JP5170694B2 - Non-contact type IC card manufacturing method - Google Patents

Description

  The present invention relates to a method for manufacturing a non-contact type IC card having an IC module having a non-contact type communication function (hereinafter referred to as a non-contact type IC module) and a communication antenna.

  Contactless IC cards have been used in various fields in recent years in terms of convenience and durability in card fields such as membership cards, cash cards, credit cards, prepaid cards, boarding pass tickets, and electronic money. It has become widespread.

  A non-contact type IC card is generally made of an electrically coupled non-contact type IC module and a communication antenna made of a material such as PVC (polyvinyl chloride) or PET-G (amorphous polyethylene terephthalate copolymer). It is sandwiched between thermoplastic resin sheets, heated, pressurized and laminated and integrated. For example, Patent Document 1 discloses a non-contact type IC card and a manufacturing method thereof.

  Patent Document 1 discloses an antenna sheet in a non-contact IC card in which an antenna sheet having an IC chip mounted is sandwiched between front and back printed sheets via an adhesive sheet and a spacer sheet, and pressed into a single substrate by hot pressing. The adhesive sheet, the spacer sheet, and the print sheet that are laminated on both sides have the same thickness, and the adhesive sheet and the spacer sheet on both sides are formed with through holes that absorb the thickness of the IC chip. A non-contact IC card is described.

JP 2003-346112 A

  In a non-contact type IC card manufacturing method in which a non-contact type IC module and a communication antenna are sandwiched between thermoplastic resin sheets, a hot plate is brought into contact with the thermoplastic resin sheet, heated, pressurized, and laminated and integrated. In the thermoplastic resin sheet before lamination integration, the thickness of the part where the non-contact type IC module and the communication antenna are arranged is non-contact compared with the part where the non-contact type IC module and the communication antenna are not arranged. The thickness of the integrated IC module or the thickness of the communication antenna is increased, and the pressure of layered integration is easily applied to the non-contact type IC module and the communication antenna. When the thickness of the IC module is thicker, the pressure of stacking integration is concentrated on the non-contact type IC module and built in the non-contact type IC module. C chip there has been a case of corruption.

  Therefore, for example, as in the method of manufacturing a non-contact type IC card described in Patent Document 1, a core sheet made of a thermoplastic resin sheet is previously provided with a through hole corresponding to the outer dimension of the non-contact type IC module. A non-contact type IC module is inserted into the non-contact type IC module by inserting a non-contact type IC module into the through hole, sandwiching it with another thermoplastic resin sheet that does not have a through hole, heating and pressurizing, and laminating and integrating. Methods have been proposed to reduce the pressure of crystallization.

  However, in the conventional method for manufacturing a non-contact IC card in which a through hole is provided in the core sheet, another thermoplastic that does not have a through hole in the upper and lower portions of the non-contact IC module inserted into the through hole of the core sheet. Only the oversheet made of a resin sheet is provided. Compared to the resin portion around the through hole where the core sheet and the oversheet overlap, the resin portion of the oversheet provided in the upper and lower portions of the non-contact type IC module is provided. However, there is a case in which the resin reaches a heat deformation temperature and starts to flow faster because it is thinner, and flows into the gap between the through hole and the non-contact type IC module.

  As a result, in the non-contact type IC card after stacking and integration, the thickness of the thermoplastic resin sheet that should originally cover the upper and lower parts of the non-contact type IC module is reduced, and the concealability of the designed non-contact type IC module is reduced. There is a case where load resistance cannot be obtained, or a step or a wrinkle is generated on the surface of the non-contact type IC card in the vicinity where the non-contact type IC module is embedded.

  In recent years, in the fields of membership cards and ID cards, there has been a demand for secondary printing to print face photos and names on the card surface with a dedicated printer when issuing the card, and the card is flat with no steps or wrinkles Non-contact type IC that has a card surface and has a concealing property that the non-contact type IC module cannot be visually recognized and a load resistance that does not damage the non-contact type IC module due to the printing pressure of the print head of a dedicated printer. Cards are being sought.

  However, the conventional non-contact type IC card manufacturing method stably provides a non-contact type IC card having a flat card surface free from steps and wrinkles and having the non-contact type IC module concealment and load resistance. Therefore, there is a problem that it is difficult to supply.

  The object of the present invention is to solve the above-mentioned problems, and has a flat card surface free of steps and wrinkles, suitable for secondary printing of a face photograph or name by a dedicated printer, and concealment of a non-contact type IC module Another object of the present invention is to provide a method of manufacturing a non-contact type IC card that can stably supply a non-contact type IC card having load resistance.

  According to the present invention, the non-contact type IC module and the communication antenna are arranged on the first core sheet made of thermoplastic resin, and the non-contact type IC module and the communication antenna are made of the thermoplastic resin on the first core sheet. A non-contact IC card in which two core sheets are stacked, and the first core sheet and the second core sheet are sandwiched between oversheets made of a thermoplastic resin, and heated and pressurized to be laminated and integrated. In the manufacturing method, the outer side of the first core sheet and the second core sheet is previously outside the peripheral portion of the non-contact type IC module in contact with the first core sheet and the second core sheet. A method of manufacturing a non-contact type IC card is provided, in which a through hole is provided at the position.

  In addition, according to the present invention, there can be obtained a method of manufacturing a non-contact type IC card, wherein a plurality of the through holes surround and surround a region where the non-contact type IC module is in contact.

  In addition, according to the present invention, after the temperature of the first core sheet and the second core sheet is heated to the heat deformation temperature, pressurization is started, and the method of manufacturing a non-contact type IC card Is obtained.

  Further, according to the present invention, the thermal deformation temperature of the oversheet is higher than the thermal deformation temperature of the first core sheet and the second core sheet. A method for manufacturing a type IC card is obtained.

  A slit-shaped or circular opening having a straight line portion and / or a curved portion is previously formed around the area where the non-contact type IC module of the first core sheet and the second core sheet is disposed. The resin portion of the core sheet that overlaps the upper and lower portions of the non-contact type IC module by providing a plurality of through-holes that surround the non-contact type IC module at a position outside the peripheral portion of the non-contact type IC module. Can flow into the through-hole provided in the core sheet, and the pressure of the resin part of the core sheet that flows due to heat and pressure at the time of stacking and integration can be prevented from concentrating on the non-contact type IC module. Furthermore, the through-holes provided around the non-contact type IC module prevent the resin part of the flowing core sheet from flowing out to other than the through-holes, and the thickness of the resin part as originally designed is the upper part of the non-contact type IC module. In addition, it is possible to obtain sufficient concealability and load resistance of the non-contact type IC module by securing it in the lower part.

  Furthermore, in the present invention, the thermal deformation temperature of the oversheet sandwiching the core sheet is made higher than the thermal deformation temperature of the core sheet, and after the core sheet temperature reaches the thermal deformation temperature, the pressure of stacking integration is applied, By making the configuration of the core sheet and the oversheet in the portion where the non-contact type IC module is not disposed, and the configuration of the core sheet and the oversheet superimposed on the upper and lower portions of the non-contact type IC module, The resin part of the core sheet provided in the upper part and the lower part and the resin part of the core sheet in the part where the non-contact type IC module is not arranged reach the heat deformation temperature almost simultaneously, become soft, start to flow, and reach the heat deformation temperature. The non-contact type IC module and the communication antenna can be embedded in the core sheet while the non-oversheet remains rigid. And wrinkle-free, it is possible to realize the card surface having excellent flatness.

  According to the present invention, the through-hole provided in the core sheet absorbs the resin portion of the core sheet that flows due to heat and pressure during the lamination integration, and prevents it from flowing out of other than the through-hole. It is possible to prevent the pressure of the resin part flowing due to heat and pressure at the time of conversion from being concentrated on the non-contact type IC module and damaging the non-contact type IC module. The thickness of the resin part as originally designed is ensured, and a non-contact type IC card manufacturing method having sufficient non-contact type IC module concealability and load resistance can be obtained.

  Furthermore, according to the present invention, the core sheet and the oversheet have the same configuration as the core sheet and the oversheet in the portion where the non-contact type IC module is not used. By providing at the upper and lower parts of the IC module, the core sheet as the card base reaches the heat deformation temperature at the same time throughout the entire area, becomes uniform and soft, and the oversheet on the card surface maintains rigidity. A contact IC module and a communication antenna can be embedded in a core sheet, and a method for producing a non-contact IC card having a card surface having excellent flatness without steps and wrinkles can be obtained.

The disassembled perspective view which shows the state of the thermoplastic resin sheet before a heating and pressurization in the manufacturing method of the non-contact-type IC card of this invention. FIGS. 2A and 2B are views showing a first form of a core sheet according to the method for manufacturing a non-contact type IC card of the present invention, FIG. 2A is a view showing a first core sheet, and FIG. 2B is a second core; The figure which shows a sheet | seat. FIGS. 3A and 3B are views showing a second form of the core sheet according to the method of manufacturing a non-contact type IC card of the present invention, FIG. 3A is a view showing the first core sheet, and FIG. 3B is a second core. The figure which shows a sheet | seat. It is a figure which shows the 3rd form of the core sheet which concerns on the manufacturing method of the non-contact-type IC card of this invention, Fig.4 (a) is a figure which shows a 1st core sheet, FIG.4 (b) is a 2nd core The figure which shows a sheet | seat. FIG. 5A is a diagram showing a fourth form of a core sheet according to the method of manufacturing a non-contact type IC card of the present invention, FIG. 5A is a diagram showing a first core sheet, and FIG. 5B is a second core. The figure which shows a sheet | seat. It is a figure which shows the 5th form of the core sheet which concerns on the manufacturing method of the non-contact-type IC card of this invention, Fig.6 (a) is a figure which shows a 1st core sheet, FIG.6 (b) is a 2nd core. The figure which shows a sheet | seat. 7A and 7B are diagrams illustrating a method for manufacturing a non-contact type IC card according to the present invention, in which FIG. 7A is a diagram showing a cross section of a thermoplastic resin sheet before heating and pressing, and FIG. 7B is during heating and pressing. FIG. 7C is a cross-sectional view of the non-contact type IC card after lamination integration. FIGS. 8A and 8B are diagrams illustrating a method for manufacturing a non-contact type IC card of a comparative example, in which FIG. 8A is a diagram illustrating a cross section of a thermoplastic resin sheet before heating and pressing, and FIG. FIG. 8C is a cross-sectional view of the non-contact type IC card after the lamination integration.

  With reference to the drawings, a method of manufacturing a non-contact type IC card of the present invention will be described.

  First, the configuration of a non-contact type IC card according to the method of manufacturing a non-contact type IC card of the present invention will be described. FIG. 1 is an exploded perspective view showing a state of a thermoplastic resin sheet before heating and pressurization in the method for producing a non-contact type IC card of the present invention.

  The non-contact type IC card manufactured by the non-contact type IC card manufacturing method of the present invention includes a non-contact type IC module 9, a communication antenna 7, the first core sheet 1 and the second core sheet 2, The oversheet 4 and the oversheet 3 are laminated and integrated.

  The non-contact type IC module 9 includes a substrate 5 on which an IC chip having a non-contact communication function is mounted and a mold part 6 formed by resin sealing, and various external shapes can be used. In the selection of the non-contact type IC module 9, the non-contact type IC module 9 is considered in consideration of the concealment of the non-contact type IC module 9 in the non-contact type IC card and the load resistance capable of withstanding the pressure of the print head of a card printer or the like The thickness of the resin provided on the IC module 9 is preferably thicker. However, according to JISX6301, the thickness of the non-contact type IC card is specified to be 840 μm or less, and in order to increase the thickness of the resin provided on the non-contact type IC module 9, a thin non-contact type IC card is provided. The module 9 is preferably used, and is preferably selected in consideration of characteristics such as the thickness and mechanical strength of the non-contact type IC card, and cost.

  The communication antenna 7 is manufactured by winding a coated copper wire in accordance with the communication characteristics of the non-contact type IC module 9. In the communication antenna 7, the antenna end 7c and the antenna end 7d are electrically joined to the substrate 5 of the non-contact type IC module 9 by soldering or welding. The shape of the communication antenna 7 may be any shape as long as it matches the communication characteristics of the non-contact type IC module 9, and various shapes such as a square shape and a circular shape can be used and are preferably selected as appropriate.

  The first core sheet 1 and the second core sheet 2 can be laminated and integrated by heating and pressurization, and can be any resin sheet made of a thermoplastic resin having a heat deformation temperature of about 60 ° C. A PET-G sheet or a general-purpose PVC sheet can be used and is preferably selected as appropriate.

  The first core sheet 1 surrounds the substrate 5 at a position outside the peripheral edge of the substrate 5 with respect to the periphery of the region where the substrate 5 of the non-contact type IC module 9 is arranged, and is a cutting machine, a laser processing machine. Using a punching machine or the like, the through hole 8a, the through hole 8b, the through hole 8c, and the through hole 8d are provided. The shape of the through hole may be any shape, such as a slit having a straight part and / or a curved part, or a through hole having a circular opening, and is preferably selected as appropriate.

  The second core sheet 2 surrounds the mold part 6 at a position outside the peripheral part of the mold part 6 with respect to the periphery of the region where the mold part 6 of the non-contact type IC module 9 is arranged, and a cutting machine, The through hole 8e, the through hole 8f, the through hole 8g, and the through hole 8h are provided using a laser processing machine, a punching machine, or the like. The shape of the through hole may be any shape, such as a slit having a straight part and / or a curved part, or a through hole having a circular opening, and is preferably selected as appropriate.

  The oversheet 4 and the oversheet 3 may be a resin sheet made of a thermoplastic resin that can be laminated and integrated by heating and pressurizing and has a higher heat deformation temperature than the core sheet. A heat-resistant PET-G sheet having a heat resistance of about 80 ° C. or a heat-resistant PVC sheet having a heat deformation temperature of about 80 ° C. can be used, and it is preferable to select appropriately. Furthermore, it is desirable to use a thermoplastic resin sheet similar to the core sheet in consideration of the dimensional stability of the non-contact card after lamination and integration.

  FIG. 2 is a view showing a first form of a core sheet according to the method of manufacturing a non-contact type IC card of the present invention, and FIG. 2 (a) is a view showing the first core sheet.

  The first core sheet 1 according to the first embodiment of the present invention surrounds the substrate at a position outside the peripheral edge of the substrate with respect to the periphery of the region where the substrate of the non-contact type IC module is disposed, and cuts the substrate. Using a machine, a laser processing machine, a punching machine, etc., the through hole 8a, the through hole 8b, the through hole 8c, and the through hole 8d having a rectangular opening are provided.

  FIG.2 (b) is a figure which shows the 2nd core sheet which concerns on the 1st form of this invention.

  In the second core sheet 2 according to the first embodiment of the present invention, the mold part is provided at a position outside the peripheral part of the mold part with respect to the periphery of the area where the mold part of the non-contact type IC module is arranged. By using an enclosure, a cutting machine, a laser processing machine, a punching machine or the like, a through hole 8e, a through hole 8f, a through hole 8g, and a through hole 8h having a rectangular opening are provided.

  FIG. 3 is a view showing a second form of the core sheet according to the method of manufacturing a non-contact type IC card of the present invention, and FIG. 3A is a view showing the first core sheet.

  The first core sheet 1 according to the second embodiment of the present invention surrounds the substrate at a position outside the peripheral edge of the substrate with respect to the periphery of the region where the substrate of the non-contact type IC module is disposed, and cuts the substrate. After using the machine, laser processing machine, punching machine, etc. to provide the through hole 8a, the through hole 8b, the through hole 8c, and the through hole 8d having a rectangular opening, the through hole 8a, the through hole 8b, A through-hole 88a, a through-hole 88b, a through-hole 88c, and a through-hole 88d having a rectangular opening are provided by surrounding the through-hole 8c and the through-hole 8d and using a cutting machine, a laser processing machine, a punching machine, or the like.

  FIG.3 (b) is a figure which shows the 2nd core sheet | seat which concerns on the 2nd form of this invention.

  The second core sheet 2 according to the second embodiment of the present invention surrounds the substrate at a position outside the peripheral edge of the mold part with respect to the periphery of the area where the mold part of the non-contact type IC module is arranged. Using a cutting machine, a laser processing machine, a punching machine, etc., a through hole 8e having a rectangular opening, a through hole 8f, a through hole 8g, and a through hole 8h are provided, and further, a through hole 8e and a through hole 8f are provided. The through hole 88g, the through hole 88f, the through hole 88g, and the through hole 88h having a rectangular opening are provided by using a cutting machine, a laser processing machine, a punching machine, or the like.

  FIG. 4 is a view showing a third form of the core sheet according to the method of manufacturing a non-contact type IC card of the present invention, and FIG. 4A is a view showing the first core sheet.

  The first core sheet 1 according to the third aspect of the present invention surrounds the substrate at a position outside the peripheral edge of the substrate with respect to the periphery of the region where the substrate of the non-contact type IC module is disposed, and cuts the substrate. A through hole 8i, a through hole 8j, a through hole 8k, and a through hole 8l having corrugated slit-shaped openings are provided using a machine, a laser processing machine, a punching machine, or the like.

  FIG.4 (b) is a figure which shows the 2nd core sheet which concerns on the 3rd form of this invention.

  The second core sheet 2 according to the third embodiment of the present invention has a mold part at a position outside the peripheral part of the mold part with respect to the periphery of the area where the mold part of the non-contact type IC module is arranged. Using an enclosure, a cutting machine, a laser processing machine, a punching machine, or the like, a through hole 8m, a through hole 8n, a through hole 8o, and a through hole 8p having corrugated slit-shaped openings are provided.

  FIG. 5 is a view showing a fourth form of the core sheet according to the method of manufacturing a non-contact type IC card of the present invention, and FIG. 5A is a view showing the first core sheet.

  The first core sheet 1 according to the fourth embodiment of the present invention surrounds the substrate at a position outside the peripheral edge of the substrate with respect to the periphery of the region where the substrate of the non-contact type IC module is arranged, and cuts the substrate. A through hole 88i, a through hole 88j, a through hole 88k, and a through hole 88l having slit-like openings having straight and curved portions are provided using a machine, a laser processing machine, a punching machine, or the like.

  FIG.5 (b) is a figure which shows the 2nd core sheet which concerns on the 4th form of this invention.

  In the second core sheet 2 according to the fourth embodiment of the present invention, a mold part is provided at a position outside the peripheral part of the mold part with respect to the periphery of the area where the mold part of the non-contact type IC module is arranged. Using an enclosure, a cutting machine, a laser processing machine, a punching machine, etc., the through-hole 88m, the through-hole 88n, the through-hole 88o, and the through-hole 88p having a slit-like opening having a straight part and a curved part are provided.

  FIG. 6 is a view showing a fifth form of the core sheet according to the method of manufacturing a non-contact type IC card of the present invention, and FIG. 6A is a view showing the first core sheet.

  The first core sheet 1 according to the fifth aspect of the present invention surrounds the substrate at a position outside the peripheral edge of the substrate with respect to the periphery of the region where the substrate of the non-contact type IC module is disposed, and cuts the substrate. Using a machine, a laser processing machine, a punching machine, etc., the through hole 8q, the through hole 8r, the through hole 8s, and the through hole 8t having a circular opening are provided.

  FIG.6 (b) is a figure which shows the 2nd core sheet which concerns on the 5th form of this invention.

  In the second core sheet 2 according to the fifth embodiment of the present invention, the mold part is provided at a position outside the peripheral part of the mold part with respect to the periphery of the area where the mold part of the non-contact type IC module is arranged. A through hole 8u, a through hole 8v, a through hole 8w, and a through hole 8y having a circular opening are provided using an enclosure, a cutting machine, a laser processing machine, a punching machine, or the like.

  Next, the manufacturing method of the non-contact type IC card of the present invention will be described.

  FIG. 7 is a diagram for explaining a method for manufacturing a non-contact type IC card according to the present invention, and a method for manufacturing a non-contact type IC card when the core sheet according to the first embodiment of the present invention shown in FIG. 2 is used. It is. Fig.7 (a) is a figure which shows the cross section of the thermoplastic resin sheet before a heating and pressurization, and has shown the state of the thermoplastic resin sheet before making a hot plate contact an oversheet.

  Coated copper wire is wound beforehand to produce a communication antenna 7 having an antenna portion 7a, an antenna portion 7b, an antenna portion 7e, an antenna portion 7f, an antenna end 7c, and an antenna end 7d, and the antenna end 7c and the antenna end 7d and the substrate 5 of the contact type IC module 9 including the substrate 5 and the mold part 6 are electrically joined.

  Next, the core sheet shown in FIG. 2 is used for the first core sheet 1 and the second core sheet 2, and through holes 8a and 8b provided in the first core sheet 1 and through holes 8c (not shown) are provided. The substrate 5 is disposed between the through holes 8d, and the mold portion 6 is disposed between the through hole 8e and the through hole 8f provided in the second core sheet 2 and between the through hole 8g and the through hole 8h (not shown). After the contact IC module 9 and the communication antenna 7 are sandwiched between the first core sheet 1 and the second core sheet 2, the oversheet 4 is overlaid on the first core sheet 1, and further the second core Oversheet 3 is overlaid on sheet 2.

  FIG. 7B is a cross-sectional view of a non-contact type IC card during heating and pressurization. A heating plate is brought into contact with the oversheet and heated, and the temperature of the core sheet reaches the heat deformation temperature, and the lamination is integrated. The state of the non-contact type IC card which has started pressurization for the purpose is shown.

  After superposing the oversheet on the core sheet, a hot plate (not shown) is brought into contact with the surface of the oversheet 4 that is not in contact with the first core sheet 1 and the surface of the oversheet 3 that is not in contact with the second core sheet 2. The temperature of the first core sheet 1 and the second core sheet 2 reaches the heat deformation temperature, and at the same time, pressurization for stacking integration is started.

  The first core sheet 1 and the second core sheet 2 that have reached the heat deformation temperature and are subjected to the lamination and integration pressure constitute the communication antenna 7. The antenna unit 7 a, antenna unit 7 b, antenna unit 7 e, antenna Begin embedding the part 7f, the antenna end 7c, and the antenna end 7d. Furthermore, the first core sheet 1 in contact with the substrate 5 of the contact-type IC module 9 starts to embed the substrate 5, and the resin flows into the through hole 8a and the through hole 8b, and the through hole 8c and the through hole 8d (not shown). To reduce the slit space. In addition, the second core sheet 2 in contact with the mold part 6 of the non-contact type IC module 9 starts embedding the mold part 6, and resin in the through hole 8 e and the through hole 8 f and through holes 8 g and 8 h (not shown). Flows in and reduces the slit space.

  FIG. 7 (c) is a cross-sectional view of the non-contact type IC card after the lamination and integration. When the temperature of the core sheet reaches the heat deformation temperature, the pressure starts to be increased to the lamination set pressure. The state of the non-contact type IC card heated to the temperature is shown.

  The first core sheet 1 and the second core sheet 2 that have been heated to the lamination set pressure and heated to the lamination set temperature by a hot plate (not shown) constitute the communication antenna 7. The antenna unit 7a, the antenna unit 7b, The antenna portion 7e, the antenna portion 7f, the antenna end 7c, and the antenna end 7d are embedded, and further, a non-contact type IC module 9 including the substrate 5 and the mold portion 6 is embedded, and the through-hole is closed with a flowing resin to disappear. The first core sheet 1 and the oversheet 4 and the second core sheet 2 and the oversheet 3 are heat-sealed and laminated and integrated.

  By the non-contact type IC card manufacturing method as described above, a non-contact type IC card having a flat card surface free from steps and wrinkles and having the non-contact type IC module concealing property and load resistance is obtained. Can do.

  The above-described method for manufacturing a non-contact type IC card according to the present invention can obtain the same effect in any of the five embodiments of the core sheet shown in FIGS. 2 to 6 and is preferably selected as appropriate.

  Examples of the present invention will be specifically described below. First, the contents of evaluation performed on a non-contact type IC card in Examples and Comparative Examples of the present invention described later will be described. The evaluated characteristics are (1) non-contact type IC module concealment, (2) non-contact type IC module load resistance, and (3) card surface flatness. did.

(1) Concealing property of non-contact type IC module The concealing property of the non-contact type IC module was evaluated by visually observing the surface of the produced non-contact type IC card according to the following criteria. The number of evaluations was 100 for each of the examples and comparative examples of the present invention.

(Criteria)
Good: The non-contact type IC module cannot be visually identified.
Defect: The non-contact type IC module can be seen through and visually discriminated.

(2) Load resistance of non-contact type IC module The load resistance of the non-contact type IC module was evaluated by directly printing on the produced non-contact type IC card with a secondary printing printer for non-contact type IC card. Later, a communication inspection machine was used to inspect and evaluate the presence of cards that could not communicate. The number of evaluations was 100 for each of the examples and comparative examples of the present invention.

(3) Flatness of card surface Evaluation of the flatness of the card surface was made by directly observing the print quality after printing directly on the produced non-contact type IC card with a secondary printing printer for non-contact type IC card. Then, the following criteria were evaluated. The number of evaluations was 100 for each of the examples and comparative examples of the present invention.

(Criteria)
Good: Print missing or streaks are not observed on the printed surface.
Defective: Print missing or streaks are observed on the printed surface.

  Next, a non-contact type IC module and a communication antenna used in both examples and comparative examples described later will be described.

  The non-contact type IC module is a commercially available non-contact communication module having a thickness of 400 μm and a communication frequency of 13.56 MHz, in which a metal substrate having a thickness of 150 μm is sealed with a resin having a thickness of 250 μm. An IC module was used. The resin sealing part of the non-contact type IC module has a width dimension of 4 mm and a length dimension of 4 mm. In addition, the terminal portion provided on the metal substrate of the non-contact type IC module to be joined to the antenna end has a width dimension of 4 mm and a length dimension of 2 mm, and is in the length direction of the resin sealing portion. It is provided at the extended position.

  The communication antenna was prepared by spirally winding a coated copper wire having a wire diameter of 140 μm in a square shape for two turns, and soldering the end of the antenna to the terminal portion of the non-contact type IC module to electrically join them.

  The embodiment of the present invention is an example of a method for manufacturing a non-contact type IC card using the core sheet according to the first aspect of the present invention as shown in FIG.

  The first core sheet and the second core sheet used in the examples of the present invention have a heat deformation temperature of 60 ° C., a thickness of 200 μm, a width dimension of 210 mm, and a length dimension of 290 mm. A white PET-G sheet having a heat distortion temperature of 80 ° C., a thickness of 200 μm, a width dimension of 210 mm, and a length dimension of 290 mm was used as the oversheet. .

  First, as described with reference to FIGS. 1 and 2, a region (width dimension = 4 mm × length dimension = 8 mm) in which the substrate 5 of the non-contact type IC module 9 is disposed is surrounded on the first core sheet 1, and the laser Using a processing machine, a through hole 8c and a through hole 8d having a rectangular opening having a width of 1 mm and a length of 8 mm, and a rectangular opening having a width of 1 mm and a length of 4 mm The through-hole 8a and the through-hole 8b which have were provided.

  Next, as shown in FIGS. 1 and 2, an area (width dimension = 4 mm × length dimension = 4 mm) in which the mold part 6 of the non-contact type IC module 9 is arranged is enclosed in the second core sheet 2. Using a laser processing machine, a through hole 8e, a through hole 8f, a through hole 8g, and a through hole 8h having a rectangular opening with a width of 1 mm and a length of 4 mm were provided.

  Next, as described with reference to FIGS. 1 and 7, the substrate 5 of the non-contact type IC module is disposed in a region surrounded by the through hole 8 c, the through hole 8 d, the through hole 8 a, and the through hole 8 b of the first core sheet 1. Further, the mold part 6 of the non-contact type IC module 9 is disposed in a region surrounded by the through hole 8e, the through hole 8f, the through hole 8g, and the through hole 8h of the second core sheet 2, and the non-contact type IC module is previously provided. After being sandwiched between the first core sheet 1 and the second core sheet 2 together with the communication antenna soldered together, the oversheet 4 is stacked on the first core sheet 1, and the oversheet 3 is stacked on the second core sheet 2. Repeated.

  Subsequently, a hot plate is brought into contact with the surface of the oversheet 4 that is not in contact with the first core sheet 1 and the surface of the oversheet 3 that is not in contact with the second core sheet 2, and heated at a hot plate temperature of 130 ° C. When the temperature of the first core sheet and the second core sheet reaches the heat deformation temperature of 60 ° C., pressurization for stacking integration is started and pressurization is performed up to a stacking set pressure of 1.0 MPa. At the same time, the laminated set temperature was heated to 100 ° C. and laminated and integrated to produce a non-contact type IC card.

  Next, with respect to the non-contact type IC card of the embodiment, (1) the concealment property of the non-contact type IC module, (2) the load resistance of the non-contact type IC module, and (3) the flatness characteristics of the card surface. For each of the evaluation characteristics, 100 sheets were evaluated, and the results are shown in Table 1 as defect rates.

  As shown in Table 1, as a result of the characteristic evaluation for the non-contact type IC card of the example, the concealability of the non-contact type IC module is not sufficient to visually distinguish the non-contact type IC module from all the cards. Concealment was obtained. Furthermore, the load resistance of the non-contact type IC module is sufficient for all cards because there are no cards that cannot communicate after printing directly with the secondary printing printer for non-contact type IC cards. It was. Furthermore, as for the flatness of the card surface, all the cards were not printed on the printing surface and no streak was observed, and a flatness suitable for secondary printing was obtained.

(Comparative example)
FIG. 8 is a diagram for explaining a method for producing a non-contact type IC card of a comparative example, and FIG. 8 (a) is a diagram showing a cross section of a thermoplastic resin sheet before heating and pressurization, The state of the thermoplastic resin sheet before making a hot plate contact is shown.

  In the comparative example, the first core sheet 31, the second core sheet 32, the oversheet 34, and the oversheet 33 have a heat deformation temperature of 60 ° C., a thickness of 200 μm, a width dimension of 210 mm, and a long length. A white PET-G sheet having a thickness of 290 mm was used.

  Further, the non-contact type IC module 39 including the antenna unit 37a, the antenna unit 37b, the antenna unit 37e, the antenna unit 37f, the antenna end 37c, the communication antenna 37 having the antenna end 37d, and the substrate 35 and the mold unit 36 is implemented. The antenna end 37c, the antenna end 37d, and the substrate 35 were soldered and electrically joined using the same ones used in the examples.

  Next, a through hole 38a having a width dimension of 4 mm and a length dimension of 8 mm is produced by a laser processing machine in the region where the substrate 35 of the non-contact type IC module 39 is arranged in the first core sheet 31. A through-hole 38b having a width dimension of 4 mm and a length dimension of 4 mm was produced by a laser processing machine in a region where the mold part 36 of the non-contact type IC module 39 is arranged in the second core sheet 32.

  FIG. 8B is a cross-sectional view of the non-contact type IC card during heating and pressurization, in which the substrate 35 of the non-contact type IC module 39 is inserted into the through hole 38a of the first core sheet 31, The mold part 36 of the non-contact type IC module 39 is inserted into the through hole 38b of the second core sheet 32, and has an antenna part 37a, an antenna part 37b, an antenna part 37e, an antenna part 37f, an antenna terminal 37c, and an antenna terminal 37d. After being sandwiched between the first core sheet 31 and the second core sheet 32 together with the communication antenna 37, the oversheet 34 was stacked on the first core sheet 31, and the oversheet 33 was stacked on the second core sheet 32. .

  Subsequently, a hot plate (not shown) is brought into contact with the surface of the oversheet 34 that is not in contact with the first core sheet 31 and the surface of the oversheet 33 that is not in contact with the second core sheet 32, and the hot plate temperature is 130 ° C. Simultaneously with heating, pressurization for stacking integration is started, pressurizing up to a stacking set pressure of 1.0 MPa, heating up to a stacking set temperature of 100 ° C., stacking and integrating, and a non-contact type IC card Produced.

  FIG. 8C is a cross-sectional view of the non-contact type IC card after lamination and integration, and is a diagram for explaining the non-contact type IC card in which a step is generated on the card surface.

  The non-contact type IC card manufactured by the manufacturing method of the comparative example described above includes a non-contact type IC module 39 including a substrate 35 and a mold part 36 between the first core sheet 31 and the second core sheet 32. The antenna portion 37a, the antenna portion 37b, the antenna portion 37e, the antenna portion 37f, the antenna end 37c, and the communication antenna 37 having the antenna end 37d are embedded, and the oversheet 34 is laminated on the first core sheet 31, The oversheet 33 is laminated on the second core sheet 32, and a step 99b is generated in the first core sheet 31 and the oversheet 34 where the substrate 35 is embedded, and the mold portion 36 is embedded. A step 99 a occurred in the second core sheet 32 and the oversheet 33.

  Next, with respect to the non-contact type IC card of the comparative example, (1) non-contact type IC module concealment property, (2) non-contact type IC module load resistance, and (3) card surface flatness characteristics For each of the evaluation characteristics, 100 sheets were evaluated, and the results are shown in Table 1 as defect rates.

  As shown in Table 1, as a result of the characteristic evaluation for the non-contact type IC card of the comparative example, the non-contact type IC module can be concealed through the non-contact type IC module, and the non-contact type IC module can be visually determined. Cards were generated at 20%, and the concealability could not be obtained stably. Furthermore, the load resistance of the non-contact type IC module is 2% of the cards that are unable to communicate after printing directly with the secondary printing printer for non-contact type IC cards. It was not obtained. Furthermore, as for the flatness of the card surface, printing omissions and streaks were observed on all cards, and flatness suitable for secondary printing was not obtained.

  From the above comparison, in the conventional method for manufacturing a non-contact type IC card in which a non-contact type IC module is inserted into a through hole provided in a core sheet and stacked and integrated, the concealment of the non-contact type IC module, and The non-contact type IC module having sufficient load resistance of the non-contact type IC module sufficient for printing with a printer dedicated to secondary printing, and a non-contact type IC card having flatness suitable for secondary printing cannot be produced. A slit-like or circular opening having a straight line portion and / or a curved portion with respect to the periphery of the area where the non-contact type IC module of the first core sheet and the second core sheet is arranged in advance. A plurality of through-holes having a non-contact type IC module are provided at positions outside the peripheral edge of the non-contact type IC module so as to surround the non-contact type IC module. Higher than the heat deformation temperature of the core, and after the core sheet temperature reaches the heat deformation temperature, the pressure for stacking and integration is applied, and the configuration of the core sheet and the oversheet in the portion where the non-contact type IC module is not disposed, In the manufacturing method in which the configurations of the core sheet and the oversheet stacked on the upper and lower parts of the contact IC module are the same, the manufacturing method has flatness suitable for secondary printing, and the non-contact IC module has concealability and load resistance. A non-contact type IC card having good characteristics could be produced.

  The embodiment of the present invention has been described above with reference to the drawings. However, the present invention is not limited to this embodiment, and the present invention can be changed even if there are changes in members and configurations without departing from the spirit of the present invention. include. That is, it goes without saying that the present invention also includes various modifications and corrections that would be obvious to those skilled in the art.

DESCRIPTION OF SYMBOLS 1, 31 1st core sheet 2, 32 2nd core sheet 3, 4, 33, 34 Over sheet 5, 35 Substrate 6, 36 Mold part 7, 37 Communication antenna 7a, 7b, 7e, 7f, 37a, 37b, 37e, 37f Antenna portions 7c, 7d, 37c, 37d Antenna ends 8a, 8b, 8c, 8d, 8e, 8f, 8g, 8h, 8i, 8j, 8k, 8l, 8m, 8n, 8o, 8p, 8q, 8r, 8s, 8t, 8u, 8v, 8w, 8y, 88a, 88b, 88c, 88d, 88e, 88f, 88g, 88h, 88i, 88j, 88k, 88l, 88m, 88n, 88o, 88p Through-hole 9, 39 Non-contact IC module 38a, 38b Through hole 99a, 99b Step difference

Claims (4)

  A non-contact type IC module and a communication antenna are arranged on a first core sheet made of a thermoplastic resin, and a second core sheet made of a thermoplastic resin is overlaid on the non-contact type IC module and the communication antenna. Further, in the method of manufacturing a non-contact type IC card, wherein the first core sheet and the second core sheet are sandwiched between oversheets made of a thermoplastic resin, heated and pressurized to be laminated and integrated. A through-hole is formed at a position outside the peripheral portion of the non-contact type IC module where the first core sheet and the second core sheet are in contact with the first core sheet and the second core sheet. A method of manufacturing a non-contact type IC card, comprising:   2. The method of manufacturing a non-contact type IC card according to claim 1, wherein a plurality of the through holes surround a region in contact with the non-contact type IC module and are provided.   3. The method of manufacturing a non-contact type IC card according to claim 1, wherein pressurization is started after the temperature of the first core sheet and the second core sheet is heated to a heat deformation temperature.   4. The method of manufacturing a non-contact type IC card according to claim 1, wherein the thermal deformation temperature of the oversheet is higher than that of the first core sheet and the second core sheet.

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