CN105184349B - A kind of smart card and its manufacturing method - Google Patents

A kind of smart card and its manufacturing method Download PDF

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Publication number
CN105184349B
CN105184349B CN201510456793.2A CN201510456793A CN105184349B CN 105184349 B CN105184349 B CN 105184349B CN 201510456793 A CN201510456793 A CN 201510456793A CN 105184349 B CN105184349 B CN 105184349B
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hollow out
out substrate
substrate
synthesis
void region
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CN105184349A (en
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陆舟
于华章
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Feitian Technologies Co Ltd
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Feitian Technologies Co Ltd
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Priority to CN201510456793.2A priority Critical patent/CN105184349B/en
Publication of CN105184349A publication Critical patent/CN105184349A/en
Priority to US15/742,057 priority patent/US11188804B2/en
Priority to PCT/CN2016/091501 priority patent/WO2017016456A1/en
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Abstract

The invention discloses a kind of smart card and its manufacturing method, the manufacturing method includes：Hollow out first substrate, second substrate and third substrate respectively, obtain bottom hollow out substrate, middle level hollow out substrate and top layer hollow out substrate；Bottom hollow out substrate, middle level hollow out substrate and top layer hollow out substrate are synthesized, synthesis hollow out substrate is obtained；Interior mold insert is filled into synthesis hollow out substrate；Bonding agent is applied on synthesis hollow out substrate, obtains smart card.The present invention obtains synthesis hollow out substrate by using the substrate of three hollow outs of synthesis, and interior mold insert is filled into the technical solution in synthesis hollow out substrate, the production difficulty of the smart card with human-computer interaction function is reduced, improves production efficiency.

Description

A kind of smart card and its manufacturing method
Technical field
The present invention relates to field of intelligent cards, more particularly to a kind of smart card and its manufacturing method.
Background technology
There are mainly two types of smart cards, and one is the smart cards with contact chip；Another kind is to carry contactless chip Smart card.At present occur that the smart card of above two function can be compatible with, i.e., double interface chip smart cards.But no matter It is which kind of smart card, the ability of human-computer interaction is all very weak.
In the prior art, although occurring that the smart card of human-computer interaction can be carried out, have in the prior art man-machine The production difficulty of the smart card of interactive function is big, low production efficiency.
Invention content
The present invention provides a kind of smart card and its manufacturing method, solve has human-computer interaction function in the prior art The technical issues of production difficulty of smart card is big, low production efficiency.
The present invention provides a kind of smart cards, including：It synthesizes hollow out substrate and is covered on the synthesis hollow out substrate Coating；Interior mold insert is accommodated in the synthesis hollow out substrate；The synthesis hollow out substrate includes：Bottom hollow out substrate, middle level Hollow out substrate and top layer hollow out substrate.
Optionally, the interior mold insert includes interaction circuit module.
Optionally, the interior mold insert further includes nonreciprocal circuit module.
Optionally, the interactive circuit module includes：Key-press module and display module；The nonreciprocal circuit module packet It includes：Power module and control module.
Optionally, the height of the interactive circuit module is more than the height of the nonreciprocal circuit module；
The interactive circuit module is located at least in the void region of the top layer hollow out substrate；The nonreciprocal circuit mould Block is located at least in the vacancy section of the bottom hollow out substrate, middle level hollow out substrate and one layer of hollow out substrate in top layer hollow out substrate In domain.
Optionally, the interactive circuit module includes：Key-press module and display module；The nonreciprocal circuit module packet It includes：Power module and control module；
The height of the key-press module and the height of the display module are more than the height of the power module and the control The height of molding block；
The key-press module be located at the void region of the bottom hollow out substrate, the middle level hollow out substrate void region In the void region of the top layer hollow out substrate；
The display module be located at the void region of the bottom hollow out substrate, the middle level hollow out substrate void region In the void region of the top layer hollow out substrate；
The power module is located at least in the void region of the bottom hollow out substrate；
The control module is located at least in the void region of the bottom hollow out substrate.
Optionally, the power module is different with the height of the control module；
When the height of the power module is more than the height of the control module, the power module is at least also located at institute In the void region for stating middle level hollow out substrate；
When the height of the control module is more than the height of the power module, the control module is at least also located at institute In the void region for stating middle level hollow out substrate.
Optionally, the control module includes：Circuit board and microcontroller.
Optionally, the coating includes：First printing pattern layer, the first printing bed of material and the first printing protective layer；Institute The first printing bed of material is stated between the synthesis hollow out substrate and first printing pattern layer, first printing pattern layer Between the first printing bed of material and the first printing protective layer.
Optionally, the coating further includes overlay film；The overlay film is located at the synthesis hollow out substrate and first print Between brush material layer.
Optionally, the coating includes：Second printing pattern layer and the second printing bed of material；Second printing pattern layer Between the second printing bed of material and the synthesis hollow out substrate；The second printing bed of material is transparent.
Optionally, the coating further includes overlay film；The overlay film is located at the synthesis hollow out substrate and second print Between map brushing pattern layer.
Optionally, the raw material of the coating are at least one of PVC, PC, PETG, PET or ABS polyvinyl chloride resin.
The present invention also provides a kind of manufacturing methods of smart card, including：
Step s1：Hollow out first substrate, second substrate and third substrate respectively, obtain bottom hollow out substrate, middle level hollow out Substrate and top layer hollow out substrate；
Step s2：The bottom hollow out substrate, the middle level hollow out substrate and the top layer hollow out substrate are synthesized, Obtain synthesis hollow out substrate；
Step s3：Interior mold insert is filled into the synthesis hollow out substrate；
Step s4：Bonding agent is applied on the synthesis hollow out substrate, obtains smart card.
Optionally, the step s1 is specifically included：Using punching, it is bored cut or milling bottom technique, respectively first described in hollow out Substrate, the second substrate and the third substrate obtain the bottom hollow out substrate, the middle level hollow out substrate and the top Layer hollow out substrate.
Optionally, the step s1 is specifically included：
According to the first default void region, first substrate described in hollow out obtains the bottom hollow out substrate, and the bottom is engraved Space base plate includes bottom void region；
According to the second default void region, second substrate described in hollow out obtains the middle level hollow out substrate, and the middle level is engraved Space base plate includes middle level void region；
Void region is preset according to third, third substrate obtains the top layer hollow out substrate described in hollow out, and the top layer is engraved Space base plate includes top layer void region.
Optionally, the step s1 is specifically included：
According to the first default void region and the first preset thickness, first substrate described in hollow out obtains the bottom hollow out base Plate, the bottom hollow out substrate include bottom void region；
According to the second default void region and the second preset thickness, second substrate described in hollow out obtains the middle level hollow out base Plate, the middle level hollow out substrate include middle level void region；
Void region and third preset thickness are preset according to third, third substrate obtains the top layer hollow out base described in hollow out Plate, the top layer hollow out substrate include top layer void region.
Optionally, the step s2 is specifically included：
Using the technique pasted and/or be laminated, according to the bottom void region, the middle level void region and the top The size of layer void region, closes the bottom hollow out substrate, the middle level hollow out substrate and the top layer hollow out substrate At obtaining the synthesis hollow out substrate that can accommodate the interior mold insert.
Optionally, the step s2 is specifically included：Using paste and/or lamination technique, to the bottom hollow out substrate, The middle level hollow out substrate and the top layer hollow out substrate are synthesized, and the synthesis for obtaining to accommodate the interior mold insert is engraved Space base plate.
Optionally, described that middle level hollow out substrate described in the bottom hollow out substrate and the top layer hollow out substrate are closed At specially：To the bottom hollow out substrate, the middle level hollow out substrate and the top layer hollow out substrate carry out single sintering or Person's multi-stage synthesis.
Optionally, the step s3 is specifically included：Using the technique pasted and/or be laminated, the interior mold insert is filled into In the synthesis hollow out substrate.
Optionally, further include after the step s3：Gap between the interior mold insert and the synthesis hollow out substrate Middle filling bonding agent.
Optionally, described after coating bonding agent, to further include on the synthesis hollow out substrate：In the synthesis hollow out base Coating is pasted on plate.
Optionally, the coating includes：First printing pattern layer, the first printing bed of material and the first printing protective layer；Institute The first printing bed of material is stated between the synthesis hollow out substrate and first printing pattern layer, first printing pattern layer Between the first printing bed of material and the first printing protective layer.
Optionally, the coating further includes overlay film；The overlay film is located at the synthesis hollow out substrate and first print Between brush material layer.
Optionally, the coating includes：Second printing pattern layer and the second printing bed of material, the second printing bed of material are Transparent；Second printing pattern layer is located at described second and prints between the bed of material and the synthesis hollow out substrate.
Optionally, the coating further includes overlay film；The overlay film is located at the synthesis hollow out substrate and second print Between map brushing pattern layer.
Optionally, the raw material of the coating are at least one of PVC, PC, PETG, PET or ABS polyvinyl chloride resin.
Optionally, before the step s4, further include：Overlay film is pasted on the top layer hollow out substrate.
Optionally, the interior mold insert includes interaction circuit module.
The beneficial effects of the invention are as follows：The present invention provides a kind of smart card and its manufacturing method, the manufacturing method is logical It crosses and synthesis hollow out substrate is obtained using the substrate of three layers of hollow out of synthesis, interior mold insert is filled into the technical side in synthesis hollow out substrate Case reduces the production difficulty of the smart card with human-computer interaction function, improves production efficiency.
Description of the drawings
Fig. 1 is a kind of flow chart for manufacture method of intelligent cards that the embodiment of the present invention 1 provides；
Fig. 2 is a kind of flow chart for manufacture method of intelligent cards that the embodiment of the present invention 2 provides；
The schematic diagram for the substrate that Fig. 3-Fig. 5 embodiment of the present invention 2 provides；
Fig. 6-8 is the schematic diagram for the hollow out substrate that the embodiment of the present invention 2 provides；
Fig. 9 is the floor map for the interior mold insert that the embodiment of the present invention 2 provides；
Figure 10 is the structural schematic diagram for the interior mold insert that the embodiment of the present invention 2 provides；
Figure 11 is the sectional view for the synthesis hollow out substrate that the embodiment of the present invention 2 provides；
Figure 12 is the sectional view for the synthesis hollow out substrate for accommodating interior mold insert that the embodiment of the present invention 2 provides；
Figure 13, Figure 14, Figure 16 and Figure 17 are the sectional view for the smart card that the embodiment of the present invention 2 provides；
Figure 15 is a kind of structure chart for coating that the embodiment of the present invention 2 provides；
Figure 18 is a kind of flow chart for manufacture method of intelligent cards that the embodiment of the present invention 3 provides；
The schematic diagram for the substrate that Figure 19-Figure 21 embodiment of the present invention 3 provides；
Figure 22-24 is the schematic diagram for the hollow out substrate that the embodiment of the present invention 3 provides；
Figure 25 is the interior mold insert floor map that the embodiment of the present invention 3 provides；
Figure 26 is the structural schematic diagram for the interior mold insert that the embodiment of the present invention 3 provides；
Figure 27 is the sectional view for the synthesis hollow out substrate that the embodiment of the present invention 3 provides；
Figure 28 is the sectional view for the synthesis hollow out substrate for accommodating interior mold insert that the embodiment of the present invention 3 provides.
Specific implementation mode
Below in conjunction with the attached drawing of the present invention, technical scheme in the embodiment of the invention is clearly and completely described, Obviously, described embodiment is only a part of the embodiment of the present invention, instead of all the embodiments.Based in the present invention Embodiment, the every other embodiment that those skilled in the art are obtained without making creative work all belongs to In the scope of protection of the invention.
Embodiment 1
A kind of smart card is present embodiments provided, including：It synthesizes hollow out substrate and is covered in covering on synthesis hollow out substrate Cap rock.
Interior mold insert is accommodated in synthesis hollow out substrate.
It includes three layers of hollow out substrate to synthesize hollow out substrate, and respectively bottom hollow out substrate, middle level hollow out substrate and top layer is engraved Space base plate.
In the present embodiment, the sum of thickness of three layers of hollow out substrate is default overall thickness.
In the present embodiment, interior mold insert may include interactive circuit module, and interaction circuit module is with human-computer interaction function Circuit module.
In the present embodiment, interior mold insert can also include nonreciprocal circuit module.Nonreciprocal circuit module is without man-machine The circuit module of interactive function.
In the present embodiment, the height between each circuit module can be identical or different, it is preferred that interaction circuit module Height be more than nonreciprocal circuit module height.Correspondingly, interaction circuit module is located at least in the hollow out of top layer hollow out substrate In region；Nonreciprocal circuit module is located at least in one layer in bottom hollow out substrate, middle level hollow out substrate and top layer hollow out substrate In the void region of hollow out substrate.Preferably, interaction circuit module is located at the void region of bottom hollow out substrate, middle level hollow out base In the void region of plate and the void region of top layer hollow out substrate；Nonreciprocal circuit module is located at least in engraving for bottom hollow out substrate In empty region.
In the present embodiment, interaction circuit module may include key-press module and display module etc..Nonreciprocal circuit module can To include power module and control module etc..
Specifically, when the height of the height of key-press module and display module is all higher than the height and control module of power module Height when, key-press module is located at the void region of bottom hollow out substrate, the void region of middle level hollow out substrate and top layer hollow out In the void region of substrate；Display module be located at the void region of bottom hollow out substrate, middle level hollow out substrate void region and In the void region of top layer hollow out substrate；Power module is located at least in the void region of bottom hollow out substrate；Control module is extremely It is located in the void region of bottom hollow out substrate less.
When the height of key-press module and the height of display module are all higher than the height of power module and the height of control module And the height of power module be more than control module height when, key-press module and display module are located at bottom hollow out substrate In the void region of void region, the void region of middle level hollow out substrate and top layer hollow out substrate；Power module is located at least in bottom In the void region of layer hollow out substrate and middle level hollow out substrate；Control module is located at least in the void region of bottom hollow out substrate In.
When the height of key-press module and the height of display module are all higher than the height of power module and the height of control module And the height of power module be less than control module height when, key-press module and display module are located at bottom hollow out substrate In the void region of void region, the void region of middle level hollow out substrate and top layer hollow out substrate；Control module is located at least in bottom In the void region of layer hollow out substrate and the void region of middle level hollow out substrate；Power module is located at least in bottom hollow out substrate In void region.
When the height of key-press module and the height of display module are all higher than the height of power module and the height of control module And power module it is identical with the height of control module when, key-press module and display module are located at the hollow out of bottom hollow out substrate In the void region in region, the void region of middle level hollow out substrate and top layer hollow out substrate；Power module and control module are at least In the void region of bottom hollow out substrate.
In the present embodiment, key-press module can specifically include the electronic building bricks such as button, and display module can specifically include aobvious The electronic building bricks such as display screen curtain, power module can specifically include the electronic building bricks such as battery, and control module can specifically include circuit The electronic building bricks such as plate and microcontroller, wherein the electronic building bricks such as display screen, battery, microcontroller and button are integrated in circuit On plate.
In the present embodiment, a kind of coating of smart card is provided, coating may include：First printing pattern layer, The one printing bed of material and the first printing protective layer；The first printing bed of material is located between synthesis hollow out substrate and the first printing pattern layer, First printing pattern layer is located between the first printing bed of material and the first printing protective layer.Coating can also include：Overlay film；Its In, overlay film is located between synthesis hollow out substrate and the first printing bed of material.
In the present embodiment, the first printing pattern layer is the figure layer with printed patterns, and the first printing bed of material is for printing The bed of material of printed patterns, the first printing protective layer are the bed of material for protecting the first printing pattern layer.Wherein, the first printing bed of material It is opaque that can be transparent can also be, the first printing protective layer can be all transparent or with the first printed patterns The part of the printed patterns contact of layer is transparent.
In the present embodiment, a kind of coating is additionally provided, coating includes：Second printing pattern layer and the second printed material Layer；The second printing bed of material is transparent.Second printing pattern layer is located between the second printing bed of material and synthesis hollow out substrate.Covering Layer can also include：Overlay film；Wherein, overlay film is located between synthesis hollow out substrate and the second printing pattern layer.
In the present embodiment, the second printing pattern layer is the figure layer with printed patterns, and the second printing bed of material is for printing The bed of material of printed patterns.Wherein, it can also be print with the second printing pattern layer that the second printing bed of material, which can be all transparent, The part of brush pattern contacts is transparent.
In the present embodiment, the raw material of coating are PVC (Polyvinyl chloride, polyvinyl chloride), PC (Polycarbonate, makrolon), PETG (Poly (ethylene terephthalateco-1,4- Cylclohexylenedimethylene terephthalate), non-crystalline type copolyesters), PET (poly (ethylene At least one of terephthalate), pet resin) or ABS polyvinyl chloride resins.
In the present embodiment, when seeing the second printing pattern layer through the transparent second printing bed of material, it is seen that be the second print Printed patterns in map brushing pattern layer, when through first printing protective layer see the first printing pattern layer when, it is seen that be the first print Printed patterns in map brushing pattern layer.Meanwhile second prints the bed of material on the second printing pattern layer, can also play the second print of protection The effect of map brushing pattern layer.In this way, the coating including the second printing pattern layer and the second printing bed of material is schemed with including the first printing The coating of pattern layer, the first printing bed of material and the first printing protective layer is compared while realizing identical function, is preferably dropped The low thickness of smart card.
In the present embodiment, overlay film suitable for using plate-shaped material made of synthetic resin, raw material can be PVC, PC, At least one of PETG, PET or ABS polyvinyl chloride resin.
The smart card with human-computer interaction function provided in the present embodiment, smart card include synthesis hollow out substrate and paste Coating on substrate, synthesis hollow out substrate include the substrate of three layers of hollow out, and the substrate of three layers of hollow out is respectively bottom hollow out Substrate, middle level hollow out substrate and top layer hollow out substrate, and synthesize and accommodate interior mold insert in hollow out substrate, such structure was both The stability of interior mold insert within a smart card is enhanced, also improves the bending resistance and folding resistance of smart card simultaneously.In the present embodiment Interior mold insert, including interaction circuit module, can also include nonreciprocal circuit module.The smart card provided in the present embodiment, base In the different height of interaction circuit module and nonreciprocal circuit module, interaction circuit module is located at least in top layer hollow out substrate In void region, and nonreciprocal circuit module is located at least in three layers of hollow out substrate in any one layer of void region, in this way Structure, while preferably protecting nonreciprocal circuit module, enhance nonreciprocal circuit module and interaction circuit module Stability within a smart card, and the bending resistance and folding resistance of smart card are further increased, extend the use of smart card Service life.
The present embodiment additionally provides a kind of manufacturing method of smart card, as shown in Figure 1, specifically including：
Step 101：Hollow out first substrate, second substrate and third substrate respectively, obtain bottom hollow out substrate, middle level hollow out Substrate and top layer hollow out substrate；
In the present invention, first substrate, second substrate and third substrate can be same substrate.In the present embodiment, it is preferred that First substrate, second substrate and third substrate be three substrates, wherein first substrate, second substrate and third substrate shape It can be the same or different.First substrate, second substrate and third substrate suitable for adopting plate-shaped material made of synthetic resin, Raw material can be at least one of PVC, PC, PETG, PET or ABS polyvinyl chloride resin.
In the present embodiment, may be used punching, it is bored cut or the techniques such as milling bottom, hollow out first substrate, second substrate respectively With third substrate, bottom hollow out substrate, middle level hollow out substrate and top layer hollow out substrate are obtained.
In the present embodiment, hollow out first substrate, second substrate and third substrate, obtain bottom hollow out substrate, middle level respectively Hollow out substrate and top layer hollow out substrate, can specifically include：
According to the first default void region, hollow out first substrate obtains bottom hollow out substrate, and bottom hollow out substrate includes bottom Layer void region；
According to the second default void region, hollow out second substrate obtains middle level hollow out substrate, during middle level hollow out substrate includes Layer void region；
Void region is preset according to third, hollow out third substrate obtains top layer hollow out substrate, and top layer hollow out substrate includes top Layer void region.
In the present embodiment, hollow out first substrate, second substrate and third substrate, obtain bottom hollow out substrate, middle level respectively Hollow out substrate and top layer hollow out substrate can also specifically include：
According to the first default void region and the first preset thickness, hollow out first substrate obtains bottom hollow out substrate, bottom Hollow out substrate includes bottom void region；
According to the second default void region and the second preset thickness, hollow out second substrate obtains middle level hollow out substrate, middle level Hollow out substrate includes middle level void region；
Void region and third preset thickness are preset according to third, hollow out third substrate obtains top layer hollow out substrate, top layer Hollow out substrate includes top layer void region.
It should be noted that the first default void region, the second default void region and can be determined according to interior mold insert It three default void regions specifically can be according to the interaction circuit module of interior mold insert and position and the height of nonreciprocal circuit module Degree determines that the first default void region, the second default void region and third preset void region；It can also be true according to interior mold insert Fixed the first default thickness corresponding with the default void region difference of the first default void region, the second default void region and third Degree, the second preset thickness and third preset thickness.It specifically, can be according to the interaction circuit module and nonreciprocal circuit of interior mold insert The position of module and height are determining and preset void region point with the first default void region, the second default void region and third Not corresponding first preset thickness, the second preset thickness and third preset thickness.Bottom hollow out substrate, middle level hollow out substrate and top Height of the sum of the thickness of layer hollow out substrate at least equal to interior mold insert.Bottom hollow out substrate, middle level hollow out substrate and top layer hollow out The sum of thickness of substrate is default overall thickness.
Step 102：Bottom hollow out substrate, middle level hollow out substrate and top layer hollow out substrate are synthesized, synthesis is obtained and engraves Space base plate；
Specifically, synthesis processing is carried out to bottom hollow out substrate, middle level hollow out substrate and top layer hollow out substrate, obtaining can The synthesis hollow out substrate of mold insert in accommodating.
In the present embodiment, can be, but not limited to specifically using paste and/or lamination technique, to bottom hollow out substrate, in Layer hollow out substrate and top layer hollow out substrate carry out synthesis processing, obtain the synthesis hollow out substrate that can accommodate interior mold insert.
It should be noted that in the present embodiment, according to bottom hollow out substrate, middle level hollow out substrate and top layer hollow out substrate Void region, it is preferable that according to the size of the void region of bottom hollow out substrate, middle level hollow out substrate and top layer hollow out substrate, Single sintering processing or repeatedly conjunction (at least twice) are carried out to bottom hollow out substrate, middle level hollow out substrate and top layer hollow out substrate Obtain to accommodate the synthesis hollow out substrate of interior mold insert at processing.
Step 103：Interior mold insert is filled into synthesis hollow out substrate；
In the present embodiment, specifically, it can be, but not limited to specifically fill out interior mold insert using the technique pasted and/or be laminated It is charged to the synthesis hollow out substrate for obtaining accommodating interior mold insert in synthesis hollow out substrate.
Step 104：Bonding agent is applied on synthesis hollow out substrate, obtains smart card；
Bonding agent uniformly equidistant strip synthesis can be coated to by automatic coating equipment such as automatic dispensing machine to engrave On the surface of space base plate；The bonding agent covered is carried out smoothing processing using roller.
It should be noted that the present embodiment in order to ensure interior mold insert and synthesize hollow out substrate fitting, after step 103 Bonding agent is filled in gap between interior mold insert and synthesis hollow out substrate.
In the present embodiment, further include after coating bonding agent on synthesis hollow out substrate：It is pasted on synthesis hollow out substrate Coating.
In the present embodiment, the coating pasted on the surface for the synthesis hollow out substrate for accommodating interior mold insert is suitable for use Plate-shaped material made of synthetic resin, raw material can be at least one of PVC, PC, PETG, PET or ABS polyvinyl chloride resin.
In the present embodiment, a kind of coating of smart card is provided, coating may include：First printing pattern layer, The one printing bed of material and the first printing protective layer；The first printing bed of material is located between synthesis hollow out substrate and the first printing pattern layer, First printing pattern layer is located between the first printing bed of material and the first printing protective layer.Coating can also include：Overlay film；Its In, overlay film is located between synthesis hollow out substrate and the first printing bed of material.
In the present embodiment, the first printing pattern layer is the figure layer with printed patterns, and the first printing bed of material is for printing The bed of material of printed patterns, the first printing protective layer are the bed of material for protecting the first printing pattern layer.Wherein, the first printing bed of material It is opaque that can be transparent can also be, the first printing protective layer can be all transparent or with the first printed patterns The part of the printed patterns contact of layer is transparent.
In the present embodiment, a kind of coating is additionally provided, coating includes：Second printing pattern layer and the second printed material Layer；The second printing bed of material is transparent.Second printing pattern layer is located between the second printing bed of material and synthesis hollow out substrate.Covering Layer can also include：Overlay film；Wherein, overlay film is located between synthesis hollow out substrate and the second printing pattern layer.
In the present embodiment, the second printing pattern layer is the figure layer with printed patterns, and the second printing bed of material is for printing The bed of material of printed patterns.Wherein, it can also be print with the second printing pattern layer that the second printing bed of material, which can be all transparent, The part of brush pattern contacts is transparent.
It should be noted that in the present embodiment, synthesizing can paste on the upper and lower surface in upper surface of hollow out substrate respectively Have including the first printing pattern layer, the coating of the first printing bed of material and the first printing protective layer or including the second printing pattern layer It is covered on the coating for printing the bed of material with second, or the upper and lower surface in upper surface of synthesis hollow out substrate including the first print The coating of map brushing pattern layer, the first printing bed of material and the first printing protective layer；Or the upper surface of synthesis hollow out substrate is upper and lower The coating including the second printing pattern layer and the second printing bed of material is covered on surface.Correspondingly, when coating further includes When overlay film, overlay film can also be covered with above and/or under the upper surface of hollow out substrate on surface by synthesizing, wherein overlay film is located at first It prints between the bed of material and synthesis hollow out substrate or between the second printing pattern layer and synthesis hollow out substrate.
It should also be noted that, when coating further includes overlay film, pastes and need to use drum in coating process, ensure institute Overlay film can gradually be contacted with the synthesis hollow out substrate for accommodating interior mold insert, and a large amount of gas are will produce when avoiding pasting overlay film Bubble.It can also be region corresponding with the interaction circuit module of interior mold insert is transparent that the overlay film pasted, which can be all transparent, , so that holder can carry out the information that such as keyboard inputted and/or checked display.
In the present embodiment, reprint printing technology may be used, printed patterns are printed on the second printing bed of material and included The coating of second printing pattern layer and the second printing bed of material.
In the present embodiment, can also include before step 104：Overlay film is pasted on top layer hollow out substrate.
A variety of active and/or passive electronic building brick can be combined in the production technology of the present invention, including：Intelligent the core of the card Piece, RFID chip and antenna, fingerprint Identification sensor, capacitance-resistance, crystal oscillator and chip etc..
The manufacturing method provided in the present embodiment obtains the substrate of three hollow outs by using three substrates of hollow out respectively, and three The substrate of a hollow out is respectively bottom hollow out substrate, middle level hollow out substrate and top layer hollow out substrate, synthesizes the substrate of three hollow outs Three layers of synthesis hollow out substrate is obtained, interior mold insert is filled into the technical solution in synthesis hollow out substrate, reduces smart card Production difficulty improves the production efficiency of smart card.When the interior mold insert in the present embodiment is including interaction circuit module and including non- When interaction circuit module, the manufacturing method of the smart card provided in the present embodiment can also be according to interaction circuit module and Fei Jiao The different height of mutual circuit module, respectively three substrates of hollow out obtain the substrate of three hollow outs, synthesize the substrate of three hollow outs Three layers of synthesis hollow out substrate is obtained, interactive circuit module is made to be located at least in the hollow out of the top layer hollow out substrate of synthesis hollow out substrate In region, so that nonreciprocal circuit module is located at least in the void region of one layer of hollow out substrate of synthesis hollow out substrate, increase in this way Strong operability, reduces the production difficulty of smart card, improves the production efficiency of smart card.
Embodiment 2
A kind of manufacturing method of smart card is present embodiments provided, as shown in Fig. 2, specifically including：
Step 201：Hollow out first substrate, second substrate and third substrate respectively, obtain bottom hollow out substrate, middle level hollow out Substrate and top layer hollow out substrate；
In the present embodiment, it is preferred that first substrate J01, as shown in Figure 3；Wherein second substrate J02, as shown in Figure 4；Its Middle third substrate J03, as shown in Figure 5.
This step specifically includes：
According to the first default void region and the first preset thickness, using punching, it is bored cut or the techniques such as milling bottom, hollow out the One substrate J01 obtains bottom hollow out substrate L01；
In the present embodiment, bottom hollow out substrate L01 can be as shown in Figure 6.
According to the second default void region and the second preset thickness, using punching, it is bored cut or the techniques such as milling bottom, hollow out the Two substrate J02 obtain middle level hollow out substrate L02；
In the present embodiment, middle level hollow out substrate L02 can be as shown in Figure 7.
Preset void region and third preset thickness according to third, using punching, it is bored cut or the techniques such as milling bottom, hollow out the Three substrate J03 obtain top layer hollow out substrate L03；
In the present embodiment, top layer hollow out substrate L03 can be as shown in Figure 8.
It should be noted that in the present embodiment, according to the position of each circuit module of interior mold insert and height, determine default Void region and preset thickness.
In the present embodiment, a kind of interior mold insert planar structure schematic diagram is provided, as shown in figure 9, interior mold insert includes control mould Block R01, power module R02, display module R03 and key-press module R04.
In the present embodiment, control module R01 can specifically include the electronic building bricks such as circuit board and microcontroller, wherein micro- Controller and key-press module R04 are integrated on circuit boards.
In the present embodiment, the dimensional structure diagram of interior mold insert, as shown in Figure 10, including control module R01, power module The circuit modules such as R02, display module R03 and key-press module R04.Wherein, control module R01 can specifically include circuit board and micro- The electronic building bricks such as controller, wherein microcontroller and key-press module R04 are integrated on circuit boards.Wherein, control module R01 Height is h01, and the height of power module R02 is h02, and the height of display module R03 is h03, and the height of key-press module R04 is h04。
In the present embodiment, it is preferred that h04>h03>h02>h01.
Wherein display module R03 and key-press module R04 is the interaction circuit module with human-computer interaction function；Control module R01 and power module R02 is the nonreciprocal circuit module without human-computer interaction function.
In the present embodiment, according to the first default void region and the first preset thickness, using punching, bored cut or milling bottom etc. The void region of technique, the bottom hollow out substrate L01 that hollow out first substrate J01 is obtained can at least fill the whole in interior mold insert Circuit module, the i.e. void region of bottom hollow out substrate L01 can at least fill control module R01, power module R02, display Module R03 and key-press module R04；The thickness of obtained bottom hollow out substrate L01 is at least equal to nothing in hollow out substrate L02 in middle level The height of the highest circuit module of method filling, i.e. height of the thickness of bottom hollow out substrate L01 at least equal to control module R01 h01；
According to the second default void region and the second preset thickness, using punching, it is bored cut or the techniques such as milling bottom, hollow out the The void region for the middle level hollow out substrate L02 that two substrate J02 are obtained can at least fill the circuit mould with human-computer interaction function The circuit module that block and height are more than the first preset thickness and can not be filled in top layer hollow out substrate L03, i.e. middle level hollow out base The void region of plate L02 can at least fill display module R03, key-press module R04 and power module R02；
The thickness of middle level hollow out substrate L02 is at least equal to the highest circuit that can not be filled in top layer hollow out substrate L03 The difference of the height for the highest circuit module that can not be filled in the height of module and in middle level hollow out substrate L02, i.e. middle level are engraved Difference (the h02- of the height h01 of the thickness of the space base plate L02 height h02 at least equal to power module R02 and control module R01 h01)。
Preset void region and third preset thickness according to third, using punching, it is bored cut or the techniques such as milling bottom, hollow out the The void region that three substrate J03 obtain top layer hollow out substrate L03 can at least fill the circuit module with human-computer interaction function, That is the void region of top layer hollow out substrate L03 can at least fill display module R03 and key-press module R04,
Height of the thickness of top layer hollow out substrate L03 at least equal to the highest circuit module being filled in top layer hollow out substrate Degree and in top layer hollow out substrate L03 on the difference of the height of highest circuit module that can not fill, i.e. top layer hollow out substrate The thickness of L03 at least equal to：The difference (h04-h02) of the height h02 of the height h04 and power module R02 of key-press module R04.
It should be noted that the thickness of bottom hollow out substrate L01, the thickness of middle level hollow out substrate L02 and top layer hollow out base The sum of thickness of plate L03 is at most equal to default overall thickness.
Step 202：Bottom hollow out substrate, middle level hollow out substrate and top layer hollow out substrate are synthesized, synthesis is obtained and engraves Space base plate；
In the present embodiment, it can be, but not limited to specifically synthesize bottom hollow out substrate using the technique pasted and/or be laminated L01, middle level hollow out substrate L02 and top layer hollow out substrate L03 obtain synthesis hollow out substrate C01, it is preferred that according to bottom hollow out base The size of the void region of plate L01, middle level hollow out substrate L02 and top layer hollow out substrate L03, to bottom hollow out substrate L01, middle level Hollow out substrate L02 and top layer hollow out substrate L03 carry out synthesis processing, obtain the synthesis hollow out substrate C01 that can accommodate interior mold insert. In the present embodiment, the sectional view of synthesis hollow out substrate C01 is provided, can be, but not limited to as shown in figure 11.
It should be noted that in the present embodiment, to bottom hollow out substrate L01, middle level hollow out substrate L02 and top layer hollow out base Plate L03 carries out single sintering processing or multiple (at least twice) synthesis handles to obtain the synthesis hollow out base that can accommodate interior mold insert Plate C01.
Such as：According to the void region of bottom hollow out substrate L01, middle level hollow out substrate L02 and top layer hollow out substrate L03 Bottom hollow out substrate L01 is placed on bottom by size, and middle level hollow out substrate L02 is placed on centre, and top layer hollow out substrate L03 is placed on top Layer, the technique pasted and/or be laminated using silk screen brush coating, three layers of hollow out substrate of synthesis obtain to accommodate by interior mold insert Synthesize hollow out substrate C01；
Or the void region according to bottom hollow out substrate L01, middle level hollow out substrate L02 and top layer hollow out substrate L03 Bottom hollow out substrate L01 is placed on bottom by size, and middle level hollow out substrate L02 is placed on top layer, using silk screen brush coating paste and/or The technique of lamination, synthesis bottom hollow out substrate L01 and middle level hollow out substrate L02 obtain the first synthesis hollow out substrate；First is closed It is placed on bottom at hollow out substrate, top layer hollow out substrate L03 is placed on top layer, and the technique pasted and/or be laminated using silk screen brush coating is closed It obtains interior mold insert being accommodated the synthesis hollow out substrate C01 to enter at the synthesis hollow out substrates of top layer hollow out substrate L03 and first；
Middle level hollow out substrate L02 and top layer hollow out substrate L03 can also first be synthesized, then again with bottom hollow out substrate L01 is synthesized.
It, also can be there are many to bottom hollow out substrate L01, middle level hollow out substrate L02 and top layer hollow out in the present embodiment Substrate L03 carries out synthesis processing, obtains the synthetic method of synthesis hollow out substrate, no longer illustrates one by one in the present embodiment.
Step 203：Interior mold insert is filled into synthesis hollow out substrate；
It in the present embodiment, can be, but not limited to that interior mold insert is specifically filled into synthesis using the technique pasted and/or be laminated Hollow out substrate C01 obtains the synthesis hollow out substrate for accommodating interior mold insert.
Step 204：Bonding agent is applied on synthesis hollow out substrate, obtains smart card；
Bonding agent uniformly can be coated to equidistant strip by automatic coating equipment such as automatic dispensing machine and be accommodated On the surface of the synthesis hollow out substrate of interior mold insert；The bonding agent covered is carried out smoothing processing using roller.
In the present embodiment, provide a kind of sectional view for the synthesis hollow out substrate C01 accommodating interior mold insert, can with but it is unlimited In as shown in figure 12.It should be noted that in order to ensure interior mold insert and synthesize the fitting of hollow out substrate C01 in the present embodiment, step Gap in being filled with bonding agent after rapid 203 between mold insert and synthesis hollow out substrate C01.
In the present embodiment, on synthesis hollow out substrate after coating bonding agent, further include：It is pasted on synthesis hollow out substrate Coating；
In the present embodiment, the coating pasted on the surface for the synthesis hollow out substrate for accommodating interior mold insert is suitable for use Plate-shaped material made of synthetic resin, raw material can be at least one of PVC, PC, PETG, PET or ABS polyvinyl chloride resin.
In the present embodiment, a kind of coating of smart card is provided, coating may include：First printing pattern layer, The one printing bed of material and the first printing protective layer；The first printing bed of material is located between synthesis hollow out substrate and the first printing pattern layer, First printing pattern layer is located between the first printing bed of material and the first printing protective layer.Coating can also include：Overlay film；Its In, overlay film is located between synthesis hollow out substrate and the first printing bed of material.
When coating specifically includes：First printing pattern layer, first printing the bed of material and first printing protective layer when, by with The sectional view of upper technique, obtained smart card can be as shown in figure 13, wherein the first printing bed of material Y01 is located at synthesis hollow out base Between plate C01 and the first printing pattern layer T01, the first printing pattern layer T01 is located at the first printing bed of material Y01 and the first printing is protected Between sheath P01.
When coating specifically includes：When overlay film, the first printing pattern layer, the first printing bed of material and the first printing protective layer, By process above, the sectional view of obtained smart card can be as shown in figure 14, overlay film M01 be located at synthesis hollow out substrate C01 and Between first printing bed of material Y01, the first printing bed of material Y01 is located between overlay film M01 and the first printing pattern layer T01, the first print Map brushing pattern layer T01 is located between the first printing bed of material Y01 and the first printing protective layer P01.
In the present embodiment, a kind of coating is additionally provided, coating can be as shown in figure 15, including：Second printed patterns The printing bed of materials of layer T02 and second Y02, the second printing bed of material Y02 is transparent.Second printing bed of material Y02 is suitable for using synthesis tree Plate-shaped material made of fat, raw material can be at least one of PVC, PC, PETG, PET or ABS polyvinyl chloride resin.
When coating specifically includes：When the second printing pattern layer and the second printing bed of material, the sectional view of obtained smart card It can be as shown in figure 16.Wherein, the second printing pattern layer T02 be located at the second printing bed of material Y02 and synthesis hollow out substrate C01 it Between.
When coating specifically includes：When overlay film, the second printing pattern layer and the second printing bed of material, obtained smart card section Figure can be as shown in figure 17.Wherein, overlay film M01 is located between synthesis hollow out substrate C01 and the second printing pattern layer T02, and second Printing pattern layer T02 is located between the second printing bed of material Y02 and overlay film M01.
It when coating further includes overlay film, pastes and needs to use drum in coating process, ensure that overlay film used can be with The synthesis hollow out substrate for accommodating interior mold insert gradually contacts, and avoids will produce a large amount of bubbles when overlay film.
In the present embodiment, the overlay film pasted on the surfaces synthesis hollow out substrate C01 for accommodating interior mold insert is plastic foil. In the present embodiment, overlay film suitable for using plate-shaped material made of synthetic resin, raw material can be PVC, PC, PETG, PET or At least one of ABS polyvinyl chloride resins.Region corresponding with display module R03 and key-press module R04 is in the overlay film pasted Pellucidity, so that holder can carry out keyboard input and check display information.
In the present embodiment, the first printing pattern layer is the figure layer with printed patterns, and the first printing bed of material is for printing The bed of material of printed patterns, the first printing protective layer are the bed of material for protecting the first printing pattern layer.Wherein, the first printing bed of material Can be it is transparent can not also be transparent, the first printing protective layer can be all transparent or with the first printing pattern layer The part of printed patterns contact is transparent.
In the present embodiment, the second printing pattern layer is the figure layer with printed patterns, and the second printing bed of material is for printing The bed of material of printed patterns.Wherein, it can also be print with the second printing pattern layer that the second printing bed of material, which can be all transparent, The part of brush pattern contacts is transparent.
In the present embodiment, reprint printing technology may be used, printed patterns are printed on the second printing bed of material and included The coating of second printing pattern layer and the second printing bed of material.
In the present embodiment, can also include before step 204：The overlay film on top layer hollow out substrate.
A variety of active and/or passive electronic building brick can be combined in the production technology of the present invention, including：Intelligent the core of the card Piece, RFID chip and antenna, fingerprint Identification sensor, capacitance-resistance, crystal oscillator and chip etc..
Embodiment 3
A kind of manufacturing method of smart card is present embodiments provided to specifically include as shown in figure 18：
Step 301：Hollow out first substrate, second substrate and third substrate respectively, obtain bottom hollow out substrate, middle level hollow out Substrate and top layer hollow out substrate；
In the present embodiment, it is preferred that first substrate J11, as shown in figure 19；Second substrate J12, as shown in figure 20；Third Substrate J13, as shown in figure 21.
This step specifically includes：
According to the first default void region and the first preset thickness, using punching, it is bored cut or the techniques such as milling bottom, hollow out the One substrate J11 obtains bottom hollow out substrate L11；
In the present embodiment, bottom hollow out substrate L11 can be as shown in figure 22.
According to the second default void region and the second preset thickness, using punching, it is bored cut or the techniques such as milling bottom, hollow out the Two substrate J12 obtain middle level hollow out substrate L12；
In the present embodiment, middle level hollow out substrate L12 can be as shown in figure 23.
Preset void region and third preset thickness according to third, using punching, it is bored cut or the techniques such as milling bottom, hollow out the Three substrate J13 obtain top layer hollow out substrate L13；
In the present embodiment, top layer hollow out substrate L13 can be as shown in figure 24.
It should be noted that in the present embodiment, according to the position of each circuit module of interior mold insert and height, determine pre- If void region and preset thickness.
In the present embodiment, a kind of interior mold insert planar structure schematic diagram is provided, as shown in figure 25, interior mold insert includes control mould The circuit modules such as block R11, power module R12, display module R13 and key-press module R14.
In the present embodiment, control module R11 can specifically include the electronic building bricks such as circuit board and microcontroller, wherein micro- Controller and key-press module R14 are integrated on circuit boards.
In the present embodiment, the dimensional structure diagram of interior mold insert, as shown in figure 26, including control module R11, power module The circuit modules such as R12, display module R13 and key-press module R14.Wherein, control module R11 can specifically include circuit board and micro- The electronic building bricks such as controller, wherein microcontroller and key-press module R14 are integrated on circuit boards.Wherein, control module R11 Height is h11, and the height of power module R12 is h12, and the height of display module R13 is h13, and the height of key-press module R14 is h14。
In the present embodiment, it is preferred that h14>h13>H12=h11.
Wherein display module R13 and key-press module R14 is the interaction circuit module with human-computer interaction function；Control module R11 and power module R12 is the nonreciprocal circuit module without human-computer interaction function.
In the present embodiment, according to the first default void region and the first preset thickness, using punching, bored cut or milling bottom etc. Technique, hollow out first substrate J11 obtain bottom hollow out substrate L11 void region can at least fill in interior mold insert all electricity Road module, the i.e. void region of bottom hollow out substrate L11 can at least fill control module R11, power module R12, display mould Block R13 and key-press module R14；The thickness of bottom hollow out substrate L11 is at least equal to can not fill in hollow out substrate L12 in middle level The height of highest circuit module, i.e. height h11 of the thickness of bottom hollow out substrate L11 at least equal to control module R11 or The height h12 of power module R12；
According to the second default void region and the second preset thickness, using punching, it is bored cut or the techniques such as milling bottom, hollow out the The void region that two substrate J12 obtain middle level hollow out substrate L12 can at least fill the circuit module with human-computer interaction function The circuit module that is more than the first preset thickness with height and can not be filled in top layer hollow out substrate L13, i.e. middle level hollow out substrate The void region of L12 can fill display module R13 and key-press module R14；
The thickness of middle level hollow out substrate L12 is more than the highest circuit module that can not be filled in top layer hollow out substrate L13 Height and the highest circuit module that can not be filled in hollow out substrate L12 in middle level height difference, i.e. middle level hollow out base The difference of the height h11 of height h12 and control module R11 of the thickness of plate L12 more than power module R12, i.e. middle level hollow out base The thickness of plate L12 is more than 0.
Preset void region and third preset thickness according to third, using punching, it is bored cut or the techniques such as milling bottom, hollow out the The void region that three substrate J13 obtain top layer hollow out substrate L13 can at least fill the circuit module with human-computer interaction function, That is the void region of top layer hollow out substrate L13 can at least fill display module R13 and key-press module R14,
The sum of the thickness of middle level hollow out substrate L12 and the thickness of top layer hollow out substrate L13 are at least equal to can be filled in top The height of highest circuit module in layer hollow out substrate L13 in top layer hollow out substrate L13 on can not fill it is highest The sum of difference of the height of circuit module, the i.e. thickness of the thickness of middle level hollow out substrate L12 and top layer hollow out substrate L13 are at least etc. In the difference (h14-h12) or key-press module R14 of the height h12 of the height h14 and power module R12 of key-press module R14 The difference (h14-h11) of the height h11 of height h14 and control module R11.
It should be noted that in the present embodiment, the void region of middle level hollow out substrate L12 and top layer hollow out substrate L13's Void region can fill display module R03 and key-press module R04；The void region of middle level hollow out substrate L12 and top layer are engraved The void region of space base plate L13 can be identical or different.
It should be noted that the thickness of bottom hollow out substrate L11, the thickness of middle level hollow out substrate L12 and top layer hollow out base The sum of thickness of plate L13 is default overall thickness.
Step 302：Bottom hollow out substrate, middle level hollow out substrate and top layer hollow out substrate are synthesized, synthesis is obtained and engraves Space base plate；
In the present embodiment, it can be, but not limited to specifically using the technique pasted and/or be laminated, according to bottom hollow out substrate L11, middle level hollow out substrate L12 and top layer hollow out substrate L12 synthesize hollow out substrate, it is preferred that according to bottom hollow out substrate L11, The size of the void region of middle level hollow out substrate L12 and top layer hollow out substrate L13, to bottom hollow out substrate L11, middle level hollow out base Plate L12 and top layer hollow out substrate L13 carry out synthesis processing, obtain the synthesis hollow out substrate C11 that can accommodate interior mold insert.This implementation In example, the sectional view of synthesis hollow out substrate C11 is provided, can be, but not limited to as shown in figure 27.
It should be noted that in the present embodiment, to bottom hollow out substrate L11, middle level hollow out substrate L12 and top layer hollow out base Plate L13 carries out single sintering processing or multiple (at least twice) synthesis handles to obtain the synthesis hollow out base that can accommodate interior mold insert Plate C11.
Such as：According to the void region of bottom hollow out substrate L11, middle level hollow out substrate L12 and top layer hollow out substrate L13 Bottom hollow out substrate L11 is placed on bottom by size, and middle level hollow out substrate L12 is placed on centre, and top layer hollow out substrate L13 is placed on top Layer, the technique pasted and/or be laminated using silk screen brush coating, three layers of hollow out substrate of synthesis obtain to accommodate by interior mold insert Synthesize hollow out substrate C11；
Or the void region according to bottom hollow out substrate L11, middle level hollow out substrate L12 and top layer hollow out substrate L13 Bottom hollow out substrate L11 is placed on bottom by size, and middle level hollow out substrate L12 is placed on top layer, using silk screen brush coating paste and/or The technique of lamination, synthesis bottom hollow out substrate L11 and middle level hollow out substrate L12 obtain the first synthesis hollow out substrate；First is closed It is placed on bottom at hollow out substrate C11-1, top layer hollow out substrate L13 is placed on top layer, the work pasted and/or be laminated using silk screen brush coating Skill synthesizes the synthesis hollow out substrates of top layer hollow out substrate L13 and first and obtains interior mold insert being accommodated the synthesis hollow out base entered Plate C11；
Middle level hollow out substrate L12 and top layer hollow out substrate L13 can also first be synthesized, then again with bottom hollow out substrate L11 is synthesized.
It, also can be there are many to bottom hollow out substrate L11, middle level hollow out substrate L12 and top layer hollow out in the present embodiment Substrate L13 carries out synthesis processing, obtains the synthetic method of synthesis hollow out substrate, no longer illustrates one by one in the present embodiment.
Step 303：Interior mold insert is filled into synthesis hollow out substrate；
In the present embodiment, it can be, but not limited to specifically using the technique of stickup and/lamination, internal mold insert is filled into synthesis and engraves Space base plate C11 obtains the synthesis hollow out substrate C11 for accommodating interior mold insert.In the present embodiment, the conjunction for accommodating interior mold insert is provided At the sectional view of hollow out substrate C11, can be, but not limited to as shown in figure 28.
Step 304：Bonding agent is applied on synthesis hollow out substrate, obtains smart card；
Bonding agent uniformly can be coated to equidistant strip by automatic coating equipment such as automatic dispensing machine and be accommodated On the surface of the substrate of interior mold insert；The bonding agent covered is carried out smoothing processing using roller.
It should be noted that in order to ensure interior mold insert and synthesize the fitting of hollow out substrate C11, can lead to after step 303 The method for crossing coating bonding agent accommodates the gap between interior mold insert and synthesis hollow out substrate C11.
In the present embodiment, on synthesis hollow out substrate after coating bonding agent, further include：It is pasted on synthesis hollow out substrate Coating；
In the present embodiment, the coating pasted on the surface for the synthesis hollow out substrate C11 for accommodating interior mold insert is suitable Using plate-shaped material made of synthetic resin, raw material can be at least one in PVC, PC, PETG, PET or ABS polyvinyl chloride resin Kind.
In the present embodiment, a kind of coating of smart card is provided, coating may include：First printing pattern layer, The one printing bed of material and the first printing protective layer；The first printing bed of material is located between synthesis hollow out substrate and the first printing pattern layer, First printing pattern layer is located between the first printing bed of material and the first printing protective layer.Coating can also include：Overlay film；Its In, overlay film is located between synthesis hollow out substrate and the first printing bed of material.
When coating specifically includes：When the first printing pattern layer, the first printing bed of material and the first printing protective layer, the first print Brush material layer is located between synthesis hollow out substrate and the first printing pattern layer, and the first printing pattern layer is located at the first printing bed of material and the Between one printing protective layer.
When coating specifically includes：When overlay film, the first printing pattern layer, the first printing bed of material and the first printing protective layer, Overlay film is located between synthesis hollow out substrate and the first printing bed of material, the first printing bed of material be located at overlay film and the first printing pattern layer it Between, the first printing pattern layer is located between the first printing bed of material and the first printing protective layer.
In the present embodiment, a kind of coating is additionally provided, including：Second printing pattern layer and the second printing bed of material, second It is transparent to print the bed of material.The second printing bed of material suitable for using plate-shaped material made of synthetic resin, raw material can be PVC, At least one of PC, PETG, PET or ABS polyvinyl chloride resin.
When coating specifically includes：When the second printing pattern layer and the second printing bed of material, the second printing pattern layer is located at the Between the two printing bed of materials and synthesis hollow out substrate.
When coating specifically includes：When overlay film, the second printing pattern layer and the second printing bed of material, overlay film is located at synthesis hollow out Between substrate and the second printing pattern layer, the second printing pattern layer is located between the second printing bed of material and overlay film.
When coating further includes overlay film, what is pasted on the surfaces synthesis hollow out substrate C11 for accommodating interior mold insert covers Film is plastic foil, suitable for using plate-shaped material made of synthetic resin, raw material can be PVC, PC, PETG, PET or ABS At least one of polyvinyl chloride resin.Paste and need to use drum in coating process, ensure overlay film used can with accommodate interior edge The synthesis hollow out substrate of part gradually contacts, and a large amount of bubbles are will produce when avoiding pasting overlay film.In the overlay film pasted with display mould The transparent state of block R13 and the corresponding regions key-press module R14, so that holder can carry out keyboard input and check display Information.
In the present embodiment, the first printing pattern layer is the figure layer with printed patterns, and the first printing bed of material is for printing The bed of material of printed patterns, the first printing protective layer are the bed of material for protecting the first printing pattern layer.Wherein, the first printing bed of material It is opaque that can be transparent can also be, the first printing protective layer can be all transparent or with the first printed patterns The part of the printed patterns contact of layer is transparent.
In the present embodiment, the second printing pattern layer is the figure layer with printed patterns, and the second printing bed of material is for printing The bed of material of printed patterns.Wherein, it can also be print with the second printing pattern layer that the second printing bed of material, which can be all transparent, The part of brush pattern contacts is transparent.
In the present embodiment, reprint printing technology may be used, printed patterns are printed on the second printing bed of material and included The coating of second printing pattern layer and the second printing bed of material.
In the present embodiment, can also include before step 304：The overlay film on top layer hollow out substrate.
A variety of active and/or passive electronic building brick can be combined in the production technology of the present invention, including：Intelligent the core of the card Piece, RFID chip and antenna, fingerprint Identification sensor, capacitance-resistance, crystal oscillator and chip etc..
The foregoing is only a preferred embodiment of the present invention, but scope of protection of the present invention is not limited thereto, Any one skilled in the art is in technical scope disclosed by the invention, the change or replacement that can be readily occurred in, It should be covered by the protection scope of the present invention.Therefore, protection scope of the present invention should be with scope of the claims Subject to.

Claims (23)

1. a kind of smart card, which is characterized in that including：Synthesis hollow out substrate and the covering being covered on the synthesis hollow out substrate Layer；Interior mold insert is accommodated in the synthesis hollow out substrate；The synthesis hollow out substrate includes：Bottom hollow out substrate, middle level hollow out Substrate and top layer hollow out substrate；The interior mold insert is wrapped in by the closing for synthesizing hollow out substrate and the coating and being constituted In space；The interior mold insert includes interaction circuit module and nonreciprocal circuit module；The nonreciprocal circuit module includes：Power supply Module and control module；
The interactive circuit module includes：Key-press module and display module；
The height of the key-press module and the height of the display module are more than the height of the power module and the control mould The height of block；
The key-press module is located at the void region of the bottom hollow out substrate, the void region of the middle level hollow out substrate and institute In the void region for stating top layer hollow out substrate；
The display module is located at the void region of the bottom hollow out substrate, the void region of the middle level hollow out substrate and institute In the void region for stating top layer hollow out substrate；
The power module is located at least in the void region of the bottom hollow out substrate；
The control module is located at least in the void region of the bottom hollow out substrate.
2. smart card according to claim 1, which is characterized in that the height of the power module and the control module is not Together；
When the height of the power module be more than the control module height when, the power module be at least also located at it is described in In the void region of layer hollow out substrate；
When the height of the control module be more than the power module height when, the control module be at least also located at it is described in In the void region of layer hollow out substrate.
3. smart card according to claim 1, which is characterized in that the control module includes：Circuit board and microcontroller.
4. smart card according to claim 1, which is characterized in that the coating includes：First printing pattern layer, first Print the bed of material and the first printing protective layer；The first printing bed of material is located at the synthesis hollow out substrate and the first printing figure Between pattern layer, first printing pattern layer is located at described first and prints between the bed of material and the first printing protective layer.
5. smart card according to claim 4, which is characterized in that the coating further includes overlay film；The overlay film is located at Between the synthesis hollow out substrate and the first printing bed of material.
6. smart card according to claim 1, which is characterized in that the coating includes：Second printing pattern layer and The two printing bed of materials；Second printing pattern layer is located at described second and prints between the bed of material and the synthesis hollow out substrate；It is described The second printing bed of material is transparent.
7. smart card according to claim 6, which is characterized in that the coating further includes overlay film；The overlay film is located at Between the synthesis hollow out substrate and second printing pattern layer.
8. smart card according to claim 1, which is characterized in that the raw material of the coating be PVC, PC, PETG, At least one of PET or ABS polyvinyl chloride resins.
9. a kind of manufacturing method of smart card, for manufacturing smart card as described in claim 1, which is characterized in that including：
Step s1：Hollow out first substrate, second substrate and third substrate respectively, obtain bottom hollow out substrate, middle level hollow out substrate With top layer hollow out substrate；
Step s2：The bottom hollow out substrate, the middle level hollow out substrate and the top layer hollow out substrate are synthesized, obtained Synthesize hollow out substrate；
Step s3：Interior mold insert is filled into the synthesis hollow out substrate；Step s4：It is applied on the synthesis hollow out substrate viscous Agent is connect, smart card is obtained；
It is described after coating bonding agent, to further include on the synthesis hollow out substrate：It pastes and covers on the synthesis hollow out substrate Cap rock.
10. according to the method described in claim 9, it is characterized in that, the step s1 is specifically included：Using punching, it is bored cut or Person's milling bottom technique, first substrate, the second substrate and the third substrate described in hollow out, obtain the bottom hollow out base respectively Plate, the middle level hollow out substrate and the top layer hollow out substrate.
11. according to the method described in claim 9, it is characterized in that, the step s1 is specifically included：
According to the first default void region, first substrate described in hollow out obtains the bottom hollow out substrate, the bottom hollow out base Plate includes bottom void region；
According to the second default void region, second substrate described in hollow out obtains the middle level hollow out substrate, the middle level hollow out base Plate includes middle level void region；
Void region is preset according to third, third substrate obtains the top layer hollow out substrate, the top layer hollow out base described in hollow out Plate includes top layer void region.
12. according to the method described in claim 9, it is characterized in that, the step s1 is specifically included：
According to the first default void region and the first preset thickness, first substrate described in hollow out obtains the bottom hollow out substrate, The bottom hollow out substrate includes bottom void region；
According to the second default void region and the second preset thickness, second substrate described in hollow out obtains the middle level hollow out substrate, The middle level hollow out substrate includes middle level void region；
Void region and third preset thickness are preset according to third, third substrate obtains the top layer hollow out substrate described in hollow out, The top layer hollow out substrate includes top layer void region.
13. method according to claim 11 or 12, which is characterized in that the step s2 is specifically included：
Using the technique pasted and/or be laminated, engraved according to the bottom void region, the middle level void region and the top layer The size of empty region synthesizes the bottom hollow out substrate, the middle level hollow out substrate and the top layer hollow out substrate, obtains To the synthesis hollow out substrate that can accommodate the interior mold insert.
14. according to the method described in claim 9, it is characterized in that, the step s2 is specifically included：Using stickup and/or layer The technique of pressure synthesizes the bottom hollow out substrate, the middle level hollow out substrate and the top layer hollow out substrate, obtains energy Enough accommodate the synthesis hollow out substrate of the interior mold insert.
15. according to the method described in claim 9, it is characterized in that, described to the bottom hollow out substrate, the middle level hollow out Substrate and the top layer hollow out substrate are synthesized specially：To the bottom hollow out substrate, the middle level hollow out substrate and institute It states top layer hollow out substrate and carries out single sintering or multi-stage synthesis.
16. according to the method described in claim 9, it is characterized in that, the step s3 is specifically included：Using stickup and/or layer The interior mold insert is filled into the synthesis hollow out substrate by the technique of pressure.
17. according to the method described in claim 9, it is characterized in that, further including after the step s3：In the interior mold insert and Bonding agent is filled in gap between the synthesis hollow out substrate.
18. according to the method described in claim 9, it is characterized in that, the coating includes：First printing pattern layer, first Print the bed of material and the first printing protective layer；The first printing bed of material is located at the synthesis hollow out substrate and the first printing figure Between pattern layer, first printing pattern layer is located at described first and prints between the bed of material and the first printing protective layer.
19. according to the method for claim 18, which is characterized in that the coating further includes overlay film；The overlay film is located at Between the synthesis hollow out substrate and the first printing bed of material.
20. according to the method described in claim 9, it is characterized in that, the coating includes：Second printing pattern layer and second The bed of material is printed, the second printing bed of material is transparent；Second printing pattern layer is located at described second and prints the bed of material and institute It states between synthesizing hollow out substrate.
21. according to the method for claim 20, which is characterized in that the coating further includes overlay film；The overlay film is located at Between the synthesis hollow out substrate and second printing pattern layer.
22. according to the method described in claim 9, it is characterized in that, the raw material of the coating are PVC, PC, PETG, PET Or at least one of ABS polyvinyl chloride resins.
23. according to the method described in claim 9, it is characterized in that, before the step s4, further include：It is engraved in the top layer Overlay film is pasted on space base plate.
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WO2017016456A1 (en) * 2015-07-29 2017-02-02 飞天诚信科技股份有限公司 Smart card and manufacturing method therefor
CN105787552B (en) * 2016-03-02 2021-11-19 苏州海博智能系统有限公司 Processing method of intelligent card with keys
CN110033071B (en) * 2019-04-17 2022-08-26 深圳华创兆业科技股份有限公司 Fingerprint identification card and preparation method thereof

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