JP6476543B2 - Card, card manufacturing method - Google Patents

Description

  The present invention relates to a card containing plant-derived material and a method for producing the card.

Conventionally, there has been a card in which sheets containing plant-derived materials are laminated (for example, Patent Document 1).
However, conventional cards have deteriorated in about several years due to low environmental resistance.

JP 2010-188637 A

  An object of the present invention is to provide a card having excellent environmental resistance even when a plant-derived material is included, and a method for manufacturing the card.

  The present invention solves the problems by the following means. In addition, in order to make an understanding easy, although the code | symbol corresponding to embodiment of this invention is attached | subjected and demonstrated, it is not limited to this. In addition, the configuration described with reference numerals may be improved as appropriate, or at least a part thereof may be replaced with another configuration.

-1st invention is a card | curd by which several layers were laminated | stacked, Comprising: At least 1 layer (10,20,40,50) of said several layers, isosorbite (ISB) reacts with diphenyl carbonate. This is a card characterized by being an isosorbite polymer sheet containing isosorbite polymer (ISP) and 1,4-cyclohexanedimethanol (CHDM).
-2nd invention is the card | curd of 1st invention, Comprising: The ratio of isosorbite in isosorbite (ISB) and 1, 4- cyclohexane dimethanol (CHDM) of the said isosorbite polymer sheet is 40 mol% or more and 70 mol% The card is characterized by the following.
The third invention is the card of the second invention, wherein the plurality of layers are at least one of a heat-resistant PET-G sheet and a heat-resistant PVC sheet (210, 250). It is.
A fourth invention is a card according to any one of the first to third inventions, wherein at least one of the plurality of layers is a PC sheet.

The fifth invention is a method for producing a card according to the second invention, wherein the isosorbite polymer sheets (10, 20, 40, 50) overlap each other and heat at a temperature of 90 ° C. or higher and 150 ° C. or lower. It is a manufacturing method of the card | curd characterized by providing the hot press process which welds the said isosorbite polymer sheet | seats by press.
-6th invention is the manufacturing method of the card | curd of 3rd invention, Comprising: By the hot press of the temperature of 90 to 150 degreeC, the said isosorbite polymer sheet (20,40) and said heat-resistant PET-G A card manufacturing method comprising a hot pressing step of welding a sheet and at least one of the heat-resistant PVC sheet (210, 250).
-7th invention is the manufacturing method of the card | curd of 4th invention, Comprising: The hot press process of welding between the said isosorbite polymer sheet and the said PC sheet | seat by the hot press of the temperature of 90 to 150 degreeC It is a manufacturing method of the card | curd characterized by providing.

  ADVANTAGE OF THE INVENTION According to this invention, even if it contains plant-derived material, the manufacturing method of the card | curd which was excellent in environmental resistance performance, and a card | curd can be provided.

It is the figure which looked at the card | curd 1 of 1st Embodiment from the ticket surface, and sectional drawing. It is a structural formula explaining the manufacturing method of the ISP sheet of 1st Embodiment. It is the table | surface and graph which compare the performance of the ISP sheet of 1st Embodiment, and the conventional PC (polycarbonate) sheet | seat. It is a graph explaining the relationship of the viscoelastic behavior accompanying the change of the ISB ratio of the ISP sheet of 1st Embodiment. It is a graph which shows the result of the time-dependent change confirmation test of the impact resistance in the ISP sheet of 1st Embodiment. It is sectional drawing explaining the lamination | stacking process of 1st Embodiment, and a hot press process. It is sectional drawing of the card | curd 201 of 2nd Embodiment.

Embodiments of the present invention will be described below with reference to the drawings.
(First embodiment)
Drawing 1 is a figure which looked at card 1 of a 1st embodiment from the ticket surface, and a sectional view.
FIG. 1A is a view of the card 1 as seen from the ticket surface.
FIG. 1B is a cross-sectional view (a cross-sectional view taken along the line BB in FIG. 1A) illustrating the layer structure of the card 1.
In the embodiment and the drawings, the longitudinal direction of the card 1 as viewed from the ticket surface is referred to as the left-right direction X, the lateral direction is referred to as the longitudinal direction Y, and the thickness direction Z is referred to. In each drawing, the size and the like of the thickness direction Z and the like are appropriately exaggerated for the sake of clarity.

The card 1 is an IC card that can communicate with an external device such as a reader / writer.
In the card 1, an upper layer 10, an upper base material layer 20, a module substrate 30, a lower base material layer 40 (second non-porous layer), and a lower layer 50 are laminated in order from the upper side Z 2 to the lower side Z 1. .
As will be described later, the upper layer 10, the upper substrate layer 20, the lower substrate layer 40, and the lower layer 50 are formed from sheets of the same material.

The upper layer 10 is a transparent sheet. On the upper layer 10, a concealing printing layer (not shown) is provided on the entire surface, and a printing layer indicating the name of the card company is provided on the concealing printing.
The upper base material layer 20 is a layer that becomes the core of the card 1. The entire surface between the upper layer 10 and the upper base material layer 20 is thermally welded by hot pressing.
In addition, in order to improve the adhesive strength between the upper layer 10 and the upper base material layer 20, the adhesive printing may be performed on the entire surface of either the upper layer 10 or the upper base material layer 20.

The module substrate 30 includes an electronic component such as an IC chip 31 and an antenna 32.
The IC chip 31 is a semiconductor integrated circuit element. For example, when the card 1 is used as a prepaid card, the IC chip 31 stores a balance, identification information, and the like.

  The antenna 32 is a loop coil antenna that communicates with an external reader / writer (not shown). The antenna 32 is a conductor formed on the upper surface of the module substrate 30 and is formed by a method such as etching. The IC chip 31 transmits and receives information to and from the reader / writer via the antenna 32 in a non-contact manner.

The module substrate 30 is formed of a material such as PET or PEN, for example. For this reason, the module substrate 30 and the upper base material layer 20 and the lower base material layer 40 are not easily heat-welded. Therefore, the outer shape of the module substrate 30 is slightly smaller than the outer shapes of the other layers.
As a result, the module substrate 30 is held in the card 1 by heat-welding the upper base material layer 20 and the lower base material layer 40 in the periphery 21 outside the module substrate 30. .

  Since the lower base layer 40 and the lower layer 50 are symmetrical with respect to the upper layer 10 and the upper base layer 20 in the thickness direction Z, detailed description thereof is omitted. The lower layer 50 is printed to explain how to use the card.

[Materials of Upper Layer 10, Upper Substrate Layer 20, Lower Substrate Layer 40, and Lower Layer 50]
The sheet of the upper layer 10, the upper substrate layer 20, the lower substrate layer 40, and the lower layer 50 (hereinafter also referred to as the upper layer 10) will be described.
As described above, the upper layer 10 and the like are formed from sheets of the same material. The upper layer 10 and the like are formed of an isosorbite polymer sheet (hereinafter referred to as “ISP sheet”) containing an isosorbite polymer (hereinafter referred to as “ISP”). However, additives that hardly affect the physical properties of the sheet (coloring dyes and the like) may be different.

[Process for producing ISP sheet]
FIG. 2 is a structural formula illustrating a method for manufacturing the ISP sheet according to the first embodiment.
The ISP sheet is created through the following steps.
(1) Glucose (glucose) is dehydrated and cyclized to produce isosorbite (hereinafter referred to as “ISB”).
(2) An ISP, which is a resin, is prepared by reacting ISB and diphenyl carbonate (DPC) by a melting method (melt transesterification method).
(3) Finally, an ISP sheet containing ISP and CHDM is prepared by reacting ISP and 1,4-cyclohexanedimethanol (hereinafter referred to as “CHDM”).
Thereby, the ISP sheet containing glucose derived from a plant can be manufactured.

[Performance of ISP sheet]
The performance of the ISP sheet will be described.
FIG. 3 is a table and a graph comparing the performance of the ISP sheet of the first embodiment and the conventional PC (polycarbonate) sheet.
(Various physical properties)
As shown in FIG. 3 (A), an IS sheet with 50 mol% of ISB ratio (hereinafter referred to as “ISB ratio”) of ISB and CHDM is manufactured, specific gravity, total light transmittance, refractive index, Charpy impact. Tests for confirming physical properties of strength, load deflection temperature, pencil hardness, and critical oxygen index were conducted.
The ISP sheet was able to satisfy the card standard etc. in each item.
The ISP sheet had the same performance as the PC sheet. The ISP sheet also has lower performance (Charpy impact strength and the like) than the PC sheet, but there was no problem in terms of the standard in actual use of the card.

(UV resistance)
As shown in FIG. 3B, the ISP sheet and the PC sheet were compared in terms of ultraviolet resistance (UV resistance).
The ISP sheet was superior to PC in discoloration against ultraviolet light when the accelerated test was passed in October. In discoloration with respect to UV resistance, the PC sheet has a durability of 10 years or more, and thus it was confirmed that the ISP sheet also has a sufficient durability.

(Falling cone impact test)
As shown in FIG. 3C, the ISP sheet and the PC sheet were compared in terms of the falling impact.
It was confirmed that the ISP sheet had the same falling impact as the PC sheet.

(Change in impact resistance over time)
FIG. 4 is a graph showing the results of a confirmation test of impact resistance with time in the ISP sheet of the first embodiment.
This test was an accelerated test in a high-temperature and high-humidity environment, and a change in hydroshot value according to the test progress was confirmed.
“Non-contact” is a card with a built-in loop antenna substrate (base material: PET sheet). The “contact” is a card formed only by an ISP sheet.
As shown in FIG. 4, the hydroshot value after 100 days is maintained at 600 kgf · mm or more. For this reason, the ISP sheet can be expected to have a durability of 10 years or more in a normal usage mode.
Further, when the operator folded the ISP sheet after 200 days and the PC sheet after 200 days by hand, there was no difference in feel between the ISP sheet and the PC sheet, and there was no expression of brittleness. . Since a card using a PC sheet usually has a durability of 10 years or more, the ISP sheet can be expected to have a durability of 10 years or more.

(Heat weldability)
A weld compatibility confirmation test was performed, and it was confirmed that the ISP sheet had the same thermal weldability as a PC sheet, a PET (polyethylene terephthalate) -G sheet, a PVC (polyvinyl chloride) sheet, and the like. That is, the thermal weldability between the ISP sheets was good, and the thermal weldability between the ISP sheet and other sheets (PC sheet, PET-G sheet, PVC sheet, etc.) was good.

(Viscoelastic behavior)
FIG. 5 is a graph for explaining the relationship of viscoelastic behavior with changes in the ISB ratio of the ISP sheet of the first embodiment.
This graph shows the measurement results of the performance of viscoelastic behavior (temperature, viscoelasticity, loss tangent) when an ISP sheet is manufactured by changing the ISB ratio. The measurement results were as follows.
-When the ISB ratio was 30 mol%, the performance was equivalent to that of the PET-G sheet.
-In ISB ratio 40 mol%, it was the performance equivalent to a heat-resistant PET-G sheet (equivalent to heat-resistant 100 degreeC).
-In ISB ratio 50 mol%, it was the performance equivalent to a heat-resistant PET-G sheet (heat-resistant 120 degreeC equivalency).
-In ISB ratio 70 mol%, it was the performance equivalent to a heat-resistant PET-G sheet (heat-resistant 140 degreeC equivalency).
In addition, in FIG. 5, although the comparison object of an ISP sheet shows as an example which is a heat resistant PET-G sheet, it is the same also about a heat resistant PVC sheet.

The result of this viscoelastic behavior indicates that the temperature setting during pressing of the ISP sheet may be set to the following conditions.
ISB ratio 40 mol%: 100 ° C. (90 ° C. or higher and 110 ° C. or lower) equivalent to heat-resistant PET-G sheet (corresponding to heat resistant 100 ° C.)
ISB ratio 50 mol%: 120 ° C. (110 ° C. or higher and 130 ° C. or lower) equivalent to heat-resistant PET-G sheet (heat-resistant to 120 ° C.)
ISB ratio 70 mol%: 140 ° C. (140 ° C. or higher and 150 ° C. or lower) equivalent to high heat resistant PET-G sheet (heat resistant 140 ° C. equivalent)

[Card manufacturing method]
A manufacturing process of the card 1 will be described.
FIG. 6 is a cross-sectional view illustrating the laminating process and the hot pressing process of the first embodiment.
An operator can manufacture the card 1 according to the following steps.
In practice, the card is manufactured by multiple imposition, but the following explanation is an example of manufacturing one card in a simplified manner.
(Lamination process)
The upper layer 10, the upper base material layer 20, the module substrate 30, the lower base material layer 40, and the lower layer 50 are sequentially laminated to produce a laminate 1 </ b> A.

(Hot press process)
The laminated body 1A is sandwiched between hot press plates 91 and 92, and heated and pressurized from the upper surface of the upper layer 10 and the lower surface of the lower layer 50. Thereby, the interlayer of the card | curd 1 is heat-welded.
At this time, as the temperature setting of the ISP sheet at the time of pressing, a setting corresponding to the ISB ratio may be selected based on the test result of the viscoelastic behavior. That is, the hot pressing may be performed by setting the temperature (90 ° C. or more and 150 ° C. or less) corresponding to the ISB ratio (40 to 70 mol%) of the ISP sheet.
For example, if the ISB ratio of the upper layer 10 or the like is 50 mol%, the temperature setting may be set to 120 ° C. (110 ° C. or more and 130 ° C. or less) equivalent to heat-resistant PET-G (corresponding to heat resistance of 120 ° C.).
Thereby, the part of the periphery 21 (refer FIG. 1) among the interlayer of the upper layer 10 and the upper base material layer 20, the interlayer of the upper layer 10 and the upper base material layer 20, and the lower base material layer 40 and the lower layer 50 can be heat-welded, respectively. .

When a predetermined pressing time has elapsed, the hot press plates 91 and 92 are separated from the laminate 1A, and the card 1 is taken out.
Thus, the card 1 can be manufactured.

As described above, the card 1 of the present embodiment has the following effects.
(1) Since the ISP sheet has the same physical performance and the like as the PC sheet, appropriate physical properties can be obtained for the card, and environmental resistance can be improved.
(2) Glucose is a plant-derived material that is produced by decomposing starch derived from corn and the like. ISB is a resin obtained by synthesizing this glucose (glucose). Since the card | curd 1 is formed by ISP which polymerized this ISB, the ratio of the plant-derived material can be improved.
Moreover, since the material of the conventional resin card is derived from petroleum, CO ₂ is generated at the time of resin synthesis, whereas in the case of ISP, the plant absorbs CO ₂ until it obtains glucose (CO ₂ emission). Minus). Therefore, card 1, the CO ₂ emissions during production, can be reduced than the conventional resin card.
(3) The ISP sheet is thermally welded at a heat welding temperature (90 ° C. or higher and 150 ° C. or lower) equivalent to that of a heat-resistant PET-G sheet or the like having a temperature lower than that of the PC sheet (about 180 ° C.). For this reason, the card | curd 1 can be used as a substitute of PC sheet | seat, and also can reduce and produce a damage to an internal electrical component in a hot press process.

(Second Embodiment)
Next, a second embodiment of the present invention will be described.
In the following description and drawings, parts having the same functions as those of the first embodiment described above are given the same reference numerals or the same reference numerals at the end (the last two digits), and overlapping explanations are appropriately given. Omitted.
FIG. 7 is a cross-sectional view of the card 201 of the second embodiment.
In the first embodiment described above, the layers other than the module substrate 30 are all ISP sheets, whereas in the second embodiment, the ISP sheet is used for only a part of the layers other than the module substrate 30.

That is, the upper base material layer 20 and the lower base material layer 40 of the card 201 are ISP sheets as in the first embodiment, while the upper layer 210 and the lower layer 250 are heat resistant PET-G sheets. The grade of the heat-resistant PET-G sheet can be appropriately selected from 100 ° C., 120 ° C., and 150 ° C. according to the heat resistance standard of the card 201.
The upper base material layer 20 and the lower base material layer 40 are ISP sheets having an ISB ratio corresponding to the heat resistant grades of the heat resistant PET-G sheets of the upper layer 210 and the lower layer 250.
For example, if the heat resistant grade of the heat resistant PET-G sheet of the upper layer 210 and the lower layer 250 is 120 ° C., the ISB ratio of the ISP sheet of the upper substrate layer 20 and the lower substrate layer 40 is 50 mol% (see FIG. 6). ).

In the hot press process of the card manufacturing process, the set temperature for heat welding is selected from 90 ° C. or higher and 150 ° C. or lower in accordance with the heat-resistant PET-G sheet of the upper layer 210 and the lower layer 250.
If the heat-resistant grade of the heat-resistant PET-G sheet of the upper layer 210 and the lower layer 250 is 120 ° C. as in the above example, the set temperature for heat welding is 120 ° C. (110 ° C. or higher and 130 ° C. or lower). Since the ISB ratio of the ISP sheet of the upper base material layer 20 and the lower base material layer 40 is 50 mol%, the upper base material layer 20 and the lower base material layer 40 are thermally welded at the periphery 21. Further, as described in the first embodiment, the ISP sheet has good weldability with other sheets. For this reason, between the upper layer 210 and the upper base material layer 20 and between the lower base material layer 40 and the lower layer 250 are also thermally welded.

  As described above, the card 201 according to the present embodiment matches the heat resistant grades of the ISP sheet and the heat-resistant PET-G sheet, even if some layers are ISP sheets and some layers are heat-resistant PET-G sheets. Can be manufactured.

In addition, which layer is used as an ISP sheet or a heat-resistant PET-G sheet can be appropriately selected according to the card specifications, cost, and the like.
The layers other than the ISP sheet are not limited to the heat-resistant PET-G sheet, and may be a heat-resistant PVC sheet. Also in this case, an ISP sheet corresponding to the grade of the heat-resistant PVC sheet can be selected and manufactured by hot pressing in the same manner as described above.

Further, a layer other than the ISP sheet may be a PC sheet. In this case, the set temperature is set to 90 ° C. or higher and 150 ° C. or lower (about 140 ° C. is suitable) in accordance with the ISP sheet during hot pressing. In addition, the ISP sheet is appropriately about 70 mol in order to further improve the heat resistance performance.
In addition, in a configuration in which a plurality of PC sheets are provided and the PC sheets are directly overlapped with each other, at a temperature setting of 90 ° C. or more and 150 ° C. or less, the welding temperature between the PC sheets is too low to be bonded easily. In this case, by arranging the ISP sheet between the PC sheets, the two PC sheets can be bonded via the ISP sheet.

  As mentioned above, although embodiment of this invention was described, this invention is not limited to embodiment mentioned above, For example, various deformation | transformation and a change are possible like the deformation | transformation form etc. which are mentioned later, These are also It is within the technical scope of the present invention. In addition, the effects described in the embodiments are merely a list of the most preferable effects resulting from the present invention, and the effects of the present invention are not limited to those described in the embodiments. It should be noted that the above-described embodiment and modifications described later can be used in appropriate combination, but detailed description thereof is omitted.

(Deformation)
In the present embodiment, the card includes a module substrate and communicates with the reader / writer. However, the present invention is not limited to this. The card may not have a module substrate. In this case, a module substrate formed of PET or the like is unnecessary, and the card can improve the plant-derived material ratio.
For example, the card may be of a type having a magnetic stripe.
The card may be of a type that prints only a barcode or the like on an ISP sheet. In this case as well, the card has the same performance as the PC sheet, and can be easily manufactured because it can have a simple layer structure.

1,201 Card 10,210 Upper layer 20 Upper substrate layer 30 Module substrate 40 Lower substrate layer 50,250 Lower layer

Claims (6)

A card in which a plurality of layers are stacked,
Among the plurality of layers, at least one of the core layers of the card is an isosorbite polymer prepared by reacting isosorbite with diphenyl carbonate and 1,4-cyclohexanedimethanol. Ri Sol bytes polymer sheet der,
At least one of the plurality of layers is at least one of a heat-resistant PET-G sheet and a heat-resistant PVC sheet,
The isosorbite polymer sheet is welded to at least one of the heat-resistant PET-G sheet and the heat-resistant PVC sheet;
Card characterized by. The card according to claim 1,
The ratio of isosorbite in isosorbite and 1,4-cyclohexanedimethanol in the isosorbite polymer sheet is 40 mol% or more and 70 mol% or less,
Card characterized by. The card according to claim 1 or 2 , wherein
At least one of the plurality of layers is a PC sheet;
Card characterized by. A method of manufacturing a card according to claim 2,
The isosorbite polymer sheets overlap each other,
Comprising a hot pressing step of welding the isosorbite polymer sheets together by hot pressing at a temperature of 90 ° C. or higher and 150 ° C. or lower;
A card manufacturing method characterized by the above. It is a manufacturing method of the card according to claim 1 , Comprising:
Comprising a hot pressing step of welding the isosorbite polymer sheet and at least one of the heat-resistant PET-G sheet and the heat-resistant PVC sheet by hot pressing at a temperature of 90 ° C. or higher and 150 ° C. or lower;
A card manufacturing method characterized by the above. A method of manufacturing a card according to claim 3 ,
Comprising a hot pressing step of welding between the isosorbite polymer sheet and the PC sheet by hot pressing at a temperature of 90 ° C. or higher and 150 ° C. or lower;
A card manufacturing method characterized by the above.

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