CN206340522U - A kind of chip package production line of multicore smart card - Google Patents

A kind of chip package production line of multicore smart card Download PDF

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Publication number
CN206340522U
CN206340522U CN201621126520.8U CN201621126520U CN206340522U CN 206340522 U CN206340522 U CN 206340522U CN 201621126520 U CN201621126520 U CN 201621126520U CN 206340522 U CN206340522 U CN 206340522U
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China
Prior art keywords
chip
card
punching
encapsulation
blanking
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CN201621126520.8U
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Chinese (zh)
Inventor
王开来
房训军
李南彪
赖汉进
胡军连
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Guangzhou Mingsen Hexing Technology Co., Ltd.
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Guangzhou Mingsen Technologies Co Ltd
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Priority to CN201621126520.8U priority Critical patent/CN206340522U/en
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Abstract

The utility model discloses a kind of chip package production line of multicore smart card, including card transport and set gradually along card conveying direction package module, hot pressing module, chip detection module and receive card module;The package module includes chip belt feed mechanism, chip blanking mechanism and chip and carries packaging mechanism;Wherein, package module is provided with two encapsulation stations, and each encapsulate is provided with clamping sheet positioning mechanism at station;The chip belt feed mechanism is two, and each chip belt feed mechanism includes chip belt and chip tape transport;Chip belt in two chip belt feed mechanisms is extended in parallel along perpendicular to the direction of card conveying direction, and the direction of transfer of the chip belt in two chip belt feed mechanisms is opposite.The encapsulation that the equipment is not only suitable for single-chip card is fixed, and the encapsulation for being also applied for multi-chip card is fixed, and fast with encapsulation and hot pressing fixed speed, production efficiency is high, high precision the advantages of.

Description

A kind of chip package production line of multicore smart card
Technical field
The utility model is related to smart card manufacturing equipment, and in particular to a kind of chip package production line of multicore smart card.
Background technology
, it is necessary to encapsulate chip into card in contact intelligent card production process.During encapsulating chip, need first Chip is transported on corresponding card chip slot and encapsulated, then carries out compressing heating fixation, therefore the packing producing line of card It is broadly divided into package module and hot pressing module.
Provided with a chip in common every card of smart card, but also there is part card to be provided with multiple chips, example Such as two chips, four chips.Chip in these multi-chip cards is divided into the two ends that two parts are arranged on card, positioned at not It is opposite with the direction of the chip at end (in four angles of chip, to have and hypotenuse is provided with an angle, the position of hypotenuse is different, chip Towards different, referring to Fig. 1), and positioned at consistent with the direction of the chip in one end.Chip positioned at card wherein one end is referred to as One group of chip, is referred to as second group of chip positioned at the chip of the card other end;Direction of the two groups of chip in card differs 180 °.Envelope It is punched from chip belt by chip before dress by chip blanking mechanism, the direction of these chips being punched it is consistent and Immobilize, being transported to encapsulation station by chip carrying mechanism during encapsulation is encapsulated into the chip slot of card.
The deficiency that existing multicore Intelligent card package production line is present is:
Package module is generally used for being packaged single-chip card in existing Intelligent card package production line, when for many , it is necessary to carry out 180 ° of rotations to card or 180 ° of rotations are carried out to chip during the encapsulation of chip card, second group of core could be protected Piece can be transported in the chip slot of card exactly;Due to needing rotary chip or card in handling process, on the one hand, so that Transporting velocity is slow, low production efficiency, on the other hand, easily the encapsulation precision of influence chip.
Utility model content
The purpose of this utility model is to overcome the deficiencies in the prior art to be given birth to there is provided a kind of chip package of multicore smart card Producing line, the production line can be continuously completed the encapsulation process of chip on a production line, and be not only suitable for single-chip card The encapsulation of piece, is also applied for the encapsulation of multi-chip card, when the encapsulation for carrying out multi-chip card, with package speed It hurry up, the advantages of production efficiency is high, encapsulation precision is high.
The purpose of this utility model is realized by following technical scheme:
A kind of chip package production line of multicore smart card, including card transport and along card conveying direction according to Package module, hot pressing module, chip detection module and the receipts card module of secondary setting;
The package module includes chip belt feed mechanism, chip blanking mechanism and chip and carries packaging mechanism;Wherein, Package module is provided with clamping sheet positioning mechanism provided with two encapsulation stations, each encapsulate at station;The chip belt feed mechanism is Two, each chip belt feed mechanism includes chip belt and chip tape transport;Chip in two chip belt feed mechanisms Band is extended in parallel along perpendicular to the direction of card conveying direction, and the sender of the chip belt in two chip belt feed mechanisms To opposite;The chip blanking mechanism is two, and each chip blanking mechanism includes blanking die and is located at below blanking die Punching executing agency;Chip blanking mechanism is rushed therefrom respectively for two chip belts in two chip belt feed mechanisms Cut out and pass through below mould.
The course of work of the chip package production line of above-mentioned multicore smart card is:
In package module, card by Timing Belt dial mechanism for card along card conveying in the way of batch (-type) it is defeated forward Send, arrive first at and be packaged in encapsulation station, the process of encapsulation is:Chip belt conveyor in two chip belt feed mechanisms Structure drives corresponding chip Tape movement, and is gone out the chip on chip belt by chip blanking mechanism;Due to two chip belts Direction of transfer on the contrary, therefore the chip of two chip blanking mechanisms direction differ 180 °, what each chip blanking mechanism was gone out Chip is just with one group of chip to be packaged in card towards unanimously.Card to be packaged is first fed into along card conveying Into first encapsulation station, the encapsulation of first group of chip is carried out, chip carries packaging mechanism and rushes two chip blanking mechanisms It is transported at card and is encapsulated into first group of chip slot towards identical chip with first group of chip in the chip gone out; Then card is transported in second encapsulation station, carries out the encapsulation of second group of chip, and chip carries packaging mechanism by chip It is transported to towards identical chip at card with second group of chip in the chip that blanking mechanism is gone out and is encapsulated into second In group chip slot, the encapsulation of multiple chips on card is so far completed.
The card for having encapsulated chip continues to be fed forward to hot pressing station, and the chip on card is pressed by hot pressing module Tight and heating so that the gum on chip is bonded together with card;The card for finally completing processing passes through chip detection module Detected, be finally transported in receipts card module and collect.
A preferred scheme of the present utility model, wherein, provided with two groups of hot-press equipments in the hot pressing module, two groups of heat The rotating mechanisms for being used for that 180 rotations to be carried out to card are provided between pressure equipment.It is advantageous in that using two groups of hot-press equipments, every group Hot-press equipment is each responsible for the hot-pressing processing of the chip of card wherein one end, so that production efficiency is improved, in every group of hot-press equipment The quantity of hot-press arrangement can flexibly be set according to number of chips, the quantity and card of hot-press arrangement in usual every group of hot-press equipment The quantity of piece one end chips is identical, that is, each hot-press arrangement is responsible for the hot-pressing processing of a chip so that each hot pressing Device operationally need to only move up and down, without being shifted between different chips.The effect of the rotating mechanism is, when After the chip hot-pressing processing of card one end finishes, 180 ° of rotations are carried out to it by the rotating mechanism, by next group of hot-press equipment to card The chip of the other end of piece carries out hot-pressing processing.
A preferred scheme of the present utility model, wherein, in multiple chips of card, along the conveying direction of card, Chip positioned at card front end is first group of chip, and the chip positioned at rear end is second group of chip;In described two encapsulation stations, The first encapsulation station and the second encapsulation station are followed successively by along card conveying direction;Two punchings of described two chip blanking mechanisms Cut out in mould, the first blanking die and the second blanking die are followed successively by along card conveying direction;In first blanking die The direction for the chip gone out is consistent with the direction of first group of chip, the direction for the chip gone out in second blanking die It is consistent with the direction of second group of chip;First blanking die is arranged at encapsulates station corresponding position with first, and in card On piece conveying direction, the punching on first blanking die is located at first group of chip package with the card in the first encapsulation station Groove corresponding position;Second blanking die is arranged at encapsulates station corresponding position with second, and on card conveying direction, this second Punching on blanking die is located at second group of chip package groove corresponding position with the card in the second encapsulation station.
Purpose using above-mentioned preferred scheme is to allow chip to carry packaging mechanism during encapsulation to carry the stroke of chip most It is short, further to improve packaging efficiency.Specifically, due to the first blanking die be located at the first encapsulation station corresponding position, and On card conveying direction, the punching on the first blanking die is located at first group of chip package with the card in the first encapsulation station Groove corresponding position, therefore when the chip package that will be gone out in the first blanking die is to first group of chip package groove, distance is most short;Together Reason, during by the chip package gone out in the second blanking die to second group of chip package groove, distance is also most short, so that maximum limit Degree ground improves the speed of encapsulation, improves production efficiency.
A preferred scheme of the present utility model, wherein, in each chip blanking mechanism, punching executing agency bag Include punching support, for chip rush from chip belt it is de- be punched bar, the punching bar fixed seat for fixed punch chipping and For driving punching bar fixed seat to make vertical reciprocating punching drive mechanism;The punching drive mechanism includes driving gas Cylinder, swing rod, driving wheel and driving seat, wherein, the cylinder body of the drive cylinder is hinged on punching support, the drive cylinder Expansion link, which is hinged in the middle part of the lower end of swing rod, swing rod, to be hinged on punching support, and the upper end of swing rod connects described by rotating shaft Driving wheel;Driver slot is provided with the driving seat, the driving wheel is arranged in driver slot, the top of the driving seat with it is described It is punched the connection of bar fixed seat.
The operation principle of above-mentioned punching executing agency is:During work, punching drive mechanism driving punching bar fixed seat and Punching bar pumps, and when punching bar is moved upwards, the chip on chip belt is rushed into de-, the upper end shape of the punching bar Shape is consistent with the punching in blanking die, and the chip form gone out is consistent with punching and in punching;The punching driving In mechanism, when the expansion link of drive cylinder stretches out, promote swing rod to be rotated around the tie point with being punched support, the upper end of swing rod to Upper driving, the driving wheel of swing rod upper end is moved upwards by driver slot driving punching bar fixed seat, and stretching when drive cylinder When bar is retracted, correspondingly it is punched bar fixed seat and moves downward.
Preferably, the punching bar fixed seat in two chip blanking mechanisms mutually presses close to set, two punching bar fixed seats Press close to face for the inclined plane at an acute angle with card conveying direction;Provided with guiding between the punching bar fixed seat and punching support Bar.It is ensuring to be punched in bar fixed seat there is enough positions to set the guide post using the purpose of the preferred scheme On the premise of, reduce (along card conveying direction) length for combining of two punching bar fixed seats as far as possible, so as to allow two It is as near as possible that individual blanking die is set, so as to be carried when chip carrying packaging mechanism is converted between two blanking dies Stroke during chip is shorter, further saves the time.
One scheme more optimized of above-mentioned punching bar fixed seat is that two punching bar fixed seats are grouped together into square Shape, the angle pressed close between face and card conveying direction of two punching bar fixed seats is 45 ° so that each punching bar fixed seat It is roughly triangular, so as to three turnings of punching bar fixed seat corresponding position in triangle, one guide post is set respectively, So as to make full use of the space in punching bar fixed seat to obtain stable guide effect.
In said chip blanking mechanism, the punching support includes the die holder for being used to fix blanking die, the mould Have in fixed seat and be provided with chip tape channel with the blanking die corresponding position, the chip belt is worn from the chip tape channel Cross.
A preferred scheme of the present utility model, wherein, in the chip belt feed mechanism, the chip belt conveyor Structure includes unused chip belt winding wheel, uses chip belt winding wheel, traction electric machine, traction wheel and chip belt guide rail, wherein, institute The main shaft for stating traction wheel and traction electric machine is connected, and the traction electric machine in two chip belt feed mechanisms is arranged at card conveying Not homonymy.
A preferred scheme of the present utility model, wherein, the chip, which carries packaging mechanism, includes encapsulation suction nozzle, for driving It is dynamic to encapsulate Z axis drive mechanism, the X-axis drive for driving Z axis drive mechanism to be moved along X-direction that suction nozzle is moved along Z-direction The Y-axis drive mechanism that motivation structure and driving X-axis drive mechanism are moved along Y direction, the encapsulation suction nozzle connects with negative pressure device Connect.
The utility model has following beneficial effect compared with prior art:
1st, in package module, two are allowed by setting two chip belt feed mechanisms and two chip blanking mechanisms, and The conveying direction of chip belt is opposite so that the direction for the chip that two chip blanking mechanisms are gone out respectively with first group on card The direction of chip and second group of chip is consistent, so by chip package into chip slot during without be revolved to chip Turn, not only save packaging time, improve package speed and efficiency, and avoid the cumulative errors that chip rotational band is come so that The encapsulation precision of chip is also improved.
2nd, by setting two encapsulation stations, the first group of chip and second group of chip allowed in card is respectively in different encapsulation Encapsulation is completed in station, chip can be reduced and carry stroke of the packaging mechanism in chip processes are carried, when equally saving encapsulation Between, improve package speed and efficiency.
3rd, it can be used not only for carrying out chip package to multi-chip card, can be used for carrying out chip to single-chip card Encapsulation.
Brief description of the drawings
Fig. 1 shows for the structure of an embodiment of the chip package production line of multicore smart card of the present utility model It is intended to.
Fig. 2 is the structural representation of Fig. 1 chips packing producing line main parts.
Fig. 3 is the structural representation of four cores smart card described in the utility model.
Fig. 4 is the dimensional structure diagram of package module in Fig. 2.
Fig. 5-Fig. 7 is the structural representation of removing chip carrying packaging mechanism in package module shown in Fig. 4, wherein, Fig. 5 is Front view, Fig. 6 is upward view, and Fig. 7 is stereogram.
Fig. 8 is the dimensional structure diagram of package module chips blanking mechanism shown in Fig. 4.
Fig. 9-Figure 11 is the structural representation of punching drive mechanism in chip blanking mechanism shown in Fig. 8, wherein, based on Fig. 9 View, Figure 10 is Fig. 9 A-A sectional views, and Figure 11 is stereogram.
Figure 12 is blanking die, punching bar and the stereochemical structure for being punched bar fixed seat in chip blanking mechanism shown in Fig. 8 Schematic diagram.
Figure 13 and Figure 14 is punching bar and the structural representation of punching bar fixed seat in chip blanking mechanism shown in Fig. 8, its In, Figure 13 is front view, and Figure 14 is stereogram.
Figure 15 and Figure 16 is the structural scheme of mechanism of clamping sheet positioning mechanism in chip encapsulation module shown in Fig. 4, wherein, Tu15Wei Front view, Figure 16 is stereogram.
Figure 17 is positioning pusher seat and the stereochemical structure of positioning pushing rolling wheels in clamping sheet positioning mechanism shown in Figure 15 and Figure 16 Schematic diagram.
Embodiment
The utility model is described in further detail with reference to embodiment and accompanying drawing, but implementation of the present utility model Mode not limited to this.
Referring to Fig. 1 and Fig. 2, the chip package production line of the multicore smart card includes card transport c and along card Package module A, hot pressing module B, chip detection module d and receipts card module e that piece conveying direction is set gradually, each above-mentioned mould Block is arranged on frame a, and frame a lower section is provided with switch board b.The card transport c include card conveying c-1, Group card actuating unit for dialling card Timing Belt c-2 and driving group card Timing Belt c-2 operatings for card of pulling over.
It is provided with and is provided between two groups of hot-press equipments f, two groups of hot-press equipment f referring to Fig. 1 and Fig. 2, in the hot pressing module B Rotating mechanism h for carrying out 180 rotations to card.It is advantageous in that using two groups of hot-press equipment f, every group of f points of hot-press equipment Not Fu Ze card wherein one end chip hot-pressing processing, so as to improve production efficiency, the hot-press arrangement in every group of hot-press equipment f G quantity can flexibly be set according to number of chips, hot-press arrangement g quantity and card one end in usual every group of hot-press equipment f The quantity of chips is identical, that is, each hot-press arrangement g is responsible for the hot-pressing processing of a chip so that each hot-press arrangement g Operationally it need to only move up and down, without being shifted between different chips.The effect of the rotating mechanism h is to work as card After the chip hot-pressing processing of piece one end is finished, 180 ° of rotations are carried out to it by rotating mechanism h, by next group of f pairs of hot-press equipment The chip of the other end of card carries out hot-pressing processing.The chip detection module c is used for the chip for detecting the card machined Whether read-write capability is normal.
Referring to Fig. 4 and Fig. 5, the package module A includes chip belt feed mechanism 3, chip blanking mechanism 4 and chip Carry packaging mechanism 5.Wherein:With package module A corresponding positions provided with two encapsulation stations, each encapsulation in card conveying 2 Clamping sheet positioning mechanism 6 is provided with station.The chip belt feed mechanism 3 is two, and each chip belt feed mechanism 3 includes chip Band and chip tape transport;Chip belt in two chip belt feed mechanisms 3 is along the direction perpendicular to card conveying direction 7 Extend in parallel, and the direction of transfer of the chip belt in two chip belt feed mechanisms 3 is opposite;It is provided with the chip belt double Chip.The chip blanking mechanism 4 is two, and each chip blanking mechanism 4 includes blanking die 4-2 and is located at blanking die Two punching 4-21 are set in the punching executing agency below 4-2, each blanking die 4-2;In two chip belt feed mechanisms 3 Two chip belts pass through therefrom below the blanking die 4-2 of a chip blanking mechanism 4 respectively.
Referring to Fig. 3 and Fig. 5, in multiple chips (the present embodiment is four) of card 1, along the conveying side of card 1 To two chips positioned at the front end of card 1 are first group of chip 4-1, and two chips positioned at rear end are second group of chip 4-2; In described two encapsulation stations, the encapsulation stations of the first encapsulation station 2-3 and second 2-4 is followed successively by along card conveying direction 7;Institute In two blanking die 4-2 for stating two chip blanking mechanisms 4, the first blanking die 4- is followed successively by along card conveying direction 7 The 22 and second blanking die 4-23;The direction for the chip gone out in the first blanking die 4-22 and first group of chip 4- 1 direction is consistent, the direction for the chip gone out in the second blanking die 4-23 and the direction one of second group of chip 4-2 Cause;The first blanking die 4-22 is arranged at encapsulates station 2-3 corresponding positions with first, and on card conveying direction 7, should Punching 4-21 on first blanking die 4-22 is located at first group of chip package groove with the card 1 in the first encapsulation station 2-3 4-3 corresponding positions;The second blanking die 4-23 is arranged at encapsulates station 2-4 corresponding positions with second, and in card conveying direction On 7, the punching 4-21 on second blanking die 4-23 is located at second group of chip with the card 1 in the second encapsulation station 2-4 Encapsulate groove 4-4 corresponding positions.
It is to allow the stroke of the chip carrying carrying chip of packaging mechanism 5 most short during encapsulation using the purpose of such scheme, with One progress improves packaging efficiency.Specifically, station 2-3 corresponding positions are encapsulated with first because the first blanking die 4-22 is located at, and On card conveying direction 7, the punching 4-21 on the first blanking die 4-22 is located at and the card 1 in the first encapsulation station 2-3 First group of chip package groove 4-3 corresponding position, therefore when will the chip package that be gone out in the first blanking die 4-22 to first group During chip package groove 4-3, distance is most short;Similarly, by the chip package gone out in the second blanking die 4-23 to second group of chip When encapsulating groove 4-4, distance is also most short, so as to improve the speed of encapsulation to greatest extent, improves production efficiency.
Referring to Fig. 8-Figure 14, in each chip blanking mechanism 4, the punching executing agency includes punching support 4-1, used In chip to be rushed to de- punching bar 4-10, punching bar fixed seat 4-8 and use for fixed punch chipping 4-10 from chip belt Make vertical reciprocating punching drive mechanism in driving punching bar fixed seat 4-8;The punching drive mechanism includes driving gas Cylinder 4-3, swing rod 4-4, driving wheel 4-5 and driving seat 4-6, wherein, the cylinder body 4-31 of the drive cylinder 4-3 is hinged on punching On support 4-1, drive cylinder 4-3 expansion link 4-32, which is hinged in the middle part of swing rod 4-4 lower end, swing rod 4-4, is hinged on punching Cut on support 4-1, swing rod 4-4 upper end connects the driving wheel 4-5 by rotating shaft;Driver slot is provided with the driving seat 4-6 4-61, the driving wheel 4-5 is arranged in driver slot 4-61, the top of the driving seat 4-6 and the punching bar fixed seat 4-8 Connection.
Referring to Figure 13 and Figure 15, further, the punching bar fixed seat 4-8 in two chip blanking mechanisms 4 mutually presses close to Set, two punching bar fixed seat 4-8 face of pressing close to is the inclined plane at an acute angle with card conveying direction 7;The punching bar is consolidated Guide post 4-20 is provided between reservation 4-8 and punching support 4-1.It is to ensure that being punched bar fixes using the purpose of the program On the premise of there is enough position setting guide post 4-20 in seat 4-8, reduce two punching bar fixed seat 4- as far as possible 8 (along card conveying direction 7) length combined, so that allow two blanking die 4-2 set is as near as possible, from And when chip, to carry the stroke that is converted between two blanking die 4-2 when carrying chip of packaging mechanism 5 shorter, further The saving time.
Referring to Figure 13 and Figure 14, further, two punching bar fixed seat 4-8 are grouped together into rectangle, two punchings The chipping fixed seat 4-8 angle pressed close between face and card conveying direction 7 is 45 ° so that each punching bar fixed seat 4-8 is big Cause is triangular in shape, and a guide post is set respectively so as to punching tri- turnings of bar fixed seat 4-8 corresponding position in triangle 4-20, so as to make full use of the space in punching bar fixed seat 4-8 to obtain stable guide effect.
Referring to Fig. 8-Figure 14, in said chip blanking mechanism 4, the punching support 4-1 includes being used to fix blanking die In 4-2 die holder 4-11, the die holder 4-11 chip band logical is being provided with the blanking die 4-2 corresponding positions Road 4-12, the chip belt is passed through from the 4-12 of the chip tape channel.
Referring to Fig. 8-Figure 14, in said chip blanking mechanism 4, the top of the driving seat 4-6 is provided with "T"-shaped connector 4- 7, the lower end of the punching bar fixed seat 4-8 is provided with contiguous block 4-9, is provided with what is matched with "T"-shaped connector 4-7 in the connection "T"-shaped link slot 4-91.During connection driving seat 4-6 and punching bar fixed seat 4-8, the "T"-shaped connector 4-7 need to be only allowed from side To loading in "T"-shaped link slot 4-91, mount and dismount all very convenient.
Referring to Fig. 8-Figure 14, in said chip blanking mechanism 4, it is provided between the driving seat 4-6 and punching support 4-1 Vertical guiding mechanism, the vertical guiding mechanism includes the guide rail 4-30 being located on punching support 4-1 and is located at driving seat 4-6 On the sliding block 4-40 matched with the guide rail 4-30, for drive seat 4-6 vertical reciprocating motion be oriented to.
Referring to Fig. 4-Fig. 7, in the chip belt feed mechanism 3, the chip tape transport is received by unused chip belt Rolling wheel 3-4, use chip belt winding wheel 3-5, traction electric machine 3-1, traction wheel 3-2 and chip belt guide rail 3-3 etc. are constituted, its In, the traction wheel 3-2 is connected with traction electric machine 3-1 main shaft, and the traction electric machine 3-1 in two chip belt feed mechanisms 3 is set It is placed in the not homonymy of card conveying 2.Further embodiment of the said chip with feed mechanism 3 is referred to prior art To implement.
Referring to Figure 15-Figure 17, the clamping sheet positioning mechanism includes locating support 6-4, locating rod 6-6 and fixed for driving Position bar 6-6 clamps or unclamped the positioning power mechanism of card 1, wherein, the locating rod 6-6 is three, these three locating rods 6-6 It is respectively arranged at three sides corresponding position of card 1;The positioning power mechanism includes Locating driver cylinder 6-1, positioning and promoted Seat 6-2, three locating rotation block 6-5 and three back-moving spring 6-7, wherein, the expansion link of the Locating driver cylinder 6-1 connects The bottom of the positioning pusher seat 6-2 is connected to, the top of the positioning pusher seat 6-2 is provided with three positioning pushing rolling wheels 6-3;Institute Three locating rotation block 6-5 are stated to be rotationally connected with locating support 6-4, each locating rotation block 6-5 one end and one of them Locating rod 6-6 is fixedly connected, and the bottom surface of the other end and one of positioning pushing rolling wheels 6-3 periphery are adjacent to;Described three In back-moving spring 6-7, one end of each back-moving spring is connected in one of locating rotation block 6-5 promotes rolling with positioning One end that wheel 6-3 is connected, the other end is connected on the positioning pusher seat 6-2.
Referring to Figure 15-Figure 17, the operation principle of above-mentioned clamping sheet positioning mechanism is:Positioning power mechanism urges during work Three locating rod 6-6 swing the clamping and release realized to card 1;Specifically, as Locating driver cylinder 6-1 expansion link 4-32 When protruding upward, locating rotation block 6-5 is promoted to turn around the positioning by positioning pusher seat 6-2 and positioning pushing rolling wheels 6-3 Run-on point between motion block 6-5 and locating support 6-4 is rotated, and the locating rod 6-6 being fixedly connected with locating rotation block 6-5 is towards remote The direction motion at the edge of card 1, final three locating rod 6-6 top surface is located at position below the bottom surface of card 1 so that card 1 can To properly enter or leave encapsulation station;And when Locating driver cylinder 6-1 expansion link 4-32 retracts downwards, described multiple Under position spring 6-7 pullling, three locating rod 6-6 are moved towards the direction close to the edge of card 1, are finally clamped in the three of card 1 On individual side, and the clamping to card 1 is realized in another side of card 1 then close on the side of card conveying 2 And positioning.
Referring to Figure 14-Figure 17, further, in three locating rod 6-6 of each clamping sheet positioning mechanism, positioned at two envelopes Locating rod 6-61 on the basis of the locating rod 6-6 between station is filled, other two locating rod 6-6 is clamping and positioning bar 6-62, and is blocked The side of piece conveying 2 constitutes another positioning reference plane of card 1.That is, corresponding in the first encapsulation station 2-3 In clamping sheet positioning mechanism, the locating rod 6-61 on the basis of first group of chip 4-1 of card 1 locating rod 6-6, in the second envelope Fill in the corresponding clamping sheet positioning mechanisms of station 2-4, the locating rod on the basis of second group of chip 4-2 of card 1 locating rod 6-6 6-61.So set and be advantageous in that:Position references of first group of chip 4-1 on card 1 in card 1 is defeated along card The front side edge edge in direction 7 is sent, correspondingly will be with the front side edge edge in the corresponding clamping sheet positioning mechanisms of the first encapsulation station 2-3 Corresponding locating rod 6-6 is arranged to origin reference location bar 6-61, two datum coincidences;Similarly, second group of chip 4-2 in card is in card Position reference on piece 1 is the rear lateral edge along card conveying direction 7, in the corresponding card positioning of the second encapsulation station 2-4 In mechanism, locating rod 6-6 corresponding with the rear lateral edge is correspondingly arranged to origin reference location bar 6-61, two datum coincidences;By The target location that the chip that this said reference is calculated carries when packaging mechanism 5 carries chip can be encapsulated with card chips The physical location of groove is more coincide, so as to improve the precision of chip package.
Referring to Fig. 4, the chip, which carries packaging mechanism 5, includes encapsulation suction nozzle 5-1, for driving encapsulation suction nozzle 5-1 along Z Z axis drive mechanism 5-2, the X-axis drive mechanism 5- for driving Z axis drive mechanism 5-2 to be moved along X-direction of direction of principal axis movement Y-axis the drive mechanism 5-4, the encapsulation suction nozzle 5-1 that 3 and driving X-axis drive mechanism 5-3 is moved along Y direction are filled with negative pressure Connection is put, the encapsulation suction nozzle 5-1 is connected by connection component 5-5 with Z axis drive mechanism 5-2.Said chip carries packaging mechanism 5 Further embodiment prior art is can refer to implement.
Referring to Fig. 6, the card conveying 2 is provided with through hole 2-4 in the local corresponding position passed through with the chip belt, The chip belt in through hole 2-4 by passing through card conveying 2;The card conveying 2 with positioned at the long side of card 1 The locating rod 6-6 corresponding positions at place are provided with avoiding hollow groove 2-1 so that the locating rod 6-6 can be movable from the high groove of the empty avoiding, from And the long side of card 1 is clamped or unclamped.
Referring to Fig. 2-Figure 17, the operation principle of said chip packaging system is:Core in two chip belt feed mechanisms 3 Piece tape transport drives corresponding chip Tape movement, and is gone out the chip on chip belt by chip blanking mechanism 4;Each core Piece blanking mechanism 4 once goes out two chips, because the direction of transfer of two chip belts is on the contrary, therefore two chip blanking mechanisms The direction of 4 chip differs 180 °, two chips of each chip blanking mechanism 4 just with one group of core to be packaged in card 1 Piece is towards unanimously.Card 1 to be packaged is first fed into first encapsulation station along card conveying 2, carries out first Group chip 4-1 encapsulation, chip carries packaging mechanism 5 and two chips gone out in first blanking die 4-22 is transported into card At 1 and it is encapsulated into first group of chip 4-1 groove;Then card 1 is transported in the second encapsulation station 2-3, carries out second group of core Piece 4-2 encapsulation, chip carries packaging mechanism 5 and two chips gone out in second blanking die 4-23 is transported at card 1 And be encapsulated into second group of chip 4-2 groove, so far complete the encapsulation of four chips on card 1.
The course of work of the chip package production line of multicore smart card of the present utility model is:
In package module A, card from Timing Belt dial mechanism for card along card conveying c-1 in the way of batch (-type) to Preceding conveying, arrives first at and is packaged in encapsulation station, the process of encapsulation is:Chip belt in two chip belt feed mechanisms is passed Send mechanism to drive corresponding chip Tape movement, and gone out the chip on chip belt by chip blanking mechanism;Due to two chips The direction of transfer of band is on the contrary, therefore the direction of the chip of two chip blanking mechanisms differs 180 °, each chip blanking mechanism punching The chip gone out is just with one group of chip to be packaged in card towards unanimously.Card to be packaged is along card conveying c-1 It is first fed into first encapsulation station, carries out the encapsulation of first group of chip, chip carries packaging mechanism and rushes two chips Cut out in the chip gone out of mechanism and be transported to towards identical chip at card with first group of chip and be encapsulated into first group In chip slot;Then card is transported in second encapsulation station, carries out the encapsulation of second group of chip, and chip carries packaging machine It is transported at card and seals towards identical chip with second group of chip in the chip that structure goes out chip blanking mechanism It is attached in second group of chip slot, so far completes the encapsulation of multiple chips on card.
The card for having encapsulated chip continues to be fed forward to hot pressing station, and the chip on card is carried out by hot pressing module B Compress and heat so that the gum on chip is bonded together with card;The card for finally completing processing detects mould by chip Block d is detected, is finally transported in receipts card module e and is collected.
Above-mentioned is the utility model preferably embodiment, but embodiment of the present utility model is not by the above Limitation, it is other it is any without departing from Spirit Essence of the present utility model and the change made under principle, modification, replacement, combine, it is simple Change, should be equivalent substitute mode, be included within protection domain of the present utility model.

Claims (8)

1. a kind of chip package production line of multicore smart card, it is characterised in that including card transport and along card Package module, hot pressing module, chip detection module and receipts card module that conveying direction is set gradually;
The package module includes chip belt feed mechanism, chip blanking mechanism and chip and carries packaging mechanism;Wherein, encapsulate Module is provided with clamping sheet positioning mechanism provided with two encapsulation stations, each encapsulate at station;The chip belt feed mechanism is two, Each chip belt feed mechanism includes chip belt and chip tape transport;Chip belt in two chip belt feed mechanisms along Direction perpendicular to card conveying direction is extended in parallel, and the direction of transfer phase of the chip belt in two chip belt feed mechanisms Instead;The chip blanking mechanism is two, and each chip blanking mechanism includes blanking die and is located at rushing below blanking die Cut out executing agency;Two chip belts in two chip belt feed mechanisms distinguish the blanking die of a chip blanking mechanism therefrom Pass through below tool.
2. the chip package production line of multicore smart card according to claim 1, it is characterised in that the hot pressing module is set There is the rotating mechanism for being provided between two groups of hot-press equipments, two groups of hot-press equipments and being used for that 180 rotations to be carried out to card.
3. the chip package production line of multicore smart card according to claim 1, it is characterised in that in multiple cores of card In piece, along the conveying direction of card, the chip positioned at card front end is first group of chip, and the chip positioned at rear end is second group Chip;In described two encapsulation stations, the first encapsulation station and the second encapsulation station are followed successively by along card conveying direction;It is described In two blanking dies of two chip blanking mechanisms, the first blanking die and the second punching are followed successively by along card conveying direction Mould;The direction for the chip gone out in first blanking die is consistent with the direction of first group of chip, second punching The direction for cutting out the chip gone out in mould is consistent with the direction of second group of chip;First blanking die is arranged at and the One encapsulation station corresponding position, and on card conveying direction, the punching on first blanking die is located at and the first encapsulation station In card first group of chip package groove corresponding position;Second blanking die is arranged at encapsulates station corresponding position with second, And on card conveying direction, the punching on second blanking die is located at second group of core with the card in the second encapsulation station Piece encapsulation groove corresponding position.
4. the chip package production line of multicore smart card according to claim 3, it is characterised in that in each chip punching In mechanism, the punching executing agency includes punching support, for chip to be rushed to de- punching bar from chip belt, for fixing It is punched the punching bar fixed seat of bar and for driving punching bar fixed seat to make vertical reciprocating punching drive mechanism;It is described Being punched drive mechanism includes drive cylinder, swing rod, driving wheel and driving seat, wherein, the cylinder body of the drive cylinder is hinged on It is punched on support, the expansion link of the drive cylinder, which is hinged in the middle part of the lower end of swing rod, swing rod, to be hinged on punching support, swing rod Upper end the driving wheel is connected by rotating shaft;Driver slot is provided with the driving seat, the driving wheel is arranged in driver slot, The top of the driving seat is connected with the punching bar fixed seat.
5. the chip package production line of multicore smart card according to claim 1, it is characterised in that two chip clicker press machines Punching bar fixed seat in structure mutually presses close to set, and the face of pressing close to of two punching bar fixed seats is at an acute angle with card conveying direction Inclined plane;Guide post is provided between the punching bar fixed seat and punching support.
6. the chip package production line of multicore smart card according to claim 5, it is characterised in that two punching bars are fixed Seat is grouped together into rectangle, and the angle pressed close between face and card conveying direction of two punching bar fixed seats is 45 °.
7. the chip package production line of multicore smart card according to claim 1, it is characterised in that supplied in the chip belt To in mechanism, the chip tape transport include unused chip belt winding wheel, with chip belt winding wheel, traction electric machine, lead Running wheel and chip belt guide rail, wherein, the main shaft of the traction wheel and traction electric machine is connected, in two chip belt feed mechanisms Traction electric machine is arranged at the not homonymy of card conveying.
8. the chip package production line of multicore smart card according to claim 1, it is characterised in that the chip carries envelope Mounting mechanism includes encapsulation suction nozzle, for driving the Z axis drive mechanism for encapsulating suction nozzle and being moved along Z-direction, for driving Z axis to drive The Y-axis drive mechanism that the X-axis drive mechanism and driving X-axis drive mechanism that mechanism is moved along X-direction are moved along Y direction, The encapsulation suction nozzle is connected with negative pressure device.
CN201621126520.8U 2016-10-15 2016-10-15 A kind of chip package production line of multicore smart card Active CN206340522U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109192681A (en) * 2018-09-01 2019-01-11 温州市科泓机器人科技有限公司 The quick flexible manufacturing system of chip

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109192681A (en) * 2018-09-01 2019-01-11 温州市科泓机器人科技有限公司 The quick flexible manufacturing system of chip

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