CN100576244C - Smart card and manufacture method thereof - Google Patents
Smart card and manufacture method thereof Download PDFInfo
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- CN100576244C CN100576244C CN200810113206A CN200810113206A CN100576244C CN 100576244 C CN100576244 C CN 100576244C CN 200810113206 A CN200810113206 A CN 200810113206A CN 200810113206 A CN200810113206 A CN 200810113206A CN 100576244 C CN100576244 C CN 100576244C
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 32
- 238000000034 method Methods 0.000 title claims abstract description 32
- 239000000758 substrate Substances 0.000 claims abstract description 51
- 239000011248 coating agent Substances 0.000 claims abstract description 18
- 238000000576 coating method Methods 0.000 claims abstract description 18
- 239000000853 adhesive Substances 0.000 claims abstract description 14
- 230000001070 adhesive effect Effects 0.000 claims abstract description 14
- 239000000463 material Substances 0.000 claims description 15
- 239000004800 polyvinyl chloride Substances 0.000 claims description 14
- 229920000915 polyvinyl chloride Polymers 0.000 claims description 14
- 238000003475 lamination Methods 0.000 claims description 13
- 239000003795 chemical substances by application Substances 0.000 claims description 8
- 229920005644 polyethylene terephthalate glycol copolymer Polymers 0.000 claims description 7
- 239000007767 bonding agent Substances 0.000 claims description 6
- 229920003002 synthetic resin Polymers 0.000 claims description 5
- 239000000057 synthetic resin Substances 0.000 claims description 5
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- 239000004433 Thermoplastic polyurethane Substances 0.000 claims description 3
- 238000009499 grossing Methods 0.000 claims description 3
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 230000008859 change Effects 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 11
- 239000000084 colloidal system Substances 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
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- 210000005056 cell body Anatomy 0.000 description 4
- 239000003292 glue Substances 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- 238000004026 adhesive bonding Methods 0.000 description 3
- 239000007858 starting material Substances 0.000 description 3
- 101150064138 MAP1 gene Proteins 0.000 description 2
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- 238000009826 distribution Methods 0.000 description 2
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- 230000003993 interaction Effects 0.000 description 2
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Abstract
The present invention relates to a kind of smart card, it comprises substrate, and this substrate is provided with fluting, and holds the display circuit electronic package in the fluting; And overlay film, being coated on the substrate, at least a portion overlay film on the display circuit electronic package is transparent.The invention still further relates to the manufacture method of smart card, comprise substrate is provided, and on substrate, offer fluting; In fluting, fill the display circuit electronic package; The real estate that is filled with the display circuit electronic package is carried out adhesive stripe-coating; With the real estate after the adhesive stripe-coating is carried out overlay film.Therefore the present invention is by adopting the manufacture method of above-mentioned smart card, produce a kind of display that is arranged in the fluting and smart card of keyboard of having, thereby realize that the operation holder can be entered into personal information in the smart card by keyboard, simultaneously can watch these personal information, and the ultra-thin and pliability that the present invention possessed can't change the use habit of holder to smart card by display.
Description
Technical field
The present invention relates to field of intelligent cards, relate in particular to a kind of smart card and manufacture method thereof.
Background technology
The smart card that meets the ISO7816 standard at present mainly contains two kinds of forms, and a kind of is the smart card that has the contact chip; Another kind is the smart card that has contactless chip.The intelligent card chip that compatible above two kinds of functions occurred at present, promptly two interfaces chip promptly can also can carry out data interaction by contactless by contact.
But can significantly see, no matter be contact or contact type intelligent card, its interactive capability all a little less than, its mode generally all is unidirectional, perhaps more strictly speaking, smart card is information carrier, and the user is a holder, thus to smart card itself energy loaded information kind and applicable occasion caused very big restriction.Yet the product form of smart card itself because it is easy to carry, is popularized characteristics such as amount is big, should possess greater functionality, realizes the one card for multiple uses of real meaning.Existing smart card should strengthen mutual between smart card and the holder, and to holder's display message, the holder can import relevant information in the smart card simultaneously.
Summary of the invention
In order to solve the interaction problems between the smart card and holder in the prior art, the object of the present invention is to provide a kind of smart card, have display to holder's display message, and the holder is by keyboard input information in smart card, thereby is convenient to mutual between holder and the smart card by this smart card.
The present invention also aims to improve a kind of manufacture method of above-mentioned smart card, thereby mutual between holder and the smart card is convenient in the manufacturing that realizes above-mentioned smart card.
The object of the present invention is to provide a kind of smart card, this smart card comprises:
Substrate, this substrate is provided with fluting, and holds the display circuit electronic package in the described fluting; With
Overlay film pastes on described substrate, and at least a portion overlay film on the wherein said display circuit is transparent.
Described fluting is arranged on the zone that comprises outside the regulation zone in territory, block and IC standard the core of the card sheet module arrangement zone.
The degree of depth of described fluting is determined according to the thickness of the display circuit that holds.
Described display circuit electronic package comprises:
Power supply;
The circuit control module is used to provide the circuit of this smart card display message; With
Display is used to show this smart card information.
Described display circuit also comprises keyboard, is used for to described smart card input information.
The flexible infill panel that described power supply, display, circuit control module and keyboard are formed as one matches with described fluting.
Described overlay film is PVC, PC, PETG, PET or the ABS polyvinyl chloride resin of sheet shape.
Described fluting is L shaped.
The present invention also provides a kind of manufacture method of intelligent cards, comprising:
Substrate is provided, and on this substrate, offers fluting;
In described fluting, fill display circuit;
The real estate that is filled with described display circuit is carried out adhesive stripe-coating; With
Real estate behind the gluing is carried out overlay film, wherein said display circuit be transparent to the small part overlay film.
Describedly described substrate carried out adhesive stripe-coating be specially:
By automatic coating machine cementing agent evenly equidistantly is coated on the described substrate strip.
Described substrate is being carried out adhesive stripe-coating and described substrate is carried out also comprising between the overlay film:
Adopt flexible cylinder that coated cementing agent is smoothed processing.
Described bonding agent adopts epoxy resin or thermoplastic polyurethane.
Described manufacture method of intelligent cards also comprises the substrate after the overlay film is carried out lamination treatment.
The processing temperature that the described lamination treatment of described manufacture method of intelligent cards adopts is 50～100 ℃.
The pressure that described lamination treatment adopts is 2.5～5MPa.
Handle and described substrate carried out also comprising between the overlay film step described smoothing:
The described substrate that is coated with cementing agent is vacuumized processing.
The film that described overlay film adopts is the plate-shaped material that PVC, PC, PETG, PET or ABS PVC synthetic resin are made.
Therefore, the present invention is by adopting the manufacture method of above-mentioned smart card, produce a kind of display that is arranged in the fluting and smart card of keyboard of having, thereby realize the interactive operation between holder and the smart card, the holder can be entered into personal information in the smart card by keyboard, simultaneously can watch these personal information, and the ultra-thin and pliability that the present invention possessed can't change the use habit of holder to smart card by display.
Description of drawings
Fig. 1 is the card module distribution synoptic diagram of ISO7810 and the definition of ISO7816 international standard;
Fig. 2 is embodiment synoptic diagram of smart card of the present invention;
Fig. 3 divides synoptic diagram for the L shaped infill panel of the present invention;
Fig. 4 is the L shaped infill panel 30 embodiment synoptic diagram of the present invention;
Fig. 5 does not comprise that for the present invention the substrate 10 of flexible power supply, flexible display, flexible circuit control module and flexible keyboard also is basic cell body synoptic diagram;
Fig. 6 is the side view of substrate embodiment of the present invention;
Fig. 7 is the process flow diagram of the manufacture method of the above-mentioned smart card of the present invention.
Embodiment
Be illustrated in figure 1 as the card module distribution synoptic diagram of ISO7810 and ISO7816 international standard definition; Wherein the zone 1 is the magnetic stripe zone, and zone 2 dashes the territory, block for card number and cardholder information, and zone 3 is zones of Contact Type Ic Card module arrangement.For can maintenance and the compatibility of ISO7810 and ISO7816 international standard, position for above 3 parts can not be revised, the very thin thickness in 1-magnetic stripe district, zone can not take the thickness of whole card, so also can arrange the electronic package that other are thin, therefore its range of size of electronic system of the present invention can only be in zone 4, be that display circuit that the present invention will provide can be arranged in the zone outside the standard code occupied area that smart card follows, magnetic stripe district one side that must be provided with as smart card in ISO7810 and ISO7816 prescribed by standard, zone 4 outside card number and holder and the shared zone of IC-card module, perhaps be arranged on comprising of prescribed by standard above-mentioned three zones and the regulation zones such as reserve area of standard code outside the zone in.But for other standards, the fluting of this smart card also can be arranged on the zone of afore mentioned rules, only otherwise influence the normal use of smart card, perhaps carries out defined range according to actual needs again and divides, and slotting also can be located on the afore mentioned rules zone.
In order to realize mutual between holder and the smart card, the invention provides a kind of smart card, it comprises substrate 100 and overlay film 200.As shown in Figure 2, be embodiment synoptic diagram of smart card of the present invention, comprise substrate 100 and overlay film 200, because this substrate 100 embodiment must follow the compatibility of ISO7810 and ISO7816 international standard etc., therefore the fluting 10 of this substrate is arranged on the zone shown in 4 among Fig. 1, and slots and be provided with the display circuit electronic package that comprises flexible power supply, flexible display, flexible circuit control module and flexible keyboard in 10; In embodiment illustrated in fig. 2, comprise that L shaped infill panel (Inlay) 20 that the display circuit electronic package of flexible power supply, flexible display, flexible circuit control module and flexible keyboard is formed as one is as L shaped flexible PCB (specifically shown in Fig. 3 and 4), be filled in this fluting 10, cooperate with fluting.Fluting is for L shaped among the figure, and keyboard is arranged on " L " on the position, the lower right corner of smart card, keyboard is set like this is convenient to holder's input information.Display is used to show this smart card information, and smart card information can comprise the various information of being stored in the IC chip, as holder's identity information etc., also can be used to the various information that show that the holder imports.
L shaped infill panel 20 is as shown in Figure 3 divided synoptic diagram, integrally formed by flexible power supply 301, flexible display 302, flexible circuit control module 303 and/or flexible keyboard 304, need between each zone to select firmly and have a flexible joint, cloth is not in the know because ISO7816 removes the definition smart card module, also defined simultaneously smart card the anti-bending requirement that must possess.
Particularly, L shaped infill panel 20 embodiment as shown in Figure 4, has flexible battery 401 on the Inlay, flexible electric circuit board 405, flexible display 404, capacitance resistance ware 402, microcontroller 403, RFID chip and flexible keyboard 406, wherein the circuit control module 303 of above-mentioned Fig. 3 specifically comprises flexible electric circuit board 405, capacitance resistance ware 401, microcontroller 403 and RFID chip etc.Because the present invention adopts flexible display 404 electronic components such as grade, the ultra-thin and pliability that the present invention possessed can't change the use habit of holder to smart card.When this smart card is set, can be only with the smart card of Presentation Function, promptly this smart card only has display, and perhaps this smart card also has keyboard, is convenient to holder's input information.
As shown in Figure 5, substrate 100 synoptic diagram that do not comprise power supply, display, circuit control module and keyboard for the present invention, it also is basic cell body, the basic material of the smart card basis cell body of making shown in above-mentioned figure is the plate-shaped material of being made by synthetic resin, but its starting material are PVC, PC, PETG, PET or ABS.Wherein 501 of substrate keep a higher relatively thickness, the thickness requirement in zone 501 is not less than 0.7mm in the present invention, zone 502 also promptly slots 10 as the zone of placing L shaped infill panel 20 in the future, need be on the basis of regional 501 thickness, utilize processing equipments such as milling machine, according to scope shown in 104 in the areal map 1, mill end operation and form fluting 10, groove depth need decide according to device highly the highest on the Inlay.For the standard intelligent card that meets ISO7810, it becomes card thickness (height h1 shown in the side view of this substrate of Fig. 6 embodiment) is 0.76 ± 0.08mm, thickness (height h2 shown in the side view of this substrate of Fig. 6 embodiment) the highest on the Inlay should be controlled at below the 0.6mm, so the degree of depth of fluting preferably is arranged on 0.66mm.The degree of depth that is described fluting is determined according to the thickness of the display circuit that holds.
L shaped infill panel 20 shown in Figure 4 is filled to and forms substrate 100 in the fluting 10.And utilize bonding agent to real estate adhesive stripe-coating that L shaped infill panel 20 is arranged and smooth processing (specifically will in following explanation).Continuation is referring among Fig. 2, and overlay film 200 pastes on the substrate after the adhesive stripe-coating 100, and wherein the overlay film of display and/or keyboard area is pellucidity.The suitable plate-shaped material that adopts synthetic resin to make of the overlay film that is superposeed, but its starting material are PVC, PC, PETG, PET or ABS PVC, and the integral body of Xing Chenging can be by the test of ISO like this.
In the present embodiment, described fluting for L shaped, infill panel is L shaped, but fluting also can be set to line strip or other shapes according to actual needs.Only need fluting and display circuit infill panel shape to match.For example in the zone shown in the zone 4, the fluting of a rectangle is set in Fig. 1, correspondingly the display circuit electronic package also is arranged to the infill panel of rectangle, and other corresponding description is consistent with L shaped description, does not repeat them here.
As shown in Figure 7, be the process flow diagram of the manufacture method of the above-mentioned smart card of the present invention.This manufacture method may further comprise the steps:
Step 701: substrate is provided, offers fluting on this substrate, fluting is arranged on and comprises on magnetic stripe zone one side, the zone outside the regulation zone of territory, block and IC standard card module layout area in this example, and becomes L shaped;
On the basic cell body that meets ISO7810 and ISO7816 international standard (comprising magnetic stripe zone one side, zone outside the regulation zone of territory, block and IC standard card module layout area), L shaped fluting is set, specifically utilize processing equipments such as milling machine, according to scope shown in 104 in the areal map 1, mill end operation and form fluting 10, the degree of depth of fluting etc. are described and are described in the above, do not repeat them here;
Step 702: display circuit is filled in the L shaped fluting; The L shaped infill panel that comprises flexible power supply, flexible display, flexible circuit control module and/or flexible keyboard promptly is provided in this example; L shaped infill panel carries out layout according to the structure of describing among Fig. 4; The shape of infill panel is arranged to get final product with the shape of slotting is consistent, and promptly fluting and infill panel all can be arranged to other multiple shapes; Wherein, when being filled to L shaped infill panel shown in Figure 4 in the fluting shown in Figure 5, there are two problems to need to consider.
At first the material of Inlay is different with the material of fluting, compatibility between the unlike material needs to consider, otherwise Inlay and the disengaging of fluting material appear in the Cheng Kahui of manufacturing, have caused drum, need therefore to consider that certain glue lipid material of use remedies the affinity between the different materials.
What secondly need consideration is that the different elements on the Inlay has different height, and is highly consistent with fluting for the height that can make entire I nlay zone after Inlay is filled into fluting, needs this moment to consider to remedy these differences in height with filling material.
Therefore selected bonding agent should have the vitreous inversion temperature of a 35-70 degree, and uses photopolymerization.Bonding agent should use epoxy resin or thermoplastic polyurethane.When using epoxy resin and vitrification point to spend, just can not damage battery and chip as 45-49.
Step 703: and substrate carried out adhesive stripe-coating and smooth processing;
And substrate is carried out gluing and smooth to handle being specially: as described in cementing agent evenly equidistantly being coated to strip as the automatically dropping glue machine by automatic coating equipment on the surface that is provided with fluting of substrate; With the flexible cylinder of employing coated colloid is smoothed.In the present invention, cementing agent itself is to be coated on the real estate that is filled with this Inlay of display circuit of substrate 10 as shown in Figure 2 by the automatically dropping glue machine, adopt evenly equidistantly that strip applies, point gum machine can accurate control points glue amount and the position of coated colloid.On above gluing basis, adopt flexible cylinder, the coating colloid is smoothed processing.The purpose that smooths processing at first is to allow the strip colloid uniform spreading open, and secondly is to avoid producing bubble at subsequent technique, and bubble can cause the final products surface irregularity.After smoothing processing, need vacuumize processing to the substrate that is coated with colloid, the purpose that vacuumizes equally also is in order to remove the bubble in the colloid.
Step 704: carry out overlay film and lamination treatment on substrate, the overlay film of wherein said display and/or keyboard area is pellucidity.
When the Inlay of completing steps 703 arranges and after bonding agent fills, obtain as shown in Figure 2 one and can supply last lamination core material, promptly substrate 10.On the substrate surface after the adhesive stripe-coating shown in the figure, coated overlay film is a plastic foil, the suitable plate-shaped material that adopts synthetic resin to make, but its starting material are PVC, PC, PETG, PET or ABS PVC.In this step 704, the overlay film process need adopt flexible cylinder equally, guarantees that used glued membrane can progressively contact with the substrate shown in the figure, can produce a large amount of bubbles when avoiding comprehensive overlay film.Coated overlay film presents pellucidity at display and keyboard place, so that the holder can carry out the keyboard input and check the information that display shows.
Generally adopt the heat zone platen press at the conventional smart card laminating method, its processing temperature is 135 ℃, and tonnage is 5～6MPa.The present invention also can adopt existing heat zone platen press, and processing temperature is 100-135 ℃, and tonnage is that 5～6MPa comes the substrate that has covered film is carried out the high temperature lamination.But because electronic devices and components and display can be damaged under high temperature and high pressure, and because the difference of its material property that adopts, can not be well and the combination of PVC material.So among the present invention, in order to protect the electronic component on the Inlay, warm laminating in preferably adopting, processing temperature is preferably 50～100 ℃, and pressure preferably adopts 2.5～5Mpa.That is, the substrate behind the overlay film is being carried out lamination, also can select lamination mode such as high temperature lamination or middle temperature lamination according to the type of display.
After the described technology of above-mentioned manufacture method of intelligent cards, also comprise: the printing of card face, towards word, the stickup of magnetic stripe, the printing of photo cards, operations such as the fluting stickup of intelligent card chip will adopt existing ISO7816 standard technology to finish fully.
Can comprise in conjunction with the electronic unit of multiple active passive in the production technology of the present invention: intelligent card chip, RFID chip and antenna, fingerprint Identification sensor and chip etc.
By the manufacturing process of smart card provided by the invention and smart card, the standard of the compatible ISO7816 of the present invention has been carried out revolutionary expansion to the notion and the function of smart card again simultaneously.Functions such as conventional smart card chip and magnetic stripe have at first been guaranteed, secondly parts such as flexible battery, flexible display, flexible electric circuit board, flexible keyboard on conventional smart card, have been introduced, the holder can be entered into personal information in the smart card by keyboard, simultaneously can watch these personal information, and the ultra-thin and pliability that the present invention possessed can't change the use habit of holder to smart card by display.The present invention has reformed traditional fabrication process, at the components and parts requirement of new product, has adopted the production technology of innovation to finish the fabrication process, makes the performance of product be guaranteed.
It should be noted last that, above embodiment is only unrestricted in order to the technical scheme of the explanation embodiment of the invention, although the embodiment of the invention is had been described in detail with reference to preferred embodiment, those of ordinary skill in the art is to be understood that, can make amendment or be equal to replacement the technical scheme of the embodiment of the invention, and not break away from the spirit and scope of embodiment of the invention technical scheme and claim.
Claims (19)
1, a kind of smart card comprises:
Substrate, this substrate is provided with fluting, and holds the display circuit electronic package in the described fluting; With
Overlay film pastes on described substrate, and at least a portion overlay film on the wherein said display circuit electronic package is transparent.
2, smart card according to claim 1 is characterized in that described fluting is arranged on the zone that comprises outside the regulation zone in territory, block and IC standard the core of the card sheet module arrangement zone.
3, smart card according to claim 1 is characterized in that the degree of depth of described fluting is determined according to the thickness of the display circuit that holds.
4,, it is characterized in that described display circuit electronic package comprises according to claim 1 or 2 or 3 described smart cards:
Power supply;
The circuit control module is used to provide the circuit of this smart card display message; With
Display is used to show this smart card information.
5, smart card according to claim 4 is characterized in that described display circuit electronic package also comprises keyboard, is used for to described smart card input information.
6, smart card according to claim 5 is characterized in that the flexible infill panel that described power supply, display, circuit control module and/or keyboard are formed as one, and matches with described fluting.
7, smart card according to claim 4 is characterized in that described overlay film is PVC, PC, PETG, PET or the ABS polyvinyl chloride resin of sheet shape.
8, smart card according to claim 4 is characterized in that described fluting is L shaped.
9, a kind of manufacture method of intelligent cards comprises:
Substrate is provided, and on this substrate, offers fluting;
In described fluting, fill the display circuit electronic package;
The real estate that is filled with described display circuit electronic package is carried out adhesive stripe-coating; With
Real estate after the adhesive stripe-coating is carried out overlay film, be transparent to the small part overlay film on the wherein said display circuit.
10, manufacture method of intelligent cards according to claim 9 is characterized in that the degree of depth of described fluting is determined according to the thickness of the display circuit that holds.
11,, it is characterized in that describedly the real estate that is filled with described display circuit is carried out adhesive stripe-coating being specially according to claim 9 or 10 described manufacture method of intelligent cards:
By automatic coating equipment cementing agent evenly equidistantly is coated on the described substrate strip.
12, manufacture method of intelligent cards according to claim 11 is characterized in that the described real estate that is filled with described display circuit is carried out adhesive stripe-coating and the real estate after the adhesive stripe-coating is carried out also comprising between the overlay film:
Adopt flexible cylinder that coated cementing agent is smoothed processing.
13, manufacture method of intelligent cards according to claim 11 is characterized in that described bonding agent adopts epoxy resin or thermoplastic polyurethane.
14, manufacture method of intelligent cards according to claim 9 is characterized in that also comprising that the substrate to after the overlay film carries out lamination treatment.
15, manufacture method of intelligent cards according to claim 14 is characterized in that the processing temperature that described lamination treatment adopts is 50～100 ℃.
16, manufacture method of intelligent cards according to claim 14 is characterized in that the pressure that described lamination treatment adopts is 2.5～5MPa.
17, manufacture method of intelligent cards according to claim 12 is characterized in that handling and described substrate being carried out also comprising between the overlay film step described smoothing:
The described substrate that is coated with cementing agent is vacuumized processing.
18, manufacture method of intelligent cards according to claim 9 is characterized in that the film that described overlay film adopts is the plate-shaped material that PVC, PC, PETG, PET or ABS PVC synthetic resin are made.
19, manufacture method of intelligent cards according to claim 9 is characterized in that described fluting is to be opened on the zone that comprises outside the regulation zone in territory, block and IC standard the core of the card sheet module arrangement zone.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810113206A CN100576244C (en) | 2008-05-27 | 2008-05-27 | Smart card and manufacture method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810113206A CN100576244C (en) | 2008-05-27 | 2008-05-27 | Smart card and manufacture method thereof |
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| CN101281618A CN101281618A (en) | 2008-10-08 |
| CN100576244C true CN100576244C (en) | 2009-12-30 |
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Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101493902B (en) * | 2009-03-06 | 2012-04-25 | 北京海升天达科技有限公司 | Method for manufacturing card |
| CN201527667U (en) * | 2009-06-12 | 2010-07-14 | 北京海升天达科技有限公司 | Smart card capable of infrared communication |
| DE102011050794A1 (en) * | 2011-06-01 | 2012-12-06 | Bundesdruckerei Gmbh | Security or value document and method for its production |
| CN103034888A (en) * | 2011-09-29 | 2013-04-10 | 智慧光科技股份有限公司 | Electronic card manufacturing method |
| CN103178348B (en) * | 2011-12-26 | 2016-09-28 | 深圳光启高等理工研究院 | Meta Materials flexible substrate package device |
| CN104156756B (en) * | 2013-05-15 | 2021-09-24 | 苏州海博智能系统有限公司 | Visual smart card and packaging method thereof |
| CN104537410A (en) * | 2014-12-11 | 2015-04-22 | 苏州海博智能系统有限公司 | Manufacturing method for intelligent pass card |
| CN107145930A (en) * | 2015-05-28 | 2017-09-08 | 苏州海博智能系统有限公司 | A kind of preparation method of card |
| WO2017016456A1 (en) * | 2015-07-29 | 2017-02-02 | 飞天诚信科技股份有限公司 | Smart card and manufacturing method therefor |
| WO2017059588A1 (en) * | 2015-10-10 | 2017-04-13 | 深圳市奥星澳科技有限公司 | Multi-functional smart card and manufacturing method therefor |
| CN206322212U (en) * | 2015-10-10 | 2017-07-11 | 深圳市奥星澳科技有限公司 | Multi-function intelligent card |
| US10762412B2 (en) | 2018-01-30 | 2020-09-01 | Composecure, Llc | DI capacitive embedded metal card |
| US10977540B2 (en) | 2016-07-27 | 2021-04-13 | Composecure, Llc | RFID device |
| JP7223748B2 (en) * | 2017-09-07 | 2023-02-16 | コンポセキュア，リミティド ライアビリティ カンパニー | Transaction cards with embedded electronics and manufacturing processes |
| US11151437B2 (en) | 2017-09-07 | 2021-10-19 | Composecure, Llc | Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting |
| CN113111993B (en) * | 2021-04-02 | 2024-04-19 | 深圳市旭澜卡科技有限公司 | Visual smart card |
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