JP4545901B2 - Non-contact IC card manufacturing method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for manufacturing a non-contact IC card having a non-contact IC module having an annular antenna.
[0002]
[Prior art]
Conventional non-contact IC cards have been manufactured by thermocompression bonding (heat press) in a state where a plurality of resin layers are arranged on top and bottom layers of a non-contact type IC module having an antenna, respectively.
[0003]
[Problems to be solved by the invention]
However, in the above-described conventional technology, first, there is a problem that the shape of the IC module or antenna is raised on the card surface due to thermocompression bonding, the card surface becomes uneven, and the pattern flows.
Second, there is a problem in that there is a risk of disconnection at the time of thermocompression bonding because there is a step between the portion where the IC module and the antenna are present and the portion where the antenna is not present.
[0004]
Therefore, the problem to be solved by the present invention is to provide a method of manufacturing a non-contact IC card in which the shape of the antenna or IC module does not rise on the card surface and does not cause disconnection or the like.
[0005]
[Means for Solving the Problems]
In order to solve the above problems, a first aspect of the invention, Oite the contactless IC card manufacturing method of having a non-contact IC module comprising an electrically connected annular antenna,
When the spacer made of resin is disposed at a predetermined position inside and outside the region surrounded by the antenna, the spacer disposed in the region surrounded by the annular antenna is surrounded by the annular antenna . An arrangement step of setting the resin to be less fluid when heated than the resin of the spacer arranged outside the region,
After the placement step, a first thermocompression step for forming an intermediate laminate by placing a resin layer on each of the upper and lower layers of the antenna and thermocompression bonding,
A non-contact IC card comprising: a second thermocompression bonding step in which a pattern sheet made of a resin is placed on each of the upper layer and the lower layer of the intermediate laminate formed in the first thermocompression bonding step and thermocompression bonding is performed. It is a manufacturing method .
[0006]
According to a second aspect of the invention, in the non-contact IC card manufacturing method according to claim 1, before Symbol second thermocompression bonding step, after laminating by thermal compression bonding a protective layer on the pattern sheet, the pattern sheet It is characterized by thermocompression bonding to the intermediate laminate.
[0007]
In the present invention, first, in the first thermocompression bonding step, resin spacers are disposed inside and outside the region surrounded by the antenna in a ring shape, and resin layers are disposed on the upper layer and the lower layer to be thermocompression bonded. . As a result, the spacer and the resin layer are fused and integrated to form an intermediate laminate.
Then, a pattern sheet is arrange | positioned and thermocompression-bonded on this intermediate | middle laminated body by a 2nd thermocompression-bonding process.
[0008]
Through the above process, after the spacer provided around the antenna and the upper and lower resin layers are integrated, a pattern sheet provided with a pattern or the like is thermocompression bonded to the intermediate laminate, so that the antenna or IC module No longer appears on the card surface. Therefore, there is no flow of the pattern on the pattern sheet. Further, the provision of the spacer eliminates the possibility of disconnection or the like.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a diagram for explaining an embodiment of a method for producing a non-contact IC card according to the present invention. FIG. 1 shows a cross section of the layer structure of a non-contact IC card before thermocompression bonding.
The antenna 11 is formed in an annular shape, and is used for the IC module (IC chip) 12 to exchange information with an external device in a non-contact manner. The IC module 12 is electrically connected to the antenna 11. The maximum thickness of the IC module 12 is about 450 to 500 μm.
[0010]
First, spacers 13 (13a and 13b) are disposed inside and outside the region surrounded by the antenna 11 in a ring shape, and thermocompression bonding is performed with the resin layer 14 disposed on the upper layer and the lower layer, respectively ( First thermocompression bonding step).
Here, the thickness of the spacer 13 is about 200 μm. The spacer 13 is made of resin. In particular, in this embodiment, the spacer 13a disposed outside the region surrounded by the antenna 11 in an annular shape is made of a resin such as PVC (polyvinyl chloride). Thus, it is a resin with high fluidity due to heat. In addition to PVC, it is preferable to use an amorphous polyester resin such as PETG (trade name of Eastman Chemical Co.) because thermocompression bonding is possible and there is no risk of environmental pollution.
[0011]
On the other hand, the spacer 13b disposed in the region surrounded by the antenna 11 in an annular shape is made of PET (polyethylene terephthalate) or the like and is a resin having low fluidity due to heat.
In addition, said resin layer 14 consists of resin, such as PVC and PETG, The thickness is about 150 micrometers.
[0012]
By the first thermocompression bonding step, the antenna 11 and the IC module 12 are sandwiched between the resin layers 14 to form an integrated intermediate laminate. Further, the spacer 13 is fused and integrated with the resin layer 14.
At this time, the spacer 13a outside the annular region of the antenna 11 has high fluidity, whereas the spacer 13b inside the annular region has low fluidity, so that the shrinkage of the resin after thermocompression can be balanced. It becomes like this. Therefore, the antenna 11 is not distorted. This can prevent the card from warping.
[0013]
Next, the pattern sheet 15 and the protective layer 16 are sequentially stacked on the upper layer and the lower layer of the intermediate laminate formed in the above process, respectively, and are thermocompression bonded and integrated (second thermocompression bonding process). . Thereby, a non-contact IC card is formed.
The pattern sheet 15 is formed by printing characters, figures or patterns on a resin sheet substrate. The protective layer 16 is a transparent layer for protecting the guard surface. Both the pattern sheet 15 and the protective layer 16 are made of a resin such as PVC. The pattern sheet 15 has a thickness of about 100 μm, and the protective layer 16 has a thickness of about 50 μm.
A magnetic stripe layer 17 is provided on the upper protective layer 16.
[0014]
In this second thermocompression bonding step, the pattern sheet 15 and the protective layer 16 may be thermocompression bonded to the intermediate laminate formed by the first thermocompression bonding step at a time. It may be thermocompression bonded and integrated, and this may be thermocompression bonded to the intermediate laminate.
[0015]
By performing the thermocompression bonding process in two steps as described above, the shapes of the antenna 11 and the IC module 12 inside the card can be prevented from being raised on the card surface. Thereby, it can prevent that a pattern flows. Therefore, it can be made inferior to the conventional general card in appearance.
Furthermore, if the pattern sheet 15 and the protective layer 16 are integrated by thermocompression bonding in advance as described above, the flow of the pattern can be more effectively prevented.
[0016]
【The invention's effect】
According to the present invention, since the shape of the antenna and the IC module does not float on the card surface, it is possible to prevent the pattern on the pattern sheet from flowing and to smooth the surface. Furthermore, the possibility of disconnection can be eliminated.
Furthermore, according to the invention of claim 2, it is possible to improve the balance of shrinkage of the resin after thermocompression bonding and to prevent distortion of the antenna. Therefore, card warpage can be prevented.
[Brief description of the drawings]
FIG. 1 is a diagram for explaining an embodiment of a method for producing a contactless IC card according to the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 11 Antenna 12 IC module 13 (13a, 13b) Spacer 14 Resin layer 15 Picture sheet 16 Protective layer 17 Magnetic stripe layer

Claims (2)

Oite to the method of manufacturing the non-contact IC card having a contactless IC module having electrically connected to an annular antenna,
When the spacer made of resin is disposed at a predetermined position inside and outside the region surrounded by the antenna, the spacer disposed in the region surrounded by the annular antenna is surrounded by the annular antenna . An arrangement step of setting the resin to be less fluid when heated than the resin of the spacer arranged outside the region,
After the arrangement step, a first thermocompression bonding step of forming an intermediate laminate by placing a resin layer on each of the upper and lower layers of the antenna and thermocompression bonding,
A non-contact IC card comprising: a second thermocompression bonding step in which a pattern sheet made of a resin is placed on each of an upper layer and a lower layer of the intermediate laminate formed in the first thermocompression bonding step. Manufacturing method. In the manufacturing method of the non-contact IC card according to claim 1,
In the second thermocompression bonding step, a protective layer is laminated on the pattern sheet by thermocompression bonding, and then the pattern sheet is thermocompression bonded to the intermediate laminate.

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