CN103050613B - Encapsulation structure of LED and manufacture method thereof - Google Patents
Encapsulation structure of LED and manufacture method thereof Download PDFInfo
- Publication number
- CN103050613B CN103050613B CN201210450968.5A CN201210450968A CN103050613B CN 103050613 B CN103050613 B CN 103050613B CN 201210450968 A CN201210450968 A CN 201210450968A CN 103050613 B CN103050613 B CN 103050613B
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- base board
- led
- board unit
- encapsulation structure
- runner
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- 238000005538 encapsulation Methods 0.000 title claims abstract description 45
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 22
- 238000000034 method Methods 0.000 title claims abstract description 21
- 239000000084 colloidal system Substances 0.000 claims abstract description 21
- 239000002390 adhesive tape Substances 0.000 claims description 35
- 239000000758 substrate Substances 0.000 claims description 23
- 239000003292 glue Substances 0.000 claims description 12
- 239000000463 material Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 230000004308 accommodation Effects 0.000 description 1
- 239000011469 building brick Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The open a kind of encapsulation structure of LED of the present invention and manufacture method thereof, by arranging flow path groove in a light emitting diode base plate and being correspondingly arranged annular runner in a mould, again by described light emitting diode base plate and described mould matched moulds to inject colloid, so that each base board unit of described light emitting diode base plate forms a sealed rubber ring, therefore significantly letter can make time of described sealed rubber ring less, and then reduce the time making described encapsulation structure of LED.
Description
Technical field
The present invention relates to a kind of encapsulation structure of LED and manufacture method thereof, particularly relate to a kind of the encapsulation structure of LED using mould to form sealed rubber ring and manufacture method thereof.
Background technology
Light emitting diode (Light-EmittingDiode, LED) is a kind of semi-conductor electricity sub-component that can be luminous.This electronic building brick occurred as far back as 1962, can only send the HONGGUANG of low-light level in early days, develop other monochromatic versions afterwards, and the light that can send even to this day is throughout visible ray, infrared ray and ultraviolet, and brightness also brings up to suitable brightness.And purposes is also by the beginning as display lamp, display panel etc.；Along with the appearance of white light emitting diode, continuous being gradually developed to is used as illumination in recent years.
In the manufacturing process of the encapsulation structure of LED of quasiconductor, typically can with transparent colloid, the light emitting diode on substrate be packaged, to protect described light emitting diode.The upper area of described light emitting diode and the glue that do not overflows it is filled in smoothly for the ease of described transparent adhesive tape physical ability, it is generally required to use point gum machine light emitting diode on described substrate to be arranged around a sealed rubber ring (Dam) in advance, but, in existing manufacture method, one light emitting diode base plate is formed by the arrangement of multiple base board units, and the sealed rubber ring of each base board unit must use single point gum machine to make one by one, not only add the activity duration, and point gum machine is also easily not enough because of a glue or too much causes defective products.Or, also there is the mode using mould that multiple base board units of one light emitting diode base plate make sealed rubber ring simultaneously, but owing to runner is formed on mould, the most after demoulding, the surface of light emitting diode base plate can stay many runner adhesive tape, remove runner adhesive tape one by one, not only expend time and manpower, be also easily damaged sealed rubber ring simultaneously.
Therefore, it is necessary to provide a kind of encapsulation structure of LED and manufacture method thereof, to solve the problem existing for prior art.
Summary of the invention
A kind of encapsulation structure of LED of offer and manufacture method thereof are provided, by arranging flow path groove in a light emitting diode base plate, and it is correspondingly arranged annular runner in a mould, again by described light emitting diode base plate and described mould matched moulds to inject colloid, so that each base board unit of described light emitting diode base plate forms a sealed rubber ring, runner adhesive tape in flow path groove is then directly as the some of substrate simultaneously, therefore the step of existing removal runner adhesive tape can be omitted, the time of described sealed rubber ring is made less with significantly letter, and then improve the efficiency making described encapsulation structure of LED.
For reaching the object defined above of the present invention, one embodiment of the invention provides a kind of encapsulation structure of LED, and it comprises: a base board unit, a light-emitting diode chip for backlight unit, a sealed rubber ring (Dam) and two runner adhesive tape.Described base board unit has a upper surface and two flow path groove；Described light-emitting diode chip for backlight unit is located on the upper surface of described base board unit；Described sealed rubber ring is located on the upper surface of described base board unit and around described light-emitting diode chip for backlight unit；And described two runner adhesive tape are formed in described two flow path groove, described runner adhesive tape connects described sealed rubber ring.
For reaching the object defined above of the present invention, another embodiment of the present invention provides the manufacture method of a kind of encapsulation structure of LED, it comprises step: provide a substrate, it is formed by the arrangement of multiple base board units, each base board unit comprises two flow path groove, and every flow path groove communicates with the sprue on described substrate respectively；A mould, each described base board unit of corresponding described substrate is provided to be provided with an annular runner；By described substrate and described mould matched moulds, make two flow path groove that each annular runner correspondence is communicated in each base board unit；The sprue of described substrate being injected colloid, to form two runner adhesive tape in described two flow path groove, and forms a sealed rubber ring in each described annular runner, described runner adhesive tape connects described sealed rubber ring；And divide mould, described sealed rubber ring to be formed on the surface of each base board unit of described substrate on described substrate and described mould.
Accompanying drawing explanation
Fig. 1 is the axonometric chart of the encapsulation structure of LED of one embodiment of the invention.
Fig. 2 is the substrate top view of the encapsulation structure of LED of one embodiment of the invention.
Fig. 3 is the mould upward view of the encapsulation structure of LED of one embodiment of the invention.
Fig. 4 A-4G is the step schematic diagram of the encapsulation structure of LED manufacture method of one embodiment of the invention.
Detailed description of the invention
For allowing above-mentioned purpose of the present invention, feature and advantage become apparent, present pre-ferred embodiments cited below particularly, and coordinate accompanying drawing, it is described in detail below:
Refer to shown in Fig. 1, Fig. 1 is the axonometric chart of the encapsulation structure of LED of one embodiment of the invention.A kind of encapsulation structure of LED 1 comprises: base board unit 10, light-emitting diode chip for backlight unit 20, sealed rubber ring (Dam) 31, two runner adhesive tape 32 and a transparent enclosure colloid 40.Base board unit 10 has a upper surface 10a and two flow path groove 11, and light-emitting diode chip for backlight unit 20 is located on the upper surface 10a of described base board unit 10, and it can be a plurality of and with the square or arrangement of circular array；Described sealed rubber ring 31 is located on the upper surface 10a of described base board unit 10 and around described light-emitting diode chip for backlight unit；Described two flow path groove 11 are recessed in described base board unit and between an edge of described sealed rubber ring 31 to described base board unit 10；And described two runner adhesive tape 32, it is formed in described two flow path groove 11, one upper surface (sign) of wherein said runner adhesive tape 32 and the upper surface 10a of described base board unit 10 are copline, one surface (sign) of described runner adhesive tape 32 and a surface 10b of described base board unit 10 are copline, described runner adhesive tape 32 connects described sealed rubber ring 31, and the material of described runner adhesive tape 32 is same as the material of described sealed rubber ring 31.
As it is shown in figure 1, described sealed rubber ring 31 inside is located at by described transparent enclosure colloid 40, in order to encapsulate described light-emitting diode chip for backlight unit 20.In the present embodiment, described transparent enclosure colloid 40, e.g. with described sealed rubber ring 31 peak as edge, forms one dome-shaped.Additionally, described two flow path groove 11 are for mold use of arranging in pairs or groups (as mentioned below), its role is to make the colloidal materials of described sealed rubber ring 31 pass through, after the most described encapsulation structure of LED 1 completes, within still having described second-rate road adhesive tape 32 to residue in described two flow path groove 11, the sectional area of wherein said two flow path groove 11 is different, the flow path groove 11 that sectional area is bigger can enter glue runner as one, the flow path groove 11 that sectional area is less as a grate flow channel, but each can all have a runner adhesive tape 32 after filler.Details are as follows for the manufacture method of described encapsulation structure of LED 1:
Referring to shown in Fig. 2, Fig. 3 and Fig. 4 A-4G, Fig. 2 is the substrate top view of the encapsulation structure of LED of one embodiment of the invention；Fig. 3 is the mould upward view of the encapsulation structure of LED of one embodiment of the invention；And Fig. 4 A-4G is the step schematic diagram of encapsulation structure of LED manufacture method of one embodiment of the invention.Special instruction, Fig. 4 A-4G is to present in the way of partial schematic diagram.
First, as shown in Figure 4 A, in a step (a), one light emitting diode base plate 100 (as shown in Figure 2) is provided, described light emitting diode base plate 100 is by the substrate strip (substratestrip) of multiple base board units 10 arrangement, each base board unit 10 comprises two flow path groove 11, and every flow path groove 11 communicates with the sprue 110 on described light emitting diode base plate 100 respectively.Described sprue 110 may also be groove-like structure, and described flow path groove 11 can be considered and the branch runner of described sprue 110.After step (a), can comprise: (a1) arranges a light-emitting diode chip for backlight unit 20 on each base board unit 10, another of described light-emitting diode chip for backlight unit 20 arranges and will separately give explanation in following opportunity.
As shown in Figure 4 B, in a step (b), one mould 200 (as shown in Figure 3) is provided, each base board unit 10 of the corresponding described light emitting diode base plate 100 of described mould 200 is provided with an annular runner 210, two flow path groove 11 that each annular runner 210 can corresponding be communicated in the base board unit 10 of each light emitting diode base plate 100.Furthermore, light-emitting diode chip for backlight unit 20 region of the corresponding each base board unit 10 of described mould 200 is provided with an accommodation space 220, houses with temporary and protect described light-emitting diode chip for backlight unit 20.
As shown in Figure 4 C, in a step (c), by described light emitting diode base plate 100 and described mould 200 matched moulds, make two flow path groove 11 that each annular runner 210 correspondence of described mould 200 is communicated in each base board unit 10.
As shown in Figure 4 D, in a step (d), the sprue 110 of described light emitting diode base plate 100 is injected colloid, described colloid sequentially by described sprue 110, described flow path groove 11 to each annular runner 210, two runner adhesive tape 32 are formed in described two flow path groove 11, and in each described annular runner 210, forming a sealed rubber ring 31, described runner adhesive tape 32 is integrally to connect described sealed rubber ring 31.When injecting glue, the flow path groove 11 that sectional area is bigger can enter glue runner as one, the flow path groove 11 that sectional area is less can be as a grate flow channel, the flow path groove 11 (entering glue runner) that sectional area is bigger simultaneously is to enter at glue source relatively close to described sprue 110, and therefore colloid can sequentially enter the flow path groove 11 (grate flow channel) that the bigger flow path groove of sectional area 11 (entering glue runner), described annular runner 210 and sectional area are less.The colloidal materials that described sealed rubber ring 31 uses can be lighttight resin material, is for example, added with light tight epoxy resin or other resins of reflective particles (such as titanium dioxide granule).
As shown in Figure 4 E, in a step (e), by described light emitting diode base plate 100 and 200 points of moulds of described mould, on the surface of each base board unit 10 that described sealed rubber ring 31 is formed at described light emitting diode base plate 100, if desired, more described light emitting diode base plate 100 can be carried out a baking (curing) process with the described sealed rubber ring 31 that hardens.It addition, it is, after step (e), also to comprise that another of described light-emitting diode chip for backlight unit 20 arranges opportunity: (e1) arranges at least one light-emitting diode chip for backlight unit 20 on each base board unit 10.Described step (a1) and (e1) only need to select one to be implemented.
As illustrated in figure 4f; in a step (f); with another transparent colloid, the sealed rubber ring 31 in each base board unit 10 being carried out encapsulating, to form a transparent enclosure colloid 40, described transparent enclosure colloid 40 is in order to light-emitting diode chip for backlight unit described in packaging protection 20.Described transparent enclosure colloid 40, with described sealed rubber ring 31 peak as edge, forms one dome-shaped.
As shown in Figure 4 G, in a step (g), cut each encapsulation unit 10 of described light emitting diode base plate 100, to form a several single encapsulation structure of LED 1.Preferably, one upper surface 10a of described base board unit 10 and a upper surface (sign) of described runner adhesive tape 32 are copline, and a side surface 10b of described base board unit 10 and a side surface (sign) of described runner adhesive tape 32 are copline.There is on the base board unit 10 of each encapsulation structure of LED 1 described light-emitting diode chip for backlight unit 20, described sealed rubber ring 31 and described transparent enclosure colloid 40, and in the flow path groove 11 of described base board unit 10, still remain with described runner adhesive tape 32.
In sum, the manufacture method of described encapsulation structure of LED 1 comprises step:
A () provides a light emitting diode base plate 100；
B () provides a mould 200；
C () is by described light emitting diode base plate 100 and described mould 200 matched moulds；
D () is injected colloid and is formed a sealed rubber ring 31 in each annular runner 210, form two runner adhesive tape 32 in described two flow path groove 11 simultaneously；
E () is by described light emitting diode base plate 100 and 200 points of moulds of described mould；
F () encapsulates described light-emitting diode chip for backlight unit 20 with transparent enclosure colloid 40；And
G () cuts described light emitting diode base plate 100, to form single encapsulation structure of LED 1.
Wherein, after step (a) or (e), also comprise: (a1) or (e1) arranges light-emitting diode chip for backlight unit 20 in each base board unit 10.
Therefore, in manufacturing process compared to existing encapsulation structure of LED, for the ease of filling encapsulating light emitting diode with transparent adhesive tape physical ability, it is generally required to pre-set a sealed rubber ring (Dam), but this sealed rubber ring must use single point gum machine to make one by one；Or use mould that multiple base board units make the mode of sealed rubber ring simultaneously, but the runner adhesive tape that must remove can be left the most on the surface of the substrate.The encapsulation structure of LED 1 of the present invention and manufacture method thereof, by arranging flow path groove 32 in a light emitting diode base plate 100, and it is correspondingly arranged annular runner 210 in a mould 200, again by described light emitting diode base plate 100 and described mould 200 matched moulds to inject colloid, so that each base board unit 10 of described light emitting diode base plate 100 forms a sealed rubber ring 31, runner adhesive tape in flow path groove is then directly as the some of substrate simultaneously, therefore the step of existing removal runner adhesive tape can be omitted, the time of described sealed rubber ring 31 is made less with significantly letter, and then improve the efficiency making described encapsulation structure of LED 1.
The present invention is been described by by above-mentioned related embodiment, but above-described embodiment is only the example implementing the present invention.It must be noted that, it has been disclosed that embodiment be not limiting as the scope of the present invention.Contrary, the amendment and the equalization that are contained in the spirit and scope of claims arrange and are all included in the scope of the present invention.
Claims (10)
1. an encapsulation structure of LED, it is characterised in that: described encapsulation structure of LED comprises:
One base board unit, has a upper surface and recessed in two flow path groove of described base board unit；
One light-emitting diode chip for backlight unit, is located on the upper surface of described base board unit；
One sealed rubber ring, is located on the upper surface of described base board unit and around described light-emitting diode chip for backlight unit；And
Two runner adhesive tape, are formed in described two flow path groove, and described runner adhesive tape integrally connects described sealed rubber ring.
2. encapsulation structure of LED as claimed in claim 1, it is characterised in that: described encapsulation structure of LED additionally comprises a transparent enclosure colloid, is located at inside described sealed rubber ring, to encapsulate described light-emitting diode chip for backlight unit.
3. encapsulation structure of LED as claimed in claim 1, it is characterised in that: described two flow path groove respectively enter glue runner and a grate flow channel, wherein said enter glue runner sectional area be more than the sectional area of described grate flow channel.
4. encapsulation structure of LED as claimed in claim 1, it is characterised in that: the upper surface of described base board unit and a upper surface copline of described runner adhesive tape.
5. encapsulation structure of LED as claimed in claim 1, it is characterised in that: described base board unit has a side surface copline of a side surface, the side surface of described base board unit and described runner adhesive tape.
6. the manufacture method of an encapsulation structure of LED, it is characterised in that: described manufacture method comprises step:
Thering is provided a substrate, it is formed by the arrangement of multiple base board units, and each base board unit comprises recessed in two flow path groove of described base board unit, and every flow path groove communicates with the sprue on described substrate respectively；
A mould, each described base board unit of corresponding described substrate is provided to be provided with an annular runner；
By described substrate and described mould matched moulds, make two flow path groove that each annular runner correspondence is communicated in each base board unit；
The sprue of described substrate being injected colloid, to form two runner adhesive tape in described two flow path groove, and forms a sealed rubber ring in described annular runner, described runner adhesive tape connects described sealed rubber ring；And
Mould, described sealed rubber ring is divided to be formed on the surface of each base board unit of described substrate on described substrate and described mould.
7. the manufacture method of encapsulation structure of LED as claimed in claim 6, it is characterized in that: also comprise: a light-emitting diode chip for backlight unit is set on each base board unit and to carry out encapsulating in the transparent colloid sealed rubber ring to each base board unit, to encapsulate described light-emitting diode chip for backlight unit.
8. the manufacture method of encapsulation structure of LED as claimed in claim 7, it is characterised in that: also comprise: cut each encapsulation unit of described substrate, to form several single encapsulation structure of LED.
9. the manufacture method of encapsulation structure of LED as claimed in claim 6, it is characterised in that: described two flow path groove respectively enter glue runner and a grate flow channel, wherein said enter glue runner sectional area be more than the sectional area of described grate flow channel.
10. the manufacture method of encapsulation structure of LED as claimed in claim 6, it is characterised in that: the surface of described base board unit and a surface copline of described runner adhesive tape.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610541507.7A CN106067507B (en) | 2012-11-12 | 2012-11-12 | Encapsulation structure of LED and its manufacturing method |
| CN201210450968.5A CN103050613B (en) | 2012-11-12 | 2012-11-12 | Encapsulation structure of LED and manufacture method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201210450968.5A CN103050613B (en) | 2012-11-12 | 2012-11-12 | Encapsulation structure of LED and manufacture method thereof |
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| CN201610541507.7A Division CN106067507B (en) | 2012-11-12 | 2012-11-12 | Encapsulation structure of LED and its manufacturing method |
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| Publication Number | Publication Date |
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| CN103050613A CN103050613A (en) | 2013-04-17 |
| CN103050613B true CN103050613B (en) | 2016-08-03 |
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| CN201210450968.5A Active CN103050613B (en) | 2012-11-12 | 2012-11-12 | Encapsulation structure of LED and manufacture method thereof |
| CN201610541507.7A Active CN106067507B (en) | 2012-11-12 | 2012-11-12 | Encapsulation structure of LED and its manufacturing method |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101436637A (en) * | 2008-12-16 | 2009-05-20 | 王海军 | High-efficiency heat-dissipating luminous high-power LED packaging structure |
| CN102623615A (en) * | 2012-03-30 | 2012-08-01 | 东南大学 | Wafer level packaging method for self-aligned light emitting diodes |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04306865A (en) * | 1991-04-03 | 1992-10-29 | Seiko Epson Corp | Semiconductor device and manufacture thereof |
| CN100481546C (en) * | 2007-11-26 | 2009-04-22 | 佛山市国星光电股份有限公司 | Power LED with glue-filling formed bottom and manufacturing method thereof |
| KR101523001B1 (en) * | 2008-03-28 | 2015-05-27 | 서울반도체 주식회사 | Light emitting diode package and method for transfer molding of the same |
| CN101577301B (en) * | 2008-09-05 | 2011-12-21 | 佛山市国星光电股份有限公司 | Package method for white light LED and LED device manufactured by package method for white light LED |
| CN102130227B (en) * | 2010-12-22 | 2012-06-20 | 哈尔滨工业大学 | Encapsulation process for white light LED with optical lens |
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2012
- 2012-11-12 CN CN201210450968.5A patent/CN103050613B/en active Active
- 2012-11-12 CN CN201610541507.7A patent/CN106067507B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101436637A (en) * | 2008-12-16 | 2009-05-20 | 王海军 | High-efficiency heat-dissipating luminous high-power LED packaging structure |
| CN102623615A (en) * | 2012-03-30 | 2012-08-01 | 东南大学 | Wafer level packaging method for self-aligned light emitting diodes |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106067507B (en) | 2019-05-10 |
| CN103050613A (en) | 2013-04-17 |
| CN106067507A (en) | 2016-11-02 |
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