JP7035397B2 - Non-contact IC card - Google Patents

Description

The present invention relates to a non-contact IC card having an antenna made of a coil wire and an inlet sheet used for the non-contact IC card.

Non-contact IC cards are used in various applications such as financial systems, transportation systems, distribution systems, and amusement systems.

FIG. 2 is an explanatory diagram illustrating a typical typical of such a conventional non-contact type IC card 100', in which an IC chip is mounted on a substrate 4 of an IC module and the mounted IC chip is molded with a resin. An example is shown in which the IC module 1 composed of the mold portion 3 of the IC module protected by the above is used.

FIG. 2A is a perspective view of the non-contact IC card from the upper surface, and illustrates the configuration of the antenna 2 including the IC module 1 and the coil wire. The antenna 2 made of a coil wire is provided along a portion near the outer periphery of the peripheral edge portion of the non-contact IC card 100'because the larger the area surrounded by the antenna 2 made of the coil wire, the higher the sensitivity. .. The number of turns of the antenna 2 made of coil wires is determined by the frequency used for communication.

FIG. 2B is a cross-sectional view of an inlet sheet 10 ′ consisting of an antenna 2 composed of an IC module 1 and a coil wire in the cross section of the AA ′ cutting line of FIG. 2A. The substrate portion 4 of the IC module is housed in the opening portion 11 ′ of the laminate in which the white sheet a5 ′ in which the opening portion 11 ′ is formed according to the size of the substrate portion 4 of the IC module and the transparent resin sheet b6 ′ are laminated. There is. This opening 11'not only enables the positioning of the IC module 1, but also has a function of eliminating the unevenness of the IC module 1 when the sheet is thermally laminated on the front and back surfaces of the laminated body. The surface of the card can be smoothed.

After the white sheet a5'and the transparent resin sheet b6' are laminated, the antenna 2 made of a coil wire is press-fitted or embedded in the white sheet a5'. Since the diameter of the coil wire and the white sheet a5'are almost the same thickness, the transparent resin sheet b6'acts as a cushion when the antenna 2 made of the coil wire is hot pressed and pressed into the white sheet a5'. The antenna 2 made of a coil wire is not damaged, and pressing or burying can be performed with a high yield.

Here, when the antenna 2 made of the coil wire is press-fitted into the white sheet a5', the antenna 2 made of the coil wire is pressed into the white sheet a5'by pressing the antenna 2 made of the coil wire against the white sheet a5'. Refers to pushing into (also called press fitting). In order to enable press-fitting, the white sheet a5'is heated above the softening point. The press-fitted state refers to a state in which a part of the antenna 2 made of a coil wire is pushed into the white sheet a5', or a state in which the antenna 2 made of a coil wire is completely pushed into the white sheet a5', and is buried. The “state” refers to a state in which all the antennas 2 made of coil wires are pushed into the white sheet a5 ′, and the antenna 2 made of coil wires is not exposed on the surface of the white sheet a5 ′.

In this way, the antenna 2 made of a coil wire is press-fitted or embedded on the white sheet a5'side of the laminated body of the white sheet a5'and the transparent resin sheet b6', but the antenna 2 is made of the coil wire in the state of being press-fitted or embedded. A transparent resin sheet b6'is used so that it is possible to visually inspect whether or not the antenna 2 is normal.

FIG. 2 (c) is a cross-sectional view of the non-contact IC card 100'in the AA'cutting line of (a).
When the visual inspection result of the inlet sheet 10'shown in FIG. 2B is good, as the next step, the white sheet b7', the white sheet c8', and the white sheet d9' are heated to the inlet sheet 10'. It is laminated and made into a card (see FIG. 2 (c)). At this time, the unevenness is alleviated by accommodating the protrusion of the IC module 1 in the portion of the white sheet b7'corresponding to the mold portion 3 of the IC module (the same position as the opening 11' of the white sheet a5'). An opening 12'is provided to smooth the surface of the non-contact IC card 100'.

In such a non-contact IC card 100', there is a demand for a card in which a red, blue, green or black resin sheet is used instead of the white sheet a5' to enhance the design of the card end face. However, especially when a black resin sheet is used, there is a problem that it is difficult to visually inspect whether or not the antenna 2 made of a press-fitted or embedded coil wire is normally press-fitted or embedded.

Therefore, in the non-contact IC card 100'equipped with the antenna 2 made of the coil wire whose design of the end face of the card is enhanced by using the black resin sheet, the antenna 2 made of the press-fitted or embedded coil wire is normally press-fitted or embedded. It was not possible to visually inspect whether it was done. Therefore, there is a problem that the antenna 2 made of the press-fitted or embedded coil wire is damaged and the defective inlet sheet 10'is flown to the next process. Therefore, there has been a long-awaited technique capable of visually inspecting whether or not the antenna 2 made of the press-fitted or embedded coil wire is normally press-fitted or embedded at the stage of producing the inlet sheet 10'.

We investigated such prior art, but in a non-contact IC card equipped with an antenna made of coil wire whose end face of the card is enhanced by using a black resin sheet, the antenna made of coil wire press-fitted or embedded is normal. No technology could be found that would allow visual inspection of whether it was buried in.

As the most similar technique, Patent Document 1 describes a laminated card that produces the same effect as when a black base material is used by making the card base material a transparent laminated body without using a black base material. The challenge is to provide a laminated card that makes the end face of the card look black without the use of a black substrate, a core sheet composed of one or more transparent substrates, and the top and top surfaces of the core sheet. A laminated card is disclosed characterized in that at least a light shielding print layer is formed on the lower surface. However, this technique relates to a card lamination configuration that enables inexpensive production of a laminated card capable of making the card end face appear black by a light shielding printing layer without using an expensive black resin sheet. There is no description about making it possible to visually inspect a state in which an antenna made of an IC module or a coil wire is press-fitted or embedded in a resin sheet.

Further, Patent Document 2 has an object of providing a card in which the end face of a card looks colored without using a white sheet or a colored sheet for the core layer and the overcoat layer, and both sides of the core layer made of a transparent sheet. A card is disclosed in which an oversheet layer made of a transparent sheet is provided, and a transparent colored printing layer containing an organic pigment is laminated between both sides of a core layer and upper and lower oversheet layers. This technique relates to a laminated card structure that makes it possible to inexpensively provide a laminated card that can make the end face of a card appear to be colored by a transparent colored printing layer without using an expensive colored sheet. Although there is a description that an IC card is assumed, there is no description about an antenna made of a coil wire, and it is considered that the technology is different from that of a non-contact IC card equipped with an antenna made of a coil wire.

Therefore, in a non-contact IC card equipped with an antenna made of coil wire that makes the end face of the card look colored or black to improve the design, the antenna made of coil wire is normally press-fitted or embedded in the sheet. There has been a long-awaited technology that enables visual inspection to see if it has been done.

Japanese Unexamined Patent Publication No. 2009-184171 Japanese Patent No. 6069930

In view of the above circumstances, in the present invention, in a non-contact IC card provided with an antenna made of a coil wire whose end face is colored or made to look black to enhance the design, the antenna made of the coil wire is normally a resin sheet. It is an object of the present invention to provide an inlet of a non-contact IC card capable of visually inspecting whether or not it is press-fitted or embedded in a wire.

As a means for solving the above problems, the first aspect of the present invention is a non-contact IC card including an IC module, an antenna made of a coil wire, and a transparent sheet, wherein the transparent sheet is at least. It is a laminated body composed of two layers of transparent resin sheets, and the transparent resin sheet of the outermost layer on one surface of the laminated body is provided with an opening capable of accommodating an IC module, and the transparent resin sheet is provided. A non-contact IC card in which a colored resin sheet is provided on the front and back surfaces of an inlet sheet that includes a part or all of the thickness of the coil wire, and is provided on the IC module side of the inlet sheet. The colored resin sheet of the first layer is provided with an opening that can accommodate and flatten the IC module in accordance with the opening provided in the transparent resin sheet of the inlet sheet, and is provided with the opening of the first layer. The non-contact IC card is characterized in that at least one layer of the colored resin sheet is provided on the colored resin sheet .
Here, the thickness direction of the coil wire refers to the thickness of the antenna made of the coil wire arranged on the transparent resin sheet in the direction parallel to the thickness direction of the transparent resin sheet.

An antenna made of a coil wire and an IC module connected to the coil wire are placed in the opening on the transparent sheet, which is a laminate of the transparent resin sheet and the other transparent resin sheet having an opening capable of accommodating the IC module. After storing and arranging, an inlet sheet is produced by applying hot pressure to press-fit the coil wire into the transparent resin sheet.

In the inlet sheet manufactured in this way, whether or not the antenna made of the coil wire is normally press-fitted or embedded or damaged can be visually recognized from the back surface of the inlet sheet. It is possible to judge the quality of the wire. Therefore, it is possible to send only non-defective products to the next process. Here, the back surface refers to the surface opposite to the side on which the antenna made of the coil wire is press-fitted.

The second aspect is the non-contact IC card according to claim 1, wherein the colored resin sheet is a black resin sheet .

The inlet sheet is a laminated body of transparent resin sheets, but the side end faces of the non-contact IC card produced by laminating a colored resin sheet or a black resin sheet on the front and back surfaces thereof are the same as the colored resin sheets. It becomes possible to provide a non-contact IC card with a high degree of design because it becomes visible in the color or black color of.

The inlet sheet of the present invention is formed on one of the transparent resin sheets, which is a laminate of a transparent resin sheet and the other transparent resin sheet having an opening formed in a size capable of accommodating an IC module. Since the antenna made of coil wire is press-fitted or embedded, the state in which the antenna made of coil wire is press-fitted or embedded is visually observed from the transparent resin sheet opposite to the transparent resin sheet in which the antenna made of coil wire is press-fitted or embedded. It is possible. Therefore, it is possible to visually inspect whether the antenna made of the coil wire is normal or damaged. Further, it is possible to select only normal inlets by visual inspection to produce a non-contact IC card.

An explanatory view illustrating the non-contact IC card of the present invention, (a) is a view seen from above, and (b) is an explanatory view showing a configuration example of an antenna composed of an IC module and a coil wire. Of the cross sections in the AA'cutting line of a), the cross-sectional view showing the cross section of the antenna composed of the IC module and the coil wire is shown in the center, and (c) is the non-contact IC in the AA' cutting line of (a). It is a cross-sectional view of a card. An explanatory view illustrating a conventional non-contact IC card, (a) is a view seen from above, and an explanatory view showing a configuration example of an antenna composed of an IC module and a coil wire, (b) is (a). ), Of the cross sections in the AA'cutting line, a cross-sectional view showing the cross section of the antenna composed of the IC module and the coil wire as the center, (c) is the non-contact IC card in the AA' cutting line in (a). It is a cross-sectional view of.

<Inlet sheet>
The inlet sheet used for the non-contact IC card of the present invention is a non-contact IC card inlet sheet including an IC module, an antenna made of a coil wire, and a transparent sheet.

The transparent sheet is a laminated body composed of at least two layers of transparent resin sheets, and the transparent resin sheet on the outermost layer of one surface of the laminated body is provided with an opening capable of accommodating an IC module at the same time. , The transparent resin sheet covers a part or all of the thickness of the coil wire.
Here, the thickness of the coil wire means the coil wire in the direction parallel to the thickness direction of the transparent resin sheet when the coil wires do not overlap, as in the coil wire antenna 2 illustrated in FIG. 1 (b). It is the same as the thickness of. When the coil wires have an overlap, it refers to the thickness of the coil wire in the direction parallel to the thickness direction of the transparent resin sheet determined by the overlap.

The IC module includes a substrate portion of the IC module and a molded portion of the IC module in which the IC chip is resin-molded, and the IC module is arranged in the opening, and the height at which the IC module protrudes. Has been relaxed.

The antenna consisting of coil wires is press-fitted inward from the surface of the other transparent resin sheet with openings, either partially exposed from the transparent resin sheet or entirely press-fitted into the transparent resin sheet. It is buried or included.

Next, the inlet 10 of the non-contact IC card of the present invention will be described in more detail with reference to FIGS. 1 (a) and 1 (b).
FIG. 1A is an example of a perspective view of the non-contact IC card 100 of the present invention viewed from above, and is an explanatory view showing the upper surface of the inlet sheet 10 inside through perspective. The inlet sheet 10 includes an antenna 2 composed of an IC module 1 and a coil wire. The antenna 2 made of a coil wire is provided along the vicinity of the outer periphery of the inlet sheet 10.

FIG. 1B is an explanatory diagram illustrating a cross section of the inlet sheet 10 when the non-contact IC card 100 of the present invention is cut along the cutting line AA'.
The other transparent resin sheet a5 is laminated on the transparent resin sheet b6. In the transparent resin sheet a5, an opening 11 corresponding to the size of the IC module 1 provided with the mold portion 3 of the IC module is formed on the substrate portion 4 of the IC module, and the IC module 1 is an IC module. The substrate portion 4 of the above is stored on the transparent resin sheet b6 side.

Further, an antenna 2 made of a coil wire is press-fitted from the surface of the transparent resin sheet a5. By press-fitting, all the thickness of the antenna 2 made of the coil wire in the direction parallel to the thickness direction of the transparent resin sheet a5 of the antenna 2 made of the coil wire may be embedded in the transparent resin sheet a5. However, a part of the antenna 2 made of the coil wire may be exposed on the surface of the transparent resin sheet a5. On the board portion 4 of the IC module, the antenna 2 composed of the IC module 1 and the coil wire is electrically connected to the IC module 1, and the IC module 1 can communicate with an external communication device. The IC module 1 includes a mold portion 3 of an IC module in which an IC chip mounted on a substrate portion 4 of the IC module is resin-molded with a mold resin.

As described above, in the inlet sheet 10 of the present invention, the resin sheet in which the antenna 2 made of the coil wire is press-fitted or embedded is made of the transparent transparent resin sheet a5, so that the antenna 2 made of the coil wire is press-fitted. It is possible to visually check the state. Therefore, whether the inlet sheet 10 is in a normal state or an abnormal state can be visually inspected from the position a shown in FIG. 1 (b), and only good products can be sent to the next process. Become.

<Non-contact IC card>
Next, the non-contact IC card of the present invention will be described with reference to the drawings.
FIG. 1C illustrates a cross-sectional view when the non-contact IC card 100 of the present invention is cut along the cutting line AA'.
The black resin sheet b8 laminated on the transparent resin sheet b6 side of the inlet sheet 10 of the non-contact IC card of the present invention exemplified in FIG. 1 (b) is laminated. Further, a black resin sheet a7 laminated on the transparent resin sheet a5 side is provided.

Further, the black resin sheet c9 is laminated on the black resin sheet a7. The black resin sheet a7 is provided with an opening 12 in line with the opening 11 provided in the transparent resin sheet a5. The opening 12 forms a space that can accommodate the molded portion 3 of the IC module, and is smoothed by accommodating the IC module that is a convex portion therein, so that unevenness is formed on the surface of the non-contact IC card 100. Has a role of suppressing. Therefore, the thickness of the black resin sheet a7 is the sum of the thickness of the transparent resin sheet a5 and the height of the IC module 1 (the sum of the thickness of the substrate portion 4 of the IC module and the height of the mold portion 3 of the IC module). Value) is selected to be equivalent.

As described above, the inlet sheet 10 is composed of a transparent sheet which is a laminated body of transparent resin sheets, but since the black resin sheet is laminated on the front and back sides thereof, the side of the completed non-contact IC card 100 The end face looks black. If the sheet laminated on the inlet sheet 10 is a colored resin sheet, it can be a non-contact IC card that looks like the color of the colored resin sheet.

The non-contact IC card described above has been described by taking the case where a black resin sheet is laminated on the front and back surfaces of the inlet sheet 10, but instead of the black resin sheet, a colored resin sheet colored in an arbitrary color is used. You may. If a black resin sheet is used, it becomes a non-contact IC card with black front and back surfaces and side end faces, and if a colored resin sheet of any color is used, a non-contact IC with front and back surfaces and side end faces of that color is used. It becomes a card and can enhance the design.

<Manufacturing method of inlet sheet and non-contact IC card>
(Manufacturing method of inlet sheet)
The manufacturing method of the inlet sheet 10 illustrated in FIG. 1B will be described.
First, the transparent resin sheet a5 and the transparent resin sheet b6 are prepared. Further, an IC module 1 having an IC module board portion 4 and an IC module mold portion 3 and an antenna 2 made of a coil wire are electrically connected to each other. This may be manufactured in a separate process or may be purchased from the outside.

An opening 11 for accommodating the IC module 1 is formed in the transparent resin sheet a5. The means for forming the opening 11 is not particularly limited as long as it is a means for forming the opening in the transparent resin sheet a5 which is a resin sheet. For example, punching using a punch, a punch, a Thomson blade, a die, or the like can be preferably used.

Examples of the material of the transparent resin sheet a5 and the transparent resin sheet b6 include resins made of polyethylene, polyvinyl chloride, polyester, polypropylene, polystyrene, polyacrylic acid ester, polycarbonate, cellulose diacetate, polyamide and the like.

The thickness of these transparent sheets may be selected so as to keep the standard thickness of the non-contact IC card, 0.76 mm. For example, the thickness of each of the transparent resin sheet a5 and the transparent resin sheet b6 may be selected from the range of 0.10 to 0.50 mm.

Next, an adhesive layer is applied to the surface on the side where the transparent resin sheet a5 and the transparent resin sheet b6 are laminated, and then both are laminated.

Next, on the transparent resin sheet a5, the substrate portion 4 of the IC module of the IC module is housed in the opening 11, and the antenna 2 made of a coil wire is arranged along the peripheral edge portion of the inlet sheet 10. ..

Next, the antenna 2 made of the coil wire is press-fitted into the transparent resin sheet a5. As a means for press-fitting, a method of hot-pressing the antenna 2 made of a coil wire by using a die in which pressure is not applied to the IC module can be mentioned.

By strengthening the heat pressing conditions (high temperature, high pressure, long time), the antenna 2 substantially made of a coil wire can be press-fitted into the transparent resin sheet a5 and embedded. When the heat pressing conditions are weakened, as illustrated in FIG. 1B, a part of the antenna 2 made of the coil wire protrudes from the surface of the transparent resin sheet a5. Any state may be used as long as a part of the antenna 2 made of the coil wire is press-fitted into the transparent resin sheet a5 and fixed.
The inlet sheet 10 can be manufactured as described above. Although described as an inlet sheet provided with one inlet for convenience of explanation, in normal production, an inlet sheet having multiple inlets is produced.

(Manufacturing method of non-contact IC card)
Next, the manufacturing method of the non-contact IC card having the inlet sheet 10 as the core layer will be described with respect to the manufacturing method in the case of the layer configuration exemplified in FIG. 1 (c). Here, the case where a black resin sheet is used will be described, but the same applies even if a colored resin sheet colored in any color is used.

First, the opening 12 is formed in the black resin sheet a7. The means for forming the opening 12 is not particularly limited as long as it is a means for forming the opening in the black resin sheet a7 which is a resin sheet. For example, punching using a punch, a punch, a Thomson blade, a die, or the like can be preferably used.

Next, a PUR (Poly Urethane Reactive) hot melt adhesive layer is applied to both sides of the inlet sheet 10 and both sides of the black resin sheet a7.

Further, the PUR-based hot melt adhesive layer is applied to the side of the black resin sheet b8 facing the inlet sheet 10 and the side of the black resin sheet c9 facing the black resin sheet a7.

In this way, the inlet sheet 10 coated with the hot melt adhesive, the black resin sheet a7, the black resin sheet b8, and the black resin sheet c9 are laminated with the PUR-based hot melt adhesive layers facing each other. ..

Next, after mounting on the vacuum heat press device, exhaust is performed and then heat pressing is performed. By this step, the laminate in which the inlet sheet 10, the black resin sheet a7, the black resin sheet b8, and the black resin sheet c9 are bonded via the PUR-based hot melt adhesive layer is completed.

When manufactured with multiple impositions, the non-contact IC card of the present invention can be produced by punching each non-contact IC card into individual pieces.

Although the case where the PUR-based hot melt adhesive layer is used as the adhesive layer has been described as an example, the adhesive layer is not limited to this. Further, in FIGS. 1 (b) and 1 (c), the adhesive layer is not shown for the sake of simplicity.

1 ... IC module 2 ... Antenna made of coil wire 3 ... IC module mold part 4 ... IC module substrate part 5 ... Transparent resin sheet a
5'... White resin sheet a
6 ... Transparent resin sheet b
6'... Transparent resin sheet b
7 ... Black resin sheet a
7'... White resin sheet b
8 ... Black resin sheet b
8'... White resin sheet c
9 ... Black resin sheet c
9'... White resin sheet d
10, 10'... Inlet sheet 11 ... (transparent resin sheet a) opening 11'... (white resin sheet a) opening 12 ... (transparent resin sheet b) opening 12'... ´ ・ ・ ・ Opening 100, 100 ′ (of white resin sheet b) ・ ・ ・ Non-contact IC card

Claims (2)

A non-contact IC card equipped with an IC module, an antenna made of coil wires, and a transparent sheet.
The transparent sheet is a laminated body composed of at least two layers of transparent resin sheets, and the transparent resin sheet of the outermost layer on one surface of the laminated body is provided with an opening capable of accommodating an IC module. The transparent resin sheet is a non-contact IC card in which colored resin sheets are provided on the front and back surfaces of an inlet sheet that includes a part or all of the thickness of the coil wire, and the IC module of the inlet sheet. The first-layer colored resin sheet provided on the side is provided with an opening that can accommodate and flatten the IC module in accordance with the opening provided in the transparent resin sheet of the inlet sheet. A non-contact IC card characterized in that at least one layer of colored resin sheet is provided on the first layer of colored resin sheet. The non-contact IC card according to claim 1 , wherein the colored resin sheet is a black resin sheet.

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