CN207503963U - Weld packaging system - Google Patents

Abstract

A kind of welding packaging system, including：Conveying mechanism, the conveying mechanism include movement portion and a plurality of card base fixtures in the movement portion, and the card base fixture is for clamping card base, a plurality of card base fixtures to move across welding post with the movement portion correspondingly；Laser, the laser are set on the welding post, melt the hot melt adhesive in die bonding face for emitting laser beam, and the chip is embedded in advance in the landfill slot of the card base, and the bonding plane of the chip and the surface of the landfill slot keep opposite.The utility model provides the welding packaging system that a kind of welding efficiency is high, precision is good.

Description

Weld packaging system

Technical field

The utility model belongs to intelligent card chip encapsulation technology field, is a kind of welding packaging system specifically.

Background technology

Smart card is the common name for the plastic clip for being embedded with microchip, and data interaction can be realized with the external world by reader. Smart card has many advantages, such as that reliability is high, safety is good, memory capacity is big, type is more, thus be widely used in financial finance, Social insurance, traffic for tourism, health care, government administration, commodity retail, amusement and recreation, school control and other fields.

With the rapid development of smart card, demand is increasing, and very big challenge is brought to the processing of smart card.Intelligence It can block and be encapsulated by chip and card base, thus processing of the master operation also around chip and card base carries out.

Traditional smart card processing is mainly processed using craft or semi-hand, and the degree of automation is very low.There are also manufacturers Welding processing is carried out, but specific aim is not strong using some simple common apparatus, for the microsize machining accuracy of microchip It is very low, and still need manual operation, it is difficult to meet the precise automatic welding encapsulation requirement of microchip.

Utility model content

For overcome the deficiencies in the prior art, the utility model provides a kind of welding packaging system, with automation means One completes the welding encapsulation of intelligent card chip.

The purpose of this utility model is achieved through the following technical solutions：

A kind of welding packaging system, including：

Conveying mechanism, the conveying mechanism include movement portion and a plurality of card base fixtures in the movement portion, institute Card base fixture is stated for clamping card base, a plurality of card base fixtures to move across Welder with the movement portion correspondingly Position；

Laser, the laser are set on the welding post, make the heat in die bonding face for emitting laser beam Melten gel melts, and the chip is embedded in advance in the landfill slot of the card base, the surface of the bonding plane of the chip and the landfill slot Keep opposite.

As an improvement of the above technical solution, the welding packaging system further includes laminating mechanism, and the laminating mechanism is used In for the hot melt adhesive thawing after press the chip and the card base.

As a further improvement of the above technical scheme, the laminating mechanism includes idler wheel and drives the idler wheel rotation Power source, the idler wheel are rotatably acted on the chip, make the chip after the hot melt adhesive thawing and the card base Pressing fastening.

As a further improvement of the above technical scheme, the welding post is equipped with cooling body, and the cooling body is used It is cooled down in the card base in processing.

As a further improvement of the above technical scheme, the cooling body includes coldplate and inlet end, the cooling Plate is equipped with the perforation air flue of a plurality of stomatas and the connection stomata and the inlet end, and a plurality of stomatas are right against described respectively A side surface of the card base far from the laser.

As a further improvement of the above technical scheme, the movement portion includes driving wheel, driven wheel and tensioning connection institute The flexible element of driving wheel and the driven wheel is stated, the flexible element sets a plurality of lug bosses, adjacent institute along its direction of motion It states lug boss and forms the card base fixture.

As a further improvement of the above technical scheme, the driving wheel includes sprocket wheel, belt wheel or rope with the driven wheel One kind in wheel, the flexible element include one kind in transmission chain, transmission belt or transmission rope, the driving wheel, the driven wheel Flexible driving relationship is formed with the flexible element.

As a further improvement of the above technical scheme, the welding packaging system further includes visual detection unit and control Unit, the visual detection unit are set on the welding post, join for detecting the movement velocity parameter of the card base with position Number, described control unit according to the movement velocity parameter regulation laser go out ray velocity and according to the position join Several light paths that go out to the laser carry out position compensation.

As a further improvement of the above technical scheme, the visual detection unit includes CCD camera or CMOS cameras.

As a further improvement of the above technical scheme, the laser is set on a Linear feed mechanism, the straight line Feed mechanism can move along a straight line close to or away from the card base.

The beneficial effects of the utility model are：

Conveying mechanism and laser are set, and conveying mechanism is equipped with a plurality of card base fixtures, for clamping and transport card base, makes The card base of preliminary pre-buried positioning is by welding post, laser transmitting laser and the hot melt adhesive for making pre-buried chip bonding plane on card base Melt, chip and card base is made to pass through hot melt adhesive and is completely stuck to position, the active area of laser is small, controllability is strong, has very high Processing precise degree and processing efficiency provide the welding packaging system that a kind of welding efficiency is high, precision is good.

For the above-mentioned purpose of the utility model, feature and advantage is enable to be clearer and more comprehensible, preferred embodiment cited below particularly, and Attached drawing appended by cooperation, is described in detail below.

Description of the drawings

It, below will be to use required in embodiment in order to illustrate more clearly of the technical solution of the utility model embodiment Attached drawing be briefly described, it should be understood that the following drawings illustrates only some embodiments of the utility model, therefore should not be by Regard the restriction to range as, for those of ordinary skill in the art, without creative efforts, may be used also To obtain other relevant attached drawings according to these attached drawings.

Fig. 1 is the first schematic diagram of welding packaging system that the utility model embodiment 1 provides；

Fig. 2 is the second schematic diagram of welding packaging system that the utility model embodiment 1 provides；

Fig. 3 is that enlarged diagram at the A of packaging system is welded in Fig. 2；

Fig. 4 is that enlarged diagram at the B of packaging system is welded in Fig. 2；

Fig. 5 is the welding post application schematic diagram of welding packaging system that the utility model embodiment 1 provides；

Fig. 6 is the laminating mechanism application schematic diagram of welding packaging system that the utility model embodiment 1 provides；

Fig. 7 is the feedback control annexation figure of welding packaging system that the utility model embodiment 1 provides.

Main element symbol description：

1000- welding packaging systems, 0100- conveying mechanisms, 0110- movements portion, 0111- driving wheels, 0112- driven wheels, 0113- flexible elements, 0113a- lug bosses, 0114- driving portions, 0120- card base fixtures, 0200- lasers, 0300- laminating mechanisms, 0400- cooling bodies, 0410- coldplates, 0411- stomatas, 0420- inlet ends, 0500- visual detection units, 0600- controls are single Member, 2000- card bases, 3000- chips.

Specific embodiment

For the ease of understanding the utility model, welding packaging system is more fully retouched below with reference to relevant drawings It states.The preferred embodiment of welding packaging system is given in attached drawing.But welding packaging system can pass through many different shapes Formula is realized, however it is not limited to embodiment described herein.On the contrary, the purpose for providing these embodiments is to make to encapsulate welding The disclosure of device more thorough and comprehensive.

It should be noted that when element is referred to as " being fixed on " another element, it can be directly on another element Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it can be directly connected to To another element or it may be simultaneously present centering elements.On the contrary, when element be referred to as " directly existing " another element " on " when, There is no intermediary elements.Term as used herein " vertically ", " horizontal ", "left", "right" and similar statement are For illustrative purposes.

Unless otherwise defined, all of technologies and scientific terms used here by the article is led with belonging to the technology of the utility model The normally understood meaning of technical staff in domain is identical.It is in the term used in the description of welding packaging system herein In order to describe the purpose of specific embodiment, it is not intended that limitation the utility model.Term as used herein " and/or " include The arbitrary and all combination of one or more relevant Listed Items.

Embodiment 1

Referring to Fig. 1, welding packaging system 1000, including conveying mechanism 0100 and laser 0200, for providing one kind Full automatic intelligent card chip sealed in unit, realize intelligent card chip dynamic welding encapsulation, have higher processing efficiency with The degree of automation.Details are as follows for the primary structure of welding packaging system 1000.

Please refer to Fig. 5~6, it should be understood that before welding packaging system 1000 is entered, card base 2000 and chip 3000 are Cross Primary Location landfill.Wherein, card base 2000 is the card body of smart card, and chip 3000 is the integrated circuit for storing data Unit.In preposition cutting process, chip 3000, which needs to cut from chip strip band, to be detached, and realize preliminary with card base 2000 Positioning.In the process, it is difficult to realize bonding encapsulation completely, only be given between card base 2000 and chip 3000 with a small amount of adhesive Connection, to prevent the two from deviating or come off.To complete welding encapsulation, it is still necessary to welding posts to be delivered to be processed.

Fig. 1~3 are please referred to, conveying mechanism 0100 is to be used to implement the tentatively card base 2000 of landfill chip 3000 Transport.Conveying mechanism 0100 includes movement portion 0110 and a plurality of card base fixtures 0120 in movement portion 0110, card base folder Tool 0120 is for clamping card base 2000, a plurality of card base fixtures 0120 to move across Welder with movement portion 0110 correspondingly Position.Since card base 2000 is installed on card base fixture 0120, card base 2000 receives with card base fixture 0120 by welding post Welding processing.

Wherein, movement portion 0110 is main mobile mechanism, and a variety of mechanical structures can be used and realize movement.Usually, it transports Straight-line motion mechanism can be used in dynamic portion 0110, such as the linear guide, linear bearing form are realized, and with motor, hydraulic motor etc. Component is driven.

Preferably, movement portion 0110 realizes movement purpose using flexible driving structure.Movement portion 0110 includes driving wheel 0111st, the flexible element 0113 of driven wheel 0112 and tensioning connection driving wheel 0111 and driven wheel 0112, in other words, flexible element 0113 Driving wheel 0111 and driven wheel 0112 are sequentially connected, forms flexible driving relationship.Further, driving wheel 0111 is also associated with driving Dynamic portion 0114, the forms such as motor, hydraulic motor can be used in driving portion 0114, driving wheel 0111 to be driven to rotate.

Wherein, flexible driving relationship is a kind of common machine driving, usually by two or more drives and flexible element 0113 composition, movement and power are transmitted by flexible element 0113 between drive.According to the type of flexible element 0113, flexibility passes Dynamic mainly to have V belt translation, chain drive and rope drive, drive is respectively belt wheel, sprocket wheel and rope sheave, and flexible element 0113 is respectively to pass Dynamic band, transmission chain and transmission rope.Wherein, driving wheel 0111 and driven wheel 0112 are drive.

Flexible element 0113 sets a plurality of lug boss 0113a, adjacent lug boss 0113a composition card bases along its direction of motion Fixture 0120.In other words, lug boss 0113a protrudes from a side surface of the flexible element 0113 far from drive, adjacent lug boss It is folded before and after 0113a and becomes card base fixture 0120.Card base 2000 is by adjacent lug boss 0113a clampings, with flexible element 0113 Rotary motion and move, realize the transport of card base 2000.

Wherein, a plurality of lug boss 0113a can be distributed with a variety of distribution forms.It is multiple in an exemplary embodiment Several lug boss 0113a are uniformly distributed along the direction of motion of flexible element 0113.In another embodiment, a plurality of lug bosses There is different spacing, to adapt to various sizes of card base 2000 between 0113a.

Preferably, movement portion 0110 has two flexible driving structures being arranged in parallel.In other words, movement portion 0110 has Two driving wheels, 0111, two drive and two flexible elements 0113, are respectively cooperating with and form two groups of flexible driving relationships.Together When, two flexible driving parallelism structurals are set, and the lug boss 0113a distributions on flexible element 0113 are completely the same, further increase Effective bearing area of card base fixture 0120, the clamping for making card base 2000 is more firm, active area bigger.

Welding post is used to implement chip 3000 and the welding of card base 2000 encapsulates, and makes chip 3000 be bonded with card base 2000 In place.Welding post accordingly sets organisation of working, and organisation of working uses laser processing mode.In other words, welding post, which is equipped with, swashs Light device 0200, laser 0200 are used to emit laser beam and melt the hot melt adhesive of the bonding plane of chip 3000.

Wherein, chip 3000 is embedded in advance in the landfill slot of card base 2000, the surface of the bonding plane and landfill slot of chip 3000 Keep opposite.Specifically, given by a small amount of adhesive between surface of the bonding plane of chip 3000 with filling slot be bonded Positioning prevents the two from coming off in the transportational process of conveying mechanism 0100.The bonding plane of chip 3000 presets one layer of hot melt adhesive, heat Under melten gel room temperature for solid without cementability.

Laser 0200 emits laser beam, and laser beam focusing generates heat in the front of chip 3000.Due to laser 0200 power and the adjusting of action time, the thermal energy that laser beam generates will not damage the structure of chip 3000.It should Thermal energy is transferred to the bonding plane of chip 3000 by the front of chip 3000, and hot melt adhesive is made to be heated and gradually melt.Hot melt adhesive is melted Afterwards, there is very high bonding strength, the bonding plane for enabling chip 3000 is Nian Jie with the surface for filling slot securely.Wherein, laser Device 0200 is laser welding head.

Preferably, laser 0200 be set on a Linear feed mechanism on, Linear feed mechanism approach with can moving along a straight line or Far from card base 2000.In other words, Linear feed mechanism is used to adjust the relative position of laser 0200 and card base 2000, further Optimize the regulatory function of laser 0200, the active position of laser beam is enable precisely to adjust.For example, Linear feed mechanism The direction of motion can be parallel or vertical with the surface of card base 2000, so as to adjust the relative position of laser 0200 and card base 2000 or Distance.Wherein, various structures can be used in Linear feed mechanism, including types such as the linear guide, linear bearing, telescopic cylinders.

Referring to Fig. 6, preferably, welding packaging system 1000 further includes laminating mechanism 0300, further to improve chip 3000 with the adhesive effect of card base 2000.Laminating mechanism 0300 is used to press the chip 3000 after hot melt adhesive is melted and card base 2000, chip 3000 is made to be welded in place with card base 2000 to squeeze the space between chip 3000 and card base 2000, avoid pine It moves and rises and falls and cause loose contact.Supplementary explanation, after hot melt adhesive is melted, gap is formed between chip 3000 and card base 2000, Mobility after melting due to hot melt adhesive makes chip 3000 and the inconvenient positioning of card base 2000, and laminating mechanism 0300 can effectively solve this One problem.

Wherein, various structures, such as clamping jaw, clamping plate, miniature block stamp can be used in laminating mechanism 0300.Preferably, pressing machine Structure 0300 uses rolling mode, and the power source including idler wheel and driving idler wheel rotation, idler wheel rotatably acts on hot melt adhesive and melts On chip 3000 after change, the chip 3000 after hot melt adhesive thawing is made to be fastened with the pressing of card base 2000.

In an exemplary embodiment, the outer profile of idler wheel keeps tangent with the upper surface of card base 2000, when card base 2000 with movement portion 0110 by laminating mechanism 0300 when, idler wheel and flexible element 0113 fold and oppress chip 3000 and card base 2000 is close, realizes the pressing of the two.

Please refer to Fig. 4~5, it is preferable that welding post be equipped with cooling body 0400, cooling body 0400 for pair plus Card base 2000 in work is cooled down.Cooling body 0400 causes structural damage for preventing working position from overheating, according to cooling Mode is different, and gas cooling or liquid cooling mode can be used.Gas cooling mode takes away heat, liquid cooling with compressed gas Mode takes away heat with coolant.

In an exemplary embodiment, cooling body 0400 uses cooling air mode.Cooling body 0400 includes Coldplate 0410 and inlet end 0420, coldplate 0410 are equipped with a plurality of stomatas 0411 and connection stomata 0411 and inlet end 0420 Perforation air flue, a plurality of 0411 side surfaces of the face card base 2000 far from laser 0200 of stomata.Inlet end as a result, 0420th, perforation air flue forms consistent vent passage with a plurality of stomatas 0411.Exemplarily, coldplate 0410 is set on welding post 0113 lower section of flexible element, directly can carry out air blowing cooling to the card base 2000 on card base fixture 0120.

Here, cooling air enters perforation air flue from inlet end 0420.Due to the effect of draught head, cooling air is through perforation Air flue reaches stomata 0411, and sprays and act on the processing department of card base 2000 through stomata 0411, processing department is driven to generate more Excess heat avoids pyrolytic damage.Wherein, the realization of the forms such as gas path joint can be used in inlet end 0420.

Please refer to Fig. 7, it is preferable that welding packaging system 1000 further includes visual detection unit 0500 and control unit 0600, visual detection unit 0500 is set on welding post, for detecting the movement velocity parameter of card base 2000 and location parameter, control Unit 0600 processed goes out ray velocity and according to location parameter to laser according to movement velocity parameter regulation laser 0200 0200 light path that goes out carries out position compensation.

Wherein, visual detection unit 0500 is a kind of equipment for machine replacing human eye to measure and judge.Vision is examined Survey unit 0500 will be ingested target and be converted into picture signal, send image processing module to.Image processing module is according to pixel Picture signal is transformed into digitized signal and carries out various operations to these signals to take out by the information such as distribution and brightness, color Take clarification of objective.Visual detection unit 0500 obtains the movement velocity parameter and location parameter of card base 2000 as a result,.Wherein, Since chip 3000 is moved with card base 2000, the movement velocity of chip 3000 is consistent with the movement velocity of card base 2000.

Diversified forms realization can be used in visual detection unit 0500, usually using industrial camera as main realization shape Formula.The most essential function of industrial camera converts optical signals into orderly electric signal, and directly determines institute's the image collected The parameters such as resolution ratio, picture quality.Preferably, industrial camera includes CCD camera or CMOS cameras, also can be used other kinds of Camera form.

Control unit 0600 receives movement velocity parameter and the location parameter that visual detection unit 0500 exports, and joins with standard Number carries out corresponding comparison calculation, sends out control instruction to laser 0200 according to operation result, adjusts adding for laser 0200 Work speed and Working position realize feedback regulation.

In other words, control unit 0600 adjusts the shifting for going out ray velocity, making laser beam and card base 2000 of laser 0200 Dynamic matching, laser welding time keep in the reasonable scope, preventing overheat or shortage of heat, improve processing efficiency；Control unit 0600 and the light path that goes out of laser 0200 is adjusted, realize position compensation, the focus point for making laser beam is ideal.

Control unit 0600 has corresponding logical operation capability, can be integrated in laser 0200, can also be used as setting In outer separate processing units.Exemplarily, the forms such as microprocessor, computer, computing circuit can be used in control unit 0600, The types such as driver also can be used.

In all examples being illustrated and described herein, any occurrence should be construed as merely illustrative, without It is as limitation, therefore, other examples of exemplary embodiment can have different values.

It should be noted that：Similar label and letter represents similar terms in following attached drawing, therefore, once a certain Xiang Yi It is defined in a attached drawing, does not then need to that it is further defined and explained in subsequent attached drawing.

Embodiment described above only expresses the several embodiments of the utility model, and description is more specific and detailed, But therefore it can not be interpreted as the limitation to the scope of the utility model.It should be pointed out that the ordinary skill for this field For personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these belong to this The protection domain of utility model.Therefore, the scope of protection of the utility model should be determined by the appended claims.

Claims (10)

1. a kind of welding packaging system, which is characterized in that including：

Conveying mechanism, the conveying mechanism include movement portion and a plurality of card base fixtures in the movement portion, the card Base fixture is for clamping card base, a plurality of card base fixtures to move across welding post with the movement portion correspondingly；

Laser, the laser are set on the welding post, make the hot melt adhesive in die bonding face for emitting laser beam Melt, the chip is embedded in advance in the landfill slot of the card base, and the bonding plane of the chip and the surface of the landfill slot are kept Relatively.

2. welding packaging system according to claim 1, which is characterized in that the welding packaging system further includes pressing machine Structure, the laminating mechanism are used to press the chip and the card base after hot melt adhesive thawing.

3. welding packaging system according to claim 2, which is characterized in that the laminating mechanism includes idler wheel and driving institute The power source of idler wheel rotation is stated, the idler wheel is rotatably acted on the chip, makes the core after the hot melt adhesive thawing Piece is fastened with card base pressing.

4. welding packaging system according to claim 1, which is characterized in that the welding post is equipped with cooling body, institute Cooling body is stated for being cooled down to the card base in processing.

5. welding packaging system according to claim 4, which is characterized in that the cooling body includes coldplate and air inlet End, the coldplate are equipped with the perforation air flue of a plurality of stomatas and the connection stomata and the inlet end, a plurality of stomatas point It is not right against a side surface of the card base far from the laser.

6. welding packaging system according to claim 1, which is characterized in that the movement portion includes driving wheel, driven wheel And tensioning connects the flexible element of the driving wheel and the driven wheel, the flexible element sets a plurality of protrusions along its direction of motion Portion, the adjacent lug boss form the card base fixture.

7. welding packaging system according to claim 6, which is characterized in that the driving wheel includes chain with the driven wheel One kind in wheel, belt wheel or rope sheave, the flexible element include one kind in transmission chain, transmission belt or transmission rope.

8. welding packaging system according to claim 1, which is characterized in that the welding packaging system further includes vision inspection Unit and control unit are surveyed, the visual detection unit is set on the welding post, for detecting the movement velocity of the card base Parameter and location parameter, described control unit laser according to the movement velocity parameter regulation go out ray velocity and root Position compensation is carried out to the light path that goes out of the laser according to the location parameter.

9. welding packaging system according to claim 8, which is characterized in that the visual detection unit includes CCD camera Or CMOS cameras.

10. welding packaging system according to claim 1, which is characterized in that the laser is set on a straight-line feed machine On structure, the Linear feed mechanism can move along a straight line close to or away from the card base.