CN109065481A - Microelectronic device package bonding machine - Google Patents
Microelectronic device package bonding machine Download PDFInfo
- Publication number
- CN109065481A CN109065481A CN201810895946.7A CN201810895946A CN109065481A CN 109065481 A CN109065481 A CN 109065481A CN 201810895946 A CN201810895946 A CN 201810895946A CN 109065481 A CN109065481 A CN 109065481A
- Authority
- CN
- China
- Prior art keywords
- substrate
- conveying device
- material process
- cover board
- cut
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
Abstract
The invention discloses a kind of microelectronic device package bonding machines, belong to microelectronics technology.Microelectronic device package bonding machine includes: conveying device, cover board arrangement, welder and cutting means, at least one diamond shape frame is provided on substrate, in which: conveying device delivers the substrate at material process；After being packed into a microelectronic component in each diamond shape frame on substrate, the substrate for being mounted with microelectronic component is delivered to cover board process by conveying device；Cover board arrangement is in substrate upper end cover upper cover plate, and cover board is towards being provided at least one set of pad, every group of pad group diamondwise in the one side of substrate；Welder melts each group of pad on cover board, is soldered to each diamond shape frame on cover board and forms component to be cut；Cutting means cut component to be cut, and making each unit cut out includes the microelectronic component after one encapsulation of part composition of diamond shape frame, the part of substrate, cover board；Solve the problems, such as that chip package is ineffective.
Description
Technical field
The present invention relates to microelectronics technology, in particular to a kind of microelectronic device package bonding machine.
Background technique
The consumption electronic products such as mobile phone, TV, wearable device are fast-developing, while function is increasingly powerful, electronics
The volume of product is but more and more frivolous.This depends on the continuous reduction of various microelectronic device chip sizes and package dimension.
However, in the encapsulation process of microelectronic component, since microelectronic device chip size and package dimension are all subtracting
It is small, it is low using operation difficulty height, the working efficiency of single substrate package one single chip.
Summary of the invention
Operation difficulty in order to solve the problems, such as single substrate package one single chip in the prior art is high, ineffective,
The embodiment of the invention provides a kind of microelectronic device package bonding machines.The microelectronic device package bonding machine includes: at least
One is used for conveying device, cover board arrangement, welder and the cutting means of conveying substrate, is provided at least on the substrate
One diamond shape frame, the diamond shape frame is for accommodating and limiting microelectronic component, in which:
The substrate is delivered at upper material process by the conveying device；
After being packed into a microelectronic component in each diamond shape frame on the substrate, the conveying device will be mounted with micro-
The substrate of electronic device is delivered to cover board process；
Cover board arrangement end cap upper cover plate on the substrate, the cover board is towards being provided in the one side of the substrate
At least one set of pad, every group of pad group diamondwise；
The welder melts each group of pad on the cover board, is soldered each diamond shape frame on the substrate
Component to be cut is formed on to the cover board；
The cutting means cut the component to be cut, and making each unit cut out includes diamond shape frame, the base
The part of plate, the cover board part form one encapsulation after microelectronic component.
Optionally, the conveying device includes plummer, power device and idler wheel, in which:
The plummer is provided with pressure sensor on the plummer for carrying the substrate；
Pressure value of the plummer after the pressure value that the pressure sensor detects increases and increases is higher than predetermined
When numerical value, the power device driving idler wheel rolling makes the conveying device be moved to the upper material process according to landline
Place.
Optionally, the microelectronic device package bonding machine further includes control assembly, the control assembly and the conveying
Device is connected, in which:
Before the conveying device is moved at the upper material process according to default route, looked into control assembly transmission
Ask request；
The control assembly is when receiving the inquiry request, when referring to feeding according to multiple upper material process are corresponding
It grows, to the quantity of feeding substrate, is that the conveying device determines material process in target from the multiple upper material process, to institute
It states conveying device and sends the query result for carrying the mark of material process in the target；
The conveying device is moved to material process in the target according to the corresponding landline of material process in the target
Place.
Optionally, according to multiple upper material process it is corresponding with reference to feeding duration, to the quantity of feeding substrate, from the multiple
It is that the conveying device determines material process in target in upper material process, comprising:
The conveying device is determined with reference to feeding duration, to the quantity of feeding substrate according to each upper material process is corresponding
The feeding waiting time at each upper material process；
Feeding waiting time the smallest upper material process is determined as material process in target.
Optionally, the cover board is provided with cutting line in the one side of the substrate, and the cutting line can be reflective
Material is provided with photosensory assembly on the knife face of the cutting knife of the cutting means, in which:
The cutting means control the cutting knife complete it is primary laterally cut after, the cutting means longitudinal movement until
The photosensory assembly detects that photoreceptor signal stops, and the cutting means again complete primary laterally to cut out by cutting knife described in secondary control
It cuts.
Optionally, the conveying device further includes rotating mechanism, and the rotating mechanism and the plummer are mechanically connected,
In:
After the transverse direction that the cutting means complete pre-determined number is cut, the rotating mechanism drives the carrying platform in water
It is rotated by 90 ° in plane, the pre-determined number is equal to the quantity of lateral cutting line and longitudinally cutting line on the substrate；
The transverse direction that the cutting means control the cutting knife completion pre-determined number is cut.
Optionally, the conveying device includes conveyor chain and transmission device, and the transmission device is able to drive described defeated
Chain drive is sent, the conveyor chain is for carrying the substrate, in which:
The cutting means cut the component to be cut, and making each unit cut out includes diamond shape frame, the base
The part of plate, the cover board part after, the transmission rotary device drives the conveyor chain to be driven to magazine direction out,
The each unit just cut out in the conveying device to be delivered in the magazine out.
Optionally, the magazine out is fixed on the side wall of the conveying device.
Technical solution provided in an embodiment of the present invention has the benefit that
By provide a kind of microelectronic device package bonding machine include: at least one for conveying substrate conveying device,
Cover board arrangement, welder and cutting means are provided at least one diamond shape frame on the substrate, and the diamond shape frame is for holding
It receives and limits microelectronic component, in which: the substrate is delivered at upper material process by conveying device；Each diamond on the substrate
After being packed into a microelectronic component in frame, the substrate for being mounted with microelectronic component is delivered to cover board process by conveying device；Cover board
Device end cap upper cover plate on the substrate, cover board is towards being provided at least one set of pad, every group of pad composition in the one side of substrate
Diamond shape；Welder melts each group of pad on cover board, make on substrate each diamond shape frame be soldered on cover board composition to
Cut component；Cutting means cut the component to be cut, make each unit cut out include diamond shape frame, substrate part,
The part of cover board forms the microelectronic component after an encapsulation；Solve that chip package in the related technology is ineffective to ask
Topic；Achieve the effect that improve packaging efficiency.
Detailed description of the invention
To describe the technical solutions in the embodiments of the present invention more clearly, make required in being described below to embodiment
Attached drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the invention, for
For those of ordinary skill in the art, without creative efforts, it can also be obtained according to these attached drawings other
Attached drawing.
Fig. 1 is the structural schematic diagram of microelectronic device package bonding machine of the invention；
Fig. 2 is the schematic diagram that multiple diamond shape frames are provided on the substrate provided in one embodiment of the invention.
Numbering in the drawing are as follows:
100 substrate of microelectronic device package bonding machine, 200 conveying device, 11 cover board arrangement 12
111 cover board of feeding ACK button, 121 diamond shape frame, 21 microelectronic component 22
13 cutting means of welder, 14 plummer, 112 power device 113
1123 control assembly of pressure sensor, 15 rotating mechanism, 114 conveyor chain 1121
1122 cutting knife of placing member, 141 photosensory assembly 142
Specific embodiment
To make the object, technical solutions and advantages of the present invention clearer, below in conjunction with attached drawing to embodiment party of the present invention
Formula is described in further detail.
Please refer to Fig. 1, Fig. 2, the embodiment of the invention provides a kind of microelectronic device package bonding machine 100, micro- electricity
Sub- device welded encapsulation machine 100 includes at least one for the conveying device 11 of conveying substrate 200, cover board arrangement 12, welding dress
13 and cutting means 14 are set, as shown in Fig. 2, being provided at least one diamond shape frame 21 on substrate 200, which is used
In accommodating and limit microelectronic component 22, in which:
The substrate 200 is delivered on substrate 200 at material process by the conveying device 11, so as on substrate 200 at material process
Technical staff carry out artificial loading, in each diamond shape frame 21 be packed into a microelectronic component 22.Optionally, conveying device
The feeding ACK button 111 of substrate 200 is provided on 11, technical staff is on the microelectronic component 22 for completing a substrate 200
200 feeding ACK button 111 of substrate is triggered after material, to trigger each diamond shape frame 21 of the conveying device 11 on the substrate 200
After one microelectronic component 22 of middle loading, the substrate 21 for being mounted with microelectronic component 22 is delivered to cover board process；In the lid
The cover board arrangement 12 of plate process is in the 200 upper end cover upper cover plate 121 of substrate, and the cover board 121 is towards setting in the one side of the substrate 200
It is equipped at least one set of pad (not shown go out), every group of pad is equipped with multiple diamond shape blocks (not shown go out)；Welder 13 melts
Change each group of pad on the cover board 121, is soldered to each diamond shape frame 21 on the cover board 121 and forms
Component to be cut；Cutting means 14 cut the component to be cut, and making each unit cut out includes diamond shape frame 21, the substrate
200 part, the cover board 121 part form one encapsulation after microelectronic component 22.
In addition, making to encapsulate retaining space by the way that diamond shape frame 21 is arranged, perceptional function is realized convenient for devices such as MEMS, is given
MEMS device volume moving part retaining space.
Optionally, conveying device can be the not modifiable conveying device (for example, conveyer belt) of landline, conveying device
It can also be the trolley with idler wheel, car top is the plummer for bearing substrate, which can control device rolling
The rotating direction and rolling distance of wheel are to change its own position.
Optionally, conveying device 11 involved in the present embodiment includes plummer 112, power device 113 and idler wheel (figure
It is not shown), in which:
When microelectronic device package bonding machine 100 starts, which is in initial position, is existed by technical staff
Initial position places a substrate 200 on plummer 112, and the plummer 112 is for carrying the substrate 200, the plummer
Pressure sensor 1123 is provided on 112；The plummer 112 is increased and is increased in the pressure value that pressure sensor 1123 detects
When pressure value afterwards is higher than predetermined value, power device 113 drives idler wheel rolling to keep conveying device 11 mobile according to landline
At supreme material process.
Optionally, microelectronic device package bonding machine 100 further includes control assembly 15, and the control assembly 15 and the conveying fill
It sets 11 to be connected and (can be electrically connected, also be connected to the network, can also be connected by Proximity Wireless Transfer Technology), in which: conveying
Before device 11 is moved at upper material process according to default route, inquiry request is sent to control assembly 15；Control assembly 15 exists
When receiving the inquiry request, according to multiple upper material process it is corresponding with reference to feeding duration, to the quantity of feeding substrate 200, from
Material process in target is determined for conveying device 11 in multiple upper material process, carries target feeding to the conveying device 11 transmission
The query result of the mark of process；Conveying device 11 obtains the corresponding landline of material process in target and is moved to target feeding work
At sequence.
In actual implementation, control assembly 15 refers to feeding duration, to feeding substrate according to each upper material process is corresponding
200 quantity determines the conveying device 11 feeding waiting time at each upper material process；Feeding waiting time is the smallest
Upper material process is determined as material process in target.
Wherein, each upper material process is corresponding is usually customized by the user with reference to feeding duration, such as user is according to being located at
Average duration needed for technical staff completes 22 feeding of microelectronic component of a substrate 200 at each upper material process.
Determine that the conveying fills with reference to feeding duration, to the quantity of feeding substrate 200 according to each upper material process is corresponding
Setting 11, the realization of feeding waiting time can be at each upper material process are as follows: calculate each upper material process it is corresponding with reference to feeding when
The product of quantity long, to feeding substrate 200, obtains the conveying device 11 feeding waiting time at each upper material process.
Optionally, it is provided with feeding ACK button 111 in conveying device 11, completes 11 upper substrate 200 of conveying device
The 111 feeding ACK button 111 is triggered after the feeding of microelectronic chip 22, conveying device 11 sends notice to control assembly 15 and disappears
Breath, the notification message are used to notify a substrate 200 of material process in 15 target of control assembly to complete feeding；Control assembly 15
The corresponding quantity to feeding substrate 200 of material process in the target is updated according to the notification message.
Optionally, cover board 121 is provided with cutting line (not shown go out) in the one side of substrate 200, which can be with
For reflectorized material, photosensory assembly 142 is provided on the knife face of the cutting knife 141 of cutting means 14, in which: the cutting means 14 control
It makes the cutting knife 141 to complete after once laterally cutting, the cutting means 14 longitudinal movement is until the photosensory assembly 142 detects sense
Optical signal stops, and the cutting means 14 again complete once laterally to cut by the secondary control cutting knife 141.
It should be understood that cutting means 14 are carrying out when cutting for the first time of the substrate 200, it is longitudinally movable until the sense
Optical assembly 142 detects that photoreceptor signal stops, and controls the cutting knife 141 and completes once laterally to cut.
Optionally, which further includes rotating mechanism 114, and the rotating mechanism 114 and the plummer 112 are mechanical even
It connects, in which: after the transverse direction that the cutting means 14 complete pre-determined number is cut, which drives the substrate 200 in level
It is rotated by 90 ° on face, pre-determined number is equal to the quantity of lateral cutting line and longitudinally cutting line on substrate 200；Cutting means 14 are controlled
The transverse direction for sanctioning the completion pre-determined number of cutter 141 is cut.
It should be understood that rotating mechanism 114 rotate after before the cutting for the first time of cutting means 14, it is longitudinally movable until
The photosensory assembly 142 detects that photoreceptor signal stops, then controls the cutting knife 141 and complete to cut for the first time；Then it vertically moves
Until the photosensory assembly 142 detects that photoreceptor signal stops, the cutting means 14 again complete once to cut out by the secondary control cutting knife 141
It cuts.
Optionally, plummer 112 includes conveyor chain 1121 and is used to carry the substrate on conveyor chain 1121
200 placing member 1122, power device 113 are able to drive the conveyor chain 1121 transmission, in which:
The cutting means 114 cut the component to be cut, and making each unit cut out includes diamond shape frame 21, the substrate
200 part, the cover board 121 part after, which drives the conveyor chain 1121 to magazine out (not shown go out)
Direction transmission, will be cut that each unit is delivered in the conveying device 11 should be out in magazine.
In one example, magazine is fixed on the side wall of the conveying device 11 out.
Optionally, welder can be electric welding machine, when melting each group of pad on cover board using electric welding machine, electric welding machine
A welding electrode be located between two conveyor chains 1121, another welding electrode is located above substrate, and two welding are electric
Releasable electric current is between pole to melt the pad between the two welding electrodes.In actual implementation, a welding motor can
It is moved between two conveyor chains 1121, another welding electrode is mobile in the top of substrate.
Term " first ", " second " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance or hidden
Quantity containing indicated technical characteristic.The feature of " first ", " second " that limit as a result, can express or implicitly include one
A or more this feature.In the description of the present invention, unless otherwise indicated, the meaning of " plurality " is two or two with
On.
Those of ordinary skill in the art will appreciate that realizing that all or part of the steps of above-described embodiment can pass through hardware
It completes, relevant hardware can also be instructed to complete by program, the program can store in a kind of computer-readable
In storage medium, storage medium mentioned above can be read-only memory, disk or CD etc..
The foregoing is merely presently preferred embodiments of the present invention, is not intended to limit the invention, it is all in spirit of the invention and
Within principle, any modification, equivalent replacement, improvement and so on be should all be included in the protection scope of the present invention.
Claims (8)
1. a kind of microelectronic device package bonding machine, which is characterized in that the microelectronic device package bonding machine includes: at least one
It is a for the conveying device of conveying substrate, cover board arrangement, welder and cutting means, be provided at least one on the substrate
A diamond shape frame, the diamond shape frame is for accommodating and limiting microelectronic component, in which:
The substrate is delivered at upper material process by the conveying device；
After being packed into a microelectronic component in each diamond shape frame on the substrate, the conveying device will be mounted with microelectronics
The substrate of device is delivered to cover board process；
Cover board arrangement end cap upper cover plate on the substrate, the cover board is towards being provided at least in the one side of the substrate
One group of pad, every group of pad group diamondwise；
The welder melts each group of pad on the cover board, each diamond shape frame on the substrate is made to be soldered to institute
It states and forms component to be cut on cover board；
The cutting means cut the component to be cut, and making each unit cut out includes diamond shape frame, the substrate
Partially, the part of the cover board forms the microelectronic component after an encapsulation.
2. microelectronic device package bonding machine according to claim 1, which is characterized in that the conveying device includes carrying
Platform, power device and idler wheel, in which:
The plummer is provided with pressure sensor on the plummer for carrying the substrate；
Pressure value of the plummer after the pressure value that the pressure sensor detects increases and increases is higher than predetermined value
When, the power device driving idler wheel rolling is moved to the conveying device at the upper material process according to landline.
3. microelectronic device package bonding machine according to claim 2, which is characterized in that the microelectronic device package weldering
Picking further includes control assembly, and the control assembly is connected with the conveying device, in which:
Before the conveying device is moved at the upper material process according to default route, inquiry is sent to the control assembly and is asked
It asks；
The control assembly when receiving the inquiry request, according to multiple upper material process it is corresponding with reference to feeding duration, to
The quantity of feeding substrate is that the conveying device determines material process in target from the multiple upper material process, to described defeated
Device is sent to send the query result for carrying the mark of material process in the target；
The conveying device is moved in the target at material process according to the corresponding landline of material process in the target.
4. microelectronic device package bonding machine according to claim 1, which is characterized in that corresponding according to multiple upper material process
Reference feeding duration, to the quantity of feeding substrate, be that the conveying device determines target from the multiple upper material process
Upper material process, comprising:
Determine the conveying device in institute with reference to feeding duration, to the quantity of feeding substrate according to each upper material process is corresponding
State feeding waiting time at each upper material process；
Feeding waiting time the smallest upper material process is determined as material process in target.
5. microelectronic device package bonding machine according to claim 1, which is characterized in that the cover board is backwards to the substrate
One side on be provided with cutting line, the cutting line can be reflectorized material, set on the knife face of the cutting knife of the cutting means
It is equipped with photosensory assembly, in which:
The cutting means control the cutting knife and complete after once laterally cutting, and the cutting means longitudinal movement is until described
Photosensory assembly detects that photoreceptor signal stops, and the cutting means again complete primary laterally to cut by cutting knife described in secondary control.
6. microelectronic device package bonding machine according to claim 5, which is characterized in that the conveying device further includes rotation
Rotation mechanism, the rotating mechanism and the plummer are mechanically connected, in which:
After the transverse direction that the cutting means complete pre-determined number is cut, the rotating mechanism drives the carrying platform in horizontal plane
On be rotated by 90 °, the pre-determined number is equal to the quantity of lateral cutting line and longitudinally cutting line on the substrate；
The transverse direction that the cutting means control the cutting knife completion pre-determined number is cut.
7. microelectronic device package bonding machine according to claim 1, which is characterized in that the conveying device includes conveying
Chain and transmission device, the transmission device are able to drive the conveyor chain transmission, and the conveyor chain is described for carrying
Substrate, in which:
The cutting means cut the component to be cut, and making each unit cut out includes diamond shape frame, the substrate
Partially, behind the part of the cover board, the transmission rotary device drives the conveyor chain to be driven to magazine direction out, will
The each unit just cut out in the conveying device is delivered in the magazine out.
8. microelectronic device package bonding machine according to claim 1, which is characterized in that the magazine out is fixed on described
On the side wall of conveying device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810895946.7A CN109065481B (en) | 2018-08-08 | 2018-08-08 | Microelectronic device packaging and welding machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810895946.7A CN109065481B (en) | 2018-08-08 | 2018-08-08 | Microelectronic device packaging and welding machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109065481A true CN109065481A (en) | 2018-12-21 |
| CN109065481B CN109065481B (en) | 2020-10-23 |
Family
ID=64678634
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810895946.7A Expired - Fee Related CN109065481B (en) | 2018-08-08 | 2018-08-08 | Microelectronic device packaging and welding machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109065481B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1447408A (en) * | 2002-03-22 | 2003-10-08 | 精工爱普生株式会社 | Mfg. appts. of electronic device, its mfg. method and mfg. program |
| CN107611067A (en) * | 2017-10-17 | 2018-01-19 | 深圳华创兆业科技股份有限公司 | Integral type encapsulates cutting machine |
| CN108231603A (en) * | 2017-12-14 | 2018-06-29 | 通富微电子股份有限公司 | The preparation method and chip packing-body of a kind of chip packing-body |
-
2018
- 2018-08-08 CN CN201810895946.7A patent/CN109065481B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1447408A (en) * | 2002-03-22 | 2003-10-08 | 精工爱普生株式会社 | Mfg. appts. of electronic device, its mfg. method and mfg. program |
| CN107611067A (en) * | 2017-10-17 | 2018-01-19 | 深圳华创兆业科技股份有限公司 | Integral type encapsulates cutting machine |
| CN108231603A (en) * | 2017-12-14 | 2018-06-29 | 通富微电子股份有限公司 | The preparation method and chip packing-body of a kind of chip packing-body |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109065481B (en) | 2020-10-23 |
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