TWI544421B - IC card automated packaging process - Google Patents

Description

IC card automation packaging process

The present invention relates to a record carrier for a semiconductor circuit component, and more particularly to an IC card automated packaging process that avoids unevenness of the seal.

The general IC card integrates the IC chip into the plastic card to achieve functions such as storage, identification, encryption and decryption, transmission and data processing. The IC card can be roughly divided into contact type and non-contact type according to the reading mode: contact type The IC card must be in physical contact with the reading device to read the data. The time for reading and trading is longer and safer. It is generally used for security cards and credit cards, and the non-contact IC card uses the coil. The method of sensing to access data has the advantage of fast transaction time, and is suitable for occasions requiring fast reading such as access control card, employee identification card or leisure card.

An IC card having an electronic display and a random number generating function is shown in FIG. 12 and FIG. 13 , and includes a wafer module 60 , a first film 30 ′, a second film 40 ′ and a frame 50 ′, wherein The frame 50' is bonded to the first film 30', the chip module 60 is coupled to the first film 30' and is received in the frame 50', and the second film 40' is coupled to the frame 50'. 60 is provided with a flexible circuit board 61, a flexible electronic paper screen 62 and a flexible battery 63. The flexible circuit board 61 is provided with a button 611; this type of IC card can be used for users to conduct commodity and financial transactions on the network. When the user presses the button 611, the flexible circuit board 61 generates a set of codes and displays them on the flexible electronic paper screen 62. At this time, the remote server also generates a set of codes, when the IC card and the remote server are two. When the code generated by the person matches, the user can conduct the transaction.

In the past, when such an IC card was fabricated, the glue was positioned on the first film 30' corresponding to the wafer module 60 and the wafer module 60 and the frame 50' were fixed to the first film 30'. The wafer module 60 is encapsulated between the wafer module 60 and the frame 50', but the package has a gap between the wafer module 60 and the first film 30', and is often filled when the package is filled. It is difficult for the encapsulant to inject into the problem between the wafer module 60 and the first film 30', so that the distribution of the encapsulant is not uniform, which not only makes the IC card unevenly pressed, but also causes the IC card thickness to be uneven and tight. Defects such as poor results have led to a decline in the production yield of IC cards.

In order to solve the existing process of the IC card, the glue is fixed on the first board, the wafer module and the frame board are fixed on the first board, and the encapsulation glue is immediately poured, resulting in uneven sealing and good production of the IC card. The problem of decreasing the rate, this proposal proposes an IC card automatic packaging process, adding a procedure for coating the inner layer before fixing the wafer module, which can solve the problem of unevenness of the existing process sealing and improve the production yield of the IC card.

The present invention solves the technical problem of the IC card automatic packaging process, which comprises: the first printing plate is fixed: first, a carrier plate is placed on a plurality of rollers for transporting, and then a first printing plate is fixed to the carrier plate. The first printing plate has two surfaces and one of the surfaces is provided with one or more layers, the first printing plate is disposed with a surface of the layer facing downward; positioning the needle point: at the first The printing layer is provided with a positioning glue corresponding to a wafer module in a range of each layer of the surface on which the layer is not provided; the inner layer is glued: in the range of each layer of the first printing plate, corresponding Forming an inner layer of glue on a flexible circuit board included in each of the wafer modules; positioning of the wafer module: attaching the wafer module to each inner layer of glue; and sizing the middle layer: close to the first printing The edge of the continuous plate and the layers are glued and more than one middle layer is formed; the middle plate is placed: a middle plate is fixed to the carrier, and the intermediate plate has more than one frame Hole, the one The upper frame hole is disposed corresponding to the layer of the first printing plate and the inner edge of each frame hole is smaller than the outer edge of each layer, and the intermediate plate is attached to the first layer by the one or more middle layer gluing portions Printing a plate and each frame hole of the middle plate surrounds each wafer module; encapsulation injection: injecting a package glue into each frame hole of the middle partition; second printing plate placement: placing a second printing company The plate is fixed to the carrier plate, the second printing plate has two surfaces and is provided with more than one layer, the one or more layers are printed on one of the surfaces of the second printing plate and corresponds to the first printing company a layer of the printing plate is disposed, the second printing plate is placed against the intermediate plate and the surface is provided with the layer facing upward; the rolling fit: the first printing plate, the second printing plate The intermediate plate and the wafer modules are rolled and laminated; the flat pressure defoaming: the carrier plate after the roll bonding is combined with the first printing plate, the second printing plate, and the septum Plate and the wafer modules for flat pressing and defoaming; static curing: static curing Four hours; cut: for cutting a card.

The IC card automatic packaging process, wherein each of the chip modules includes a flexible electronic paper screen, and each of the flexible circuit boards is provided with a button; each layer of the first printing serial corresponds to a soft electronic paper The screen is provided with a window; the positioning rubber needle step is formed by the dispenser at the window of each layer of the first printing layer and at the button corresponding to the flexible circuit board of each layer, which is located at the button The positioning glue coating portion of the window is covered with the entire window, and the other coating film coating portion is annularly coated corresponding to the circumference of the button.

The IC card automatic packaging process, wherein the first printing serial is a rectangular sheet and has two long sides and two short sides, and the first printing layer has eight layers, and the layers are Arranging into two rows and four rows, the middle layer sizing step is performed by laterally coating the two long sides of the first printing splicing layer and the two rows of layers and forming a three-layer sizing place, in the first The two short sides of the printing plate and the printing patterns of the rows are longitudinally coated to form a five-layer sizing.

The IC card is an automated packaging process, wherein the positioning adhesive is a quick-drying adhesive.

The IC card is an automated packaging process, wherein the encapsulant is made of AB glue.

The IC card auto-packaging process, wherein the middle layer gluing step uses AB glue for the middle layer gluing.

The enhancement of the technical means of this creation is that the IC card automated packaging process of the creation adds a procedure for coating the inner layer before fixing the wafer module, and coating the package corresponding to the wafer module on the first printing plate. Glue can solve the problem that the coating of the existing process package is uneven, resulting in poor IC card adhesion and reduced yield.

In order to understand the technical features and practical functions of the present work in detail, and in accordance with the creative content, the following further describes the preferred embodiment as shown in the following figure:

Please refer to FIG. 1 and FIG. 2, the IC card automatic packaging process of the present invention is performed after the pre-processing, the first printing plate fixing A, the positioning rubber point B, the inner layer coating C, the wafer module positioning D, The middle layer is glued E, the middle partition plate is placed into F, the package glue is injected into G, the second printing plate is placed into H, the roll is laminated I, the flat pressure defoaming J, the static curing K and the cutting L are performed; The pretreatment system includes two steps of positioning hole punching and surface treatment. After the pretreatment step, the present invention is placed on a plurality of rollers 20 by a carrier 10, and the plurality of rollers 20 are rotated and transported. The carrier 10 performs the processes of the various stages, and sequentially packs the materials for making the IC card in each step.

As shown in FIG. 2, the IC card package material of the present invention comprises a first printing plate 30, a second printing plate 40, a middle plate 50 and more than one wafer module 60; wherein the positioning hole is performed When rushing, the CCD alignment punching device first aligns the positioning holes in the first printing plate 30, the second printing plate 40 and the intermediate plate 50, and then performs a corona discharge process (Corona Cleaner) The first printing plate 30, the second printing plate 40, and the intermediate plate 50 are surface-treated.

As shown in FIG. 2 and FIG. 3 , the carrier 10 is rectangular and has two long sides. The carrier 10 is provided with two rows of positioning pins 11 , and the two rows of positioning pins 11 are respectively erected on the carrier 10 . Close to the two long sides and equally spaced, in the preferred embodiment, the positioning pins 11 are provided with ten and divided into two rows; the plurality of rollers 20 are disposed below the carrier 10, the plurality of The roller 20 is used to support and transport the carrier 10;

The first printing plate 30 is a rectangular sheet and has two long sides, two short sides and two surfaces. The first printing plate 30 is provided with one or more layers 31 and two rows of positioning holes 32, the one or more The layer 31 is printed on one of the surfaces of the first printing plate 30, and each layer 31 is provided with a rectangular and transparent window 311. The two rows of positioning holes 32 are corresponding to the two rows of positioning pins of the carrier 10. 11 is disposed and equally spaced at the two adjacent long sides of the first printing pass 30. In the preferred embodiment of the present invention, the layer 31 of the first printing pass 30 is provided with eight There are two rows and four rows on average. The positioning holes 32 of the first printing plate 30 are provided with ten rows of positioning pins 11 corresponding to the carrier 10;

The second printing plate 40 is also a rectangular sheet and has two long sides, two short sides and two surfaces. The second printing plate 40 is provided with one or more layers 41 and two rows of positioning holes 42. The layer 41 is printed on one of the surfaces of the second printing plate 40 and is aligned with the layer 31 corresponding to the first printing plate 30. The two rows of positioning holes 42 are corresponding to the two rows of positioning pins of the carrier 10. 11 is disposed and equally spaced at the two adjacent sides of the two printing plates 40. In the preferred embodiment of the present invention, the layer 41 of the two printing plates 40 is provided with eight and an average score. In the second row, the positioning holes 42 of the two printing plates 40 are provided with ten rows of positioning pins 11 corresponding to the carrier 10; the intermediate plate 50 is also a rectangular sheet and has two long sides and two short sides. The intermediate plate 50 is provided with one or more frame holes 51 and two rows of positioning holes 52. The one or more frame holes 51 are arranged corresponding to the layer 31 of the first printing plate 30 and the inner edges of the frame holes 51. The outer edge of the layer 31 of the first printing plate 30 is smaller than the two rows of positioning pins 11 of the carrier 10 Arranged at equal intervals adjacent to the two long sides of the intermediate partition 50. In the preferred embodiment, the frame apertures 51 of the intermediate spacer 50 are provided with eight layers 31 corresponding to the first printing plate 30 and There are two rows, and the positioning holes 52 of the intermediate plate 50 are provided with ten rows of positioning pins 11 corresponding to the carrier 10;

The number of the chip modules 60 is set to correspond to the number of the layers 31 of the first printing plate 30. Each of the chip modules 60 is provided with a flexible circuit board 61, a flexible electronic paper screen 62 and a flexible battery 63. The flexible circuit board 61 is provided with a button 611, and the flexible electronic paper screen 62 and the flexible battery 63 are respectively coupled to the flexible circuit board 61.

For the processing steps of the IC card automated packaging process of this creation, the details are as follows:

The first printing plate fixed A: as shown in FIG. 2 and FIG. 3, the first printing plate 30 is placed on the carrier plate 10 with the surface 31 provided with the layer 31 facing down, the first printing plate 30 The two rows of positioning holes 32 are sleeved on the two rows of positioning pins 11 of the carrier 10.

Positioning the rubber needle point B: as shown in FIG. 3, firstly, the glue is placed on the surface of the first printing continuous plate 30 where the layer 31 is not provided, and the placement point of each wafer module 60 is positioned by the dispenser. In the preferred embodiment of the present invention, the glue is applied to the window 311 of the first printing plate 30 and the button 611 corresponding to each flexible circuit board 61 of each layer 31 to form a positioning glue and form two positioning positions. The glue coating portion 33, the positioning glue coating portion 33 located at each of the windows 311 is covered with the entire window 311, and the other positioning glue coating portion 33 is coated with a ring shape corresponding to the circumference of each button 611. In the preferred embodiment, a quick-drying adhesive is used for positioning.

Inner layer glue C: as shown in FIG. 4, step B is a precision dispensing process in which the flexible circuit board 61 of each wafer module 60 is glued in the range of each layer 31 of the first printing plate 30 and An inner layer of glue is formed 34. In the preferred embodiment of the present invention, the step of applying the inner layer of the glue is performed using AB glue, and the amount of the AB glue is about one gram.

The wafer module positioning D: as shown in FIG. 5, in step C, the wafer module 60 is attached to each layer 31 of the first printing plate 30 by using a CCD positioning system and a vacuum chuck mechanism, and each wafer module is molded. The flexible electronic paper screen 62 of the group 60 is facing downward and the first printing continuous plate 30 is attached, so that the flexible electronic paper screen 62 and the button 611 of each wafer module 60 are adhered to the two positioning adhesive coatings formed in the step A. 33, and the flexible circuit board 61 of each of the wafer modules 60 is adhered to the inner layer coating portion 34 formed in the step B.

The middle layer is smeared E: as shown in FIG. 6, the two sides of the first printing plate 30 and the two rows of layers 31 are laterally coated by a precision dispensing mechanism and three intermediate layers are formed. The two intermediate layer gluing portions 35 formed on the two long sides of the first printing plate 30 are located between the rows of the layers 31 and the rows of positioning holes 32, and then in the first printing plate 30. The two short sides and the row layers 31 are longitudinally coated to form five intermediate layers of the glue 35. In the preferred embodiment, the AB glue is used for the middle layer D.

The intermediate plate is placed in the F: as shown in FIG. 7, the spacer plate 50 is placed on the positioning pin 52 provided in the carrier 10, and the middle layer is formed in the step D. 35 is attached to the first printing plate 30 such that each of the wafer modules 60 is located in each of the frame holes 51 of the intermediate partition 50.

The encapsulant G is injected into the frame holes 51 of the intermediate plate 50 as shown in FIG. 8. The encapsulant used in the preferred embodiment of the present invention is AB glue. .

The second printing plate is placed in H: as shown in FIG. 9, the second printing plate 40 is disposed with the surface of the second printing plate 40 facing the upper surface of the second printing plate 40. The two rows of positioning pins 11 are placed on the carrier 10 such that the second printing plate 40 abuts against the intermediate plate 50.

Rolling fit I: as shown in FIG. 10, after the second printing plate 40 is attached, the first printing plate 30, the second printing plate 40, the intermediate plate 50, and the like The wafer module 60 is rolled and bonded.

Pressing and defoaming J: placing the roll-bonded carrier 10 together with the first printing plate 30, the second printing plate 40, the intermediate plate 50 and the wafer modules 60 into a vacuum pressure Combine equipment for flat pressing and defoaming.

Static setting K: The carrier 10 was taken out and allowed to stand for twenty-four hours to be solidified.

Cutting J: As shown in Fig. 11, the cutting of the card shape is performed.

The IC card automated packaging process of the present invention applies a package glue to the first printing plate 30 to eliminate the formation between the chip modules 60 and the first printing plate 30 before performing the wafer module positioning C. The gap can avoid the problem of uneven distribution of the encapsulant between each wafer module 60 and the first printing plate 30 in the subsequent step of encapsulating the G injection. The process of the creation not only improves the production of the IC card. The IC card produced by the present invention has a uniform thickness and a good adhesion compared with the IC card produced by the existing process.

A‧‧‧The first printed version is fixed
B‧‧‧ Positioning needle point
C‧‧‧Inner coating
D‧‧‧ wafer module positioning
E‧‧‧Middle layer gluing
F‧‧‧Separate version placement
G‧‧‧Package injection
H‧‧‧Second printing serial placement
I‧‧‧Rolling fit
J‧‧ ‧ flat pressure defoaming
K‧‧ ‧ static curing
L‧‧‧ cutting
10‧‧‧ Carrier Board
11‧‧‧Locating pin
20‧‧‧Roller
30‧‧‧First print version
30'‧‧‧First film
31‧‧‧ layers
311‧‧‧Window
32‧‧‧Positioning holes
33‧‧‧Positive coating station
34‧‧‧Inner gluing
35‧‧‧Middle layer gluing
40‧‧‧Second print version
40'‧‧‧second film
41‧‧‧ layers
42‧‧‧Positioning holes
50‧‧‧Sept
50'‧‧‧ frame piece
51‧‧‧Box hole
52‧‧‧Positioning holes
60‧‧‧ wafer module
61‧‧‧Soft circuit board
611‧‧‧ button
62‧‧‧Soft electronic paper screen
63‧‧‧Soft battery

1 is a flow chart of a preferred embodiment of the present creation. Figure 2 is an exploded view of the IC card production of the present creation. Figure 3 is a schematic diagram of the implementation of step B of the present creation. Figure 4 is a schematic diagram of the implementation of step C of the present creation. Figure 5 is a schematic diagram of the implementation of step D of the present creation. Figure 6 is a schematic diagram of the implementation of step E of the present creation. Figure 7 is a schematic diagram of the implementation of step F of the present creation. Figure 8 is a schematic diagram of the implementation of step G of the present creation. Figure 9 is a schematic diagram of the implementation of step H of the present creation. Figure 10 is a schematic diagram of the implementation of step I of the present creation. Figure 11 is a schematic diagram of the implementation of step L of the present creation. Fig. 12 is a perspective view showing the appearance of the IC card of the present invention. Figure 13 is an exploded view of the components of the IC card of the present invention.

A‧‧‧The first printed version is fixed

B‧‧‧ Positioning needle point

C‧‧‧Inner coating

D‧‧‧ wafer module positioning

E‧‧‧Middle layer gluing

F‧‧‧Separate version placement

G‧‧‧Package injection

H‧‧‧Second printing serial placement

I‧‧‧Rolling fit

J‧‧ ‧ flat pressure defoaming

K‧‧ ‧ static curing

L‧‧‧ cutting

Claims (6)

An IC card automatic packaging process, comprising: fixing a first printing plate: first placing a carrier plate on a plurality of rollers for transporting, and then fixing a first printing plate to the carrier plate, the first printing plate One surface having two surfaces and having more than one layer, the first printing plate having a surface facing down with a layer; positioning the needle point: no layer is provided in the first printing plate The other layer of the surface corresponds to a positioning glue on a placement point of a wafer module; the inner layer is glued: in the range of each layer of the first printing layer, corresponding to each wafer module Forming an inner layer of glue on a flexible circuit board; positioning of the wafer module: attaching the wafer module to each inner layer of glue; middle layer of glue: near the edge of the first printing plate and each The layers are glued and more than one middle layer is formed; the intermediate plate is placed: a middle plate is fixed to the carrier, the intermediate plate is provided with more than one frame hole, the one or more frames The hole system corresponds to the first Sweeping the layers of the plate to set and the inner edge of each frame hole is smaller than the outer edge of each layer, and the intermediate plate is attached to the first printing plate and the intermediate plate by the one or more middle layer gluing portions Each of the frame holes surrounds each of the chip modules; the encapsulation glue is injected into the frame holes of the middle partition plate; the second printing plate is placed: a second printing plate is fixed to the carrier plate, the first The second printing plate has two surfaces and is provided with more than one layer, the one or more layers being printed on one of the surfaces of the second printing plate and corresponding to the layer of the first printing plate, the second Printing a plate against the septum and with the surface facing the layer facing up; rolling fit: the first printing plate, the second printing plate, the intermediate plate, and the wafers The module is rolled and rolled; the flat pressure defoaming: the carrier plate after the roll bonding is flattened together with the first printing plate, the second printing plate, the intermediate plate and the wafer modules Pressurization and defoaming; static curing: static curing for 24 hours; cutting: Line card cutting. The IC card automatic packaging process of claim 1, wherein each of the chip modules comprises a flexible electronic paper screen, and each of the flexible circuit boards is provided with a button; The flexible electronic paper screen should be provided with a window; the positioning rubber needle step is to form a two-position adhesive coating at the window of each layer of the first printing continuous layer and the button corresponding to the soft circuit board of each layer by the dispenser. At the cloth, the positioning glue coating portion located at the window covers the entire window, and the other coating film coating portion is annularly coated corresponding to the circumference of the button. The IC card automatic packaging process of claim 2, wherein the first printing serial is a rectangular sheet and has two long sides and two short sides, and the first printing layer has eight layers. The layers are arranged in two rows and four rows, and the middle layer coating step is performed by laterally coating the two long sides of the first printing plate and the two rows of layers to form a three-layer glue layer. A longitudinal coating is performed between the two short sides of the first printing plate and the printing patterns of the respective rows to form a five-layer sizing. The IC card automated packaging process according to any one of claims 1 to 3, wherein the positioning adhesive is a quick-drying adhesive. The IC card automated packaging process of claim 4, wherein the encapsulant is AB glue. The IC card automated packaging process of claim 5, wherein the middle layer sizing step is performed by using an AB glue for the middle layer sizing.