CN103034888A - Electronic card manufacturing method - Google Patents
Electronic card manufacturing method Download PDFInfo
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- CN103034888A CN103034888A CN2011102908099A CN201110290809A CN103034888A CN 103034888 A CN103034888 A CN 103034888A CN 2011102908099 A CN2011102908099 A CN 2011102908099A CN 201110290809 A CN201110290809 A CN 201110290809A CN 103034888 A CN103034888 A CN 103034888A
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- card body
- card
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- electronic cards
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Abstract
The invention discloses an electronic card manufacturing method. The electronic card manufacturing method is mainly that a circuit substrate is pre-embedded into a card body (polyvinyl chloride (PVC)), adhesive for bonding (an adhesion agent) is coated on the front face and the back face of the card body, dielectric layers are fixedly adhered to the front face and the back face of the card body to form a middle layer (a semi-finished product), then package processing is finally finished after the middle layer is transported to different regions in the follow-up process, and only two outer wrapping pieces are required to be directly adhered to a dielectric on the card body through hot melting in a hot compression mode in the package processing so as to finish manufacture of a whole electronic card (an intelligent card). By means of the electronic card manufacturing method, the problem that manufacturers in the different regions have different processing devices and are immature in process technologies can be solved, or the semi-finished product with high technological difficulty level can be finished to improve appropriateness rate, card quality and processing convenience.
Description
Technical field
The present invention relates to the electronic cards technical field, be particularly related to a kind of electronic cards method for making, the higher semi-manufacture of its main first completing technology degree of difficulty, be transported to again each department and carry out following process, differ and the jejune problem of process technology in order to solve its process equipment of each department making manufacturer, promote card quality and process velocity.
Background technology
Along with the electronic card of the employed consumption of the general common people of progress of science and technology or drawing on function also increasingly with lifting, and follow the situation of swindling and usurping more and more, industry has a kind of novel electronic card (or claiming smart card) that screen and button are set on electronic card at present, utilize screen and button on the electronic card to be available for users to when consuming or using this card, the action of confirming and verifying is to improve the security of its use.
The manufacturing process of above-mentioned electronic card (smart card) is a ring important in the process because it needs the circuit substrate down of a control usefulness is entered in the card, begins to finish processing and card must be encapsulated after the circuit substrate down enters.
See also Fig. 1 and 2, be the active card job operation.Mainly first circuit substrate B down is entered among the card body A; be coated on card body A pros and cons with two outer-skin sheet C again; this outer-skin sheet C is generally the PVC material; looking the material characteristic utilizes sticker or heating to make outer-skin sheet C produce heat to melt and be combined with card body A again; usually outer-skin sheet C has comprised the protective seam protection printing-ink of layer of transparent, fits in advance in conjunction with front elder generation at two synusia C and body A and finishes.
But above-mentioned job sequence in the better area of some process technology or and country problem on major imperfections or the quality can't appear, but electronic card (smart card) area that these electronic products are used is very extensive, even develop in the future and replace the conditional electronic card and may extend over the entire globe use, if so when making, carry out production and processing in grown place (for example Taiwan) single or that the minority process technology is better, be transported to the whole world other areas use, being to be very big burden at the integral production cost, is not best business model.If the voluntarily production and processing in each department, on holistic cost, can obtain control, and have preferably and make a profit, but, problem in regional production and processing maximum is that dimensional packaged circuit board enters its down in the card, if having problem, encapsulation process may affect its function, cause the user when operation, to have problems, and there is very big drop each department to this type of product processing technique, very big-difference is also arranged on hardware or the process equipment, making each department processing level reach same degree quite is not easy, teach its process technology except promoting, on equipment, also may need to eliminate trade-in, so each department processor level will be risen to same levels and be in fact a hard problem very, moreover there is the homemade percentage of requirement some country, or the higher finished product tariff of class, promote again its processing quality and overall throughput and reduce under the situation of cost, form the important disappearance that a utmost point need solve in industrial community or practical application always and wait to improve.
Summary of the invention
Fundamental purpose of the present invention provides a kind of electronic cards method for making, it mainly is after down enters circuit substrate in advance on the card body (PVC), and all be coated with upper one then with viscose glue (solid) in card body tow sides, again a middle layer is adhered to card body tow sides and begin to form semi-manufacture, treat that the follow-up each department that are transported to go last encapsulation process again and finish, to promote the convenience of card quality and processing.
Secondary objective of the present invention provides a kind of electronic cards method for making, utilizes semi-manufacture, is transported to each department and goes last encapsulation process again and finish, and can greatly reduce it and transport and cost of manufacture.
For reaching above-mentioned purpose, electronic cards method for making of the present invention is to include the following step:
(a) the circuit board down is entered in the card body to encapsulate;
(b) coating one solid on the card body;
(c) on solid in conjunction with a medium, finish the middle layer;
(d) middle layer being transported to each department goes last encapsulation process again and finishes.
Electronic cards method for making of the present invention, it mainly is after down enters circuit substrate in advance on the card body (PVC or other plastic rubber substrates), and all be coated with upper one then with viscose glue (solid) in card body tow sides, again a dielectric layer is adhered to card body tow sides, begin to form a middle layer (semi-manufacture), treat that the follow-up each department that are transported to go last encapsulation process again and finish, and only need during encapsulation process with two outer cladding sheets directly with the card body on medium pass through hot pressuring method, make medium and outer cladding sheet because of the moulding of hot melt cementation, make and finish whole electronic cards (smart card).Electronic cards method for making of the present invention differs and the jejune problem of process technology except solving its process equipment of each department making manufacturer, also can improve its appropriate rate by the higher semi-manufacture of first completing technology degree of difficulty, to promote the convenience of card quality and processing.
For making your juror can understand technology contents of the present invention, and the effect that can reach, hereby cooperate and graphicly enumerate all preferred embodiments and be described in detail as follows.
Description of drawings
Fig. 1 is existing electronic card machining sketch chart;
Fig. 2 is the schematic diagram of existing electronic card coating hyaline membrane;
Fig. 3 is step schematic diagram of the present invention;
Fig. 4 is the schematic diagram that circuit board down of the present invention enters the card body;
Fig. 5 is the schematic diagram of card body coating solid binding medium of the present invention;
Fig. 6 is the structural representation that the present invention finishes the middle layer;
Fig. 7 is the schematic diagram that following process is carried out in middle layer of the present invention.
Fig. 8 is the schematic diagram that Fig. 7 machines.
Description of reference numerals: A-card body; The B-circuit substrate; The C-outer-skin sheet; 1-card body; The 2-circuit board; The 3-solid; The 4-medium; The 5-middle layer; 6-outer cladding sheet.
Embodiment
Your juror can further to structure of the present invention, use and feature thereof darker one deck be arranged for ease of, clear and definite, full and accurate understanding and understanding, the inventor enumerates preferred embodiment, cooperates graphic being described in detail as follows:
The present invention is a kind of electronic cards method for making, it mainly is after the middle layer that the process technology difficulty is higher produces in the original producton location, again gone again last encapsulation process and finish through being transported to each department in the middle layer, and only need during encapsulation process with two outer cladding sheets directly with the card body on medium pass through hot pressuring method, make medium and outer cladding sheet because of the moulding of hot melt cementation, make and finish whole electronic cards (smart card), make manufacturer for artificial each district and can make card via simple following process, except solving the not identical problem of each department process equipment and process technology, also can improve and production capacity and effective its cost that reduces.
Please refer to the drawing 3 is depicted as and reaches above-mentioned purpose, and electronic cards method for making of the present invention is to include the following step:
(a) circuit board 2 down are entered in the card body 1 to encapsulate;
(b) coating one solid 3 on card body 1;
(c) on solid in conjunction with a medium 4, finish middle layer 5;
(d) middle layer 5 being transported to each department goes last encapsulation process again and finishes.
Electronic cards method for making of the present invention, it mainly is after down enters circuit board 2 in advance on the card body 1 (PVC or other plastic rubber substrates), and all be coated with a upper solid 3 (then using viscose glue) in card body 1 tow sides, again a medium 4 is adhered to card body 1 tow sides, begin to form a middle layer 5 (semi-manufacture), treat that the follow-up each department that are transported to go last encapsulation process again and finish, and only need during encapsulation process with two outer cladding sheets 6 directly with card body 1 on medium 4 pass through hot pressuring method, make medium 4 and outer cladding sheet 6 because of the moulding of hot melt cementation, make and finish whole electronic cards (smart card).Electronic cards method for making of the present invention differs and the jejune problem of process technology except solving its process equipment of each department making manufacturer, also can improve its appropriate rate by the higher semi-manufacture of first completing technology degree of difficulty, to promote the convenience of card quality and processing.
Please refer to the drawing 4 is the middle layer schematic diagram of finishing of the present invention to shown in Figure 8.As described in step (a), that circuit board 2 down are entered in the card body 1 to encapsulate among Fig. 4, these circuit board 2 tight down enter in the card body 1 and its combination after to be packaged, its mode is the slot part (not shown) of digging out a coincidence circuit plate 2 sizes with dig in the card body 1 in advance, circuit board 2 tight down is entered in the card body 1 again.
As described in step (b), all be coated with one deck solid 3 in card body 1 pros and cons, this solid 3 is as preparation adhesion medium 4 usefulness.Treat that solid namely will in conjunction with a medium 4 on solid 3, finish middle layer 5 such as step (c) mode before dry; In the present embodiment, but this medium 4 be a thermosol film, plastic rubber substrate or and bind membraneous material.
Moreover as described in the step (d), middle layer 5 is transported to each department goes again last encapsulation process and finish.When in the end encapsulating, the area makes manufacturer when carrying out encapsulation process, only need 6 direct and middle layer 5 combinations of two outer cladding sheets, utilize hot pressuring method to make middle layer 5 outmost media 4 and outer cladding sheet 6 produce thermokarst phenomenon, variation by the control temperature,, make medium 4 and outer cladding sheet 6 because of the moulding of hot melt cementation, and then finish whole electronic cards (smart card) and make.
In sum, electronic cards method for making of the present invention, production and processing production middle layer 5 is carried out in the main grown place (for example Taiwan) single or that the minority process technology is better of going ahead of the rest when making, finish first and be transported to again each department behind the middle layer 5 and go again last encapsulation process and finish, these practices except can solve the better area of some process technology or and country problem on flaw or the quality appears in process, also need not to consider the drop of each department process technology or the otherness on hardware device, each department processor only need have hot melt pressurization technology can finish finished product.The present invention can obtain control and have preferably to make a profit on the integral manufacturing cost, to produce best cooked mode through many experiments, and can solve its process equipment of each department making manufacturer differs and the jejune problem of process technology, also can improve its appropriate rate by the higher semi-manufacture of first completing technology degree of difficulty, to promote the convenience of card quality and processing.
The above person, it only is preferred embodiment of the present invention, when not limiting scope of the invention process with this, the simple equivalence of namely generally doing according to the present patent application claim and description of the invention content changes and modifies, and all should still belong in the scope that patent of the present invention contains.
Claims (6)
1. an electronic cards method for making is characterized in that, is to include the following step:
(a) the circuit board down is entered in the card body to encapsulate;
(b) coating one solid on the card body;
(c) on solid in conjunction with a medium, finish the middle layer;
(d) middle layer being transported to each department goes last encapsulation process again and finishes.
2. electronic cards method for making according to claim 1, it is characterized in that, this this step (a), the mode that this circuit board down enters the card body are the slot parts of digging out a coincidence circuit board size size with dig in the card body in advance, the tightr down of circuit board are entered in the card body.
3. electronic cards method for making according to claim 1 is characterized in that, but this medium is a thermosol film.
4. electronic cards method for making according to claim 1 is characterized in that, this medium is a plastic rubber substrate.
5. electronic cards method for making according to claim 1 is characterized in that, but this medium is an adhesive film material.
6. electronic cards method for making according to claim 1, it is characterized in that, the described last encapsulation process of this step (d) is that two outer cladding sheets are combined with the middle layer, utilizes hot pressuring method to make the outmost medium in middle layer and outer cladding sheet produce the moulding of hot melt cementation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102908099A CN103034888A (en) | 2011-09-29 | 2011-09-29 | Electronic card manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102908099A CN103034888A (en) | 2011-09-29 | 2011-09-29 | Electronic card manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103034888A true CN103034888A (en) | 2013-04-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011102908099A Pending CN103034888A (en) | 2011-09-29 | 2011-09-29 | Electronic card manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103034888A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101183434A (en) * | 2007-12-18 | 2008-05-21 | 中电智能卡有限责任公司 | Smart card preparing technique |
| CN101281618A (en) * | 2008-05-27 | 2008-10-08 | 北京海升天达科技有限公司 | Smart card and method for manufacturing the same |
| CN101976368A (en) * | 2010-09-21 | 2011-02-16 | 深圳市卡的智能科技有限公司 | Method for manufacturing IC (Integrated Circuit) card |
-
2011
- 2011-09-29 CN CN2011102908099A patent/CN103034888A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101183434A (en) * | 2007-12-18 | 2008-05-21 | 中电智能卡有限责任公司 | Smart card preparing technique |
| CN101281618A (en) * | 2008-05-27 | 2008-10-08 | 北京海升天达科技有限公司 | Smart card and method for manufacturing the same |
| CN101976368A (en) * | 2010-09-21 | 2011-02-16 | 深圳市卡的智能科技有限公司 | Method for manufacturing IC (Integrated Circuit) card |
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Application publication date: 20130410 |