CN106601651A - Multi-chip contact type intelligent card slot milling packaging device - Google Patents
Multi-chip contact type intelligent card slot milling packaging device Download PDFInfo
- Publication number
- CN106601651A CN106601651A CN201610900419.1A CN201610900419A CN106601651A CN 106601651 A CN106601651 A CN 106601651A CN 201610900419 A CN201610900419 A CN 201610900419A CN 106601651 A CN106601651 A CN 106601651A
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- China
- Prior art keywords
- chip
- card
- punching
- groove milling
- encapsulation
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23C—MILLING
- B23C3/00—Milling particular work; Special milling operations; Machines therefor
- B23C3/28—Grooving workpieces
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Abstract
The invention discloses a multi-chip contact type intelligent card slot milling packaging device comprising a slot milling device and a packaging device, which are connected together. The packaging device comprises packaging modules, which comprises chip belt supply mechanisms, chip blanking mechanisms, and chip conveying packaging mechanisms. The card conveying guide rail of the slot milling device is provided with two packaging stations corresponding to the packaging modules, and each packaging station is provided with a card positioning mechanism. The two chi belt feeding mechanisms are provided, and each chip belt supply mechanism comprises a chip belt and a chip belt conveying mechanism. The chip belts of the two chip belt supply mechanisms are extended parallely along a direction vertical to the card conveying direction, and the conveying directions of the conveying belts of the two chip belt supply mechanisms are opposite to each other. The multi-chip contact type intelligent card slot milling packaging device is suitable for slot milling packaging of single-chip cards, and is suitable for slot milling packaging of multi-chip cards. When the multi-chip contact type intelligent card slot milling packaging device is used for the slot milling packaging of the multi-chip cards, the multi-chip contact type intelligent card slot milling packaging device has advantages of fast packaging speed, high production efficiency, and high packaging precision.
Description
Technical field
The present invention relates to smart card manufacturing equipment, and in particular to a kind of multi-chip contact intelligent card groove milling sealed in unit.
Background technology
In contact intelligent card production process, need to encapsulate chip into card.Before encapsulation chip, need in card
On mill out chip slot for accommodating chip, therefore the encapsulation process of card is broadly divided into two master operations of groove milling and encapsulation,
Wherein, Xiyanping injection is completed by groove milling equipment, and encapsulation process is completed by sealed in unit.
A chip is provided with common every card of smart card, but also has part card to be provided with multiple chips, example
Such as two chips, four chips.Chip in these multi-chip cards is divided into the two ends that two parts are arranged on card, positioned at not
(in four angles of chip, have at an angle and be provided with hypotenuse, the position of hypotenuse is different, chip on the contrary with the direction of the chip at end
Towards different, referring to Fig. 3), and the direction of the chip being located in same one end is consistent.Chip positioned at card wherein one end is referred to as
One group of chip, positioned at the chip of the card other end second group of chip is referred to as；Direction of the two groups of chip in card differs 180 °.Envelope
Chip before dress is punched it from chip belt by chip blanking mechanism, the direction of these chips being punched it is consistent and
Immobilize, encapsulation station is transported to by chip carrying mechanism during encapsulation and is encapsulated in the chip slot of card.
The deficiency that existing smart card groove milling and sealed in unit are present is：
1st, groove milling and packaging technology are respectively completed by two independent equipment, and card transfer between both devices is occupied
More production time, low production efficiency.
2nd, existing groove milling equipment is generally used for being packaged single-chip card, when the encapsulation for multi-chip card
When, need to carry out card 180 ° of rotations or 180 ° of rotations are carried out to chip, just can guarantee that second group of chip can be exactly
In being encapsulated into the encapsulation groove of card；Due to needing rotary chip or card in encapsulation process, on the one hand, so that package speed is slow,
Low production efficiency, on the other hand, easily affects the encapsulation precision of chip.
The content of the invention
It is an object of the invention to overcome the deficiencies in the prior art, there is provided a kind of multi-chip contact intelligent card groove milling encapsulation
Equipment, the equipment is not only able to be continuously completed the groove milling of card and encapsulation process, and is not only suitable for the milling of single-chip card
Groove is encapsulated, and is also applied for the groove milling encapsulation of multi-chip card, when for the groove milling encapsulation for carrying out multi-chip card, with encapsulation
The advantages of speed is fast, production efficiency is high, encapsulation precision is high.
The purpose of the present invention is realized by following technical scheme：
A kind of multi-chip contact intelligent card groove milling sealed in unit, it is characterised in that set including the groove milling for linking together
Standby and sealed in unit, wherein：
The groove milling equipment include card transport and the card-issuing module that sets gradually along card conveying direction and
Groove milling module；
The sealed in unit includes card transport and the package module, the heat that set gradually along card conveying direction
Die block and receipts card module；
Card transition transfer device is provided between the end of the groove milling equipment and the top of sealed in unit；
The package module includes that chip belt feed mechanism, chip blanking mechanism and chip carry packaging mechanism；Wherein,
Two encapsulation stations are provided with position corresponding with package module in the card conveying of groove milling equipment, at each encapsulation station
It is provided with clamping sheet positioning mechanism；The chip belt feed mechanism is two, and each chip belt feed mechanism includes chip belt and chip
Tape transport；Chip belt in two chip belt feed mechanisms along extending in parallel perpendicular to the direction of card conveying direction,
And the direction of transfer of the chip belt in two chip belt feed mechanisms is contrary；The chip blanking mechanism is two, each chip
Blanking mechanism includes blanking die and the punching executing agency being located at below blanking die；In two chip belt feed mechanisms two
Individual chip belt passes through respectively from below the blanking die of one of chip blanking mechanism.
The course of work of above-mentioned multi-chip contact intelligent card groove milling sealed in unit is：
In groove milling equipment, card to be processed is sent by card-issuing module, and mechanism for card is dialled by card along card by Timing Belt
Piece conveying is fed forward in step mode, after card arrival groove milling module corresponding groove milling station, by groove milling mould
Block mills out chip slot on card；The card that groove milling is finished reaches the module of groove milling equipment, is shifted by card transition transfer device
To in sealed in unit.
In sealed in unit, it is defeated forward in step mode along card conveying that card dials mechanism for card by Timing Belt
Send, arrive first at and be packaged in the corresponding encapsulation station of package module, the process of encapsulation is：In two chip belt feed mechanisms
Chip tape transport drive corresponding chip Tape movement, and the chip on chip belt is gone out by chip blanking mechanism；By
In two chip belts direction of transfer conversely, therefore two chip blanking mechanisms chip direction differ 180 °, each chip
The chip that blanking mechanism is gone out is just consistent with one group of chip direction to be packaged in card.Card to be packaged is defeated along card
Send guide rail to be first fed into in first encapsulation station, carry out the encapsulation of first group of chip, chip carries packaging mechanism by two
It is transported at card and is encapsulated into towards identical chip with first group of chip in the chip that chip blanking mechanism is gone out
In first group of chip slot；Then card is transported in second encapsulation station, carries out the encapsulation of second group of chip, and chip is carried
Card is transported in the chip that packaging mechanism goes out chip blanking mechanism towards identical chip with second group of chip
Place is simultaneously encapsulated in second group of chip slot, so far completes the encapsulation of multiple chips on card.Encapsulated chip card continue to
Before be delivered to hot pressing station, by hot pressing module the chip on card is compressed and heated so that gum on chip and card
Piece is bonded together；The card for finally completing processing reaches collection in receipts card module.
One preferred version of the present invention, wherein, in the groove milling equipment, the groove milling module is two, two millings
The rotating mechanism for carrying out 180 rotations to card is provided between channel mould block；A chip is provided with after each groove milling module clear
Clean mechanism.It is advantageous in that using two groove milling modules, each groove milling module is each responsible for the chip slot of card wherein one end
Processing, the distance that such groove milling module is moved in groove milling is shorter, so as to improve production efficiency；And rotating mechanism is acted on
In, after the chip slot milling of card one end is finished, by the rotating mechanism it is carried out 180 ° rotation, by next groove milling module
Milling is carried out to the other end of card；The effect of the chip cleaning mechanism is to the chip slot the inside after milling and surrounding
Remaining debris be purged, it is ensured that card face clean.
One preferred version of the present invention, wherein, in the sealed in unit, the hot pressing module is two groups, and two groups are hot
The rotating mechanism for carrying out 180 rotations to card is provided between die block.It is advantageous in that using two groups of hot pressing modules, per group
Hot pressing module is each responsible for the hot-pressing processing of the chip of card wherein one end, so as to improve production efficiency, in every group of hot pressing module
The quantity of hot pressing module can flexibly be arranged according to number of chips, the quantity of hot pressing module and card in generally every group of hot pressing module
The quantity of piece one end chips is identical, that is, each hot pressing module is responsible for the hot-pressing processing of a chip so that each hot pressing
Module operationally only need to move up and down, and without the need for shifting between different chips.The effect of the rotating mechanism is, when
After the chip hot-pressing processing of card one end finishes, 180 ° of rotations are carried out to it by the rotating mechanism, by next group of hot pressing module to card
The chip of the other end of piece carries out hot-pressing processing.
One preferred version of the present invention, wherein, end section and the encapsulation of the card conveying of the groove milling equipment
Mutually stagger and with lap between the initial portion of the card conveying of equipment, the card transition transfer device sets
Put in the lap corresponding position；The card transition transfer device includes handling arm, the vacuum cups being located in handling arm, drives
Dynamic handling arm makees the vertical drive mechanism of vertical motion and drives handling arm to move between the card conveying of two equipment
Dynamic card transfer actuating unit；The handling arm and vacuum cups are arranged at the top of the lap corresponding region；Institute
State vacuum cups to be connected with negative pressure device.
It is advantageous in that using above-mentioned preferred version：The card conveying of groove milling equipment and sealed in unit mutually staggers simultaneously
Overlap at handing-over position, the overall length of equipment can be shortened；And card transfer between both devices is also beneficial to, such as
Fruit directly docks the card conveying edge of two equipment, in order to realize smoothly transitting for card, the card feed section of two equipment
Clapping needs unanimously, and the debugging difficulty of equipment is big, and in above-mentioned preferred version, card only need to be capable of achieving by the way of carrying
Transfer, the card feed beat of two equipment is without the need for strict conformance.Specifically, the operation principle of the card transition transfer device is：
The Timing Belt of groove milling equipment dials mechanism for card and card is delivered to into end station by its card conveying beat, and the card shifts power
Mechanism drives handling arm and vacuum cups to be moved to the top of the end station of groove milling equipment, dials in the Timing Belt of groove milling equipment
Mechanism for card was dialled twice in the dead time between card, and the vertical drive mechanism drives handling arm and vacuum cups to moving down
Dynamic, vacuum cups contact card simultaneously holds card under the vacuum suction effect that negative pressure device is produced, subsequently vertical driving machine
Structure drives handling arm and vacuum cups to move up, and card transfer actuating unit drives handling arm and vacuum cups transfer
To above the top station of the card conveying of sealed in unit, finally the Timing Belt in sealed in unit dials mechanism for card and dials card twice
Between dead time in, vertical drive mechanism drives handling arm and vacuum cups to move down, and card is transferred to into encapsulation
On the top station of the card conveying of equipment, so as to complete the once transfer carrying work of card.
One preferred version of the present invention, wherein, in multiple chips of card, along the conveying direction of card, it is located at
The chip of card front end is first group of chip, and the chip positioned at rear end is second group of chip；In described two encapsulation stations, along
Card conveying direction is followed successively by the first encapsulation station and the second encapsulation station；Two blanking dies of described two chip blanking mechanisms
In tool, along card conveying direction the first blanking die and the second blanking die are followed successively by；Go out in first blanking die
Chip direction it is consistent with the direction of first group of chip, direction and the institute of the chip gone out in second blanking die
The direction for stating second group of chip is consistent；First blanking die is arranged at and the first encapsulation station corresponding position, and defeated in card
Send on direction, the punching on first blanking die is located at first group of chip package groove pair with the card in the first encapsulation station
Should locate；Second blanking die is arranged at and the second encapsulation station corresponding position, and on card conveying direction, second punching
Punching on mould is located at second group of chip package groove corresponding position with the card in the second encapsulation station.
Be using the purpose of above-mentioned preferred version allow during encapsulation chip carry packaging mechanism carry chip stroke most
It is short, packaging efficiency is improved with a progress.Specifically, because the first blanking die is located at and the first encapsulation station corresponding position, and
On card conveying direction, the punching on the first blanking die is located at first group of chip package with the card in the first encapsulation station
Groove corresponding position, therefore when the chip package that will be gone out in the first blanking die is to first group of chip package groove, distance is most short；Together
Reason, during by the chip package gone out in the second blanking die to second group of chip package groove, distance is also most short, so as to maximum limit
Improve the speed of encapsulation, improve production efficiency in degree ground.
One preferred version of the present invention, wherein, in each chip blanking mechanism, the punching executing agency includes punching
Cut support, for chip to be rushed from chip belt de- punching bar, the punching bar fixed seat for fixed punch chipping and be used for
Punching bar fixed seat is driven to make vertical reciprocating punching drive mechanism；The punching drive mechanism includes drive cylinder, pendulum
Bar, driving wheel and drive seat, wherein, the cylinder body of the drive cylinder is hinged on punching support, the drive cylinder it is flexible
Bar is hinged on the lower end of fork, is hinged in the middle part of fork on punching support, and the upper end of fork connects the driving by rotating shaft
Wheel；Driver slot is provided with the driving seat, the driving wheel is arranged in driver slot, it is described drive seat top and the punching
Bar fixed seat connects.
The operation principle of above-mentioned punching executing agency is：During work, punching drive mechanism drive punching bar fixed seat and
Punching bar pumps, when punching bar is moved upwards, the chip punching on chip belt is de-, the upper end shape of the punching bar
Shape is consistent with the punching in blanking die, and the chip form gone out is consistent with punching and in punching；The punching drives
In mechanism, when the expansion link of drive cylinder stretches out, promote fork around rotating with the tie point of punching support, the upper end of fork to
Upper driving, the driving wheel of fork upper end drives punching bar fixed seat to move upwards by driver slot, and works as the flexible of drive cylinder
When bar is retracted, correspondingly it is punched bar fixed seat and moves downward.
Preferably, the punching bar fixed seat in two chip blanking mechanisms mutually presses close to arrange, two punching bar fixed seats
Face of pressing close to be the inclined plane at an acute angle with card conveying direction；Guiding is provided between the punching bar fixed seat and punching support
Bar.It is in punching bar fixed seat is guaranteed there is enough positions to arrange the guide post using the purpose of the preferred version
On the premise of, (along card conveying direction) length for combining of two punching bar fixed seats is reduced as far as possible, so as to allow two
It is as near as possible that individual blanking die is arranged, and carries so as to working as chip carrying packaging mechanism and converting between two blanking dies
Stroke during chip is shorter, further time-consuming.
One scheme for more optimizing of above-mentioned punching bar fixed seat is that two punching bar fixed seats are grouped together into square
Shape, the angle pressed close between face and card conveying direction of two punching bar fixed seats is 45 ° so that each punching bar fixed seat
It is roughly triangular, a guide post is respectively provided with such that it is able to three turnings of the punching bar fixed seat corresponding position in triangle,
Space in so as to make full use of punching bar fixed seat obtains stable guide effect.
In said chip blanking mechanism, the punching support includes the die holder for fixing blanking die, the mould
Chip tape channel is being provided with the blanking die corresponding position in tool fixed seat, the chip belt is worn from the chip tape channel
Cross.
One preferred version of the present invention, wherein, in the chip belt feed mechanism, the chip tape transport bag
Include unused chip belt winding wheel, use chip belt winding wheel, traction electric machine, traction wheel and chip belt guide rail, wherein, it is described to lead
Running wheel is connected with the main shaft of traction electric machine, and the traction electric machine in two chip belt feed mechanisms is arranged at card conveying not
Homonymy.
One preferred version of the present invention, wherein, the chip carries packaging mechanism including encapsulation suction nozzle, for driving envelope
Z axis drive mechanism, the X-axis driving machine for driving Z axis drive mechanism to move along X-direction that dress suction nozzle is moved along Z-direction
The Y-axis drive mechanism that structure and driving X-axis drive mechanism are moved along Y direction, the encapsulation suction nozzle is connected with negative pressure device.
The present invention has compared with prior art following beneficial effect：
1st, by the way that groove milling equipment and sealed in unit are combined into work, the time of people's card transfer is reduced, is improve
Production efficiency.
2nd, in the package module of sealed in unit, by arranging two chip belt feed mechanisms and two chip clicker press machines
Structure, and make the conveying direction of two chip belts contrary so that the direction of the chip that two chip blanking mechanisms are gone out respectively with card
The direction of first group of chip and second group of chip on piece is consistent, so need not during by chip package to chip slot
Chip is rotated, packaging time is not only saved, package speed and efficiency is improved, and avoids the tired of chip rotational band
Meter error so that the encapsulation precision of chip is also improved.
3rd, by arranging two encapsulation stations, the first group of chip allowed in card and second group of chip are respectively in different encapsulation
Encapsulation is completed in station, chip can be reduced and carried stroke of the packaging mechanism in chip processes are carried, during same saving encapsulation
Between, improve package speed and efficiency.
4th, can be used not only for carrying out chip package to multi-chip card, it is also possible to for carrying out chip to single-chip card
Encapsulation.
Description of the drawings
Fig. 1 is that the structure of a specific embodiment of the multi-chip contact intelligent card groove milling sealed in unit of the present invention is shown
It is intended to.
Fig. 2 is the structural representation of groove milling equipment and sealed in unit in Fig. 1.
Fig. 3 is the structural representation of four cores smart card of the present invention.
Fig. 4 is the dimensional structure diagram of package module in Fig. 2.
Fig. 5-Fig. 7 is that the structural representation that chip carries packaging mechanism is removed in package module shown in Fig. 4, wherein, Fig. 5 is
Front view, Fig. 6 is upward view, and Fig. 7 is stereogram.
Fig. 8 is the dimensional structure diagram of package module chips blanking mechanism shown in Fig. 4.
Fig. 9-Figure 11 is the structural representation that drive mechanism is punched in chip blanking mechanism shown in Fig. 8, wherein, based on Fig. 9
View, Figure 10 is the A-A sectional views of Fig. 9, and Figure 11 is stereogram.
Figure 12 is the stereochemical structure of blanking die in chip blanking mechanism shown in Fig. 8, punching bar and punching bar fixed seat
Schematic diagram.
Figure 13 and Figure 14 is the structural representation that bar and punching bar fixed seat are punched in chip blanking mechanism shown in Fig. 8, its
In, Figure 13 is front view, and Figure 14 is stereogram.
Figure 15 and Figure 16 is the structural scheme of mechanism of clamping sheet positioning mechanism in chip packaging device shown in Fig. 4, wherein, Tu15Wei
Front view, Figure 16 is stereogram.
Figure 17 is the stereochemical structure that pusher seat and positioning pushing rolling wheels are positioned in clamping sheet positioning mechanism shown in Figure 15 and Figure 16
Schematic diagram.
Figure 18-Figure 21 is the structural representation of card transition transfer device in Fig. 2, wherein, Figure 18 is front view, Tu19Wei
Right view, Figure 20 is top view, and Figure 21 is stereogram.
Specific embodiment
With reference to embodiment and accompanying drawing, the present invention is described in further detail, but embodiments of the present invention are not limited
In this.
Referring to Fig. 1 and Fig. 2, the multi-chip contact intelligent card groove milling sealed in unit of the present invention includes the milling for linking together
Groove device A and sealed in unit B.The groove device A and sealed in unit B are arranged in frame a, and the bottom of frame a arranges switch board
b。
Referring to Fig. 1, Fig. 2 and Figure 18-Figure 21, the groove milling equipment A includes card transport c and along card conveying side
To the card-issuing module e and groove milling module g that set gradually, wherein, card transport c includes card conveying c-1, uses
In group card actuating unit c-3 for dialling card Timing Belt c-2 and driving group card Timing Belt c-2 operatings of card of pulling over.Wherein, it is described
Card conveying c-1 is used to position card and be oriented to, and forms card transfer passage, and card is in card transfer passage
Move and stop and be processed, the position of stop forms processing stations.The top of described group of card Timing Belt c-2 conveys along card
Passage extends, and dials the moving tooth on card Timing Belt c-2 and stirs card movement.The card-issuing module e is used in card transfer passage
Card is sent into, specifically, card-issuing module e has two card sending mechanisms, two cards can be sent in card transfer passage simultaneously
Piece.
Referring to Fig. 1, Fig. 2 and Figure 18-Figure 21, in the groove milling equipment A, groove milling module g is two, two groove millings
The rotating mechanism h for carrying out 180 rotations to card is provided between module g；A chip is provided with after each groove milling module g clear
Clean mechanism i.It is advantageous in that each groove milling module g can be each responsible for the core of card wherein one end using two groove milling modules g
The processing of film trap, the distance that such groove milling module g is moved in groove milling is shorter, so as to improve production efficiency, it is also possible to each milling
Card module is each responsible for the groove milling work of a card, and card transport c can once convey two cards and come to carry out milling
Groove, equally being capable of improve production efficiency.And the effect of rotating mechanism h is, after the chip slot milling of card one end is finished, by
Rotating mechanism h carries out 180 ° of rotations to it, and milling is carried out to the other end of card by next groove milling module g；The chip
The effect of cleaning mechanism i is that the Remaining debris to the chip slot the inside after milling and surrounding are purged, it is ensured that Ka Mianqing
It is clean.It is additionally provided between the card-issuing module and groove milling module g for detecting whether the attitude of card is correct and detection card is
No card detection means f for belonging to this batch card to be produced.
Referring to Fig. 1, Fig. 2 and Figure 18-Figure 21, the sealed in unit B includes card transport d and along card conveying side
To the package module k, hot pressing module l, chip detection module m and receipts card module n that set gradually.Card transport d
It is similar to groove milling equipment A, including card conveying d-1, group card Timing Belt d-2 for card of pulling over and driving group card are together
Walk and dial card actuating unit with d-2 operatings.
Referring to Fig. 1 and Fig. 2, in the sealed in unit B, hot pressing module l is two groups, between two groups of hot pressing modules l
It is provided with the rotating mechanism h for carrying out 180 rotations to card.It is advantageous in that using two groups of hot pressing modules g, every group of hot pressing module
L is each responsible for the hot-pressing processing of the chip of card wherein one end, so as to improve production efficiency, the hot pressing in every group of hot pressing module l
The quantity of module l can flexibly be arranged according to number of chips, the quantity and card of hot pressing module l in generally every group of hot pressing module l
The quantity of one end chips is identical, that is, each hot pressing module l is responsible for the hot-pressing processing of a chip so that each hot-die
Block l operationally only need to move up and down, and without the need for shifting between different chips.The effect of the rotating mechanism h is, when
After the chip hot-pressing processing of card one end finishes, 180 ° of rotations are carried out to it by rotating mechanism h, by next group of hot pressing module l pair
The chip of the other end of card carries out hot-pressing processing.Chip detection module m is used for the chip of the card that detection is machined
Whether read-write capability is normal.
Referring to Fig. 4, the package module k includes that chip belt feed mechanism 3, chip blanking mechanism 4 and chip carry envelope
Mounting mechanism 5.Wherein：Two encapsulation stations are provided with package module k corresponding positions in card conveying 2, at each encapsulation station
It is provided with clamping sheet positioning mechanism 6.The chip belt feed mechanism 3 is two, and each chip belt feed mechanism 3 includes chip belt and core
Piece tape transport；Chip belt in two chip belt feed mechanisms 3 prolongs along the direction perpendicular to card conveying direction 7 is parallel
Stretch, and the direction of transfer of the chip belt in two chip belt feed mechanisms 3 is contrary；Double chip is provided with the chip belt.
The chip blanking mechanism 4 is two, and each chip blanking mechanism 4 includes blanking die 4-2 and is located at blanking die 4-2 lower sections
Punching executing agency, in each blanking die 4-2 arrange two punching 4-21；Two in two chip belt feed mechanisms 3
Chip belt passes through respectively from below the blanking die 4-2 of one of chip blanking mechanism 4.
Referring to Fig. 3 and Fig. 5, in multiple chips (the present embodiment is four) of card 1, along the conveying direction of card 1,
Two chips positioned at the front end of card 1 are first group of chip 4-1, and two chips positioned at rear end are second group of chip 4-2；It is described
In two encapsulation stations, along card conveying direction 7 the encapsulation station 2-4 of the first encapsulation station 2-3 and second are followed successively by；Described two
In two blanking die 4-2 of individual chip blanking mechanism 4, along card conveying direction 7 be followed successively by the first blanking die 4-22 and
Second blanking die 4-23；The direction of the chip gone out in the first blanking die 4-22 is with first group of chip 4-1's
Towards unanimously, the direction of the chip gone out in the second blanking die 4-23 is consistent with the direction of second group of chip 4-2；
The first blanking die 4-22 is arranged at and the first encapsulation station 2-3 corresponding positions, and on card conveying direction 7, this first
Punching 4-21 on blanking die 4-22 is located at first group of chip package groove 4-3 pair with the card 1 in the first encapsulation station 2-3
Should locate；The second blanking die 4-23 is arranged at and the second encapsulation station 2-4 corresponding positions, and on card conveying direction 7, should
Punching 4-21 on second blanking die 4-23 is located at second group of chip package groove with the card 1 in the second encapsulation station 2-4
4-4 corresponding positions.
It is to allow the stroke of the chip carrying carrying chip of packaging mechanism 5 most short during encapsulation using the purpose of such scheme, with
One progress improves packaging efficiency.Specifically, because the first blanking die 4-22 is located at and the first encapsulation station 2-3 corresponding positions, and
On card conveying direction 7, the punching 4-21 on the first blanking die 4-22 is located at and the card 1 in the first encapsulation station 2-3
First group of chip package groove 4-3 corresponding position, therefore when the chip package to first group that will go out in the first blanking die 4-22
During chip package groove 4-3, distance is most short；In the same manner, by the chip package gone out in the second blanking die 4-23 to second group of chip
During encapsulation groove 4-4, distance is also most short, so as to improve the speed of encapsulation, improve production efficiency to greatest extent.
Referring to Fig. 8-Figure 14, in each chip blanking mechanism 4, the punching executing agency includes punching support 4-1, uses
In chip to be rushed from chip belt de- punching bar 4-10, for punching bar fixed seat 4-8 and use of fixed punch chipping 4-10
Make vertical reciprocating punching drive mechanism in punching bar fixed seat 4-8 is driven；The punching drive mechanism includes drive gas
Cylinder 4-3, fork 4-4, driving wheel 4-5 and driving seat 4-6, wherein, the cylinder body 4-31 of the drive cylinder 4-3 is hinged on punching
On support 4-1, the expansion link 4-32 of drive cylinder 4-3 is hinged on the lower end of fork 4-4, and punching is hinged in the middle part of fork 4-4
Cut on support 4-1, the upper end of fork 4-4 connects the driving wheel 4-5 by rotating shaft；Driver slot is provided with the driving seat 4-6
4-61, the driving wheel 4-5 is arranged in driver slot 4-61, the top of the driving seat 4-6 and it is described punching bar fixed seat 4-8
Connection.
Referring to Figure 13 and Figure 15, further, punching bar fixed seat 4-8 in two chip blanking mechanisms 4 is mutually pressed close to
Arrange, the face of pressing close to of two punching bar fixed seats 4-8 is the inclined plane at an acute angle with card conveying direction 7；The punching bar is consolidated
Guide post 4-20 is provided between reservation 4-8 and punching support 4-1.It is to guarantee that being punched bar fixes using the purpose of the program
On the premise of in seat 4-8 there is enough positions to arrange the guide post 4-20, two punching bar fixed seats 4-8 are reduced as far as possible
(along the card conveying direction 7) length combined, it is as near as possible so as to allow two blanking die 4-2 to arrange, so as to
When the stroke that chip carrying packaging mechanism 5 is converted when carrying chip between two blanking die 4-2 is shorter, further save
Time.
Referring to Figure 13 and Figure 14, further, two punching bar fixed seats 4-8 are grouped together into rectangle, two punchings
The angle pressed close between face and card conveying direction 7 of chipping fixed seat 4-8 is 45 ° so that each punching bar fixed seat 4-8 is big
Cause is triangular in shape, and such that it is able to tri- turnings of the punching bar fixed seat 4-8 corresponding position in triangle a guide post is respectively provided with
4-20, so as to make full use of the space being punched in bar fixed seat 4-8 to obtain stable guide effect.
Referring to Fig. 8-Figure 14, in said chip blanking mechanism 4, the punching support 4-1 is included for fixing blanking die
The die holder 4-11 of 4-2, chip tape channel is being provided with die holder 4-11 with the blanking die 4-2 corresponding positions
4-12, the chip belt is passed through from the 4-12 of the chip tape channel.
Referring to Fig. 8-Figure 14, in said chip blanking mechanism 4, at the top of the driving seat 4-6 "T"-shaped connector 4- is provided with
7, the lower end of punching bar fixed seat 4-8 is provided with contiguous block 4-9, is provided with the connection and matches with "T"-shaped connector 4-7
"T"-shaped link slot 4-91.When connection drives seat 4-6 with punching bar fixed seat 4-8, only the "T"-shaped connector 4-7 need to be allowed from side
To loading in "T"-shaped link slot 4-91, mount and dismount all very convenient.
Referring to Fig. 8-Figure 14, in said chip blanking mechanism 4, it is provided with perpendicular between the driving seat 4-6 and punching support 4-1
To guiding mechanism, the vertical guiding mechanism includes the guide rail 4-30 being located on punching support 4-1 and is located on driving seat 4-6
The slide block 4-40 matched with the guide rail 4-30, for being oriented to the vertical reciprocating motion for driving seat 4-6.
Referring to Fig. 4-Fig. 7, in the chip belt feed mechanism 3, the chip tape transport is received by unused chip belt
Rolling wheel 3-4, constituted with chip belt winding wheel 3-5, traction electric machine 3-1, traction wheel 3-2 and chip belt guide rail 3-3 etc., its
In, the traction wheel 3-2 is connected with the main shaft of traction electric machine 3-1, and the traction electric machine 3-1 in two chip belt feed mechanisms 3 sets
It is placed in the not homonymy of card conveying 2.Further embodiment of the said chip with feed mechanism 3 is referred to prior art
To implement.
Referring to Figure 15-Figure 17, the clamping sheet positioning mechanism includes locating support 6-4, locating rod 6-6 and determines for driving
Position bar 6-6 clamps or unclamps the positioning power mechanism of card 1, wherein, locating rod 6-6 is three, these three locating rods 6-6
It is respectively arranged at three sides corresponding position of card 1；The positioning power mechanism includes that Locating driver cylinder 6-1, positioning are promoted
Seat 6-2, three locating rotation block 6-5 and three back-moving spring 6-7, wherein, the expansion link of the Locating driver cylinder 6-1 connects
The bottom of positioning pusher seat 6-2 is connected to, the top of positioning pusher seat 6-2 is provided with three positioning pushing rolling wheels 6-3；Institute
State three locating rotation block 6-5 to be rotationally connected with locating support 6-4, one end of each locating rotation block 6-5 and one of them
Locating rod 6-6 is fixedly connected, and the bottom surface of the other end is adjacent to the periphery of one of positioning pushing rolling wheels 6-3；Described three
In back-moving spring 6-7, one end of each back-moving spring is connected in one of locating rotation block 6-5 and positioning pushing rolling wheels
One end that 6-3 is connected, the other end is connected in positioning pusher seat 6-2.
Referring to Figure 15-Figure 17, the operation principle of above-mentioned clamping sheet positioning mechanism is：Positioning power mechanism urges during work
Three locating rods 6-6 swing the clamping and release realized to card 1；Specifically, as the expansion link 4-32 of Locating driver cylinder 6-1
When protruding upward, locating rotation block 6-5 is promoted to turn around the positioning by positioning pusher seat 6-2 and positioning pushing rolling wheels 6-3
Run-on point between motion block 6-5 and locating support 6-4 is rotated, locating rod 6-6 being fixedly connected with locating rotation block 6-5 towards away from
The direction motion at the edge of card 1, the top surface of final three locating rods 6-6 is located at position below the bottom surface of card 1 so that card 1 can
To properly enter or leave encapsulation station；And when the expansion link 4-32 of Locating driver cylinder 6-1 retracts downwards, described multiple
Under the pullling of position spring 6-7, three locating rods 6-6 are moved towards the direction near the edge of card 1, are finally clamped in the three of card 1
On individual side, and the clamping to card 1 is realized in another side of card 1 then near on the side of card conveying 2
And positioning.
Referring to Figure 14-Figure 17, further, in three locating rods 6-6 of each clamping sheet positioning mechanism, positioned at two envelopes
Locating rod 6-61 on the basis of locating rod 6-6 between dress station, other two locating rod 6-6 is clamping and positioning bar 6-62, and is blocked
The side of piece conveying 2 constitutes another positioning reference plane of card 1.That is, corresponding in the first encapsulation station 2-3
In clamping sheet positioning mechanism, locating rod 6-61 on the basis of locating rod 6-6 of first group of chip 4-1 of card 1, in the second encapsulation
In the corresponding clamping sheet positioning mechanisms of station 2-4, locating rod 6- on the basis of locating rod 6-6 of second group of chip 4-2 of card 1
61.So arrange and be advantageous in that：Position references of the first group of chip 4-1 in card 1 on card 1 is along card conveying
The front side edge edge in direction 7, in the corresponding clamping sheet positioning mechanisms of the first encapsulation station 2-3, correspondingly will be with the front side edge along right
Locating rod 6-6 answered is arranged to origin reference location bar 6-61, two datum coincidences；In the same manner, second group of chip 4-2 in card is in card
Position reference on 1 is the rear lateral edge along card conveying direction 7, in the corresponding card localization machines of the second encapsulation station 2-4
In structure, correspondingly locating rod 6-6 corresponding with the rear lateral edge is arranged to into origin reference location bar 6-61, two datum coincidences；Thus
The chip that said reference is calculated carries target location when packaging mechanism 5 carries chip and can encapsulate groove with card chips
Physical location more coincide, so as to improve the precision of chip package.
Referring to Fig. 4, the chip carries packaging mechanism 5 to be included encapsulation suction nozzle 5-1, encapsulates suction nozzle 5-1 along Z axis for driving
Z axis drive mechanism 5-2, X-axis drive mechanism 5-3 for driving Z axis drive mechanism 5-2 to move along X-direction of direction movement
And Y-axis drive mechanism 5-4 that driving X-axis drive mechanism 5-3 is moved along Y direction, the encapsulation suction nozzle 5-1 and negative pressure device
Connection, encapsulation suction nozzle 5-1 is connected by coupling assembly 5-5 with Z axis drive mechanism 5-2.Said chip carries packaging mechanism 5
Further embodiment can refer to prior art to implement.
Referring to Fig. 6, the card conveying 2 corresponding position where passing through with the chip belt is provided with through hole 2-4, institute
Chip belt is stated by passing through card conveying 2 in through hole 2-4；The card conveying 2 with positioned at card 1 long edge position
Locating rod 6-6 corresponding position be provided with avoiding hollow groove 2-1 so that locating rod 6-6 can from the empty avoiding high groove activity, so as to right
The long side of card 1 is clamped or unclamps.
Referring to Fig. 2-Figure 17, the operation principle of said chip packaging system is：Chip in two chip belt feed mechanisms 3
Tape transport drives corresponding chip Tape movement, and is gone out the chip on chip belt by chip blanking mechanism 4；Each chip
Blanking mechanism 4 once goes out two chips, because the direction of transfer of two chip belts is conversely, therefore two chip blanking mechanisms 4
The direction of chip differ 180 °, two chips of each chip blanking mechanism 4 just with one group of chip to be packaged in card 1
Towards unanimously.Card 1 to be packaged is first fed into in first encapsulation station along card conveying 2, carries out first group
The encapsulation of chip 4-1, chip carries packaging mechanism 5 and two chips gone out in first blanking die 4-22 is transported to into card 1
Place is simultaneously encapsulated in first group of chip 4-1 groove；Then card 1 is transported in the second encapsulation station 2-3, carries out second group of chip
The encapsulation of 4-2, chip carries packaging mechanism 5 and two chips gone out in the second blanking die 4-23 is transported at card 1 simultaneously
In being encapsulated into second group of chip 4-2 groove, the encapsulation of four chips on card 1 is so far completed.
Referring to Figure 18-Figure 21, card transition is provided between the end of the groove milling equipment A and the top of sealed in unit B and is turned
Telephone-moving structure j.The end section of the card conveying c-1 of the groove milling equipment A and the card conveying d-1 of sealed in unit B
Initial portion between mutually stagger and with lap, the lap has two station 1a, that is, the overlapping portion
Office can accommodate two cards；The card transition transfer device j is arranged on the lap corresponding position.
Referring to Figure 18-Figure 21, the card transition transfer device j includes handling arm 2a, the vacuum being located in handling arm 2a
Suction nozzle 3a, driving handling arm 2a make vertical drive mechanism 4a of vertical motion and drive handling arm 2a in the card of two equipment
The card transfer actuating unit 5a moved between conveying c-1, d-1；Handling arm 2a and vacuum cups 3a are arranged at institute
State the top of lap corresponding region；The vacuum cups 3a is connected with negative pressure device.In said structure, groove milling equipment A and
The card conveying d-1 of sealed in unit B mutually staggers and overlaps at handing-over position, can shorten the overall length of equipment；And
And card transfer between both devices is also beneficial to, if by card conveying c-1, d-1 of two equipment along directly
Docking, in order to realize smoothly transitting for card, the card feed beat of two equipment needs unanimously, and the debugging difficulty of equipment is big, and on
In stating scheme, the transfer of card only need to be capable of achieving by the way of carrying, the card feed beat of two equipment is without the need for strict conformance.
Specifically, the operation principle of the card transition transfer device j is：Groove milling equipment A's dials card Timing Belt c-2 by its card conveying
Card is delivered to end station by beat, and the card transfer actuating unit 5a drives handling arm 2a and vacuum cups 3a movements
To the top of the end station of groove milling equipment A, the dead time between card is dialled twice in group card Timing Belt c-2 of groove milling equipment A
Interior, vertical drive mechanism 4a drives handling arm 2a and vacuum cups 3a to move down, and vacuum cups 3a contacts card is simultaneously
Card is held under the vacuum suction effect that negative pressure device is produced, subsequently vertical drive mechanism 4a drives handling arm 2a and true
Suction head 3a is moved up, and card transfer actuating unit 5a drives handling arm 2a and vacuum cups 3a to be transferred to sealed in unit
Above the top station of the card conveying d-1 of B, finally the card Timing Belt d-2 that dials in sealed in unit B is dialled twice between card
In dead time, vertical drive mechanism 4a drives handling arm 2a and vacuum cups 3a to move down, and card is transferred to into encapsulation
On the top station of the card conveying d-1 of equipment B, so as to complete the once transfer carrying work of card.
Referring to Figure 18-Figure 21, handling arm 2a includes being located at the has lateral extension arms of bottom and being connected to extending laterally
Upwardly extending vertically extending arm in the middle part of arm, described two vacuum cups 3a are arranged at the two ends of has lateral extension arms；It is described perpendicular
It is connected in vertical drive mechanism 4a to adjutage.
Referring to Figure 18-Figure 21, vertical drive mechanism 4a and card transfer actuating unit 5a are constituted by cylinder, its
In, cylinder body and the card of the corresponding cylinder of vertical drive mechanism 4a shift the expansion link company of the corresponding cylinders of actuating unit 5a
Connect, the expansion link and the vertically extending arm of the corresponding cylinder of vertical drive mechanism 4a.With simple structure, it is easy to peace
Dress, low cost and other advantages.
The course of work of multi-chip contact intelligent card groove milling sealed in unit of the present invention is：
Referring to Fig. 1-Figure 21, in groove milling equipment A, card to be processed is sent by card-issuing module e, and by Timing Belt card machine is dialled
Structure is fed forward card in step mode along card conveying c-1, when card reaches the corresponding milling of groove milling module g
After groove station, chip slot is milled out on card by groove milling module g；The card that groove milling is finished reaches the module of groove milling equipment A, by card
Piece transition transfer device j is transferred in sealed in unit B.
In sealed in unit B, card from Timing Belt dial mechanism for card along card conveying d-1 with step mode to
Front conveying, arrives first at and is packaged in the corresponding encapsulation stations of package module k, and the process of encapsulation is：Two chip belt supplies
Chip tape transport in mechanism drives corresponding chip Tape movement, and is rushed the chip on chip belt by chip blanking mechanism
Go out；Due to two chip belts direction of transfer conversely, therefore two chip blanking mechanisms chip direction differ 180 °, each
The chip that chip blanking mechanism is gone out is just consistent with one group of chip direction to be packaged in card.Card to be packaged is along card
Piece conveying d-1 is first fed into in first encapsulation station, carries out the encapsulation of first group of chip, and chip carries packaging mechanism
It is transported at card simultaneously towards identical chip with first group of chip in the chip that two chip blanking mechanisms are gone out
In being encapsulated into first group of chip slot；Then card is transported in second encapsulation station, carries out the encapsulation of second group of chip, core
Piece is carried in the chip that packaging mechanism goes out chip blanking mechanism and carried towards identical chip with second group of chip
To at card and it is encapsulated in second group of chip slot, so far completes the encapsulation of multiple chips on card.The card of chip is encapsulated
Continue to be fed forward to hot pressing station, by hot pressing module l the chip on card is compressed and heated so that the back of the body on chip
Glue is bonded together with card；The card for finally completing processing reaches collection in receipts card module n.
It is above-mentioned not limited by the above for the present invention preferably embodiment, but embodiments of the present invention, its
He any Spirit Essence and the change, modification, replacement made under principle without departing from the present invention, combine, simplification, should be
The substitute mode of effect, is included within protection scope of the present invention.
Claims (10)
1. a kind of multi-chip contact intelligent card groove milling sealed in unit, it is characterised in that including the groove milling equipment for linking together
And sealed in unit, wherein：
The groove milling equipment includes card transport and the card-issuing module set gradually along card conveying direction and groove milling
Module；
The sealed in unit includes card transport and the package module, the hot-die that set gradually along card conveying direction
Block and receipts card module；
Card transition transfer device is provided between the end of the groove milling equipment and the top of sealed in unit；
The package module includes that chip belt feed mechanism, chip blanking mechanism and chip carry packaging mechanism；Wherein, groove milling
Two encapsulation stations are provided with position corresponding with package module in the card conveying of equipment, are provided with each encapsulation station
Clamping sheet positioning mechanism；The chip belt feed mechanism is two, and each chip belt feed mechanism includes that chip belt and chip belt are passed
Send mechanism；Chip belt in two chip belt feed mechanisms along extending in parallel perpendicular to the direction of card conveying direction, and two
The direction of transfer of the chip belt in individual chip belt feed mechanism is contrary；The chip blanking mechanism is two, each chip punching
Mechanism includes blanking die and the punching executing agency being located at below blanking die；Two cores in two chip belt feed mechanisms
Piece band passes through respectively from below the blanking die of one of chip blanking mechanism.
2. multi-chip contact intelligent card groove milling sealed in unit according to claim 1, it is characterised in that in the groove milling
In equipment, the groove milling module is two, and the whirler for carrying out 180 rotations to card is provided between two groove milling modules
Structure；A chip cleaning mechanism is provided with after each groove milling module.
3. multi-chip contact intelligent card groove milling sealed in unit according to claim 1, it is characterised in that the hot-die
Block is two groups, and the rotating mechanism for carrying out 180 rotations to card is provided between two groups of hot pressing modules.
4. multi-chip contact intelligent card groove milling sealed in unit according to claim 1, it is characterised in that the groove milling sets
Mutually stagger and have between the initial portion of the end section of standby card conveying and the card conveying of sealed in unit
There is lap, the card transition transfer device is arranged on the lap corresponding position；The card transition transfer device bag
Include handling arm, the vacuum cups being located in handling arm, drive handling arm to make the vertical drive mechanism of vertical motion and drive to remove
The card transfer actuating unit that fortune arm is moved between the card conveying of two equipment；The handling arm and vacuum cups set
It is placed in the top of the lap corresponding region；The vacuum cups is connected with negative pressure device.
5. the multi-chip contact intelligent card groove milling sealed in unit according to any one of claim 1-4, it is characterised in that
In multiple chips of card, along the conveying direction of card, the chip positioned at card front end is first group of chip, positioned at rear end
Chip is second group of chip；In described two encapsulation stations, along card conveying direction the first encapsulation station and second are followed successively by
Encapsulation station；In two blanking dies of described two chip blanking mechanisms, along card conveying direction the first punching is followed successively by
Mould and the second blanking die；The direction one of the direction of the chip gone out in first blanking die and first group of chip
Cause, the direction of the chip gone out in second blanking die is consistent with the direction of second group of chip；First punching
Mould is arranged at and the first encapsulation station corresponding position, and on card conveying direction, the punching on first blanking die is located at
With first group of chip package groove corresponding position of the card in the first encapsulation station；Second blanking die is arranged at and the second envelope
Dress station corresponding position, and on card conveying direction, the punching on second blanking die is located at and is encapsulated in station with second
Second group of chip package groove corresponding position of card.
6. multi-chip contact intelligent card groove milling sealed in unit according to claim 5, it is characterised in that in each chip
In blanking mechanism, the executing agency that is punched is including punching support, for chip being rushed into de- punching bar from chip belt, being used for
The punching bar fixed seat of fixed punch chipping and for driving punching bar fixed seat to make vertical reciprocating punching drive mechanism；
The punching drive mechanism includes drive cylinder, fork, driving wheel and driving seat, wherein, the cylinder body hinge of the drive cylinder
It is connected on punching support, the expansion link of the drive cylinder is hinged on the lower end of fork, is hinged in the middle part of fork on punching support,
The upper end of fork connects the driving wheel by rotating shaft；Driver slot is provided with the driving seat, the driving wheel is arranged at driving
It is described to drive the top of seat to be connected with the punching bar fixed seat in groove.
7. multi-chip contact intelligent card groove milling sealed in unit according to claim 1, it is characterised in that two chips punchings
Cut out the punching bar fixed seat in mechanism mutually to press close to arrange, the face of pressing close to of two punching bar fixed seats is to be in card conveying direction
The inclined plane of acute angle；Guide post is provided between the punching bar fixed seat and punching support.
8. multi-chip contact intelligent card groove milling sealed in unit according to claim 7, it is characterised in that two punching bars
Fixed seat is grouped together into rectangle, and the angle pressed close between face and card conveying direction of two punching bar fixed seats is
45 ° so that each punching bar fixed seat is roughly triangular, such that it is able at three turnings pair of punching bar fixed seat of triangle
Should place be respectively provided with a guide post, so as to make full use of punching bar fixed seat in space obtain stable guide effect.
9. multi-chip contact intelligent card groove milling sealed in unit according to claim 1, it is characterised in that in the chip
In band feed mechanism, the chip tape transport includes unused chip belt winding wheel, has used chip belt winding wheel, traction electricity
Machine, traction wheel and chip belt guide rail, wherein, the traction wheel is connected with the main shaft of traction electric machine, and two chip belts supply machine
Traction electric machine in structure is arranged at the not homonymy of card conveying.
10. multi-chip contact intelligent card groove milling sealed in unit according to claim 1, it is characterised in that the chip
Packaging mechanism is carried including encapsulation suction nozzle, for driving the Z axis drive mechanism for encapsulating suction nozzle and moving along Z-direction, for driving Z
X-axis drive mechanism and drive X-axis drive mechanism to drive along the Y-axis that Y direction is moved that axle drive mechanism is moved along X-direction
Mechanism, the encapsulation suction nozzle is connected with negative pressure device.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201610900419.1A CN106601651B (en) | 2016-10-15 | 2016-10-15 | Multi-chip contact type intelligent card milling groove packaging equipment |
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| CN201610900419.1A CN106601651B (en) | 2016-10-15 | 2016-10-15 | Multi-chip contact type intelligent card milling groove packaging equipment |
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| CN106601651B CN106601651B (en) | 2023-06-06 |
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| CN109396512A (en) * | 2018-12-24 | 2019-03-01 | 浙江金泓乐器有限公司 | A kind of integrated processing device of guitar handle |
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| CN109545725A (en) * | 2018-12-27 | 2019-03-29 | 东莞市锐祥智能卡科技有限公司 | A kind of full-automatic take-up packing integral machine |
| CN109766985A (en) * | 2019-03-13 | 2019-05-17 | 楚天龙股份有限公司 | A kind of chip initiation production and processing line of electronics license |
| CN109766985B (en) * | 2019-03-13 | 2024-04-30 | 楚天龙股份有限公司 | Chip initialization production processing line of electronic license |
| CN112216622A (en) * | 2019-07-10 | 2021-01-12 | 广东精毅科技股份有限公司 | Device for sticking chip by cold glue and working method thereof |
| CN112216622B (en) * | 2019-07-10 | 2022-09-30 | 广东精毅科技股份有限公司 | Device for sticking chip by cold glue and working method thereof |
| CN110416138B (en) * | 2019-07-23 | 2024-04-05 | 东莞市锐祥智能卡科技有限公司 | Intelligent card efficient milling groove thread take-up device |
| CN110416138A (en) * | 2019-07-23 | 2019-11-05 | 东莞市锐祥智能卡科技有限公司 | A kind of efficient groove milling wire picking device of smart card |
| CN117352425A (en) * | 2023-09-22 | 2024-01-05 | 昆山同兴达芯片封测技术有限责任公司 | Chip implanter and method of operating the same |
| CN117352425B (en) * | 2023-09-22 | 2024-04-05 | 昆山日月同芯半导体有限公司 | Chip implanter and method of operating the same |
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