CN110033071B - Fingerprint identification card and preparation method thereof - Google Patents
Fingerprint identification card and preparation method thereof Download PDFInfo
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- CN110033071B CN110033071B CN201910307201.9A CN201910307201A CN110033071B CN 110033071 B CN110033071 B CN 110033071B CN 201910307201 A CN201910307201 A CN 201910307201A CN 110033071 B CN110033071 B CN 110033071B
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/0716—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising a sensor or an interface to a sensor
- G06K19/0718—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising a sensor or an interface to a sensor the sensor being of the biometric kind, e.g. fingerprint sensors
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/073—Special arrangements for circuits, e.g. for protecting identification code in memory
- G06K19/07309—Means for preventing undesired reading or writing from or onto record carriers
- G06K19/07345—Means for preventing undesired reading or writing from or onto record carriers by activating or deactivating at least a part of the circuit on the record carrier, e.g. ON/OFF switches
- G06K19/07354—Means for preventing undesired reading or writing from or onto record carriers by activating or deactivating at least a part of the circuit on the record carrier, e.g. ON/OFF switches by biometrically sensitive means, e.g. fingerprint sensitive
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07701—Constructional details, e.g. mounting of circuits in the carrier the record carrier comprising an interface suitable for human interaction
- G06K19/07703—Constructional details, e.g. mounting of circuits in the carrier the record carrier comprising an interface suitable for human interaction the interface being visual
- G06K19/07705—Constructional details, e.g. mounting of circuits in the carrier the record carrier comprising an interface suitable for human interaction the interface being visual the visual interface being a single light or small number of lights capable of being switched on or off, e.g. a series of LEDs
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Automation & Control Theory (AREA)
- Computer Security & Cryptography (AREA)
- General Engineering & Computer Science (AREA)
- Credit Cards Or The Like (AREA)
Abstract
The invention provides a fingerprint identification card and a preparation method thereof, wherein the fingerprint identification card comprises an inlay, a surface layer, a middle layer with a first thickness, a hollow frame layer with a second thickness and a bottom layer which are sequentially stacked; the inlay comprises a base layer and a plurality of electronic components which are arranged on the base layer and comprise fingerprint identifiers; the middle layer is provided with a plurality of through holes for accommodating the electronic components; inlay sets up in the cavity frame on cavity frame layer, and first thickness is greater than second thickness, and the surface course is provided with the hole that is used for exposing fingerprint identification ware. According to the technical scheme of the invention, effective fixation can be realized only by filling a proper amount of hot melt adhesive, the inlay is not required to be completely wrapped by the adhesive, the adhesive consumption and the adhesive drying time can be reduced, the production efficiency is improved, and the like.
Description
Technical Field
The invention relates to a non-contact IC card, in particular to a fingerprint identification card and a preparation method thereof.
Background
In the prior art, the manufacture of the fingerprint identification card generally comprises the steps of punching a card with the thickness of 0.8mm out of a frame with the size of an inlay, putting the inlay into the frame, filling glue, and enabling the glue to completely wrap the inlay, wherein the thickness of the glue is the same as the thickness of the outer frame with the thickness of 0.8 mm. The fabric is provided with a hole with the size of a fingerprint identifier, and the fabric is aligned with the inlay and covers the middle material layer filled with the glue. And punching into cards after the gel is solidified. However, the preparation method needs more glue to be filled, and has higher cost; the efficiency of the process is low, and the time for completing the drying-out of each card of filling adhesive needs more than 24 hours because the filling adhesive is thicker. The manufacturing needs to be completed under a specific tooling fixture, so the efficiency is lower; the finished product rate is low, and if the filling glue is not well controlled, bubbles are easily generated, particularly between the surface layer and the glue. And the adhesive force between the surface layer and the middle material layer is not high, the corners are easy to be layered, and the yield is not high.
Disclosure of Invention
In order to solve at least one of the problems, the invention provides a fingerprint identification card and a preparation method thereof, which can realize effective fixation only by filling a proper amount of hot melt adhesive without completely wrapping inlay with adhesive, thereby reducing the adhesive consumption and the adhesive drying time, improving the production efficiency and the like.
The embodiment of the invention discloses a fingerprint identification card, which comprises an inlay, a surface layer, a middle layer, a hollow frame layer and a bottom layer, wherein the surface layer, the middle layer, the hollow frame layer and the bottom layer are sequentially stacked; the inlay comprises a base layer and a plurality of electronic components which are arranged on the base layer and comprise fingerprint identifiers; the middle layer is provided with a plurality of through holes for accommodating the electronic components; inlay sets up in the cavity frame on cavity frame layer, first thickness is greater than second thickness, the surface course is provided with and is used for exposing fingerprint identification ware's hole.
Further, the electronic component comprises an LED lamp.
Further, the intermediate layer is the same thickness as the fingerprint identifier.
Further, the base layer and the hollow frame layer have the same thickness.
The invention also provides a preparation method of the fingerprint identification card, which comprises the following steps:
processing a plurality of through holes on the intermediate material with the first thickness to obtain an intermediate layer;
processing a hollow frame on a middle material with a second thickness to obtain a hollow frame layer, wherein the first thickness is larger than the second thickness;
processing the intermediate layer, the hollow frame layer and an inlay to form a composite middleware, wherein the inlay comprises a base layer and a plurality of electronic components which are arranged on the base layer and comprise fingerprint identifiers, the base layer is embedded into the hollow frame of the hollow frame layer in the composite middleware, and the electronic components are respectively accommodated in the through holes of the intermediate layer;
laminating surface course, compound middleware and bottom after coincide in proper order, the surface course is provided with and is used for exposing fingerprint identification ware's hole, the basic unit next-door neighbour the bottom.
Further, the processing the intermediate layer, the hollow frame layer and the inlay to form the composite intermediate member comprises:
after the intermediate layer and the hollow frame layer are overlapped, inlay is embedded into the hollow frame of the hollow frame layer, and the plurality of electronic components are respectively accommodated in the plurality of through holes of the intermediate layer;
and filling glue in the through holes to form the composite intermediate piece.
Further, the base layer and the hollow frame layer have the same thickness; the thickness of the middle layer is the same as that of the fingerprint recognizer.
Further, the preparation of the surface layer comprises the following steps: forming a white coating layer on the transparent material; and forming a colorful pattern on the white coating layer, and then performing clearance at a position corresponding to the fingerprint identifier to form the hole.
Further, the electronic component comprises an LED lamp, and a window level for the LED lamp is reserved when the white paint layer is formed.
Further, cutting is performed after the lamination to obtain the fingerprint identification card.
According to the technical scheme, the interlayer and the hollow frame layer with different thicknesses are arranged, the inlay is arranged in the hollow frame, the electronic component of the inlay is arranged in the through hole of the interlayer, effective fixation can be achieved only by filling a proper amount of hot melt adhesive into the hollow frame and the through hole, the inlay is not required to be completely wrapped by the adhesive, the adhesive consumption and the adhesive drying time can be reduced, and the production efficiency is improved.
Drawings
Fig. 1 is a schematic structural diagram of a fingerprint identification card in embodiment 1;
FIG. 2 is a first flowchart of a method for manufacturing a fingerprint identification card according to embodiment 2;
fig. 3 is a second flowchart of the method for manufacturing the fingerprint identification card in embodiment 2.
Description of the main element symbols:
1-surface layer, 2-middle layer, 3-hollow frame layer, 4-bottom layer, 5-base layer, 6-hollow frame, 7-hole, 8-through hole, 9-fingerprint recognizer and 10-electronic component.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present invention without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "length," "width," "thickness," "lower," "front," "rear," "left," "right," "face," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present invention and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and thus should not be construed as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
Example 1
As shown in fig. 1, the present embodiment provides a fingerprint identification card, which includes an inlay, and a surface layer 1, an intermediate layer 2 having a first thickness, a hollow frame layer 3 having a second thickness, and a bottom layer 4, which are sequentially stacked, wherein the first thickness is greater than the second thickness.
In this embodiment, the inlay includes a base layer 5 and a plurality of electronic components 10 including a fingerprint identifier 9, which are disposed on the base layer 5; the intermediate layer 2 is provided with a plurality of through holes 8 for accommodating the electronic components 10; the inlay is arranged in the hollow frame 6 of the hollow frame layer 3; the surface layer 1 is provided with a hole 7 used for exposing the fingerprint identifier 9.
In this embodiment, the inlay is manufactured through a series of processes such as positioning, punching, winding, and attaching. Specifically, the positioning and punching are to punch a plurality of through holes 8 which meet the specification of a fingerprint identification card chip and the specification of a fingerprint identifier 9 on the antenna material layer; the winding comprises the steps that a plurality of antenna coils are fixed on the antenna material layer, and antenna wire ends are arranged at the corresponding positions of the through holes; the surface mounting means that a fingerprint identification card chip and a fingerprint identifier 9 are mounted and attached on the through hole 8, and welding points of the surface mounting means correspond to the positions of the antenna wire ends one by one and are fixed in a butt welding mode.
In the present embodiment, a plurality of through holes 8 are obtained by performing clearance at predetermined positions of the intermediate layer 2, wherein each through hole 8 can be used to accommodate a plurality of electronic components 10 provided on the base layer 5. Meanwhile, the hollow frame layer 3 is evacuated to obtain the hollow frame 6, wherein the hollow frame 6 is used for setting the inlay. Preferably, the thickness of the base layer 5 is the same as the thickness of the hollow frame layer 3. Exemplarily, when the thickness of the base layer 5 is 0.1mm, the thickness of the hollow frame layer 3 is also 0.1mm, and the same thickness can reduce the filling amount of the hot melt adhesive.
It will be appreciated that the predetermined positions described above correspond to the positions of the electronic components 10 on the base layer 5 embedded in the hollow frame layer 3, in other words, when the base layer 5 containing the electronic components 10 is embedded in the hollow frame 6, the electronic components 10 will be able to be aligned and accommodated in the through holes 8 of the intermediate layer 2. Alternatively, pvc material or the like may be used for the intermediate layer 2 and the hollow frame layer 3.
In this embodiment, the plurality of electronic components 10 may include a fingerprint identification card chip, a fingerprint identifier 9, and the like. Preferably, the thickness of the intermediate layer 2 is equal to the thickness of the fingerprint identifier 9. In this way, when each electronic component 10 is accommodated in the intermediate layer 2, the fingerprint identifier 9 will be located in the same plane as the intermediate layer 2, while the other electronic components 10 are all located at a lower height than the plane of the intermediate layer 2. Typically, the thickness of the other electronic components 10 will be less than the thickness of the fingerprint identifier 9. The thickness of the fingerprint sensor 9 is 0.7mm, the thickness of the fingerprint sensor chip is 0.6mm, and the thickness of the intermediate layer 2 is set to 0.7mm for the thickest fingerprint sensor 9. It is understood that this effectively prevents the electronic component 10 including the fingerprint identifier 9 and the like from being crushed at the time of lamination, thereby functioning as a protection device.
Further, the electronic component 10 may further include an LED lamp. Exemplarily, the LED lamp may be used to indicate whether the fingerprint recognition is successful.
In this embodiment, the surface layer 1 may be made of a thinner transparent material printed with white color, for example, a transparent material of 0.15 mm; the bottom layer 4 may be made of the same material as the top layer 1, for example, 0.1mm white material may be used. Optionally, color patterns and the like are printed on the white material. In order to facilitate the use of the fingerprint identifier 9, the surface layer 1 is also spaced apart from the corresponding position of the fingerprint identifier 9 to form a hole 7, so that a user can perform fingerprint identification through the hole 7. Of course, an LED light window level may be reserved on the surface layer 1, so that a user can check or the device can detect whether the fingerprint identification is successful or not.
The fingerprint identification card that this embodiment provided, through setting up intermediate level 2 and hollow frame layer 3, only need can realize effectively fixedly at the hollow frame 6 and the through-hole 8 of the basic unit 5 that has held inlay and electronic components 10 in filling in proper amount hot melt adhesive, need not to let and glue and wrap up inlay completely, reduced the use amount of gluing, the cost is reduced, and reduced and filled to glue and accomplished the dry required time that passes through, improve production efficiency.
Example 2
Referring to fig. 2, the present embodiment provides a method for preparing a fingerprint identification card to obtain the fingerprint identification card of embodiment 1. Specifically, the preparation method comprises the following steps:
step S210: and processing a plurality of through holes on the middle material with the first thickness to obtain the middle layer.
Step S220: and processing a hollow frame on the intermediate material with the second thickness to obtain a hollow frame layer, wherein the first thickness is greater than the second thickness.
Exemplarily, line position diagrams can be printed on the two intermediate materials in advance to respectively determine the arrangement positions of the through hole and the hollow frame, and then the laser cutting process or the corresponding die or the like is used for performing the space avoidance process. In this embodiment, the obtained intermediate layer and hollow frame layer correspond to those of embodiment 1, and their structures and functions are the same, so that they are not described in detail herein.
It can be understood that, compared with the prior art, the present embodiment can effectively improve the efficiency by using the laser cutting process or using the corresponding die to avoid the positions of the electronic components. In addition, batch production can be effectively carried out under the condition that the number of the tool fixtures is not increased, and therefore mass production efficiency is greatly improved.
Step S230: and processing the middle layer, the hollow frame layer and the inlay to form a composite middleware, wherein the inlay comprises a base layer and a plurality of electronic components which are arranged on the base layer and comprise fingerprint identifiers.
For the above step S230, as shown in fig. 3, one possible implementation scheme includes the following sub-steps:
substep S231: and overlapping the intermediate layer and the hollow frame layer.
Substep S232: embedding the inlay into the hollow frame of the hollow frame layer, and enabling the plurality of electronic components to be respectively accommodated in the plurality of through holes of the intermediate layer.
Substep S233: and filling glue in the through hole to form the composite intermediate piece.
Illustratively, a suitable amount of hot melt adhesive filling and bonding may be performed using a glue gun or like tool.
As an alternative embodiment, in the sub-steps S231 and S232, the inlay may be first inserted into the hollow frame of the hollow frame layer, and then the inlay is stacked with the intermediate layer, so that the electronic components are respectively accommodated in the through holes of the intermediate layer.
It can be understood that because the use of the hot melt adhesive can be reduced to the minimum by adopting the composite middleware obtained by the steps, the inlay is not required to be completely wrapped by the adhesive, compared with the prior art, the drying time of the adhesive can be greatly shortened, the production efficiency is improved, and because the cost of the hot melt adhesive is reduced, the mass production cost can be greatly reduced, and the like. In addition, since bubbles are easily generated if the control is not good during the underfill process, and the number of the underfill area is small in the embodiment, defective products due to the underfill can be effectively controlled, and the yield and the like can be greatly improved.
Step S240: and laminating the surface layer, the composite intermediate piece and the bottom layer after sequentially overlapping.
In this embodiment, the surface layer is provided with the hole that is used for exposing fingerprint identification ware, the basic unit is close to the bottom. Exemplarily, the preparation process of the surface layer comprises the following steps: forming a white coating layer on the transparent material; and forming a colorful pattern on the white coating layer, and then carrying out clearance at a position corresponding to the fingerprint identifier to form the hole.
Optionally, the electronic component further includes an LED lamp, and a window position for the LED lamp is set aside when the white paint layer of the surface layer is formed.
It can be understood that, since the surface layer and the bottom layer can be printed by using lines, the printing position is mainly processed during processing, and the NFC card is produced based on the manufacturing process of the conventional NFC card, so that the technical requirements on operators can be reduced, the NFC card is more applicable, and the like.
Further, the method for manufacturing the fingerprint identification card further comprises a step S250 of cutting after the laminating to obtain the fingerprint identification card.
It is understood that the middle layer, the hollow frame layer, the surface layer and the bottom layer of this embodiment correspond to the structures of the fingerprint identification card in embodiment 1, and the functions and structures thereof are the same. The alternatives described in embodiment 1 are also applicable to this embodiment, and therefore will not be described in detail here.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention. It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present invention, and shall cover the scope of the present invention.
Claims (7)
1. The fingerprint identification card is characterized by comprising an inlay, a surface layer, a middle layer, a hollow frame layer and a bottom layer, wherein the surface layer, the middle layer, the hollow frame layer and the bottom layer are sequentially stacked; the inlay comprises a base layer and a plurality of electronic components which are arranged on the base layer and comprise fingerprint identifiers;
the middle layer is provided with a plurality of through holes for accommodating the electronic components;
the inlay is arranged in a hollow frame of the hollow frame layer, the first thickness is larger than the second thickness, and the surface layer is provided with a hole for exposing the fingerprint identifier; wherein the thickness of the base layer is the same as that of the hollow frame layer, and the thickness of the middle layer is the same as that of the fingerprint identifier.
2. The card of claim 1, wherein the electronic components comprise LED lights.
3. A method for preparing a fingerprint identification card is characterized by comprising the following steps:
processing a plurality of through holes on the intermediate material with the first thickness to obtain an intermediate layer;
processing a hollow frame on a middle material with a second thickness to obtain a hollow frame layer, wherein the first thickness is larger than the second thickness;
processing the intermediate layer, the hollow frame layer and the inlay to form a composite middleware, wherein the inlay comprises a base layer and a plurality of electronic components which are arranged on the base layer and comprise fingerprint identifiers, the base layer is embedded into the hollow frame of the hollow frame layer in the composite middleware, and the electronic components are respectively accommodated in the through holes of the intermediate layer;
laminating a surface layer, a composite intermediate part and a bottom layer after being sequentially overlapped, wherein the surface layer is provided with a hole for exposing the fingerprint identifier, and the base layer is close to the bottom layer;
wherein the base layer and the hollow frame layer are the same in thickness; the thickness of the middle layer is the same as that of the fingerprint recognizer.
4. The method for preparing the fingerprint identification card according to the claim 3, wherein the processing the middle layer, the hollow frame layer and the inlay to form the composite middleware comprises:
after the intermediate layer and the hollow frame layer are overlapped, inlay is embedded into the hollow frame of the hollow frame layer, and the plurality of electronic components are respectively accommodated in the plurality of through holes of the intermediate layer;
and filling glue in the through hole to form the composite intermediate piece.
5. The method of claim 3, wherein the preparing of the surface layer comprises: forming a white coating layer on the transparent material; and forming a colorful pattern on the white coating layer, and then carrying out clearance at a position corresponding to the fingerprint identifier to form the hole.
6. The fingerprint identification card preparation method of claim 5, wherein the electronic component comprises an LED lamp, and a window level for the LED lamp is set aside when the white paint layer is formed.
7. The fingerprint identification card preparation method according to claim 5,
cutting after the laminating to obtain the fingerprint identification card.
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| CN201910307201.9A CN110033071B (en) | 2019-04-17 | 2019-04-17 | Fingerprint identification card and preparation method thereof |
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| CN201910307201.9A CN110033071B (en) | 2019-04-17 | 2019-04-17 | Fingerprint identification card and preparation method thereof |
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| CN112672536A (en) * | 2020-12-29 | 2021-04-16 | 江苏恒宝智能系统技术有限公司 | Fingerprint identification card and preparation method thereof |
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| Title |
|---|
| Efficient fingerprint matching on smart cards for high security and privacy in smart systems;Nedjah Nadia等;《Information Sciences》;20190430;第622-639页 * |
| 新品技术;无;《金卡工程》;20070630(第06期);第11-13页 * |
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| Publication number | Publication date |
|---|---|
| CN110033071A (en) | 2019-07-19 |
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