structure of LED as claimed in claim 7 is characterized in that: also comprise: cut each encapsulation unit of described substrate, to form several independent encapsulation structure of LEDs.
9. the manufacture method of encapsulation structure of LED as claimed in claim 6, it is characterized in that: described two runner grooves are respectively one and advance solation road and a grate flow channel, wherein saidly advance the sectional area in solation road greater than the sectional area of described grate flow channel.
10. the manufacture method of encapsulation structure of LED as claimed in claim 6 is characterized in that: a surperficial copline of the surface of described base board unit and described runner adhesive tape.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610541507.7A CN106067507B (en) | 2012-11-12 | 2012-11-12 | Encapsulation structure of LED and its manufacturing method |
| CN201210450968.5A CN103050613B (en) | 2012-11-12 | 2012-11-12 | Encapsulation structure of LED and manufacture method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210450968.5A CN103050613B (en) | 2012-11-12 | 2012-11-12 | Encapsulation structure of LED and manufacture method thereof |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610541507.7A Division CN106067507B (en) | 2012-11-12 | 2012-11-12 | Encapsulation structure of LED and its manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103050613A true CN103050613A (en) | 2013-04-17 |
| CN103050613B CN103050613B (en) | 2016-08-03 |
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| CN201610541507.7A Active CN106067507B (en) | 2012-11-12 | 2012-11-12 | Encapsulation structure of LED and its manufacturing method |
| CN201210450968.5A Active CN103050613B (en) | 2012-11-12 | 2012-11-12 | Encapsulation structure of LED and manufacture method thereof |
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| CN201610541507.7A Active CN106067507B (en) | 2012-11-12 | 2012-11-12 | Encapsulation structure of LED and its manufacturing method |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04306865A (en) * | 1991-04-03 | 1992-10-29 | Seiko Epson Corp | Semiconductor device and manufacture thereof |
| CN101436637A (en) * | 2008-12-16 | 2009-05-20 | 王海军 | High-efficiency heat-dissipating luminous high-power LED packaging structure |
| KR20090103473A (en) * | 2008-03-28 | 2009-10-01 | 서울반도체 주식회사 | Light emitting diode package and method for transfer molding of the same |
| CN102130227A (en) * | 2010-12-22 | 2011-07-20 | 哈尔滨工业大学 | Fluorescent powder coating process for LED optical lens and encapsulation process for white light LED with optical lens |
| CN102623615A (en) * | 2012-03-30 | 2012-08-01 | 东南大学 | Wafer level packaging method for self-aligned light emitting diodes |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100481546C (en) * | 2007-11-26 | 2009-04-22 | 佛山市国星光电股份有限公司 | Power LED with glue-filling formed bottom and manufacturing method thereof |
| CN101577301B (en) * | 2008-09-05 | 2011-12-21 | 佛山市国星光电股份有限公司 | Package method for white light LED and LED device manufactured by package method for white light LED |
-
2012
- 2012-11-12 CN CN201610541507.7A patent/CN106067507B/en active Active
- 2012-11-12 CN CN201210450968.5A patent/CN103050613B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04306865A (en) * | 1991-04-03 | 1992-10-29 | Seiko Epson Corp | Semiconductor device and manufacture thereof |
| KR20090103473A (en) * | 2008-03-28 | 2009-10-01 | 서울반도체 주식회사 | Light emitting diode package and method for transfer molding of the same |
| CN101436637A (en) * | 2008-12-16 | 2009-05-20 | 王海军 | High-efficiency heat-dissipating luminous high-power LED packaging structure |
| CN102130227A (en) * | 2010-12-22 | 2011-07-20 | 哈尔滨工业大学 | Fluorescent powder coating process for LED optical lens and encapsulation process for white light LED with optical lens |
| CN102623615A (en) * | 2012-03-30 | 2012-08-01 | 东南大学 | Wafer level packaging method for self-aligned light emitting diodes |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103050613B (en) | 2016-08-03 |
| CN106067507B (en) | 2019-05-10 |
| CN106067507A (en) | 2016-11-02 |
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