CN106328566A - Chip package production line of multichip intelligent card - Google Patents

Chip package production line of multichip intelligent card Download PDF

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Publication number
CN106328566A
CN106328566A CN201610900479.3A CN201610900479A CN106328566A CN 106328566 A CN106328566 A CN 106328566A CN 201610900479 A CN201610900479 A CN 201610900479A CN 106328566 A CN106328566 A CN 106328566A
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CN
China
Prior art keywords
chip
card
die
blanking
encapsulation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610900479.3A
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Chinese (zh)
Inventor
王开来
房训军
李南彪
赖汉进
胡军连
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Guangzhou Mingsen Technologies Co Ltd
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Guangzhou Mingsen Technologies Co Ltd
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Application filed by Guangzhou Mingsen Technologies Co Ltd filed Critical Guangzhou Mingsen Technologies Co Ltd
Priority to CN201610900479.3A priority Critical patent/CN106328566A/en
Publication of CN106328566A publication Critical patent/CN106328566A/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67184Apparatus for manufacturing or treating in a plurality of work-stations characterized by the presence of more than one transfer chamber
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber

Abstract

The invention discloses a chip package production line of a multichip intelligent card, comprising a card conveying mechanism, a packaging module, a thermal compression module, a chip detection module and a card receiving module, wherein the modules are in sequence arranged along a card conveying direction; the packaging module comprises two chip belt supply mechanisms, a chip blanking mechanism and a chip carry packaging mechanism; two packaging stations are configured for the packaging module; a chip positioning mechanism is respectively arranged at each packaging station; chip belt supply mechanisms comprise chip belts and chip belt transmission mechanism; chip belts in two chip belt supply mechanisms in parallel extend along a direction perpendicular to the card conveying direction, and the transmission directions thereof are opposite. The equipment is applicable to package and fixation of the single-chip card and the multichip card and has the advantages of quick package and thermal compression fixation speed, high production efficiency and precision.

Description

A kind of chip package production line of multicore smart card
Technical field
The present invention relates to smart card and manufacture equipment, be specifically related to the chip package apparatus for production line of a kind of multicore smart card.
Background technology
In contact intelligent card production process, need to encapsulate chip in card.During encapsulation chip, first need To be transported to chip on the card chip slot of correspondence encapsulate, then carry out compression and add heat fixation, the therefore packing producing line of card It is broadly divided into package module and hot pressing module.
Common smart card every card is provided with a chip, but also has part card to be provided with multiple chip, example Such as two chips, four chips etc..Chip in these multi-chip cards is divided into two parts and is arranged on the two ends of card, is positioned at not With end chip (in four angles of chip, having at an angle and be provided with hypotenuse, the position of hypotenuse is different, chip towards contrary Towards difference, see Fig. 1), and be positioned at the chip in same one end towards unanimously.The chip being positioned at card wherein one end is referred to as One core assembly sheet, the chip being positioned at the card other end is referred to as the second core assembly sheet;Two groups of chip in card towards difference 180 °.Envelope Its stamping-out from chip belt is got off by the chip before dress by chip blanking mechanism, the chip that these stamping-outs get off towards consistent and Immobilize, be transported to encapsulate station by chip carrying mechanism during encapsulation and be encapsulated in the chip slot of card.
The deficiency that existing multicore Intelligent card package production line exists is:
In existing Intelligent card package production line, package module is generally used for being packaged single-chip card, when for many During the encapsulation of chip card, need that card is carried out 180 ° and rotate or chip is carried out 180 ° of rotations, the second core assembly could be protected Sheet can be transported in the chip slot of card exactly;Owing to handling process needing rotary chip or card, on the one hand, make Transporting velocity is slow, and production efficiency is low, on the other hand, easily affects the encapsulation precision of chip.
Summary of the invention
It is an object of the invention to overcome the deficiencies in the prior art, it is provided that the chip package of a kind of multicore smart card produces Line, this production line can be continuously completed the encapsulation process of chip on a production line, and be not only suitable for single-chip card Encapsulation, be also applied for the encapsulation of multi-chip card, when for carrying out the encapsulation of multi-chip card, have package speed fast, Production efficiency is high, encapsulation precision advantages of higher.
The purpose of the present invention is realized by following technical scheme:
The chip package production line of a kind of multicore smart card, depends on including card transport and along card conveying direction The package module of secondary setting, hot pressing module, chip detection module and receipts card module;
Described package module includes chip belt feed mechanism, chip blanking mechanism and chip carrying packaging mechanism;Wherein, Package module is provided with two encapsulation stations, is provided with clamping sheet positioning mechanism at each encapsulation station;Described chip belt feed mechanism is Two, each chip belt feed mechanism includes chip belt and chip belt connecting gear;Chip in two chip belt feed mechanisms Band extends in parallel along the direction being perpendicular to card conveying direction, and the sender of the chip belt in two chip belt feed mechanisms To on the contrary;Described chip blanking mechanism is two, and each chip blanking mechanism includes blanking die and is located at below blanking die Stamping-out actuator;Rushing of two chip belts chip blanking mechanism the most from which in two chip belt feed mechanisms The lower section cutting out mould is passed through.
The work process of the chip package production line of above-mentioned multicore smart card is:
In package module, it is the most defeated in step mode along card conveying that card is dialled mechanism for card by Timing Belt Sending, arrive first in encapsulation station and be packaged, the process of encapsulation is: the chip belt conveyer in two chip belt feed mechanisms Structure drives corresponding chip belt to move, and is gone out by the chip on chip belt by chip blanking mechanism;Due to two chip belts Direction of transfer is contrary, therefore the chip of two chip blanking mechanisms towards difference 180 °, each chip blanking mechanism is gone out A chip core assembly sheet just to be packaged with card is towards consistent.Card to be packaged is first fed into along card conveying In first encapsulation station, carrying out the encapsulation of the first core assembly sheet, two chip blanking mechanisms are rushed by chip carrying packaging mechanism With being transported at card towards identical chip and be encapsulated in the first core assembly film trap of described first core assembly sheet in the chip gone out; Then during card is transported to second encapsulation station, carrying out the encapsulation of the second core assembly sheet, chip carrying packaging mechanism is by chip With being transported at card towards identical chip and be encapsulated into second of described second core assembly sheet in the chip that blanking mechanism is gone out In core assembly film trap, so far complete the encapsulation of multiple chips on card.
The card having encapsulated chip continues to be fed forward to hot pressing station, hot pressing module press the chip on card Tight and heating so that the gum on chip is bonded together with card;Finally complete the card of processing through chip detection module Detect, be finally transported to receive in card module and collect.
One preferred version of the present invention, wherein, is provided with two groups of hot-press equipments in described hot pressing module, and two groups of hot pressing set The rotating mechanism for card being carried out 180 rotations it is provided with between Bei.Use two groups of hot-press equipments to be advantageous in that, often organize hot pressing Equipment is each responsible for the hot-pressing processing of the chip of card wherein one end, thus improves production efficiency, often the heat in group hot-press equipment The quantity of pressure device can be arranged flexibly according to number of chips, the most often organizes the quantity of hot-press arrangement and card one in hot-press equipment The quantity of end chips is identical, and the hot-pressing processing of a chip is responsible for by the most each hot-press arrangement so that each hot-press arrangement The most only need to move up and down, and without shifting between different chips.The effect of described rotating mechanism is, works as card After the chip hot-pressing processing of one end finishes, this rotating mechanism it is carried out 180 ° of rotations, by next group hot-press equipment to card The chip of the other end carries out hot-pressing processing.
One preferred version of the present invention, wherein, in multiple chips of card, along the conveying direction of card, is positioned at The chip of card front end is the first core assembly sheet, and the chip being positioned at rear end is the second core assembly sheet;In said two encapsulation station, along Card conveying direction is followed successively by the first encapsulation station and the second encapsulation station;Two blanking dies of said two chip blanking mechanism In tool, it is followed successively by the first blanking die and the second blanking die along card conveying direction;Described first blanking die is gone out Chip towards with described first core assembly sheet towards consistent, the chip gone out in described second blanking die towards with institute State the second core assembly sheet towards unanimously;Described first blanking die is arranged at and the first encapsulation station corresponding position, and defeated at card Sending on direction, the punching on this first blanking die is positioned at and first group of chip package groove pair of the card in the first encapsulation station Should locate;Described second blanking die is arranged at and the second encapsulation station corresponding position, and on card conveying direction, this second stamping-out Punching on mould is positioned at and second group of chip package groove corresponding position of the card in the second encapsulation station.
The purpose using above-mentioned preferred version is, allow during encapsulation chip carrying packaging mechanism carrying chip stroke Short, to improve packaging efficiency further.Specifically, owing to the first blanking die is positioned at and the first encapsulation station corresponding position, and On card conveying direction, the punching on the first blanking die is positioned at and first group of chip package of the card in the first encapsulation station Groove corresponding position, therefore when the chip package will gone out in the first blanking die to first group chip package groove, distance is the shortest;With Reason, during by the chip package gone out in the second blanking die to second group of chip package groove, distance is also the shortest, thus maximum limit Degree ground improves the speed of encapsulation, improves production efficiency.
One preferred version of the present invention, wherein, in each chip blanking mechanism, described stamping-out actuator includes punching Cut support, fix seat for die-cut bar chip being rushed from chip belt de-die-cut bar, being used for fixed punch chipping and be used for Drive die-cut bar to fix seat and make vertical reciprocating die-cut drive mechanism;Described die-cut drive mechanism includes driving cylinder, pendulum Bar, driving wheel and drive seat, wherein, the cylinder body of described driving cylinder is hinged on die-cut support, stretching of this driving cylinder Bar is hinged on the lower end of fork, and the middle part of fork is hinged on die-cut support, and the upper end of fork connects described driving by rotating shaft Wheel;Being provided with driver slot in described drive seat, described driving wheel is arranged in driver slot, and the top of described drive seat is die-cut with described Bar is fixed seat and is connected.
The operation principle of above-mentioned stamping-out actuator is: during work, die-cut drive mechanism drive die-cut bar fix seat and Die-cut bar pumps, and when die-cut bar moves upward, is rushed by the chip on chip belt de-, the upper end shape of this die-cut bar Shape is consistent with the punching in blanking die, and the chip form gone out is consistent with punching and is positioned in punching;Described die-cut driving In mechanism, drive the expansion link of cylinder when stretching out, promote fork to rotate around the junction point with die-cut support, the upper end of fork to Upper driving, the driving wheel of fork upper end drives die-cut bar to fix seat by driver slot and moves upward, and when driving the flexible of cylinder When bar is retracted, the most die-cut bar is fixed seat and is moved downward.
Preferably, the die-cut bar in two chip blanking mechanisms is fixed seat and mutually is pressed close to arrange, and seat fixed by two die-cut bars Face of pressing close to be the inclined plane at an acute angle with card conveying direction;Described die-cut bar is fixed and is provided with guiding between seat and die-cut support Bar.The purpose using this preferred version is, arranges described guide post guaranteeing die-cut bar to fix in seat to have enough positions On the premise of, (along card conveying direction) length that seat is combined fixed by two die-cut bars of reduction as far as possible, thus allows two It is near as far as possible that individual blanking die is arranged, thus carries when chip carrying packaging mechanism converts between two blanking dies Stroke during chip is shorter, the most time-consuming.
A scheme more optimized of seat fixed by above-mentioned die-cut bar is that two die-cut bars are fixed seat and are grouped together into square Shape, the angle pressed close between face and card conveying direction that seat fixed by two die-cut bars is 45 ° so that seat fixed by each die-cut bar Roughly triangular, such that it is able to fix corresponding position, three turnings of seat at the die-cut bar of triangle to be respectively provided with a guide post, Thus make full use of the space that die-cut bar fixes in seat and obtain stable guide effect.
In said chip blanking mechanism, described die-cut support includes the die holder for fixing blanking die, this mould Being provided with chip belt passage with described blanking die corresponding position in the fixing seat of tool, described chip belt is worn from this chip belt passage Cross.
One preferred version of the present invention, wherein, in described chip belt feed mechanism, described chip belt connecting gear bag Include unused chip belt winding wheel, with chip belt winding wheel, traction electric machine, traction wheel and chip belt guide rail, wherein, described in lead Running wheel is connected with the main shaft of traction electric machine, and the traction electric machine in two chip belt feed mechanisms is arranged at card conveying not Homonymy.
One preferred version of the present invention, wherein, described chip carrying packaging mechanism includes encapsulating suction nozzle, for driving envelope Z axis drive mechanism that dress suction nozzle moves along Z-direction, drive machine for the X-axis driving Z axis drive mechanism to move along X-direction The Y-axis drive mechanism that structure and driving X-axis drive mechanism move along Y direction, described encapsulation suction nozzle is connected with negative pressure device.
The present invention compared with prior art has a following beneficial effect:
1, in package module, by arranging two chip belt feed mechanisms and two chip blanking mechanisms, and two are allowed The conveying direction of chip belt is contrary so that the chip that two chip blanking mechanisms are gone out towards respectively with first group on card Chip and the second core assembly sheet towards unanimously, so without chip is revolved during by chip package to chip slot Turn, not only save packaging time, improve package speed and efficiency, and avoid chip and rotate the cumulative errors brought so that The encapsulation precision of chip is also improved.
2, by arranging two encapsulation stations, the first core assembly sheet in card and the second core assembly sheet is allowed to encapsulate in difference respectively Station completes encapsulation, it is possible to reduction chip carrying packaging mechanism stroke in carrying chip processes, when saving encapsulation equally Between, improve package speed and efficiency.
3, can be used not only for multi-chip card is carried out chip package, it is also possible to for single-chip card is carried out chip Encapsulation.
Accompanying drawing explanation
Fig. 1 is the structural representation of a detailed description of the invention of the chip package production line of the multicore smart card of the present invention Figure.
Fig. 2 is the structural representation of Fig. 1 chips packing producing line main part.
Fig. 3 is the structural representation of four core smart cards of the present invention.
Fig. 4 is the perspective view of package module in Fig. 2.
Fig. 5-Fig. 7 is the structural representation removing chip carrying packaging mechanism in package module shown in Fig. 4, and wherein, Fig. 5 is Front view, Fig. 6 is upward view, and Fig. 7 is axonometric chart.
Fig. 8 is the perspective view of package module chips blanking mechanism shown in Fig. 4.
Fig. 9-Figure 11 is the structural representation of die-cut drive mechanism in chip blanking mechanism shown in Fig. 8, and wherein, Fig. 9 is main View, Figure 10 is the A-A sectional view of Fig. 9, and Figure 11 is axonometric chart.
Figure 12 is the stereochemical structure that seat fixed by blanking die in chip blanking mechanism shown in Fig. 8, die-cut bar and die-cut bar Schematic diagram.
Figure 13 and Figure 14 is the structural representation that in chip blanking mechanism shown in Fig. 8, seat fixed by die-cut bar and die-cut bar, its In, Figure 13 is front view, and Figure 14 is axonometric chart.
Figure 15 and Figure 16 is the structural scheme of mechanism of clamping sheet positioning mechanism in chip encapsulation module shown in Fig. 4, wherein, Tu15Wei Front view, Figure 16 is axonometric chart.
Figure 17 is that in clamping sheet positioning mechanism shown in Figure 15 and Figure 16, location promotes seat and the stereochemical structure of location pushing rolling wheels Schematic diagram.
Detailed description of the invention
Below in conjunction with embodiment and accompanying drawing, the present invention is described in further detail, but embodiments of the present invention do not limit In this.
Below in conjunction with embodiment and accompanying drawing, the present invention is described in further detail, but embodiments of the present invention do not limit In this.
Seeing Fig. 1 and Fig. 2, the chip package production line of described multicore smart card includes card transport c and along card Package module A, hot pressing module B, chip detection module d and receipts card module e, each mould above-mentioned that sheet conveying direction sets gradually Block is arranged in frame a, and the lower section of frame a is provided with switch board b.Described card transport c include card conveying c-1, Dialling card Timing Belt c-2 and driving group group card actuating unit of card Timing Belt c-2 operating for card of pulling over.
See Fig. 1 and Fig. 2, described hot pressing module B is provided with two groups of hot-press equipment f, between two groups of hot-press equipment f, is provided with use In the rotating mechanism h that card is carried out 180 rotations.Using two groups of hot-press equipment f to be advantageous in that, often group hot-press equipment f is respectively The hot-pressing processing of the chip of responsible card wherein one end, thus improve production efficiency, the often hot-press arrangement g in group hot-press equipment f Quantity can arrange flexibly according to number of chips, the most often in group hot-press equipment f in quantity and card one end of hot-press arrangement g The quantity of chip is identical, and the most each hot-press arrangement g is responsible for the hot-pressing processing of a chip so that each hot-press arrangement g exists Only need to move up and down during work, and without shifting between different chips.The effect of described rotating mechanism h is, works as card After the chip hot-pressing processing of one end, this rotating mechanism h it is carried out 180 ° of rotations, by next group hot-press equipment f to card The chip of the other end of sheet carries out hot-pressing processing.The chip of the card that described chip detection module c machines for detection is read Write function the most normal.
See Fig. 4 and Fig. 5, described package module A and include that chip belt feed mechanism 3, chip blanking mechanism 4 and chip are removed Fortune packaging mechanism 5.Wherein: card conveying 2 is provided with two encapsulation stations, each encapsulation work with package module A corresponding position Clamping sheet positioning mechanism 6 it is provided with at Wei.Described chip belt feed mechanism 3 is two, and each chip belt feed mechanism 3 includes chip belt With chip belt connecting gear;Chip belt in two chip belt feed mechanisms 3 is put down along the direction being perpendicular to card conveying direction 7 Row extends, and the direction of transfer of the chip belt in two chip belt feed mechanisms 3 is contrary;Described chip belt is provided with double core Sheet.Described chip blanking mechanism 4 is two, and each chip blanking mechanism 4 includes blanking die 4-2 and is located at blanking die 4-2 The stamping-out actuator of lower section, arranges two punching 4-21 in each blanking die 4-2;In two chip belt feed mechanisms 3 The lower section of the blanking die 4-2 of two chip belt chip blanking mechanisms 4 the most from which is passed through.
See Fig. 3 and Fig. 5, in multiple chips (the present embodiment is four) of card 1, along the conveying direction of card 1, Two chips being positioned at card 1 front end are the first core assembly sheet 4-1, and two chips being positioned at rear end are the second core assembly sheet 4-2;Described In two encapsulation stations, it is followed successively by the first encapsulation station 2-3 and second encapsulation station 2-4 along card conveying direction 7;Described two In two blanking die 4-2 of individual chip blanking mechanism 4, along card conveying direction 7 be followed successively by the first blanking die 4-22 and Second blanking die 4-23;The chip gone out in described first blanking die 4-22 towards with described first core assembly sheet 4-1's Towards unanimously, the chip gone out in described second blanking die 4-23 towards with described second core assembly sheet 4-2 towards consistent; Described first blanking die 4-22 is arranged at and the first encapsulation station 2-3 corresponding position, and on card conveying direction 7, this is first years old Punching 4-21 on blanking die 4-22 is positioned at and first group of chip package groove 4-3 pair of the card 1 in the first encapsulation station 2-3 Should locate;Described second blanking die 4-23 is arranged at and the second encapsulation station 2-4 corresponding position, and on card conveying direction 7, should Punching 4-21 on second blanking die 4-23 is positioned at and second group of chip package groove of the card 1 in the second encapsulation station 2-4 4-4 corresponding position.
The purpose using such scheme is, allows chip carrying packaging mechanism 5 carry the stroke of chip the shortest during encapsulation, with One progressive raising packaging efficiency.Specifically, owing to the first blanking die 4-22 is positioned at and the first encapsulation station 2-3 corresponding position, and On card conveying direction 7, the punching 4-21 on the first blanking die 4-22 is positioned at and the card 1 in the first encapsulation station 2-3 First group of chip package groove 4-3 corresponding position, therefore when the chip package will gone out in the first blanking die 4-22 to first group During chip package groove 4-3, distance is the shortest;In like manner, by the chip package gone out in the second blanking die 4-23 to the second core assembly sheet During encapsulation groove 4-4, distance is also the shortest, thus improves the speed of encapsulation to greatest extent, improves production efficiency.
Seeing Fig. 8-Figure 14, in each chip blanking mechanism 4, described stamping-out actuator includes die-cut support 4-1, use Seat 4-8 and use is fixed in die-cut bar chip being rushed from chip belt de-die-cut bar 4-10, being used for fixed punch chipping 4-10 Vertical reciprocating die-cut drive mechanism is made in driving die-cut bar to fix seat 4-8;Described die-cut drive mechanism includes driving gas Cylinder 4-3, fork 4-4, driving wheel 4-5 and drive seat 4-6, wherein, the cylinder body 4-31 of described driving cylinder 4-3 is hinged on die-cut On support 4-1, the expansion link 4-32 of this driving cylinder 4-3 is hinged on the lower end of fork 4-4, and the middle part of fork 4-4 is hinged on punching Cutting on support 4-1, the upper end of fork 4-4 connects described driving wheel 4-5 by rotating shaft;Described drive seat 4-6 is provided with driver slot 4-61, described driving wheel 4-5 are arranged in driver slot 4-61, and seat 4-8 fixed by the top of described drive seat 4-6 and described die-cut bar Connect.
Seeing Figure 13 and Figure 15, further, the die-cut bar in two chip blanking mechanisms 4 is fixed seat 4-8 and is mutually pressed close to Arranging, the face of pressing close to that seat 4-8 fixed by two die-cut bars is the inclined plane at an acute angle with card conveying direction 7;Described die-cut bar is solid It is provided with guide post 4-20 between reservation 4-8 and die-cut support 4-1.The purpose using the program is, is guaranteeing that die-cut bar is fixed Having on the premise of enough positions arrange described guide post 4-20 in seat 4-8, seat 4-8 fixed by two die-cut bars of reduction as far as possible (along the card conveying direction 7) length combined, thus allow two blanking die 4-2 arrange near as far as possible, thus When chip carrying packaging mechanism 5, to convert stroke when carrying chip between two blanking die 4-2 shorter, saves further Time.
Seeing Figure 13 and Figure 14, further, two die-cut bars are fixed seat 4-8 and are grouped together into rectangle, two punchings It is 45 ° that chipping fixes the angle pressed close between face and card conveying direction 7 of seat 4-8 so that it is big that seat 4-8 fixed by each die-cut bar Cause triangular in shape, such that it is able to fix corresponding position, tri-turnings of seat 4-8 at the die-cut bar of triangle to be respectively provided with a guide post 4-20, thus make full use of the space that die-cut bar fixes in seat 4-8 and obtain stable guide effect.
Seeing Fig. 8-Figure 14, in said chip blanking mechanism 4, described die-cut support 4-1 includes for fixing blanking die The die holder 4-11 of 4-2, is being provided with chip belt passage with described blanking die 4-2 corresponding position in this die holder 4-11 4-12, described chip belt passes from this chip belt passage 4-12.
Seeing Fig. 8-Figure 14, in said chip blanking mechanism 4, the top of described drive seat 4-6 is provided with "T"-shaped union joint 4- 7, the lower end that seat 4-8 fixed by described die-cut bar is provided with contiguous block 4-9, is provided with and matches with "T"-shaped union joint 4-7 in this connection "T"-shaped link slot 4-91.When connection drive seat 4-6 fixes seat 4-8 with die-cut bar, only described "T"-shaped union joint 4-7 need to be allowed from side Within loading "T"-shaped link slot 4-91, mount and dismount the most very convenient.
See Fig. 8-Figure 14, in said chip blanking mechanism 4, be provided with perpendicular between described drive seat 4-6 and die-cut support 4-1 To guiding mechanism, this vertical guiding mechanism includes the guide rail 4-30 being located on die-cut support 4-1 and is located in drive seat 4-6 The slide block 4-40 matched with described guide rail 4-30, for guiding vertical reciprocating motion of drive seat 4-6.
Seeing Fig. 4-Fig. 7, in described chip belt feed mechanism 3, described chip belt connecting gear is received by unused chip belt Rolling wheel 3-4, use chip belt winding wheel 3-5, traction electric machine 3-1, traction wheel 3-2 and chip belt guide rail 3-3 etc. are constituted, its In, the main shaft of described traction wheel 3-2 and traction electric machine 3-1 is connected, and the traction electric machine 3-1 in two chip belt feed mechanisms 3 sets It is placed in the not homonymy of card conveying 2.The further embodiment of said chip band feed mechanism 3 is referred to prior art Implement.
Seeing Figure 15-Figure 17, described clamping sheet positioning mechanism includes locating support 6-4, location bar 6-6 and determines for driving Position bar 6-6 clamps or unclamps the positioning power mechanism of card 1, and wherein, described location bar 6-6 is three, these three location bar 6-6 It is respectively arranged at three side corresponding positions of card 1;Described positioning power mechanism includes that Locating driver cylinder 6-1, location promote Seat 6-2, three locating rotation block 6-5 and three back-moving spring 6-7, wherein, the expansion link of described Locating driver cylinder 6-1 is even Being connected to described location and promote the bottom of seat 6-2, described location promotes the top of seat 6-2 to be provided with three location pushing rolling wheels 6-3;Institute State three locating rotation block 6-5 to be rotationally connected with on locating support 6-4, one end of each locating rotation block 6-5 and one of them Location bar 6-6 is fixing to be connected, and the bottom surface of the other end is adjacent to the periphery of one of them location pushing rolling wheels 6-3;Described three In back-moving spring 6-7, one end of each back-moving spring is connected in one of them locating rotation block 6-5 and location pushing rolling wheels One end that 6-3 is connected, the other end is connected to described location and promotes on seat 6-2.
Seeing Figure 15-Figure 17, the operation principle of above-mentioned clamping sheet positioning mechanism is: described positioning power mechanism urges during work Three location bar 6-6 swing and realize the clamping to card 1 and unclamp;Specifically, as the expansion link 4-32 of Locating driver cylinder 6-1 When protruding upward, seat 6-2 and location pushing rolling wheels 6-3 is promoted to promote locating rotation block 6-5 to turn around this location by location Run-on point between motion block 6-5 and locating support 6-4 rotates, fix with locating rotation block 6-5 the location bar 6-6 that is connected towards away from The direction motion at card 1 edge, the end face of final three location bar 6-6 is positioned at position, below card 1 bottom surface so that card 1 can To properly enter or to leave encapsulation station;And when the expansion link 4-32 of Locating driver cylinder 6-1 retracts downwards, described multiple Under the pullling of position spring 6-7, three location bar 6-6, towards the direction motion near card 1 edge, are finally clamped in the three of card 1 On individual side, the another one side of card 1 is then near on the side of card conveying 2, it is achieved the clamping to card 1 And location.
See Figure 14-Figure 17, further, in three location bar 6-6 of each clamping sheet positioning mechanism, be positioned at two envelopes Positioning bar 6-61 on the basis of location bar 6-6 between dress station, other two location bar 6-6 is clamping and positioning bar 6-62, and blocks The side of sheet conveying 2 constitutes another positioning reference plane of card 1.It is to say, it is corresponding at the first encapsulation station 2-3 In clamping sheet positioning mechanism, on the basis of the location bar 6-6 of the first core assembly sheet 4-1 of card 1, position bar 6-61, in the second encapsulation In the clamping sheet positioning mechanism that station 2-4 is corresponding, on the basis of the location bar 6-6 of the second core assembly sheet 4-2 of card 1, position bar 6- 61.So arrange and be advantageous in that: the position reference on card 1 of the first core assembly sheet 4-1 in card 1 is for carrying along card The front side edge edge in direction 7, in the first clamping sheet positioning mechanism corresponding for encapsulation station 2-3, correspondingly will be with this front side edge along right The location bar 6-6 answered is arranged to origin reference location bar 6-61, two datum coincidences;In like manner, the second core assembly sheet 4-2 in card is at card Position reference on 1 is the back side edge edge along card conveying direction 7, in the second card localization machine corresponding for encapsulation station 2-4 In structure, correspondingly will be arranged to origin reference location bar 6-61, two datum coincidences with this back side edge along corresponding location bar 6-6;Thus Target location when the chip carrying packaging mechanism 5 that said reference calculates carries chip can encapsulate groove with card chips Physical location more identical, thus improve the precision of chip package.
Seeing Fig. 4, described chip carrying packaging mechanism 5 includes encapsulating suction nozzle 5-1, for driving encapsulation suction nozzle 5-1 along Z axis Z axis drive mechanism 5-2 that direction is moved, for X-axis drive mechanism 5-3 driving Z axis drive mechanism 5-2 to move along X-direction And Y-axis drive mechanism 5-4 that driving X-axis drive mechanism 5-3 moves along Y direction, described encapsulation suction nozzle 5-1 and negative pressure device Connecting, this encapsulation suction nozzle 5-1 is connected with Z axis drive mechanism 5-2 by connecting assembly 5-5.Said chip carrying packaging mechanism 5 Further embodiment can refer to prior art and implements.
Seeing Fig. 6, described card conveying 2 is provided with through hole 2-4, institute in the local corresponding position passed through with described chip belt State chip belt and passed through card conveying 2 by this through hole 2-4;Described card conveying 2 with the long edge position being positioned at card 1 Bar 6-6 corresponding position, location be provided with avoiding hollow groove 2-1 so that described location bar 6-6 can be movable from this empty avoiding height groove, thus right The long limit of card 1 is clamped or unclamps.
Seeing Fig. 2-Figure 17, the operation principle of said chip packaging system is: the chip in two chip belt feed mechanisms 3 Tape transport drives corresponding chip belt to move, and is gone out by the chip on chip belt by chip blanking mechanism 4;Each chip Blanking mechanism 4 once goes out two chips, owing to the direction of transfer of two chip belts is contrary, and therefore two chip blanking mechanisms 4 Chip towards difference 180 °, the core assembly sheet that two chips of each chip blanking mechanism 4 are just to be packaged with card 1 Towards unanimously.Card 1 to be packaged is first fed in first encapsulation station along card conveying 2, carries out first group The encapsulation of chip 4-1, two chips gone out in the first blanking die 4-22 are transported to card 1 by chip carrying packaging mechanism 5 Place is also encapsulated in the first core assembly sheet 4-1 groove;Then, during card 1 is transported to the second encapsulation station 2-3, the second core assembly sheet is carried out The encapsulation of 4-2, two chips gone out in the second blanking die 4-23 are transported at card 1 also by chip carrying packaging mechanism 5 It is encapsulated in the second core assembly sheet 4-2 groove, so far completes the encapsulation of four chips on card 1.
The work process of the chip package production line of the multicore smart card of the present invention is:
In package module A, card by Timing Belt dial mechanism for card along card conveying c-1 with step mode to Front conveying, arrives first in encapsulation station and is packaged, and the process of encapsulation is: the chip belt in two chip belt feed mechanisms passes Send mechanism to drive corresponding chip belt to move, and by chip blanking mechanism, the chip on chip belt is gone out;Due to two chips The direction of transfer of band is contrary, therefore the chip of two chip blanking mechanisms towards difference 180 °, each chip blanking mechanism rushes The chip gone out a core assembly sheet just to be packaged with card is towards consistent.Card to be packaged is along card conveying c-1 Being first fed in first encapsulation station, carry out the encapsulation of the first core assembly sheet, two chips are rushed by chip carrying packaging mechanism Cut out in the chip gone out of mechanism with being transported at card towards identical chip and be encapsulated into first group of described first core assembly sheet In chip slot;Then, during card is transported to second encapsulation station, the encapsulation of the second core assembly sheet, chip carrying packaging machine are carried out With being transported at card towards identical chip and seal of described second core assembly sheet in the chip that chip blanking mechanism is gone out by structure Install to, in the second core assembly film trap, so far complete the encapsulation of multiple chips on card.
The card having encapsulated chip continues to be fed forward to hot pressing station, hot pressing module B carry out the chip on card Compress and heating so that the gum on chip is bonded together with card;Finally complete the card of processing through chip detection mould Block d detects, and is finally transported to receive in card module e and collects.
Above-mentioned for the present invention preferably embodiment, but embodiments of the present invention are not limited by foregoing, its The change made under his any spirit without departing from the present invention and principle, modify, substitute, combine, simplify, all should be The substitute mode of effect, within being included in protection scope of the present invention.

Claims (8)

1. the chip package production line of a multicore smart card, it is characterised in that include card transport and along card Package module, hot pressing module, chip detection module and the receipts card module that conveying direction sets gradually;
Described package module includes chip belt feed mechanism, chip blanking mechanism and chip carrying packaging mechanism;Wherein, encapsulation Module is provided with two encapsulation stations, is provided with clamping sheet positioning mechanism at each encapsulation station;Described chip belt feed mechanism is two, Each chip belt feed mechanism includes chip belt and chip belt connecting gear;Chip belt in two chip belt feed mechanisms along The direction being perpendicular to card conveying direction extends in parallel, and the direction of transfer phase of the chip belt in two chip belt feed mechanisms Instead;Described chip blanking mechanism is two, and each chip blanking mechanism includes blanking die and is located at rushing below blanking die Cut out actuator;The blanking die of two chip belts chip blanking mechanism the most from which in two chip belt feed mechanisms The lower section of tool is passed through.
Multicore intelligent card chip packing producing line the most according to claim 1, it is characterised in that described hot pressing module is provided with Two groups of hot-press equipments, are provided with the rotating mechanism for card carries out 180 rotations between two groups of hot-press equipments.
Multicore intelligent card chip packing producing line the most according to claim 1, it is characterised in that at multiple chips of card In, along the conveying direction of card, the chip being positioned at card front end is the first core assembly sheet, and the chip being positioned at rear end is the second core assembly Sheet;In said two encapsulation station, it is followed successively by the first encapsulation station and the second encapsulation station along card conveying direction;Described two In two blanking dies of individual chip blanking mechanism, it is followed successively by the first blanking die and the second blanking die along card conveying direction Tool;The chip gone out in described first blanking die towards with described first core assembly sheet towards consistent, described second stamping-out The chip gone out in mould towards with described second core assembly sheet towards consistent;Described first blanking die is arranged at and first Encapsulation station corresponding position, and on card conveying direction, the punching on this first blanking die is positioned at and encapsulates in station with first First group of chip package groove corresponding position of card;Described second blanking die is arranged at and the second encapsulation station corresponding position, and On card conveying direction, the punching on this second blanking die is positioned at and the second core assembly sheet of the card in the second encapsulation station Encapsulation groove corresponding position.
Multicore intelligent card chip packing producing line the most according to claim 3, it is characterised in that at each chip clicker press machine In structure, described stamping-out actuator includes die-cut support, for chip rushing from chip belt de-die-cut bar, being used for fixed punch The die-cut bar of chipping is fixed seat and makees vertical reciprocating die-cut drive mechanism for driving die-cut bar to fix seat;Described punching Cutting drive mechanism to include driving cylinder, fork, driving wheel and drive seat, wherein, the cylinder body of described driving cylinder is hinged on punching Cutting on support, the expansion link of this driving cylinder is hinged on the lower end of fork, and the middle part of fork is hinged on die-cut support, fork Upper end connects described driving wheel by rotating shaft;Being provided with driver slot in described drive seat, described driving wheel is arranged in driver slot, institute State the top of drive seat to fix seat with described die-cut bar and be connected.
Multicore intelligent card chip packing producing line the most according to claim 1, it is characterised in that two chip blanking mechanisms In die-cut bar fix seat and mutually press close to arrange, the face of pressing close to that seat fixed by two die-cut bars is at an acute angle with card conveying direction Inclined plane;Described die-cut bar is fixed and is provided with guide post between seat and die-cut support.
Multicore intelligent card chip packing producing line the most according to claim 5, it is characterised in that seat fixed by two die-cut bars Being grouped together into rectangle, the angle pressed close between face and card conveying direction that seat fixed by two die-cut bars is 45 °.
Multicore intelligent card chip packing producing line the most according to claim 1, it is characterised in that supply at described chip belt In mechanism, described chip belt connecting gear includes unused chip belt winding wheel, with chip belt winding wheel, traction electric machine, traction Wheel and chip belt guide rail, wherein, described traction wheel is connected with the main shaft of traction electric machine, leading in two chip belt feed mechanisms Draw motor and be arranged at the not homonymy of card conveying.
Multicore intelligent card chip packing producing line the most according to claim 1, it is characterised in that described chip carrying encapsulation Mechanism includes encapsulating suction nozzle, for the Z axis drive mechanism driving encapsulation suction nozzle to move along Z-direction, for driving Z axis to drive machine X-axis drive mechanism that structure moves along X-direction and drive the Y-axis drive mechanism that X-axis drive mechanism moves, institute along Y direction State encapsulation suction nozzle to be connected with negative pressure device.
CN201610900479.3A 2016-10-15 2016-10-15 Chip package production line of multichip intelligent card Pending CN106328566A (en)

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Application Number Priority Date Filing Date Title
CN201610900479.3A CN106328566A (en) 2016-10-15 2016-10-15 Chip package production line of multichip intelligent card

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Application Number Priority Date Filing Date Title
CN201610900479.3A CN106328566A (en) 2016-10-15 2016-10-15 Chip package production line of multichip intelligent card

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108962799A (en) * 2018-09-01 2018-12-07 温州市科泓机器人科技有限公司 Ultraprecise chip manufacturing assembly line
CN110164799A (en) * 2019-05-31 2019-08-23 吉林建筑大学 A kind of positioning package mechanism and method based on Controlled by micro computer

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108962799A (en) * 2018-09-01 2018-12-07 温州市科泓机器人科技有限公司 Ultraprecise chip manufacturing assembly line
CN110164799A (en) * 2019-05-31 2019-08-23 吉林建筑大学 A kind of positioning package mechanism and method based on Controlled by micro computer

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