CN207503926U - Chip cutters - Google Patents
Chip cutters Download PDFInfo
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- CN207503926U CN207503926U CN201721347419.XU CN201721347419U CN207503926U CN 207503926 U CN207503926 U CN 207503926U CN 201721347419 U CN201721347419 U CN 201721347419U CN 207503926 U CN207503926 U CN 207503926U
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- chip
- strip band
- cutting
- cutters
- chip strip
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Abstract
A kind of chip cutters, including：Conveying mechanism, for the conveying mechanism for making chip strip band successively by dispensing station and cutting work station, the chip strip band has the chip of multiple array distributions；Glue applying mechanism, the glue applying mechanism are set on the dispensing station, for being encapsulated in the die bonding face of the die bonding millet cake glue of the chip strip band, the chip strip band for Nian Jie with card base；Cutting mechanism, the cutting mechanism is set on the cutting work station, for the chip to be made to be detached from the chip strip band.The utility model provides a kind of chip cutters, and the feeding and cutting processing of chip are integrally completed with automation means.
Description
Technical field
The utility model belongs to chip encapsulating device technical field, is a kind of chip cutters specifically.
Background technology
Smart card is the common name for the plastic clip for being embedded with microchip, and data interaction can be realized with the external world by reader.
Smart card has many advantages, such as that reliability is high, safety is good, memory capacity is big, type is more, thus be widely used in financial finance,
Social insurance, traffic for tourism, health care, government administration, commodity retail, amusement and recreation, school control and other fields.
With the rapid development of smart card, demand is increasing, and very big challenge is brought to the processing of smart card.Intelligence
It can block and be encapsulated by chip and card base, thus processing of the master operation also around chip and card base carries out.Usually, chipset
Bonding encapsulation is carried out into after on chip strip band, being cut.
Traditional smart card processing is mainly cut using machinery cross cutting or mold blunderbuss, for different size or the chip of type,
It needs pointedly to make corresponding mold.Different molds propose compatible problem for frock clamp, and production process needs
Will frequent more mold exchange, cause production efficiency very low.In addition, numerous Mold Makings needs, the manufacture of smart card is also increased
Cost.
Utility model content
For overcome the deficiencies in the prior art, the utility model provides a kind of chip cutters, with automation means
One completes the feeding and cutting processing of chip.
The purpose of this utility model is achieved through the following technical solutions：
A kind of chip cutters, including：
Conveying mechanism, the conveying mechanism are used to make chip strip band successively by dispensing station and cutting work station, the core
Slip band has the chip of multiple array distributions；
Glue applying mechanism, the glue applying mechanism is set on the dispensing station, in the die bonding face of the chip strip band
Dispensing, the die bonding face of the chip strip band is for encapsulation Nian Jie with card base；
Cutting mechanism, the cutting mechanism is set on the cutting work station, for making the chip from the chip strip band
Separation.
As an improvement of the above technical solution, the cutting mechanism includes laser, and the laser is used for the core
Slip band carries out chip cutting, and the light direction of the laser is vertical with the die bonding face of the chip strip band.
As a further improvement of the above technical scheme, the conveying mechanism includes the first charging tray and the second charging tray, described
Chip strip band one ends wound on first charging tray, the other end is then wound on second charging tray, first charging tray with
The second charging tray synchronous rotary and drive the chip strip movement.
As a further improvement of the above technical scheme, the glue applying mechanism includes Glue dripping head, and the Glue dripping head has point
Sharp plastic emitting portion, the sharp plastic emitting portion and the vertically opposite setting in die bonding face of the chip strip band.
As a further improvement of the above technical scheme, the chip cutters further include visual detection unit and control
Unit, the visual detection unit are set on the cutting work station, join for detecting the movement velocity parameter of the chip with position
Number, described control unit cutting speed of cutting mechanism and according to the position according to the movement velocity parameter regulation
Parameter carries out position compensation to the cutting mechanism.
As a further improvement of the above technical scheme, the visual detection unit includes CCD camera or CMOS cameras.
As a further improvement of the above technical scheme, through the cutting mechanism separation chip in its four corners with it is described
Still there is connecting portion, the largest contours size of the connecting portion is not more than 0.02mm between chip strip band.
As a further improvement of the above technical scheme, the chip cutters further include conversion landfill mechanism, described
Conversion landfill mechanism detaches for removing chip detach through the cutting mechanism by described through the cutting mechanism
Chip is filled in the landfill slot of the card base.
As a further improvement of the above technical scheme, the conversion landfill mechanism includes rotary shaft body and multiple suction nozzles,
The rotary shaft body is set on the back side in the die bonding face of the chip strip band, rotation of the suction nozzle along the rotary shaft body
Even circumferential is distributed in the outer surface of the rotary shaft body, the suction nozzle and the back side in the die bonding face of the chip strip band
It is oppositely arranged and is used to remove the chip detached through the cutting mechanism.
As a further improvement of the above technical scheme, the conversion landfill mechanism is set on the card base and cut institute
Between stating chip strip band, the card base is arranged in parallel to each other with the cut chip strip band.
The beneficial effects of the utility model are：
The automatic loading/unloading of chip material is realized with conveying mechanism, the preposition dispensing of chip is realized with glue applying mechanism, to cut
Cutting mill structure realizes the separation of chip and chip strip band, and there is integral type to automate processing characteristics, without human intervention, automates journey
Degree is high and ensures processing efficiency, and avoid the processing of universal machine tools coarse, pointedly improves machining accuracy.
For the above-mentioned purpose of the utility model, feature and advantage is enable to be clearer and more comprehensible, preferred embodiment cited below particularly, and
Attached drawing appended by cooperation, is described in detail below.
Description of the drawings
It, below will be to use required in embodiment in order to illustrate more clearly of the technical solution of the utility model embodiment
Attached drawing be briefly described, it should be understood that the following drawings illustrates only some embodiments of the utility model, therefore should not be by
Regard the restriction to range as, for those of ordinary skill in the art, without creative efforts, may be used also
To obtain other relevant attached drawings according to these attached drawings.
Fig. 1 is the axonometric schematic diagram for the chip cutters that the utility model embodiment 1 provides；
Fig. 2 is enlarged diagram at the A of Fig. 1 chips cutter devices；
Fig. 3 is the schematic front view for the chip cutters that the utility model embodiment 1 provides；
Fig. 4 is the feedback link schematic diagram for the chip cutters that the utility model embodiment 1 provides；
Fig. 5 is the application schematic diagram for the chip cutters that the utility model embodiment 1 provides.
Main element symbol description：
1000- chip cutters, 0100- conveying mechanisms, the first charging trays of 0110-, the second charging trays of 0120-, 0200- dispensings
Mechanism, 0210- Glue dripping heads, the sharp plastic emitting portions of 0211-, 0300- cutting mechanisms, 0310- lasers, 0400- visual detection units,
0500- control units, 0600- conversion landfills mechanism, 0610- rotary shaft bodies, 0620- suction nozzles, 2000- chip strip bands, 3000- cores
Piece, 4000- card bases.
Specific embodiment
For the ease of understanding the utility model, chip cutters are more fully retouched below with reference to relevant drawings
It states.The preferred embodiment of chip cutters is given in attached drawing.But chip cutters can pass through many different shapes
Formula is realized, however it is not limited to embodiment described herein.On the contrary, the purpose for providing these embodiments is made to chip cutting
The disclosure of device more thorough and comprehensive.
It should be noted that when element is referred to as " being fixed on " another element, it can be directly on another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it can be directly connected to
To another element or it may be simultaneously present centering elements.On the contrary, when element be referred to as " directly existing " another element " on " when,
There is no intermediary elements.Term as used herein " vertically ", " horizontal ", "left", "right" and similar statement are
For illustrative purposes.
Unless otherwise defined, all of technologies and scientific terms used here by the article is led with belonging to the technology of the utility model
The normally understood meaning of technical staff in domain is identical.It is in the term used in the description of chip cutters herein
In order to describe the purpose of specific embodiment, it is not intended that limitation the utility model.Term as used herein " and/or " include
The arbitrary and all combination of one or more relevant Listed Items.
Embodiment 1
Please refer to Fig. 1~2, chip cutters 1000, including conveying mechanism 0100, glue applying mechanism 0200 and cutting
Mechanism 0300 for providing a kind of full automatic chip dynamic cutting equipment, realizes the dynamic cutting of chip 3000, has higher
Processing efficiency and the degree of automation.Make introductions all round the concrete structures of chip cutters 1000 below.
Chip cutters 1000 are needed as chip 3000 and the previous step of 4000 assembled package of card base to chip strip
Be split with the chip 3000 on 2000, and spot printing appropriate adhesive in advance, filled in time after dividing so as to chip 3000 in
In the landfill slot of card base 4000, it is ready for subsequent encapsulation process.Correspondingly, chip cutters 1000 set dispensing work
Position and cutting work station, for carrying out dispensing processing, cutting work station is used to carry out cutting processing dispensing station.
To realize the automatic conveying of chip strip band 2000, chip cutters 1000 set conveying mechanism 0100.Conveyer
Structure 0100 is for making chip strip band 2000 successively by dispensing station and cutting work station, to realize for the dynamic of chip strip band 2000
State is processed.Wherein, chip strip band 2000 has the chip 3000 of multiple array distributions.In other words, multiple chips 3000 form one
Banded structure.
Various structures realization, such as the linear guide, linear bearing form can be used in conveying mechanism 0100.Please refer to figure
1 and Fig. 3, it is preferable that conveying mechanism 0100 uses flexible driving structure.In other words, conveying mechanism 0100 includes the first charging tray
0110 and second charging tray 0120, for 2000 one ends wound of chip strip band on the first charging tray 0110, the other end is then wound in the second material
On disk 0120, the first charging tray 0110 is with 0120 synchronous rotary of the second charging tray and driving chip band 2000 moves.
In an exemplary embodiment, the first charging tray 0110 is axially set in parallel with the second charging tray 0120.First
One is driving wheel in 0110 and second charging tray 0120 of charging tray, and another one is driven wheel.In other words, the first charging tray 0110 or the second
Charging tray 0120 is connected with driving mechanism, and driving mechanism rotates for the first charging tray 0110 of driving or the second charging tray 0120.Wherein, it drives
Various forms realization, such as electric rotating machine, hydraulic motor can be used in motivation structure.
By the first charging tray 0110 for for driving wheel, when the first charging tray 0110 rotates, chip strip band 2000 is in the first material
Blowing on disk 0110, and wound on the second charging tray 0120, the second charging tray 0120 is driven to rotate integrally.Chip strip band 2000 is with
The rotation of one charging tray 0110 and gradually move, successively by dispensing station and cutting work station, realize self-feeding process.
Dispensing station sets corresponding organisation of working and realizes dispensing and process.Here, glue applying mechanism 0200 is set on dispensing work
Position, in the die bonding millet cake glue of chip strip band 2000.Wherein, the die bonding face of chip strip band 2000 is used for and card base
4000 bonding encapsulation.Usually, die bonding face is set on the back side of chip strip band 2000.More specifically, die bonding face is
Chip 3000 is used for the surface Nian Jie with card base 4000.
In an exemplary embodiment, hot melt adhesive has been preset in the die bonding face of chip strip band 2000.Under room temperature, heat
Melten gel for solid without have cementability, can not realize bonding.Here, glue applying mechanism 0200 is used to smear in right amount in die bonding face
Adhesive can realize chip 3000 and card base 4000 after being cut so as to chip 3000 promptly with 4000 cemented in place of card base
Preliminary bonding.
Multiple structural forms realization, such as rubber gun, dispensing needle head type can be used in glue applying mechanism 0200.Preferably, point
Gluing mechanism 0200 includes Glue dripping head 0210, and Glue dripping head 0210 has sharp plastic emitting portion 0211, sharp plastic emitting portion 0211 and chip strip
With the 2000 vertically opposite setting in die bonding face.Wherein, sharp plastic emitting portion 0211 has conical structure, the tip of conical structure
Directly facing the die bonding face of chip strip band 2000, make gel quantity controllable, avoid dispensing excessive and cause adhesion pollution or wave
Take.
Cutting work station is used to implement the cutting of chip 3000, is main Working position, needs to set corresponding processing machine
Structure.For this purpose, cutting mechanism 0300 is set in cutting work station, for chip 3000 to be made to be detached from chip strip band 2000.Cutting machine
A variety of processing structures can be used in structure 0300, including forms such as Milling Process, wire cuttings, correspondingly set milling cutter, line cutting electrode
The mechanical structures such as silk.
Preferably, cutting mechanism 0300 uses laser cutting mode.Cutting mechanism 0300 includes laser 0310, laser
0310 for cutting chip strip band 2000, the light direction of laser 0310 and the die bonding face of chip strip band 2000
Vertically.For laser 0310 for being generated and transmitted by laser, laser action makes the chip strip of Working position in the position that needs are cut
The heating vaporization rapidly of band 2000, evaporation form hole.With the relative movement of laser beam and chip strip band 2000, continuously generate
Hole be connected into joint-cutting, realize the separation of chip 3000 and chip strip band 2000.
Wherein, multiple types can be used in laser 0310, including gas laser, solid state laser, semiconductor laser
With the types such as dye laser.Preferably, laser 0310 uses the type of ultraviolet laser, for emitting ultraviolet laser,
Short wavelength's characteristic can carry out the processing of subtle component, and can obtain very high energy convenient for focusing on the point of systems
Metric density, joint-cutting is neat and small, makes 3000 neat in edge of chip regular, avoids there is cutting burr and influencing and card base 4000
Cooperation, ensure encapsulation precision.
In an exemplary embodiment, cutting mechanism 0300 is according to the specification of chip 3000, along die bonding face
Metal edges are cut.
Please refer to Fig. 4, it is preferable that chip cutters 1000 further include visual detection unit 0400 and control unit
0500, visual detection unit 0400 is set on cutting work station, for the movement velocity parameter and location parameter of detection chip 3000, control
Unit 0500 processed is according to the cutting speed of movement velocity parameter regulation cutting mechanism 0300 and according to location parameter to cutting machine
Structure 0300 carries out position compensation.
Wherein, visual detection unit 0400 is a kind of equipment for machine replacing human eye to measure and judge.Vision is examined
Survey unit 0400 will be ingested target and be converted into picture signal, send image processing module to.Image processing module is according to pixel
Picture signal is transformed into digitized signal and carries out various operations to these signals to take out by the information such as distribution and brightness, color
Take clarification of objective.Visual detection unit 0400 obtains the movement velocity parameter and location parameter of chip 3000 as a result,.Wherein,
Since chip 3000 is moved with chip strip band 2000, the movement velocity of chip 3000 and the movement velocity of chip strip band 2000
Unanimously.
Diversified forms realization can be used in visual detection unit 0400, usually using industrial camera as main realization shape
Formula.The most essential function of industrial camera converts optical signals into orderly electric signal, and directly determines institute's the image collected
The parameters such as resolution ratio, picture quality.Preferably, industrial camera includes CCD camera or CMOS cameras, also can be used other kinds of
Camera form.
Control unit 0500 receives movement velocity parameter and the location parameter that visual detection unit 0400 exports, and joins with standard
Number carries out corresponding comparison calculation, sends out control instruction to cutting mechanism 0300 according to operation result, adjusts cutting mechanism 0300
Process velocity and Working position, realize feedback regulation.For example, in laser cutting, control unit 0500 adjusts laser
0310 shifted matching for going out ray velocity, making laser beam and chip strip band 2000 improves processing efficiency；Control unit 0500 is simultaneously
The light path that goes out of laser 0310 is adjusted, realizes position compensation, the focus point for making laser beam is ideal.
Control unit 0500 has corresponding logical operation capability, can be integrated in cutting mechanism 0300, can also be used as setting
It is placed in outer separate processing units.Exemplarily, the shapes such as microprocessor, computer, computing circuit can be used in control unit 0500
The types such as driver also can be used in formula.
Preferably, the chip 3000 that cleaved mechanism 0300 detaches still has between its four corners and chip strip band 2000
Connecting portion, the largest contours size of connecting portion are not more than 0.02mm.In other words, the chip 3000 that cleaved mechanism 0300 detaches with
There are joint-cutting between chip strip band 2000, only in 3000 four corners remnants connecting portions of chip.Connecting portion make chip 3000 still with
2000 one of chip strip band is mobile, and to be out cutting work station, while minimum size for connection makes bonding strength very low, it is only necessary to compared with
Small feeding active force can be such that chip 3000 is completely separated with chip strip band 2000.
On the basis of aforementioned structure, chip cutters 1000 should be arranged in correspondence with feeding structure, to make chip
3000 are completely separated with chip strip band 2000.Please refer to Fig. 2 and Fig. 5, it is preferable that chip cutters 1000 include conversion
Mechanism 0600 is filled, conversion landfill mechanism 0600 is used to remove the chip 3000 that cleaved mechanism 0300 detaches, and will be cleaved
The chip 3000 that mechanism 0300 detaches is filled in the landfill slot of card base 4000.Here, conversion landfill mechanism 0600 realizes core
The seamless connection of piece cutter device 1000 and following process device.
Multiple structural forms, such as collet, clamping jaw form can be used in conversion landfill mechanism 0600, realizes grabbing for chip 3000
It takes and is transported with conversion.Preferably, conversion landfill mechanism 0600 includes rotary shaft body 0610 and multiple suction nozzles 0620.Wherein, it rotates
Axis body 0610 is set on the back side in the die bonding face of chip strip band 2000, has rotational motion capability and realizes suction nozzle 0620
Rotation transposition.The rotation round of suction nozzle 0620 along rotary shaft body 0610 is uniformly distributed in the outer surface of rotary shaft body 0610, so as to
It is formed and multiple picks and places station.Suction nozzle 0620 and the back side in the die bonding face of chip strip band 2000 are oppositely arranged, for removing
The chip 3000 that cleaved mechanism 0300 detaches.
In an exemplary embodiment, suction nozzle 0620 forms negative pressure of vacuum.Under suction function, suction nozzle 0620 and core
Piece 3000 is connected as one.Rotary shaft body 0610 rotates, drive suction nozzle 0620 rotate, the chip 3000 being connect with suction nozzle 0620 by
It drives and is detached with chip strip band 2000, and rotated with suction nozzle 0620.When suction nozzle 0620 turns over certain angle and card base 4000
During face, the suction function of suction nozzle 0620 disappears, and chip 3000 is made to detach and fall into the landfill slot of card base 4000 with suction nozzle 0620
It is interior.The die bonding face of chip 3000 is contacted with filling the surface of slot, real under the adhesive effect of 0200 spot printing of glue applying mechanism
Existing cemented in place.
Preferably, conversion landfill mechanism 0600 is set between card base 4000 and cut chip strip band 2000, card base
4000 arrange in parallel to each other with cut chip strip band 2000.Exemplarily, card base 4000 is flatly laid with, and landfill slot is opened
Mouth is straight up.Correspondingly, the chip strip band 2000 at cutting work station moves and horizontally disposed in the horizontal direction.
In all examples being illustrated and described herein, any occurrence should be construed as merely illustrative, without
It is as limitation, therefore, other examples of exemplary embodiment can have different values.
It should be noted that：Similar label and letter represents similar terms in following attached drawing, therefore, once a certain Xiang Yi
It is defined in a attached drawing, does not then need to that it is further defined and explained in subsequent attached drawing.
Embodiment described above only expresses the several embodiments of the utility model, and description is more specific and detailed,
But therefore it can not be interpreted as the limitation to the scope of the utility model.It should be pointed out that the ordinary skill for this field
For personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these belong to this
The protection domain of utility model.Therefore, the scope of protection of the utility model should be determined by the appended claims.
Claims (10)
1. a kind of chip cutters, which is characterized in that including：
Conveying mechanism, the conveying mechanism are used to make chip strip band successively by dispensing station and cutting work station, the chip strip
Band has the chip of multiple array distributions；
Glue applying mechanism, the glue applying mechanism are set on the dispensing station, in the die bonding millet cake glue of the chip strip band,
The die bonding face of the chip strip band is for encapsulation Nian Jie with card base；
Cutting mechanism, the cutting mechanism is set on the cutting work station, for the chip to be made to be detached from the chip strip band.
2. chip cutters according to claim 1, which is characterized in that the cutting mechanism includes laser, described
Laser is used to carry out the chip strip band chip cutting, the light direction of the laser and the cut chip strip
The die bonding face of band is vertical.
3. chip cutters according to claim 1, which is characterized in that the conveying mechanism includes the first charging tray and the
Two charging trays, on first charging tray, the other end is wound on second charging tray chip strip band one ends wound, and described the
One charging tray and the second charging tray synchronous rotary and drive the chip strip movement.
4. chip cutters according to claim 1, which is characterized in that the glue applying mechanism includes Glue dripping head, described
Glue dripping head has sharp plastic emitting portion, the sharp plastic emitting portion and the vertically opposite setting in die bonding face of the chip strip band.
5. chip cutters according to claim 1, which is characterized in that the chip cutters further include vision inspection
Unit and control unit are surveyed, the visual detection unit is set on the cutting work station, for detecting the movement velocity of the chip
Parameter and location parameter, described control unit according to the movement velocity parameter regulation cutting speed of cutting mechanism and
Position compensation is carried out to the cutting mechanism according to the location parameter.
6. chip cutters according to claim 5, which is characterized in that the visual detection unit includes CCD camera
Or CMOS cameras.
7. chip cutters according to claim 1, which is characterized in that the chip through cutting mechanism separation is in it
Still there is connecting portion, the largest contours size of the connecting portion is not more than 0.02mm between four corners and the chip strip band.
8. chip cutters according to claim 1, which is characterized in that the chip cutters further include conversion and fill out
Mechanism is buried, the conversion landfill mechanism is used to remove the chip detached through the cutting mechanism, and by described through the cutting machine
The chip of structure separation is filled in the landfill slot of the card base.
9. chip cutters according to claim 8, which is characterized in that the conversion landfill mechanism includes rotary shaft body
With multiple suction nozzles, the rotary shaft body is set on the back side in the die bonding face of the chip strip band, and the suction nozzle is along the rotation
The rotation round of rotary shaft body is uniformly distributed in the outer surface of the rotary shaft body, and the chip of the suction nozzle and the chip strip band glues
The back side of junction is oppositely arranged and is used to remove the chip detached through the cutting mechanism.
10. chip cutters according to claim 9, which is characterized in that the conversion landfill mechanism is set on the card
Between base and the cut chip strip band, the card base is arranged in parallel with the cut chip strip band.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721347419.XU CN207503926U (en) | 2017-10-17 | 2017-10-17 | Chip cutters |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721347419.XU CN207503926U (en) | 2017-10-17 | 2017-10-17 | Chip cutters |
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| Publication Number | Publication Date |
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| CN207503926U true CN207503926U (en) | 2018-06-15 |
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ID=62500886
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| Application Number | Title | Priority Date | Filing Date |
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| CN201721347419.XU Active CN207503926U (en) | 2017-10-17 | 2017-10-17 | Chip cutters |
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| CN (1) | CN207503926U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107611068A (en) * | 2017-10-17 | 2018-01-19 | 深圳华创兆业科技股份有限公司 | Chip cutters |
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2017
- 2017-10-17 CN CN201721347419.XU patent/CN207503926U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107611068A (en) * | 2017-10-17 | 2018-01-19 | 深圳华创兆业科技股份有限公司 | Chip cutters |
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