JP2019051616A - Inlet sheet and contactless ic card - Google Patents

Abstract

To provide an inlet of a contactless IC card that enables visual inspection as to whether an antenna of an embedded coil wire is normally embedded, in the contactless IC card comprising the antenna of the coil wire that improves designability such that a card end surface looks black.SOLUTION: There is provided an inlet sheet 10 of a contactless IC card 100 comprising an IC module 1, an antenna 2 of a coil wire, and a transparent sheet. The transparent sheet is a laminated body of a transparent resin sheet of at least two layers, the transparent resin sheet at the outermost layer on one surface of the laminated body comprises an opening 11 capable of storing the IC module, and the transparent resin sheet contains all or part of the coil wire in its thickness direction.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a non-contact IC card having an antenna made of a coil wire and an inlet sheet used for the non-contact IC card.

  Non-contact IC cards are used for various purposes such as financial, transportation, distribution, and amusement.

  FIG. 2 is an explanatory view illustrating a typical example of such a conventional non-contact type IC card 100 '. The IC chip is mounted on the substrate part 4 of the IC module, and the mounted IC chip is molded with resin. The example which uses the IC module 1 which consists of the mold part 3 of the IC module protected by this is shown.

  FIG. 2A is a perspective view of a non-contact type IC card seen from the top, and illustrates the configuration of the antenna 2 including the IC module 1 and coil wires. The antenna 2 made of coil wire has a higher sensitivity as the area surrounded by the antenna 2 made of coil wire is larger. Therefore, the antenna 2 is provided along a portion near the outer periphery of the peripheral portion of the non-contact IC card 100 ′. . The number of turns of the antenna 2 made of a coil wire is determined by the frequency used for communication.

  FIG. 2B is a cross-sectional view of the inlet sheet 10 ′ including the IC module 1 and the antenna 2 made of a coil wire in the cross section taken along the line AA ′ of FIG. The substrate portion 4 of the IC module is accommodated in the opening portion 11 ′ of the laminate obtained by laminating the white sheet a5 ′ formed with the opening portion 11 ′ according to the size of the substrate portion 4 of the IC module and the transparent resin sheet b6 ′. Yes. The opening 11 ′ not only enables the positioning of the IC module 1, but also has a function of eliminating the unevenness of the IC module 1 when a sheet is thermally laminated on the front and back surfaces of the laminated body. The surface of the card can be smoothed.

  After the white sheet a5 ′ and the transparent resin sheet b6 ′ are laminated, the antenna 2 made of a coil wire is press-fitted or embedded in the white sheet a5 ′. Since the diameter of the coil wire and the white sheet a5 ′ are substantially the same thickness, when the antenna 2 made of the coil wire is press-fitted or embedded in the white sheet a5 ′ by heat-pressing or embedding, the cushion acts on the transparent resin sheet b6 ′. Thus, it is possible to perform press-fitting or burying processing with a high yield without damaging the antenna 2 made of coil wire.

  Here, the antenna 2 made of coil wire is press-fitted into the white sheet a5 ′. By pressing the antenna 2 made of coil wire against the white sheet a5 ′, the antenna 2 made of coil wire is pushed into the white sheet a5 ′. To push into (also referred to as press-fitting). In order to enable the press-fitting, the white sheet a5 ′ is carried out in a state of being heated above the softening point. The press-fitted state refers to a state where a part of the antenna 2 made of coil wire is pushed into the white sheet a5 ′, or a state where all the antenna 2 made of coil wire is pushed into the white sheet a5 ′. The state in which the antenna 2 made of coil wire is all pushed into the white sheet a5 ′ and the antenna 2 made of coil wire is not exposed on the surface of the white sheet a5 ′.

In this way, the antenna 2 made of a coil wire is press-fitted or embedded on the white sheet a5 ′ side of the laminate of the white sheet a5 ′ and the transparent resin sheet b6 ′, but is made of the coil wire in the press-fitted or embedded state. A transparent resin sheet b6 ′ is used to enable visual inspection of whether the antenna 2 is normal.

FIG. 2C is a cross-sectional view of the non-contact IC card 100 ′ taken along the line AA ′ in FIG.
When the result of visual inspection for the inlet sheet 10 ′ shown in FIG. 2B is good, as the next step, the white sheet b7 ′, the white sheet c8 ′, and the white sheet d9 ′ are heated to the inlet sheet 10 ′. Lamination is performed to form a card (see FIG. 2C). At this time, in the portion corresponding to the mold part 3 of the IC module of the white sheet b7 ′ (the same position as the opening 11 ′ of the white sheet a5 ′), the protrusions of the IC module 1 are accommodated to reduce the unevenness, An opening 12 'for smoothing the surface of the non-contact IC card 100' is provided.

  In such a non-contact IC card 100 ′, a card having a high end face design using a red, blue, green or black resin sheet instead of the white sheet a5 ′ is required. However, particularly when a black resin sheet is used, there is a problem that it is difficult to visually inspect whether the antenna 2 made of a press-fitted or embedded coil wire is normally press-fitted or embedded.

  Therefore, in the non-contact IC card 100 ′ having the antenna 2 made of a coil wire whose black end face is improved using a black resin sheet, the antenna 2 made of the press-fitted or embedded coil wire is normally press-fitted or embedded. It was not possible to visually inspect whether or not Therefore, there is a problem in that the antenna 2 made of press-fitted or embedded coil wire is damaged and the defective inlet sheet 10 ′ is flowed to the next process. Therefore, there has been a demand for a technique that enables visual inspection of whether the antenna 2 made of a press-fitted or embedded coil wire is normally press-fitted or embedded at the stage of producing the inlet sheet 10 '.

  Although such a prior art has been investigated, in a non-contact IC card having an antenna made of a coil wire in which the design of the card end face is improved using a black resin sheet, the antenna made of a press-fitted or embedded coil wire is normal. It was not possible to find a technique that enables visual inspection of whether or not it is embedded in

  As the most similar technology, Patent Document 1 discloses a laminated card that produces the same effect as when a black base material is used by making the card base material a transparent laminated body without using a black base material. An object of the present invention is to provide a laminated card in which the end face of a card looks black without using a black base material, a core sheet composed of one or more transparent base materials, the top surface and the top surface of the core sheet. A laminated card is disclosed in which at least a light shielding printing layer is formed on the lower surface. However, this technology relates to a laminated structure of a card that enables inexpensive production of a laminated card that can make the card end face appear black by the light shielding printing layer without using an expensive black resin sheet. There is no description about enabling visual inspection of a state in which an antenna made of an IC module or a coil wire is press-fitted or embedded in a resin sheet.

Further, in Patent Document 2, it is an object to provide a card in which the end face of the card looks colored without using a white sheet or a colored sheet for the core layer and the overcoat layer. Discloses a card in which an oversheet layer made of a transparent sheet is provided, and a transparent colored printing layer containing an organic pigment is laminated between both surfaces of a core layer and upper and lower oversheet layers. This technique relates to a laminated structure of cards that can provide a laminated card that can appear as if the end face of the card is colored by a transparent colored printed layer without using an expensive colored sheet at low cost. Although there is a description that an IC card is assumed, there is no description about an antenna made of a coil wire, and it is considered to be a technology different from a non-contact IC card provided with an antenna made of a coil wire.

  Therefore, in a non-contact IC card equipped with an antenna made of coil wire with improved design so that the end face of the card looks colored or black, the antenna made of coil wire is normally press-fitted or embedded in the sheet There has been a long-awaited technology that enables visual inspection of whether or not the above has been performed.

JP 2009-184171 A Japanese Patent No. 6069930

  In view of the above circumstances, the present invention provides a non-contact IC card having an antenna made of coil wire whose design is enhanced by making the card end face appear colored or black, and the antenna made of coil wire is normally a resin sheet. An object of the present invention is to provide an inlet of a non-contact IC card that enables visual inspection of whether it is press-fitted or embedded in the card.

As means for solving the above problems, a first aspect of the present invention is an inlet sheet of a non-contact IC card comprising an IC module, an antenna made of a coil wire, and a transparent sheet,
The transparent sheet is a laminate composed of at least two layers of transparent resin sheets, and the outermost transparent resin sheet on one surface of the laminate has an opening capable of accommodating an IC module, and The transparent resin sheet is an inlet sheet characterized by including part or all of the coil wire in the thickness direction.
Here, the thickness direction of the coil wire refers to the thickness in the direction parallel to the thickness direction of the transparent resin sheet of the antenna formed of the coil wire disposed on the transparent resin sheet.

  On the transparent sheet, which is a laminate of the transparent resin sheet and the other transparent resin sheet having an opening capable of accommodating the IC module, an antenna made of a coil wire and an IC module connected thereto are provided in the opening. After storing and arrange | positioning, an inlet sheet is produced by press-fitting a coil wire in a transparent resin sheet, applying a heat pressure.

  In the inlet sheet produced in this way, it is possible to visually check whether the antenna made of coil wire is normally press-fitted or embedded or damaged from the back side of the inlet sheet. Can be determined. Therefore, it is possible to flow only non-defective products to the next process. Here, the back surface refers to the surface opposite to the side on which the antenna made of coil wire is press-fitted.

Further, the second aspect is a non-contact IC card provided with a colored resin sheet on the front and back surfaces of the inlet sheet according to the first aspect.
The first colored resin sheet provided on the IC module side of the inlet sheet has an opening that can accommodate and flatten the IC module in accordance with the opening provided in the transparent resin sheet of the inlet sheet. The contactless IC card is characterized in that at least one colored resin sheet is provided on the first colored resin sheet.

  Moreover, a 3rd aspect is a non-contact IC card as described in a 2nd aspect, wherein the said colored resin sheet is a black resin sheet.

  The inlet sheet is a laminate of transparent resin sheets, but the side end surface of a non-contact IC card produced by laminating a colored resin sheet or a black resin sheet on the front and back surfaces is the same as that of the colored resin sheets. Therefore, it is possible to provide a non-contact IC card having a high design property.

  In the inlet sheet of the present invention, the transparent resin sheet and the other transparent resin sheet having an opening formed with a size capable of accommodating the IC module, and one transparent resin sheet of the transparent sheet that is a laminate of the transparent sheet, Since the antenna made of coil wire is press-fitted or embedded, the antenna made of coil wire is visually pressed or embedded from the transparent resin sheet opposite to the transparent resin sheet press-fitted or embedded with the coil wire antenna. Is possible. Therefore, it is possible to visually inspect whether the antenna made of coil wire is normal or damaged. Furthermore, it is possible to produce a non-contact IC card by selecting only normal inlets by visual inspection.

BRIEF DESCRIPTION OF THE DRAWINGS It is explanatory drawing which illustrated the non-contact IC card of this invention, Comprising: (a) is the figure seen through from the upper surface, The explanatory drawing which showed the structural example of the antenna which consists of an IC module and a coil wire, (b) Sectional drawing which mainly showed the cross section of the antenna which consists of an IC module and a coil wire among the cross sections in the AA 'cutting line of a), (c) is a non-contact IC in the AA' cutting line of (a). It is sectional drawing of a card | curd. It is explanatory drawing which illustrated the conventional non-contact IC card, Comprising: (a) is the figure seen through from the upper surface, (b) is explanatory drawing which showed the structural example of the antenna which consists of an IC module and a coil wire. ) Is a cross-sectional view centered on the cross section of the antenna formed of the IC module and the coil wire among the cross sections taken along the line AA ′. FIG. FIG.

<Inlet sheet>
The inlet sheet used for the non-contact IC card of the present invention is an inlet sheet of a non-contact IC card provided with an IC module, an antenna made of a coil wire, and a transparent sheet.

The transparent sheet is a laminate composed of at least two layers of transparent resin sheets, and the outermost transparent resin sheet on one surface of the laminate has an opening that can accommodate an IC module. The transparent resin sheet includes part or all of the thickness of the coil wire.
Here, the coil wire thickness refers to a coil wire in a direction parallel to the thickness direction of the transparent resin sheet when the coil wires do not overlap like the coil wire antenna 2 illustrated in FIG. Is the same as the thickness of Moreover, when there exists overlap in a coil wire, the thickness of the coil wire of the direction parallel to the thickness direction of the transparent resin sheet determined by overlap is pointed out.

  The IC module includes an IC module substrate portion and an IC module mold portion in which an IC chip is resin-molded, and the IC module is disposed in the opening, and the IC module protrudes to a height. Has been relaxed.

The antenna made of a coil wire is press-fitted into the inside from the surface of the other transparent resin sheet having an opening, and a part of the antenna is exposed from the transparent resin sheet or the whole is press-fitted into the transparent resin sheet. It is buried or contained.

Next, the non-contact IC card inlet 10 of the present invention will be described in more detail with reference to FIGS.
FIG. 1A is an example of a perspective view of the contactless IC card 100 of the present invention as seen from above, and is an explanatory view showing the top surface of the inlet sheet 10 inside as seen through. The inlet sheet 10 includes an IC module 1 and an antenna 2 made of a coil wire. The antenna 2 made of a coil wire is provided along the vicinity of the outer periphery of the inlet sheet 10.

FIG. 1B is an explanatory view illustrating a cross section of the inlet sheet 10 when the non-contact IC card 100 of the present invention is cut along a cutting line AA ′.
The other transparent resin sheet a5 is laminated on the transparent resin sheet b6. In the transparent resin sheet a5, an opening 11 is formed according to the size of the IC module 1 provided with the mold part 3 of the IC module on the substrate part 4 of the IC module. The substrate portion 4 is stored with the transparent resin sheet b6 side.

  The transparent resin sheet a5 is press-fitted with an antenna 2 made of a coil wire from the surface thereof. The entire thickness of the antenna 2 made of coil wire in the direction parallel to the thickness direction of the transparent resin sheet a5 of the antenna 2 made of coil wire may be embedded in the transparent resin sheet a5 by being press-fitted. A part of the antenna 2 made of a coil wire may be exposed on the surface of the transparent resin sheet a5. On the substrate part 4 of the IC module, the IC module 1 and the antenna 2 made of a coil wire are electrically connected to the IC module 1, and the IC module 1 can communicate with an external communication device. The IC module 1 includes an IC module mold portion 3 in which an IC chip mounted on a substrate portion 4 of the IC module is resin-molded with a mold resin.

  Thus, in the inlet sheet 10 of the present invention, since the resin sheet in which the antenna 2 made of coil wire is press-fitted or embedded is composed of the transparent transparent resin sheet a5, the antenna 2 made of coil wire is press-fitted. The visible state is visible. Therefore, it is possible to visually inspect whether the inlet sheet 10 is in a normal state or an abnormal state from the position a shown in FIG. 1B, and it is possible to flow only non-defective products to the next step. Become.

<Non-contact IC card>
Next, the non-contact IC card of the present invention will be described with reference to the drawings.
FIG.1 (c) has illustrated sectional drawing at the time of cut | disconnecting the non-contact IC card 100 of this invention by cutting line AA '.
A black resin sheet b8 laminated on the transparent resin sheet b6 side of the inlet sheet 10 of the non-contact IC card of the present invention illustrated in FIG. 1B is laminated. Moreover, the black resin sheet a7 laminated | stacked on the transparent resin sheet a5 side is provided.

  Further, a black resin sheet c9 is laminated on the black resin sheet a7. The black resin sheet a7 is provided with an opening 12 in accordance with the opening 11 provided in the transparent resin sheet a5. The opening 12 forms a space in which the mold part 3 of the IC module can be accommodated, and is smoothed by accommodating the IC module which is a convex portion therein, whereby irregularities are formed on the surface of the non-contact IC card 100. It has a role to suppress. Therefore, the total thickness of the black resin sheet a7 and the thickness of the transparent resin sheet a5 is the height of the IC module 1 (the sum of the thickness of the substrate portion 4 of the IC module and the height of the mold portion 3 of the IC module). Value).

  Thus, although the inlet sheet 10 is comprised from the transparent sheet which is a laminated body of a transparent resin sheet, since it is set as the structure which laminated | stacked the black resin sheet on the front-and-back surface side, the completed non-contact IC card 100 side The end face appears black. If the sheet laminated on the inlet sheet 10 is a colored resin sheet, a non-contact IC card that looks like the color of the colored resin sheet can be obtained.

  The non-contact IC card described above has been described by taking as an example the case where a black resin sheet is laminated on the front and back surfaces of the inlet sheet 10, but a colored resin sheet colored in an arbitrary color is used instead of the black resin sheet. You may do it. If a black resin sheet is used, it becomes a non-contact IC card having black front and back surfaces and side end surfaces. When a colored resin sheet of an arbitrary color is used, a non-contact IC having front and back surfaces and side end surfaces of that color It becomes a card and can improve the design.

<Inlet sheet and non-contact IC card manufacturing method>
(Inlet sheet manufacturing method)
A method for manufacturing the inlet sheet 10 illustrated in FIG. 1B will be described.
First, a transparent resin sheet a5 and a transparent resin sheet b6 are prepared. In addition, an IC module 1 having an IC module substrate portion 4 and an IC module mold portion 3 and an antenna 2 made of coil wires are electrically connected. This may be manufactured in a separate process or purchased from the outside.

  An opening 11 for accommodating the IC module 1 is formed in the transparent resin sheet a5. The means for forming the opening 11 is not particularly limited as long as it is a means capable of forming the opening in the transparent resin sheet a5 that is a resin sheet. For example, a punching process using a punch, a punch, a Thomson blade, a mold or the like can be preferably used.

  Examples of the material of the transparent resin sheet a5 and the transparent resin sheet b6 include resins made of polyethylene, polyvinyl chloride, polyester, polypropylene, polystyrene, polyacrylic ester, polycarbonate, cellulose diacetate, polyamide, and the like.

  The thickness of these transparent sheets may be selected so that the reference thickness of the non-contact IC card, 0.76 mm, can be observed. For example, the thicknesses of the transparent resin sheet a5 and the transparent resin sheet b6 may be selected from a range of 0.10 to 0.50 mm.

  Next, after an adhesive layer is applied to the surface on which the transparent resin sheet a5 and the transparent resin sheet b6 are laminated, both are laminated.

  Next, on the transparent resin sheet a5, the substrate part 4 of the IC module of the IC module is accommodated in the opening 11, and the antenna 2 made of coil wire is arranged along the peripheral edge of the inlet sheet 10. .

  Next, the antenna 2 made of a coil wire is press-fitted into the transparent resin sheet a5. As a means for press-fitting, there can be mentioned a method of hot pressing the antenna 2 made of a coil wire by using a mold in which pressure is not applied to the IC module.

By strengthening the hot press conditions (high temperature, high pressure, and long time), the antenna 2 made of substantially coil wire can be press-fitted into the transparent resin sheet a5 and embedded. When the hot pressing condition is weakened, as illustrated in FIG. 1B, a part of the antenna 2 made of a coil wire protrudes from the surface of the transparent resin sheet a5. As long as a part of the antenna 2 made of a coil wire is press-fitted into the transparent resin sheet a5 and fixed, any state may be used.
The inlet sheet 10 can be produced as described above. In addition, although demonstrated as an inlet sheet | seat provided with one inlet for convenience of explanation, in normal production, the inlet sheet | seat with which the inlet was multi-faced is produced.

(Manufacturing method of non-contact IC card)
Next, a method for manufacturing a non-contact IC card using the inlet sheet 10 as a core layer will be described in the case of the layer configuration illustrated in FIG. Here, although the case where a black resin sheet is used is demonstrated, it is the same even if it uses the colored resin sheet colored in arbitrary colors.

  First, the opening 12 is formed in the black resin sheet a7. The means for forming the opening 12 is not particularly limited as long as it is a means capable of forming the opening in the black resin sheet a7 that is a resin sheet. For example, a punching process using a punch, a punch, a Thomson blade, a mold or the like can be preferably used.

  Next, a PUR (Poly Urethane Reactive) hot melt adhesive layer is applied to both sides of the inlet sheet 10 and both sides of the black resin sheet a7.

  A PUR hot melt adhesive layer is applied to the side of the black resin sheet b8 facing the inlet sheet 10 and the side of the black resin sheet c9 facing the black resin sheet a7.

  In this manner, the inlet sheet 10 coated with the hot melt adhesive, the black resin sheet a7, the black resin sheet b8, and the black resin sheet c9 are laminated with the PUR hot melt adhesive layer facing each other. .

  Next, after mounting on a vacuum hot press apparatus, the hot press is performed after exhausting. By this step, a laminated body in which the inlet sheet 10, the black resin sheet a7, the black resin sheet b8, and the black resin sheet c9 are bonded through the PUR hot melt adhesive layer is completed.

  When manufactured with multiple faces, the non-contact IC card of the present invention can be manufactured by punching out individual non-contact IC cards into individual pieces.

  In addition, although the case where the PUR type | system | group hot melt adhesive layer was used was demonstrated as an example as an adhesive bond layer, as an adhesive bond layer, it is not necessary to limit to this. In FIGS. 1B and 1C, the adhesive layer is not shown for the sake of simplicity.

DESCRIPTION OF SYMBOLS 1 ... IC module 2 ... Antenna which consists of coil wire 3 ... Mold part of IC module 4 ... Substrate part of IC module 5 ... Transparent resin sheet a
5 '... White resin sheet a
6 ... Transparent resin sheet b
6 '... Transparent resin sheet b
7 ... Black resin sheet a
7 '... White resin sheet b
8 ... Black resin sheet b
8 '... White resin sheet c
9 ... Black resin sheet c
9 '... White resin sheet d
10, 10 '... Inlet sheet 11 ... Opening 11' (of transparent resin sheet a) ... Opening 12 of (white resin sheet a) ... Opening 12 of (transparent resin sheet b) '... Opening 100 (of white resin sheet b), 100' ... Non-contact IC card

Claims (3)

An inlet sheet of a non-contact IC card comprising an IC module, an antenna made of a coil wire, and a transparent sheet,
The transparent sheet is a laminate composed of at least two layers of transparent resin sheets, and the outermost transparent resin sheet on one surface of the laminate has an opening capable of accommodating an IC module, and The inlet sheet, wherein the transparent resin sheet includes part or all of the thickness of the coil wire. In the non-contact IC card provided with the colored resin sheet on the front and back surfaces of the inlet sheet according to claim 1,
The first colored resin sheet provided on the IC module side of the inlet sheet has an opening that can accommodate and flatten the IC module in accordance with the opening provided in the transparent resin sheet of the inlet sheet. A non-contact IC card, wherein at least one colored resin sheet is provided on the first colored resin sheet.   The non-contact IC card according to claim 2, wherein the colored resin sheet is a black resin sheet.