CN107611067A - Integral type encapsulates cutting machine - Google Patents
Integral type encapsulates cutting machine Download PDFInfo
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- CN107611067A CN107611067A CN201710964135.3A CN201710964135A CN107611067A CN 107611067 A CN107611067 A CN 107611067A CN 201710964135 A CN201710964135 A CN 201710964135A CN 107611067 A CN107611067 A CN 107611067A
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- 238000005520 cutting process Methods 0.000 title claims abstract description 66
- 239000000758 substrate Substances 0.000 claims abstract description 62
- 238000003466 welding Methods 0.000 claims abstract description 47
- 238000005538 encapsulation Methods 0.000 claims abstract description 31
- 238000004806 packaging method and process Methods 0.000 claims abstract description 22
- 238000009826 distribution Methods 0.000 claims abstract description 12
- 238000000926 separation method Methods 0.000 claims abstract description 9
- 230000007246 mechanism Effects 0.000 claims description 60
- 230000033001 locomotion Effects 0.000 claims description 48
- 238000010030 laminating Methods 0.000 claims description 22
- 238000001514 detection method Methods 0.000 claims description 21
- 239000003292 glue Substances 0.000 claims description 16
- 238000006243 chemical reaction Methods 0.000 claims description 12
- 230000000007 visual effect Effects 0.000 claims description 11
- 230000033228 biological regulation Effects 0.000 claims description 8
- 239000000155 melt Substances 0.000 claims description 7
- 238000003825 pressing Methods 0.000 claims description 5
- 238000010257 thawing Methods 0.000 claims description 5
- 244000062793 Sorghum vulgare Species 0.000 claims description 2
- 235000019713 millet Nutrition 0.000 claims description 2
- 238000000605 extraction Methods 0.000 claims 1
- 238000002844 melting Methods 0.000 abstract description 4
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- 238000012545 processing Methods 0.000 description 26
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- 238000013021 overheating Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
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- 239000012943 hotmelt Substances 0.000 description 1
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Abstract
A kind of integral type encapsulates cutting machine, including：Base board delivery device, the base board delivery device are used to for substrate to be delivered to landfill station, welding post and cutting station, card base of the substrate provided with a plurality of array distributions successively；Chip fills device, and the chip landfill device is located at the landfill station, for the chip cut after separating to be filled in the landfill groove of the corresponding card base respectively；Packaging system is welded, the welding packaging system is located at the welding post, and for melting the PUR of bonding plane of the chip, the chip is formed into smart card with the corresponding card base encapsulation；Card dividing device, the card dividing device is located at the cutting station, for realizing the separation of the smart card and the substrate.The invention provides a kind of automaticity is high, space-saving integral type encapsulation cutting machine.
Description
Technical field
The invention belongs to intelligent card chip encapsulation technology field, is a kind of integral type encapsulation cutting machine specifically.
Background technology
Smart card is the common name for the plastic clip for being embedded with microchip, and data interaction can be realized with the external world by read write line.
Smart card has the advantages that reliability is high, security is good, memory capacity is big, type is more, thus be widely used in financial finance,
Social insurance, traffic for tourism, health care, government administration, commodity retail, amusement and recreation, school control and other fields.
With developing rapidly for smart card, its demand is increasing, and the processing to smart card brings very big challenge.Intelligence
It can block and be formed by chip and the encapsulation of card base, thus processing of the master operation also around chip and card base is carried out.Traditional smart card
Processing is mainly processed using craft or semi-hand, and automaticity is very low, it is difficult to meets the needs of the automatic integrated processing of multiple operation.
Especially, under existence conditions, when having multiple card bases on substrate, it is necessary to after first each card base is cut respectively
Individually encapsulation, causes processing efficiency more low.In addition, also face the problems such as equipment is numerous, space-consuming is big.
The content of the invention
For overcome the deficiencies in the prior art, the invention provides a kind of integral type to encapsulate cutting machine, with automation means
Intelligent card chip encapsulation and cutting on integral completing substrate, have prominent processing efficiency.
The purpose of the present invention is achieved through the following technical solutions：
A kind of integral type encapsulates cutting machine, including：
Base board delivery device, the base board delivery device be used for by substrate successively be delivered to landfill station, welding post with
Station is cut, the substrate is provided with the card base of a plurality of array distributions；
Chip fills device, and the chip landfill device is located at the landfill station, for will cut the chip after separating
Landfill is arrived in the landfill groove of the corresponding card base respectively；
Packaging system is welded, the welding packaging system is located at the welding post, for making the bonding plane of the chip
PUR melt, the chip is encapsulated with the corresponding card base and forms smart card；
Card dividing device, the card dividing device is located at the cutting station, for realizing the smart card and institute
State the separation of substrate.
As the improvement of above-mentioned technical proposal, the base board delivery device includes motion portion with being located in the motion portion
A plurality of substrate fixtures, the substrate fixture are used for substrate described in clamping correspondingly, and a plurality of substrate fixtures are with institute
State motion portion and move across landfill station, the welding post and the cutting station.
As the further improvement of above-mentioned technical proposal, the chip landfill device includes：
Chip conveying mechanism, the chip conveying mechanism are used to make chip strip band pass through dispensing station, the chip successively
Band has multiple chips by cutting；
Glue applying mechanism, the glue applying mechanism is located at the dispensing station, in the die bonding face of the chip strip band
Dispensing, the die bonding face of the chip strip band are used for encapsulation Nian Jie with card base；
Conversion landfill mechanism, the conversion landfill mechanism are used to remove the chip and fill the chip in the card
In the landfill groove of base.
As the further improvement of above-mentioned technical proposal, the conversion landfill mechanism includes the array direction along the card base
A plurality of landfill devices of distribution, the landfill device include rotary shaft body and multiple suction nozzles, and the rotary shaft body is located at the chip
The rear side in the die bonding face of band, rotation round of the suction nozzle along the rotary shaft body are uniformly distributed in the rotary shaft
The outer surface of body, the suction nozzle and the rear side in the die bonding face of the chip strip band are oppositely arranged and are used to remove the core
Piece.
As the further improvement of above-mentioned technical proposal, the chip landfill device also includes the first laminating mechanism, described
First laminating mechanism is used to press the chip and the card base through landfill；
And/or the welding packaging system also includes the second laminating mechanism, second laminating mechanism is used in the heat
Melten gel presses the chip and the card base after melting.
As the further improvement of above-mentioned technical proposal, the welding packaging system includes at least one first laser device,
The first laser device is located at the welding post, melts the PUR in die bonding face for launching laser beam, institute
State chip to be embedded in advance in the landfill groove of the card base, the surface of the bonding plane of the chip and the landfill groove keeps relative.
As the further improvement of above-mentioned technical proposal, it is described welding packaging system also include First look detection unit with
Control unit, the First look detection unit is located at the welding post, for detecting the movement velocity parameter of the substrate
With location parameter, described control unit first laser device according to the movement velocity parameter regulation goes out ray velocity and root
Position compensation is carried out to the light path that goes out of the first laser device according to the location parameter.
As the further improvement of above-mentioned technical proposal, the card dividing device includes at least one second laser,
The second laser is used to carry out the substrate in card cutting, the light direction of the second laser and the substrate table
Face is vertical.
As the further improvement of above-mentioned technical proposal, the card dividing device also include the second visual detection unit with
Control unit, second visual detection unit is located at the cutting station, for detecting the movement velocity parameter of the substrate
With location parameter, described control unit second laser according to the movement velocity parameter regulation goes out ray velocity and root
Position compensation is carried out to the light path that goes out of the second laser according to the location parameter.
As the further improvement of above-mentioned technical proposal, a plurality of cards are based on the substrate at least in the first direction
Distribution, the direction of motion of the first direction and the substrate are not parallel to each other.
The beneficial effects of the invention are as follows：
Including base board delivery device, chip landfill device, welding packaging system and card dividing device, integrally complete
Feeding, landfill, welding and the cutting process of card base on chip and substrate on chip strip band, and with synchronous Multi-axis Machining
Ability, there is prominent processing efficiency, there is provided a kind of automaticity is high, space-saving integral type encapsulation cutting machine.
To enable the above objects, features and advantages of the present invention to become apparent, preferred embodiment cited below particularly, and coordinate
Appended accompanying drawing, is described in detail below.
Brief description of the drawings
In order to illustrate the technical solution of the embodiments of the present invention more clearly, below by embodiment it is required use it is attached
Figure is briefly described, it will be appreciated that the following drawings illustrate only certain embodiments of the present invention, therefore be not construed as pair
The restriction of scope, for those of ordinary skill in the art, on the premise of not paying creative work, can also be according to this
A little accompanying drawings obtain other related accompanying drawings.
Fig. 1 is the overall schematic for the integral type encapsulation cutting machine that the embodiment of the present invention 1 provides；
Fig. 2 is the structural representation of the base board delivery device for the integral type encapsulation cutting machine that the embodiment of the present invention 1 provides；
Fig. 3 be in Fig. 2 integral type encapsulation cutting machine base board delivery device A at enlarged diagram；
Fig. 4 be in Fig. 2 integral type encapsulation cutting machine base board delivery device B at enlarged diagram；
Fig. 5 is the structural representation of the chip landfill device for the integral type encapsulation cutting machine that the embodiment of the present invention 1 provides；
Fig. 6 is the structural representation of the chip strip band for the integral type encapsulation cutting machine application that the embodiment of the present invention 1 provides；
Fig. 7 is the welding packaging system and card dividing device for the integral type encapsulation cutting machine that the embodiment of the present invention 1 provides
Structural representation；
Fig. 8 is the feedback control connection of the welding packaging system for the integral type encapsulation cutting machine that the embodiment of the present invention 1 provides
Schematic diagram；
Fig. 9 is the feedback control connection of the card dividing device for the integral type encapsulation cutting machine that the embodiment of the present invention 1 provides
Schematic diagram.
Main element symbol description：
10000- integral types encapsulation cutting machine, 1000- base board delivery devices, 1100- motions portion, 1110- driving wheels,
1120- driven pulleys, 1130- flexible elements, 1131- lug bosses, 1140- drive divisions, 1200- substrate fixtures, 2000- chips landfill dress
Put, 2100- chip conveying mechanisms, 2200- glue applying mechanisms, 2210- Glue dripping heads, the sharp plastic emitting portions of 2211-, 2300- conversion landfills
Mechanism, 2310- landfill devices, 2311- rotary shaft bodies, 2312- suction nozzles, the laminating mechanisms of 2400- first, 3000- welding packaging systems,
3100- first laser devices, the laminating mechanisms of 3200- second, 3300- First look detection units, 4000- card dividing devices,
4100- second lasers, the visual detection units of 4200- second, 5000- cooling bodies, 5100- coldplates, 5110- stomatas,
5200- inlet ends, 6000- control units, 7000- automatic blanking devices, 7100- feeding heads, 7200- storing areas, 20- substrates,
21- card bases, 30- chip strip bands, 31- chips.
Embodiment
For the ease of understanding the present invention, integral type encapsulation cutting machine is more fully retouched below with reference to relevant drawings
State.The preferred embodiment of integral type encapsulation cutting machine is given in accompanying drawing.But integral type encapsulation cutting machine can pass through many
Different form is realized, however it is not limited to embodiment described herein.On the contrary, the purpose for providing these embodiments is to make pair
Integral type encapsulates the disclosure more thorough and comprehensive of cutting machine.
It should be noted that when element is referred to as " being fixed on " another element, it can be directly on another element
Or there may also be element placed in the middle.When an element is considered as " connection " another element, it can be directly connected to
To another element or it may be simultaneously present centering elements.On the contrary, when element be referred to as " directly existing " another element " on " when,
In the absence of intermediary element.Term as used herein " vertically ", " horizontal ", "left", "right" and similar statement are
For illustrative purposes.
Unless otherwise defined, all of technologies and scientific terms used here by the article is with belonging to technical field of the invention
The implication that technical staff is generally understood that is identical.It is in the term used in the description of integral type encapsulation cutting machine herein
In order to describe the purpose of specific embodiment, it is not intended that the limitation present invention.Term as used herein " and/or " include one
Or the arbitrary and all combination of multiple related Listed Items.
Embodiment 1
Fig. 1 and Fig. 5~6 are please referred to, integral type encapsulation cutting machine 10000 includes base board delivery device 1000, chip
Device 2000, welding packaging system 3000 and card dividing device 4000 are filled, is integrally completed on chip 31 and substrate 20
Card base 21 feeding, landfill, welding and cutting process, and the ability with synchronous Multi-axis Machining has prominent processing effect
Rate.The primary structure for encapsulating cutting machine 10000 to integral type below describes in detail.
Base board delivery device 1000 is used for the conveying of substrate 20, substrate 20 is delivered to landfill station, welding post successively
With cutting station.Wherein, substrate 20 is provided with the card base 21 of a plurality of array distributions, and card base 21 is used to be packaged into intelligence with chip 31
Can card.The array way of card base 21 is varied, such as the direction of motion along substrate 20.Preferably, a plurality of card bases 21 are in base
At least it is distributed in the first direction on plate 20, the direction of motion of first direction and substrate 20 is not parallel to each other.In an exemplary reality
Apply in example, first direction is vertical with the direction of motion of substrate 20.Further preferably, a plurality of card bases 21 are on substrate 20 and along
Two directional spredings, second direction is parallel with the direction of motion of substrate 20, forms being interspersed laterally and longitudinally.
Please refer to Fig. 2~4, it is preferable that base board delivery device 1000 includes motion portion 1100 and is located at motion portion
A plurality of substrate fixtures 1200 on 1100, substrate fixture 1200 are used for clamping substrate 20 correspondingly, a plurality of substrate cards
Tool 1200 moves across welding post with motion portion 1100.Because substrate 20 is installed on substrate fixture 1200, substrate 20 is with base
Board tool 1200 receives welding processing by welding post.
Wherein, motion portion 1100 is main travel mechanism, a variety of mechanical structures can be used to realize motion.Usually, transport
Dynamic portion 1100 can use straight-line motion mechanism, and such as line slideway, linear bearing form are realized, and with motor, hydraulic motor etc.
Part is driven.
Preferably, motion portion 1100 realizes motion purpose using flexible driving structure.Motion portion 1100 includes driving wheel
1110th, the flexible element 1130 of driven pulley 1120 and tensioning connection driving wheel 1110 and driven pulley 1120, in other words, flexible element 1130
Driving wheel 1110 and driven pulley 1120 are sequentially connected, forms flexible driving relation.Further, driving wheel 1110 is also associated with driving
Dynamic portion 1140, drive division 1140 can use the forms such as motor, hydraulic motor, to drive driving wheel 1110 to rotate.
Wherein, flexible driving relation, it is a kind of common machine driving, generally by two or more drives and flexible element
1130 compositions, motion and power are transmitted by flexible element 1130 between drive.According to the type of flexible element 1130, flexibility passes
Dynamic mainly to have V belt translation, Chain conveyer and rope drive, drive is respectively belt wheel, sprocket wheel and rope sheave, and flexible element 1130 is respectively to pass
Dynamic band, driving-chain and transmission rope.Wherein, driving wheel 1110 and driven pulley 1120 are drive.
Flexible element 1130 sets a plurality of lug bosses 1131, the adjacent composing base card of lug boss 1131 along its direction of motion
Tool 1200.In other words, lug boss 1131 protrudes from a side surface of the flexible element 1130 away from drive, adjacent lug boss 1131
Front and rear fold becomes substrate fixture 1200.Substrate 20 is transported by the adjacent clamping of lug boss 1131 with the revolution of flexible element 1130
Move and move, realize the transport of substrate 20.
Wherein, a plurality of lug bosses 1131 can be distributed with a variety of distribution forms.In an exemplary embodiment, plural number
The direction of motion of the individual lug boss 1131 along flexible element 1130 is uniformly distributed.In another embodiment, a plurality of lug bosses 1131
Between there is different spacing, to adapt to various sizes of substrate 20.
Preferably, motion portion 1100 has two flexible driving structures be arrangeding in parallel.In other words, motion portion 1100 has
Two driving wheels, 1110, two drives and two flexible elements 1130, are respectively cooperating with and form two groups of flexible driving relations.Together
When, two flexible driving parallelism structurals are set, and the lug boss 1131 on flexible element 1130 is distributed completely the same, further increases base
Effective Area of bearing of board tool 1200, makes that the clamping of substrate 20 is more firm, and active area is bigger.
Chip landfill device 2000 be located at the landfill station, for will cut separation after chip 31 respectively fill arrive pair
In the landfill groove for the card base 21 answered.Chip landfill is installed on the appropriate adhesive of spot printing on card base 21, chip 31 is divided from card base 21
From and fill in time in the landfill groove of card base 21, be ready for follow-up encapsulation process.Correspondingly, chip landfill device
2000 set dispensing station and landfill station, and dispensing station is used to carry out dispensing processing, and landfill station is used to carry out landfill processing.
It should be appreciated that chip 31 has been subjected to preliminary cutting, only still it is connected with card base 21 in edge and is not completely separated.
Fig. 5~6 are please referred to, to realize the automatic transport of card base 21, chip landfill device 2000 sets chip to convey
Mechanism 2100.Chip conveying mechanism 2100 is used to make card base 21 successively by dispensing station and landfill station, to realize for card
The dynamic machining of base 21.Wherein, card base 21 has the chip 31 of multiple array distributions.In other words, multiple chips 31 form a band
Shape structure.
Chip conveying mechanism 2100 can use various structures to realize, such as line slideway, linear bearing form.Preferably,
Chip conveying mechanism 2100 uses flexible driving structure.In other words, chip conveying mechanism includes the first charging tray and the second charging tray, core
In on the first charging tray, the other end is then wound on the second charging tray the one ends wound of piece band 30, and the first charging tray is synchronous with the second charging tray
Rotation and driving chip band 30 moves.
Dispensing station sets corresponding organisation of working and realizes dispensing and process.Here, glue applying mechanism 2200 is located at dispensing work
Position, for the die bonding millet cake glue in chip strip band 30.Wherein, the die bonding face of chip strip band 30 is used for viscous with card base 21
Connect encapsulation.Usually, die bonding face is located at the back side of chip strip band 30.More specifically, die bonding face is that chip 31 is used
In the surface Nian Jie with card base 21.
In an exemplary embodiment, PUR is preset in the die bonding face of chip strip band 30.Under normal temperature, hot melt
Glue be solid without have cementability, bonding can not be realized.Here, glue applying mechanism 2200 is used to smear appropriate glue in die bonding face
Stick, the preliminary bonding of chip 31 and card base 21 can be realized promptly with the cemented in place of card base 21 after being cut so as to chip 31.
Glue applying mechanism 2200 can use multiple structural forms to realize, such as rubber gun, dispensing needle head type.Preferably, point
Gluing mechanism 2200 includes Glue dripping head 2210, and Glue dripping head 2210 has sharp plastic emitting portion 2211, sharp plastic emitting portion 2211 and card base 21
The vertically opposite setting in die bonding face.Wherein, sharp plastic emitting portion 2211 has conical structure, the sophisticated direct face of conical structure
To the die bonding face of card base 21, make gel quantity controllable, avoid dispensing excessive and cause adhesion to pollute or waste.
Preferably, chip landfill device 2000 includes conversion landfill mechanism 2300, and conversion landfill mechanism 2300 is used to remove
Cleaved chip 31, and separated chip 31 is filled in the landfill groove of card base 21.Here, conversion landfill mechanism 2300
Realize the seamless connection of chip landfill device 2000 and following process device.Preferably, conversion landfill mechanism 2300 includes edge
A plurality of landfill devices 2310 of the array direction distribution of card base 21.In an exemplary embodiment, a plurality of landfill devices
2310 linear array distributions in the first direction.
Landfill device 2310 can use multiple structural forms, such as chuck, clamping jaw form, realize the crawl and conversion of chip 31
Transport.Preferably, filling device 2310 includes rotary shaft body 2311 and multiple suction nozzles 2312.Wherein, rotary shaft body 2311 is located at card
The rear side in the die bonding face of base 21, there is rotational motion capability and realize the rotation transposition of suction nozzle 2312.The edge of suction nozzle 2312
The rotation round of rotary shaft body 2311 is uniformly distributed in the outer surface of rotary shaft body 2311, and multiple station is picked and placeed so as to be formed.Inhale
Mouth 2312 and the rear side in the die bonding face of card base 21 are oppositely arranged, for removing the chip 31 through initial gross separation.
In an exemplary embodiment, suction nozzle 2312 forms negative pressure of vacuum.Under suction function, suction nozzle 2312 and core
Piece 31 connects as one.Rotary shaft body 2311 rotates, and drives suction nozzle 2312 to rotate, the chip 31 being connected with suction nozzle 2312 is driven
And separated with card base 21, and rotated with suction nozzle 2312.When suction nozzle 2312 turns over certain angle with card 21 face of base, suction nozzle
2312 suction function disappears, and chip 31 is separated with suction nozzle 2312 and falls into the landfill groove of card base 21.The chip of chip 31
Bonding plane is contacted with filling the surface of groove, and cemented in place is realized under the adhesive effect of the spot printing of glue applying mechanism 2200.
Preferably, device 2310 is filled between card base 21 and cut card base 21, card base 21 and cut card base
21 arrange in parallel to each other.Exemplarily, card base 21 is flatly laid, and landfill channel opening is straight up.Correspondingly, station is filled
The card base 21 at place moves and horizontally disposed in the horizontal direction.
Preferably, chip landfill device 2000 also includes the first laminating mechanism 2400, further to improve chip 31 and card
The adhesive effect of base 21.First laminating mechanism 2400 is used to press the chip 31 after PUR melts and card base 21, with extrusion die
Space between piece 31 and card base 21 and chip 31 is welded in place with card base 21, avoid loosening and rise and fall and cause loose contact.
Supplementary notes, after PUR melts, gap is formed between chip 31 and card base 21, and the mobility after melting due to PUR makes
Chip 31 positions with the inconvenience of card base 21, and the first laminating mechanism 2400 can effectively solve this problem.
Wherein, the first laminating mechanism 2400 can use various structures, such as clamping jaw, clamping plate, miniature block stamp.Preferably,
One laminating mechanism 2400 uses rolling mode, and its power source for including roller and driving roller rotation, roller rotatably acts on
On chip 31 after PUR thawing, the chip 31 after PUR thawing is set to be fastened with the pressing of card base 21.
In an exemplary embodiment, the outline of roller keeps tangent with the upper surface of card base 21, when substrate 20
During with motion portion 1100 by the first laminating mechanism 2400, roller folds with flexible element 1130 and oppresses chip 31 and connect with card base 21
Closely, the pressing of the two is realized.
After preliminary landfill, the substrate 20 with chip 31 enters welding post from station is filled, and receives welding encapsulation
Processing.Fig. 7 is please referred to, welding post is provided with welding packaging system 3000, the PUR of the bonding plane for making chip 31
Melt, chip 31 is encapsulated into smart card with corresponding card base 21.
Welding packaging system 3000 can use a variety of processing modes, it is preferable that welding packaging system 3000 uses Laser Welding
Connect mode.In other words, welding post is provided with least one first laser device 3100, and first laser device 3100 is used to launch laser light
Beam and melt the PUR of the bonding plane of chip 31.In an exemplary embodiment, welding packaging system 3000 has
A plurality of first laser devices 3100, linear array is distributed first laser device 3100 in the first direction, so as to match a plurality of card bases
Processed while 21, there is prominent processing efficiency.
First laser device 3100 launches laser beam, and laser beam focusing generates heat in the front of chip 31.Due to first
The power of laser 3100 and the regulation of action time, heat energy caused by laser beam will not cause brokenly to the structure of chip 31
It is bad.The heat energy is transferred to the bonding plane of chip 31 by the front of chip 31, is made PUR heated and is gradually melted.PUR melts
Afterwards, there is very high bonding strength, enable the bonding plane of chip 31 Nian Jie with the surface for filling groove firmly.Wherein, first swashs
Light device 3100 is laser welding head.
Preferably, on a Linear feed mechanism, Linear feed mechanism connects first laser device 3100 in which can move along a straight line
Close or remote from card base 21.In other words, Linear feed mechanism is used to adjust first laser device 3100 and the relative position of card base 21, enters
The regulatory function of one-step optimization first laser device 3100, the active position of laser beam is set precisely to adjust.For example, straight line enters
The direction of motion to mechanism can be parallel or vertical with the surface of card base 21, so as to adjust first laser device 3100 and the phase of card base 21
To position or distance.Wherein, Linear feed mechanism can use various structures, including line slideway, linear bearing, telescopic cylinder etc.
Type.
, it is preferable that welding packaging system 3000 also includes the second laminating mechanism 3200, further to improve chip 31 and card
The adhesive effect of base 21.Second laminating mechanism 3200 is used to press the chip 31 after PUR melts and card base 21, with extrusion die
Space between piece 31 and card base 21 and chip 31 is welded in place with card base 21, avoid loosening and rise and fall and cause loose contact.
Supplementary notes, after PUR melts, gap is formed between chip 31 and card base 21, and the mobility after melting due to PUR makes
Chip 31 positions with the inconvenience of card base 21, and the second laminating mechanism 3200 can effectively solve this problem.
Wherein, the second laminating mechanism 3200 can use various structures, such as clamping jaw, clamping plate, miniature block stamp.Preferably,
Two laminating mechanisms 3200 use rolling mode, and its power source for including roller and driving roller rotation, roller rotatably acts on
On chip 31 after PUR thawing, the chip 31 after PUR thawing is set to be fastened with the pressing of card base 21.
In an exemplary embodiment, the outline of roller keeps tangent with the upper surface of card base 21, when substrate 20
During with motion portion 1100 by the second laminating mechanism 3200, roller folds with flexible element 1130 and oppresses chip 31 and connect with card base 21
Closely, the pressing of the two is realized.
Please refer to Fig. 4, it is preferable that welding post is provided with cooling body 5000, and cooling body 5000 is used for processing
In card base 21 cooled down.Cooling body 5000 is used to prevent working position from overheating and causing structural damage, according to the type of cooling
Difference, gas cooling or liquid cooling mode can be used.Gas cooling mode takes away heat, liquid cooling mode with compressed gas
Heat is taken away with coolant.
In an exemplary embodiment, cooling body 5000 uses cooling air mode.Cooling body 5000 includes
Coldplate 5100 and inlet end 5200, coldplate 5100 are provided with a plurality of stomatas 5110 and connection stomata 5110 and inlet end 5200
Insertion air flue, an a plurality of side surfaces of the face card base 21 away from first laser device 3100 of stomata 5110.Thus, inlet end
5200th, penetrate air flue and form consistent vent passage with a plurality of stomatas 5110.Exemplarily, coldplate 5100 is located at welding post
The lower section of flexible element 1130, directly can carry out air blowing cooling to the card base 21 on substrate fixture 1200.
Here, cooling air enters insertion air flue from inlet end 5200.Due to the effect of draught head, cooling air is through insertion
Air flue reaches stomata 5110, and is sprayed through stomata 5110 and act on the processing department of card base 21, and it is unnecessary caused by processing department to drive
Heat, avoid pyrolytic damage.Wherein, inlet end 5200 can use the forms such as gas path joint to realize.
Please referring to Fig. 8, it is preferable that welding packaging system 3000 also includes First look detection unit 3300, and first
Visual detection unit 3300 is electrically connected with control unit 6000.First look detection unit 3300 is located at welding post, is used for
The movement velocity parameter and location parameter of card base 21 are detected, control unit 6000 is according to movement velocity parameter regulation first laser device
3100 go out ray velocity and according to location parameter to first laser device 3100 go out light path carry out position compensation.
Wherein, First look detection unit 3300 is a kind of equipment for machine replacing human eye to measure and judge.The
One visual detection unit 3300 will be ingested target and be converted into picture signal, send image processing module to.Image processing module
According to the information such as pixel distribution and brightness, color, picture signal is transformed into digitized signal and these signals carried out various
Clarification of objective is extracted in computing.Thus, First look detection unit 3300 obtains movement velocity parameter and the position of card base 21
Parameter.Wherein, because chip 31 moves with card base 21, the movement velocity of chip 31 is consistent with the movement velocity of card base 21.
First look detection unit 3300 can take various forms realization, usually be used as main realization using industrial camera
Form.The most essential function of industrial camera converts optical signals into orderly electric signal, and directly determines collected figure
As parameters such as resolution ratio, picture qualities.Preferably, industrial camera includes CCD camera or CMOS cameras, can also use other types
Camera form.
Control unit 6000 receives the movement velocity parameter and location parameter of the output of First look detection unit 3300, with mark
Quasi- parameter carries out corresponding comparison calculation, sends control instruction to first laser device 3100 according to operation result, regulation first swashs
The process velocity and Working position of light device 3100, realize feedback regulation.
In other words, control unit 6000 adjusts first laser device 3100 and goes out ray velocity, makes laser beam and card base 21
Shifted matching, laser welding time keep in the reasonable scope, preventing overheat or shortage of heat, improve processing efficiency；Control is single
Member 6000 and adjust first laser device 3100 go out light path, realizes position compensation, makes the focus point of laser beam ideal.
Control unit 6000 has corresponding logical operation capability, can be integrated in first laser device 3100, can act also as
It is arranged at outer separate processing units.Exemplarily, control unit 6000 can use microprocessor, computer, computing circuit etc.
Form, it can also use the types such as driver.
In order to complete the cutting of smart card processing, smart card is set to meet trimmed size requirement, integral type encapsulation cutting machine
10000 set cutting station to carry out card cutting.Fig. 7 is please referred to, cutting station is provided with card dividing device 4000, is used for
Realize the separation of smart card and substrate 20, that is, the separation of card base 21 and substrate 20.
Card dividing device 4000 can use a variety of processing modes, such as mechanical milling head, wire cutting.Preferably, card point
Cutting apparatus 4000 uses laser cutting mode.Card dividing device 4000 includes at least one second laser 4100, and second swashs
Light device 4100 is used to cut card base 21, and the light direction of second laser 4100 is vertical with the surface of substrate 20.One
In individual exemplary embodiment, card dividing device 4000 has a plurality of second lasers 4100, the edge of second laser 4100
First direction linear array is distributed, and is processed so as to match while a plurality of card base 21, has prominent processing efficiency.
Second laser 4100 is used to be generated and transmitted by laser, and laser action makes Working position in the position that needs are cut
Card base 21 rapidly heating vaporization, evaporation form hole.With the relative movement of laser beam and card base 21, the hole continuously generated
Hole, which is connected, forms joint-cutting, realizes the separation of card base 21 and substrate 20.
Wherein, second laser 4100 can use polytype, including gas laser, solid state laser, semiconductor to swash
The type such as light device and dye laser.Preferably, second laser 4100 uses the type of ultraviolet laser, ultraviolet for launching
Laser, its short wavelength's characteristic are easy to focus on the point of systems, can carry out the processing of trickle part, and can obtain very
High energy density, joint-cutting is neat and small, makes the neat in edge of card base 21 regular, avoids cutting burr being present and influenceing smart card
Outward appearance it is round and smooth.
Please referring to Fig. 9, it is preferable that card dividing device 4000 also includes the second visual detection unit 4200, and second
Visual detection unit 4200 is electrically connected with control unit 6000.Second visual detection unit 4200 is used for located at cutting station
The movement velocity parameter and location parameter of substrate 20 are detected, control unit 6000 is according to movement velocity parameter regulation second laser
4100 go out ray velocity and according to location parameter to second laser 4100 go out light path carry out position compensation.
Control unit 6000 has corresponding logical operation capability, can be integrated in second laser 4100, can act also as
It is arranged at outer separate processing units.Exemplarily, control unit 6000 can use microprocessor, computer, computing circuit etc.
Form, it can also use the types such as driver.
Please refer to Fig. 4, it is preferable that cutting station is also provided with cooling body 5000, and cooling body 5000 is used to pair add
Card base 21 in work is cooled down with substrate 20, prevents working position from overheating and causing structural damage.The knot of cooling body 5000
Structure will not be repeated here.
Please refer to Fig. 1, it is preferable that integral type encapsulation cutting machine 10000 also includes automatic blanking device 7000, is used for
Realize the automatic blanking of smart card.Wherein, automatic blanking device 7000 includes a plurality of feedings first 7100, for by the quilt of substrate 20
The smart card of separation is removed simultaneously, is placed into storing area 7200.
In all examples being illustrated and described herein, any occurrence should be construed as merely exemplary, without
It is that therefore, other examples of exemplary embodiment can have different values as limitation.
It should be noted that：Similar label and letter represents similar terms in following accompanying drawing, therefore, once a certain Xiang Yi
It is defined, then it further need not be defined and explained in subsequent accompanying drawing in individual accompanying drawing.
Embodiment described above only expresses the several embodiments of the present invention, and its description is more specific and detailed, but simultaneously
Therefore limitation of the scope of the invention can not be interpreted as.It should be pointed out that for the person of ordinary skill of the art,
Without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection model of the present invention
Enclose.Therefore, protection scope of the present invention should be determined by the appended claims.
Claims (10)
1. a kind of integral type encapsulates cutting machine, it is characterised in that including：
Base board delivery device, the base board delivery device are used to for substrate to be delivered to landfill station, welding post and cutting successively
Station, the substrate are provided with the card base of a plurality of array distributions；
Chip fills device, and the chip landfill device is located at the landfill station, distinguishes for will cut the chip after separating
In the landfill groove for filling the corresponding card base；
Packaging system is welded, the welding packaging system is located at the welding post, the heat of the bonding plane for making the chip
Melten gel melts, and the chip is formed into smart card with the corresponding card base encapsulation；
Card dividing device, the card dividing device is located at the cutting station, for realizing the smart card and the base
The separation of plate.
2. integral type according to claim 1 encapsulates cutting machine, it is characterised in that the base board delivery device includes motion
Portion and a plurality of substrate fixtures in the motion portion, the substrate fixture are used for substrate described in clamping correspondingly,
A plurality of substrate fixtures move across landfill station, the welding post and the cutting work with the motion portion
Position.
3. integral type according to claim 1 encapsulates cutting machine, it is characterised in that the chip landfill device includes：
Chip conveying mechanism, the chip conveying mechanism are used to make chip strip band pass through dispensing station, the chip strip band successively
With multiple chips by cutting；
Glue applying mechanism, the glue applying mechanism are located at the dispensing station, for the die bonding millet cake glue in the chip strip band,
The die bonding face of the chip strip band is used for encapsulation Nian Jie with card base；
Conversion landfill mechanism, the conversion landfill mechanism are used to remove the chip and fill the chip in the card base
Fill in groove.
4. integral type according to claim 3 encapsulates cutting machine, it is characterised in that the conversion landfill mechanism is included along institute
A plurality of landfill devices of the array direction distribution of card base are stated, the landfill device includes rotary shaft body and multiple suction nozzles, the rotation
Axis body is located at the rear side in the die bonding face of the chip strip band, and rotation round of the suction nozzle along the rotary shaft body is uniform
The outer surface of the rotary shaft body is distributed in, the suction nozzle and the rear side in the die bonding face of the chip strip band are oppositely arranged
And it is used to remove the chip.
5. integral type according to claim 1 encapsulates cutting machine, it is characterised in that the chip landfill device also includes the
One laminating mechanism, first laminating mechanism are used to press the chip and the card base through landfill；And/or the welding envelope
Assembling device also includes the second laminating mechanism, second laminating mechanism be used to after PUR thawing pressing the chip with
The card base.
6. integral type according to claim 1 encapsulates cutting machine, it is characterised in that the welding packaging system is included at least
One first laser device, the first laser device are located at the welding post, make die bonding face for launching laser beam
PUR melt, the chip is embedded in the landfill groove of the card base in advance, the bonding plane of the chip and the landfill groove
Surface keeps relative.
7. integral type according to claim 6 encapsulates cutting machine, it is characterised in that the welding packaging system also includes the
One visual detection unit and control unit, the First look detection unit is located at the welding post, for detecting the base
The movement velocity parameter and location parameter of plate, described control unit first laser device according to the movement velocity parameter regulation
Go out ray velocity and according to the location parameter to the first laser device go out light path carry out position compensation.
8. integral type according to claim 1 encapsulates cutting machine, it is characterised in that the card dividing device is included at least
One second laser, the second laser are used to carry out card cutting, the light extraction of the second laser to the substrate
Direction is vertical with the substrate surface.
9. integral type according to claim 8 encapsulates cutting machine, it is characterised in that the card dividing device also includes the
Two visual detection units and control unit, second visual detection unit is located at the cutting station, for detecting the base
The movement velocity parameter and location parameter of plate, described control unit second laser according to the movement velocity parameter regulation
Go out ray velocity and according to the location parameter to the second laser go out light path carry out position compensation.
10. integral type according to claim 1 encapsulates cutting machine, it is characterised in that a plurality of cards are based on the base
At least it is distributed in the first direction on plate, the direction of motion of the first direction and the substrate is not parallel to each other.
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|---|---|---|---|
| CN201710964135.3A CN107611067A (en) | 2017-10-17 | 2017-10-17 | Integral type encapsulates cutting machine |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710964135.3A CN107611067A (en) | 2017-10-17 | 2017-10-17 | Integral type encapsulates cutting machine |
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| CN107611067A true CN107611067A (en) | 2018-01-19 |
Family
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| CN201710964135.3A Pending CN107611067A (en) | 2017-10-17 | 2017-10-17 | Integral type encapsulates cutting machine |
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| CN109065481A (en) * | 2018-08-08 | 2018-12-21 | 常州信息职业技术学院 | Microelectronic device package bonding machine |
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| CN112490160A (en) * | 2020-12-23 | 2021-03-12 | 深圳新益昌科技股份有限公司 | Semiconductor packaging all-in-one machine |
| CN112951743A (en) * | 2021-02-07 | 2021-06-11 | 新一代半导体研究所(深圳)有限公司 | Semiconductor packaging equipment and packaging method |
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