CN204204913U - LED encapsulation structure - Google Patents
LED encapsulation structure Download PDFInfo
- Publication number
- CN204204913U CN204204913U CN201420581057.0U CN201420581057U CN204204913U CN 204204913 U CN204204913 U CN 204204913U CN 201420581057 U CN201420581057 U CN 201420581057U CN 204204913 U CN204204913 U CN 204204913U
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- China
- Prior art keywords
- led
- encapsulation structure
- cavity
- catoptric arrangement
- arrangement part
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000005538 encapsulation Methods 0.000 title claims abstract description 29
- 238000012856 packing Methods 0.000 claims abstract description 32
- 239000000084 colloidal system Substances 0.000 claims abstract description 25
- 239000000463 material Substances 0.000 claims description 17
- 238000000465 moulding Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 description 9
- 229920003023 plastic Polymers 0.000 description 7
- 239000004033 plastic Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 238000005520 cutting process Methods 0.000 description 4
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- 241000826860 Trapezium Species 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- GNFTZDOKVXKIBK-UHFFFAOYSA-N 3-(2-methoxyethoxy)benzohydrazide Chemical compound COCCOC1=CC=CC(C(=O)NN)=C1 GNFTZDOKVXKIBK-UHFFFAOYSA-N 0.000 description 1
- FGUUSXIOTUKUDN-IBGZPJMESA-N C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 Chemical compound C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 FGUUSXIOTUKUDN-IBGZPJMESA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- STTCDNLESVYWPH-UHFFFAOYSA-N benzene-1,4-diamine;terephthalic acid Chemical compound NC1=CC=C(N)C=C1.OC(=O)C1=CC=C(C(O)=O)C=C1 STTCDNLESVYWPH-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model discloses a kind of LED encapsulation structure, comprising: catoptric arrangement part, described catoptric arrangement part has cavity, is respectively arranged with and the open top of described cavity connects and bottom opening in the upper surface of described catoptric arrangement part and lower surface; LED flip chip, described LED flip chip is arranged in described cavity, and the electrode surface of described LED flip chip is towards described bottom opening; And packing colloid, described packing colloid is filled in described cavity to encapsulate described LED flip chip.LED encapsulation structure of the present utility model, the light that flip-chip sends downwards can from the direct outgoing of bottom opening, the light part upwards sent directly can pass packing colloid outgoing, by also can through fluorescence packing colloid after reflection on the inwall that another part light sent upwards is incident upon cavity, overall light efficiency be high.
Description
Technical field
The utility model relates to technical field of semiconductors, particularly relates to a kind of LED encapsulation structure.
Background technology
LED, as a forth generation lighting source, has energy-conservation and life-span advantage significantly.
LED is the key link obtaining high-quality LED illumination light source, existing flip chip mounting method has the following two kinds: one is adopt fluorescence packing colloid (mixture of fluorescent material and silica gel) 2 directly to carry out encapsulating (as shown in Figure 1) in all sides of flip-chip 1 and top, the inhomogeneities that this encapsulating structure mixes due to fluorescent material, during cutting, stress causes product rejection rate high.Two is that all sides of flip-chip 1 adopt vertical plastic material 3, top adopts fluorescence packing colloid 4 to carry out sealing (as shown in Figure 2).This encapsulating structure is because the vertical plastic material 21 of all sides is to the multiple reflections formation heat of light, and light efficiency is low.
Summary of the invention
For above-mentioned prior art present situation, technical problem to be solved in the utility model is, provides the LED encapsulation structure that a kind of structure is simple, light loss is low.
In order to solve the problems of the technologies described above, a kind of LED encapsulation structure provided by the utility model, comprising:
Catoptric arrangement part, described catoptric arrangement part has cavity, is respectively arranged with and the open top of described cavity connects and bottom opening in the upper surface of described catoptric arrangement part and lower surface;
LED flip chip, described LED flip chip is arranged in described cavity, and the electrode surface of described LED flip chip is towards described bottom opening; And
Packing colloid, described packing colloid is filled in described cavity to encapsulate described LED flip chip.
Wherein in an embodiment, described catoptric arrangement part is moulding.
Wherein in an embodiment, the longitudinal section of the inwall of described cavity is herringbone.
Wherein in an embodiment, the inwall of described cavity bottom is provided with inwardly outstanding flange, the electrode surface of described LED flip chip and the either flush of described flange.
Wherein in an embodiment, the lateral surface of described catoptric arrangement part is vertical with described lower surface with described upper surface.
Wherein in an embodiment, the electrode of described LED flip chip stretches out from described bottom opening, and the end face of described electrode is concordant with described lower surface.
Wherein in an embodiment, in described packing colloid, be mixed with fluorescent material.
Wherein in an embodiment, the end face of described packing colloid is concordant with the upper surface of described catoptric arrangement part.
Compared with prior art, LED encapsulation structure of the present utility model, the light that flip-chip sends downwards can directly outgoing, the light part upwards sent directly can pass packing colloid outgoing, by also can through fluorescence packing colloid after reflection on the inwall that another part light sent upwards is incident upon cavity, overall light efficiency be high.
The beneficial effect that the utility model additional technical feature has will be described in this specification embodiment part.
Accompanying drawing explanation
Fig. 1 is a kind of structural representation of the Flip-Chip Using of prior art;
Fig. 2 is the another kind of structural representation of the Flip-Chip Using of prior art;
Fig. 3 is the structural representation of the LED encapsulation structure in one of them embodiment of the utility model;
The cancellated schematic diagram of right-angled trapezium plasticity catoptric arrangement part that Fig. 4 is the method for packing of LED encapsulation structure shown in Fig. 3;
The schematic diagram of attached heat resistant plastics's counterdie of the method for packing that Fig. 5 is LED encapsulation structure shown in Fig. 3;
Fig. 6 is the schematic diagram of the die bond of the method for packing of LED encapsulation structure shown in Fig. 3;
Fig. 7 is the schematic diagram of the injecting glue of the method for packing of LED encapsulation structure shown in Fig. 3;
Fig. 8 is the schematic diagram of the cutting of the method for packing of LED encapsulation structure shown in Fig. 3.
In Fig. 3-Fig. 8,10-LED flip-chip; The electrode surface of 11-LED flip-chip; 12-electrode; 20-catoptric arrangement part; 21-cavity; 21a-open top; 21b-bottom opening; The upper surface of 22-catoptric arrangement part; The lower surface of 23-catoptric arrangement part; 24-flange; The inwall of 25-cavity; The lateral surface of 26-catoptric arrangement part; 30-packing colloid; 40-catoptric arrangement part sheet material; 50-counterdie; 60-line of cut.
Embodiment
And the utility model is described in detail below with reference to the accompanying drawings in conjunction with the embodiments.It should be noted that, when not conflicting, the feature in following embodiment and embodiment can combine mutually.
Fig. 3 is the structural representation of the LED encapsulation structure in one of them embodiment of the utility model.As shown in the figure, LED encapsulation structure comprises: catoptric arrangement part 20, LED flip chip 10 and packing colloid 30, wherein, described catoptric arrangement part 20 is moulding, catoptric arrangement part 20 has cavity 21, is respectively arranged with the open top 21a be communicated with described cavity 21 and bottom opening 21b in the upper surface 22 of described catoptric arrangement part 20 and lower surface 23.Preferably, the longitudinal section of the inwall 25 of described cavity 21 is herringbone, and the smooth reflecting effect of inwall 25 of described cavity 21 is good.Preferably, the inwall 25 bottom described cavity 21 is provided with inwardly outstanding flange 24, this flange 24 is for locating LED flip chip 10.Preferably, the lateral surface 26 of described catoptric arrangement part 20 is vertical with described lower surface 23 with described upper surface 22, to facilitate processing.
Described LED flip chip 10 is arranged in described cavity 21, and the electrode surface 11 of described LED flip chip 10 is towards described bottom opening 21b, the electrode surface 11 of described LED flip chip 10 and the either flush of described flange 24, the electrode 12 of described LED flip chip 10 stretches out from described bottom opening 21b, and the end face of described electrode 12 is concordant with described lower surface 23, so that directly welding circuit uses.
Described packing colloid 30 (not shown in Fig. 3) is filled in described cavity 21 to encapsulate described LED flip chip 10.
LED encapsulation structure in the utility model embodiment is owing to have employed said structure, the light that flip-chip 10 sends downwards can from the direct outgoing of bottom opening 21b, the light part upwards sent directly can pass packing colloid outgoing, by also can through fluorescence packing colloid after reflection on the inwall that another part light sent upwards is incident upon cavity, overall light efficiency be high.
The utility model additionally provides a kind of method for packing of above-mentioned LED encapsulation structure, and as shown in Fig. 4-Fig. 8, method for packing comprises the following steps:
Step a, the injection moulding of employing plastic material form catoptric arrangement part sheet material 40, and described catoptric arrangement part sheet material 40 has the described cavity 21 (as shown in Figure 4) of some arrangements in matrix.Plastic material preferably gathers terephthalate p-phenylenediamine (PPD) PPA plastics, poly terephthalic acid 1,4-CHDM ester PCT resin, epoxy film EMC resin from modification.Wherein two hypotenuses of isosceles trapezoid plasticity catoptric arrangement part 23 form a cavity of falling the Eight characters.
Step b, on the lower surface of described catoptric arrangement part sheet material 40, paste counterdie 50, make the bottom opening 21b of described cavity 21 close (as shown in Figure 5).Counterdie 50 is preferably heat resistant plastics's film.
Step c, flip-chip 10 is put into described cavity 21 carry out die bond, the electrode 12 of described flip-chip 10 abuts against on described counterdie 50 (as shown in Figure 6).
Steps d, encapsulating material is injected described cavity 21, form described packing colloid 30.Encapsulating material height concordant with the upper surface of catoptric arrangement part sheet material 40 (as shown in Figure 7).
Packing colloid 30 described in step e, baking-curing.Preferably, at temperature 150 ± 5 DEG C, solidify 30 ~ 60min, the setting of temperature section can carry out corresponding adjustment according to encapsulating material difference.
After step f, solidification, cut along line of cut 50 pairs of catoptric arrangement part sheet materials 40 under baking temperature, cut to described plasticity net bottom film thickness 1/2 ~ 3/4 place, form described catoptric arrangement part 20.High-temperature machining, there is not cutting stress and cause and scrap, rate of finished products is high, low cost of manufacture.
Step g, removed by counterdie 40, sorting obtains required LED encapsulation structure.
From technical scheme above, by the LED encapsulation structure that LED encapsulation method of the present utility model obtains, the light that flip-chip sends downwards can between outgoing, the light part upwards sent directly can pass the outgoing of fluorescence packing colloid, and the light that another part light sent upwards is incident upon both sides right-angled trapezium plasticity catoptric arrangement part is by also can through fluorescence packing colloid after reflection, overall light efficiency is high, also there is not cutting stress and causes and scrap, rate of finished products is high, low cost of manufacture.
The above embodiment only have expressed several execution mode of the present utility model, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the utility model the scope of the claims.It should be pointed out that for the person of ordinary skill of the art, without departing from the concept of the premise utility, can also make some distortion and improvement, these all belong to protection range of the present utility model.
Claims (8)
1. a LED encapsulation structure, is characterized in that, comprising:
Catoptric arrangement part (20), described catoptric arrangement part (20) has cavity (21), is respectively arranged with the open top (21a) and bottom opening (21b) that are communicated with described cavity (21) in the upper surface (22) of described catoptric arrangement part (20) and lower surface (23);
LED flip chip (10), described LED flip chip (10) is arranged in described cavity (21), and the electrode surface (11) of described LED flip chip (10) is towards described bottom opening (21b); And
Packing colloid (30), described packing colloid (30) is filled in described cavity (21) to encapsulate described LED flip chip (10).
2. LED encapsulation structure according to claim 1, is characterized in that, described catoptric arrangement part (20) is moulding.
3. LED encapsulation structure according to claim 1, is characterized in that, the longitudinal section of the inwall (25) of described cavity (21) is herringbone.
4. LED encapsulation structure according to claim 3, it is characterized in that, the inwall (25) of described cavity (21) bottom is provided with inwardly outstanding flange (24), the electrode surface (11) of described LED flip chip (10) and the either flush of described flange (24).
5. LED encapsulation structure according to claim 1, is characterized in that, the lateral surface (26) of described catoptric arrangement part (20) is vertical with described lower surface (23) with described upper surface (22).
6. LED encapsulation structure according to claim 1, it is characterized in that, the electrode (12) of described LED flip chip (10) stretches out from described bottom opening (21b), and the end face of described electrode (12) is concordant with described lower surface (23).
7. LED encapsulation structure according to claim 1, is characterized in that, described packing colloid is mixed with fluorescent material in (30).
8. LED encapsulation structure according to claim 1, is characterized in that, the end face of described packing colloid (30) is concordant with the upper surface (22) of described catoptric arrangement part (20).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420581057.0U CN204204913U (en) | 2014-10-09 | 2014-10-09 | LED encapsulation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420581057.0U CN204204913U (en) | 2014-10-09 | 2014-10-09 | LED encapsulation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204204913U true CN204204913U (en) | 2015-03-11 |
Family
ID=52662837
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420581057.0U Expired - Fee Related CN204204913U (en) | 2014-10-09 | 2014-10-09 | LED encapsulation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204204913U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105576107A (en) * | 2014-10-09 | 2016-05-11 | 广东德豪润达电气股份有限公司 | LED packaging structure and packaging method thereof |
| CN107331760A (en) * | 2017-07-06 | 2017-11-07 | 庞绮琪 | Long-life LED chip |
-
2014
- 2014-10-09 CN CN201420581057.0U patent/CN204204913U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105576107A (en) * | 2014-10-09 | 2016-05-11 | 广东德豪润达电气股份有限公司 | LED packaging structure and packaging method thereof |
| CN105576107B (en) * | 2014-10-09 | 2018-02-13 | 广东德豪润达电气股份有限公司 | LED encapsulation structure and its method for packing |
| CN107331760A (en) * | 2017-07-06 | 2017-11-07 | 庞绮琪 | Long-life LED chip |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20190920 Address after: 519000 Guangdong city of Zhuhai province high tech Zone Tangjiawan town Jinfeng Road No. 1 office building on the third floor Room 301 Patentee after: ELEC-TECH INTERNATIONAL CO.,LTD. Address before: 4 building, No. six, No. 18, Harbour Road, Tang Wan Town, Zhuhai, Guangdong, 519000 Patentee before: ELEC-TECH INTERNATIONAL Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 519000 Guangdong city of Zhuhai province high tech Zone Tangjiawan town Jinfeng Road No. 1 office building on the third floor Room 301 Patentee after: Zhuhai Leishi Lighting Co.,Ltd. Address before: 519000 Guangdong city of Zhuhai province high tech Zone Tangjiawan town Jinfeng Road No. 1 office building on the third floor Room 301 Patentee before: ELEC-TECH INTERNATIONAL Co.,Ltd. |
|
| CP01 | Change in the name or title of a patent holder | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150311 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |