KR20190014002A - A method of molding a card type printed circuit board - Google Patents

Abstract

The present invention relates to a method for encapsulating a card-type printed circuit board, the method comprising the following steps: preparing a jig comprising a plurality of holes fitting the shape of a card in which a printed circuit board element is to be inserted, a guide side surrounding the holes, a lower side on which a protective tape is to be placed, and an upper side on which UV resin is to be placed; attaching the protective tape to the lower side of the jig and mounting the printed circuit board element on the hole; applying the UV resin on a portion of the upper side of the jig by pouring the UV resin, placing a PET film for printing on the UV resin, and then flattening the UV resin and attaching the PET film for printing by using a roller at the same time; and applying the UV resin on a portion of the lower side of the jig by pouring the UV resin, placing the PET film for printing on the UV resin, and then flattening the UV resin and attaching the PET film for printing by using a roller at the same time. According to the method of the present invention, a plurality of card-type flexible printed circuit boards can be encapsulated with the UV resin at once and a phenomenon that the surface of the UV resin becomes uneven can be prevented.

Description

[0001] The present invention relates to a method of sealing a card type printed circuit board,

The present invention relates to a method of sealing a card-type printed circuit board, and more particularly, to a method of sealing a card-type printed circuit board more efficiently than the conventional method.

Unlike conventional M / S (Magnetic Stripe) cards, smart cards use 8-bit or 16-bit, 32-bit microprocessors (MPUs) (COS), a security algorithm, and an integrated circuit (IC) card chip in which an EEPROM is embedded as a storage area and can perform various functions, is embedded in a COB (chip on board) form. It is equipped with S / W (application program, OS) based on H / W (memory, CPU) inside the chip, so it is possible to store and operate information on IC card just as many applications can be used by general computer. Because it contains a chip, you can drive complex applications. One of the applications is the electronic money function. Among them, transportation card is the most widely used.

In addition, smart display cards have recently been added to smart cards, one of which is a one-time password (OPT) card that is used instead of a password and resident registration number for security-critical financial services.

Such a multifunction card is equipped with a power supply unit, an MCU, an IC contact unit, a display unit and a switch, and a touch pad and a sensor, if necessary, on a flexible printed circuit board (FPCB) in which an electronic circuit is complicatedly designed. In the present invention, any one including such a configuration will be simply referred to as a circuit board element.

The user must completely encapsulate the flexible printed circuit board (FPCB) element used here to carry and use the card to manufacture the card and display information about the card on the outer surface of the card.

In the related art registration No. 10-0798685 (filed on Jan. 22, 2008), a method of manufacturing a smart display card having a liquid crystal display part that can be rapidly cured by UV resin to maximize the efficiency of the operation is provided have. The method comprises the steps of: punching a synthetic resin sheet with a press so that only the edges remain; Attaching a rim on a transparent synthetic resin base coated with an adhesive; Placing a circuit board within the rim; Applying UV resin to the inside of the rim; Attaching a surface paper, which is a transparent synthetic resin, to the top of the rim; Pressing the surface paper flatly to remove bubbles from the UV resin; Curing the UV resin by irradiating ultraviolet light while placing a substrate, a frame into which UV resin is injected, and a surface paper on a glass plate; Separating the background paper and the surface paper from the rim; And adhering the synthetic resin printing paper to the upper and lower edges of the frame where the components are fixed by the cured UV resin, thereby completing the smart display card.

In this method, a single frame is formed on one synthetic resin sheet to prevent the UV resin from overflowing, and a circuit board element is inserted therein, and only one card is manufactured. Then, the surface of the UV resin layer is covered with a roller, and the bubbles are removed from the UV resin by using a roller thereon, so that the surface may become uneven. Further, in the step of removing the surface paper attached to the cured UV resin and adhering the printing paper, a step of attaching the printing paper to the outline of the card is required. This significantly reduces the productivity of the manufacture.

Another prior art, registration number 10-0875952 (registered on Dec. 18, 2008), describes an electronic card with a display at a low temperature using a dam formed on the edge of the card and a thermosetting resin and a manufacturing method thereof . The method includes applying a curable resin on a first print film and attaching a dam having a predetermined thickness and height; Mounting a flexible PCB, an RFID module and a display formed in the first print film; Injecting a thermosetting resin into the first print film; And covering the second print film on top of the dam and curing the thermosetting resin. Although a plurality of circuit boards can be manufactured by a single process by attaching a plurality of dams on one placement plate, when the curable resin is applied to a predetermined thickness, it should be prevented from flowing over the dam, but adjustment of the resin solution is not easy . When the amount of the resin liquid is small, an empty space is generated. When the amount of the resin liquid is large, overflow occurs. After the application of the resin liquid, bubbles are generated by pushing the dam and the circuit board (FPCB) on the resin liquid, and there is a problem that the surface of the resin liquid becomes uneven.

 In order to solve the drawback that the card is manufactured by the thermocompression bonding method by using the resin liquid in the above-described two prior art documents, there is a risk of damage to the electronic parts. In addition, another prior art registration No. 10-1097065 December 15) uses a semi-cured resin sheet.

Registration number 10-0798685 (registered date January 22, 2008) Registration No. 10-0875952 (Registration date December 18, 2008) Registration number 10-1097065 (Registration date December 15, 2011)

The present invention provides a method for sealing a circuit board element in a smart card that overcomes the disadvantages of the prior art and can maintain its merits. It is an object of the present invention to encapsulate a plurality of circuit board elements in a single process, The present invention provides a method of encapsulating a card-type printed circuit board, which can prevent development and prevent damage to electronic parts.

In addition, the present invention provides a method of sealing a card-type printed circuit board in a simpler manner.

The present invention also provides a method in which a part of a jig is cut together to form an outer surface during CNC machining, thereby providing excellent reliability of the product.

In order to achieve the above object, there is provided a method of sealing a card-type printed circuit board according to the present invention, comprising: a plurality of holes corresponding to a card shape into which a printed circuit board element is to be inserted; a guide surface surrounding the holes; And a top surface on which the UV resin is to be laid, a step of attaching a protective tape to the lower surface of the jig and mounting a printed circuit board element on the hole, a step of applying a UV resin onto one side of the jig A step of flattening the UV resin while adhering the printing PET film by using a roller by placing a printing PET film thereon and applying a UV resin to one side of the lower surface of the jig to apply the printing PET film, And flattening the UV resin while attaching the printing PET film by using a roller.

The circuit board element is provided with a support on the opposite side to which the electronic component is mounted. In the outer frame of the jig, the UV resin liquid covers the hole of the jig and overflows to the upper surface, but does not exceed the outer edge of the jig.

In a preferred embodiment, the step of planarizing the UV resin is such that the UV resin liquid completely covers the front and back surfaces of the printed circuit element, but does not completely cover the entire surface of the jig.

In a preferred embodiment, the thickness of the guide surface of the jig is greater than the thickness of the printed circuit board.

In a preferred embodiment, the step of curing the UV resin by irradiating UV light, the step of printing on the PET film for printing, and the step of cutting the printed circuit board element sealed with a part of the guide surface of the jig to form an outer surface, And cutting the containing card.

In a preferred embodiment, the method further comprises the step of contacting terminals in contact with the circuit board element.

When a card-type flux-sealable printed circuit board is sealed with UV resin, it can be done several times at once, preventing the rugged surface of the UV resin surface and providing a more convenient method. Also, part of the jig is cut together when forming CNC to form the outer surface, which is more reliable than the existing UV liquid product.

1 is a perspective view showing one jig used in a preferred embodiment of the present invention.
Fig. 2 is a view showing the sequential sealing method of the circuit board element in the preferred embodiment of the present invention. Fig.
3 is a view for explaining a method of applying the UV resin liquid 30.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings, which will be readily apparent to those skilled in the art to which the present invention pertains. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

In order to clearly illustrate the present invention, parts not related to the description are omitted, and the same or similar components are denoted by the same reference numerals throughout the specification.

It is to be understood that both the foregoing general description and the following detailed description of the present invention are exemplary and explanatory and are intended to provide further explanation of the invention as claimed. .

Referring first to Fig. 1, there is shown one jig used in the preferred embodiment of the present invention. Below is a cross-sectional view cut in the direction of the arrow. The jig 10 is made of a plastic material and has a plurality of holes 11 corresponding to the card shape, preferably four holes are formed in the figure, and a guide surface 12 surrounding the holes is formed. A lower surface 14 and an upper surface 13 on which the UV resin is to be placed. The overall shape of the jig 10 is preferably rectangular. The jig 10 is formed with four outer side edges 19 on the four sides of the jig 10 so that the resin liquid 30 covers the upper surface of the jig 10 when the resin liquid 30 is put on the roll, It is wide enough not to cloud. The thickness T of the guide surface 12 is made slightly larger than the thickness of the card-shaped circuit board element. For example, if the thickness of the circuit board element is 0.4 to 0.5 mm, the height or thickness of the guide surface 12 is about 0.4 to 0.6 mm. The circuit board element 20 can be completely sealed because the thickness T of the guide surface 12 is slightly thicker than the thickness of the card-like circuit substrate element. Even when the UV resin is pressed by the roller in the subsequent planarization step The rollers do not come into contact with the electronic components of the circuit board element, thereby preventing damage thereto.

Next, FIG. 2 shows a process in which the circuit board element 20 is seated on the jig 10 shown in FIG. 1 and a final card is manufactured. Only one of the four holes 11 of the present invention is selected and shown.

2A, the circuit board element 20 is shown in a state where the circuit board element 20 is seated in the guide surface 12 formed in four holes 11 in the middle, and is a cross-sectional view of the circuit board element 20 in the bottom. A state in which the protective tape 15 is attached to the lower surface 14 of the jig 10 of the present invention and the circuit board element 20 is seated on the upper surface 13 of the jig. The substrate 20 is mounted with a support 60 on one side for mounting electronic components and the other for supporting a substrate 20. A space is formed in the space between the lower surface 14 and the guide surface 12 so that the UV resin liquid 30 can enter. The support 60 will later serve as a support for the cured UV resin liquid 30.

The next step is to encapsulate the front surface of the circuit board element 20 so that the UV resin liquid 30 is poured into one side of the upper surface 13 of the jig 10 to be coated and then the printing film 40 is covered, The UV resin liquid 30 penetrates between the electronic components and the wirings mounted on the circuit board to seal them, and the circuit board element is completely covered and the thickness (d) of about 0.1 mm from the guide surface 12 The surface of the UV resin liquid is flattened by using a roller. Here, the electronic component includes a liquid crystal display part, a battery, a chip, a CPU, a communication device, and the like. The UV resin liquid 30 is applied and planarized so as to completely cover the upper surface 13 having the holes 11 in the jig 10 and the UV resin liquid 30 flowing over the guide surface 12 is applied to the surface of the jig 10 And flows down to the upper surface 13. Therefore, the UV resin liquid 30 can be applied to the upper surface 13 of the hole 11 without generating any bubbles. The UV resin liquid 30 is transparent, but shown in diagonal lines in FIG. 3, since the UV resin liquid 30 flows down from the upper surface 13 of the jig but does not flow over the entire upper surface of the jig 10, the problem caused by overflow of the UV resin liquid can be prevented, Is convenient. Further, since no bubbles are formed and uneven surfaces are not formed, it is not necessary to press the UV resin liquid 30 with a strong force, so that an unnecessary force is not applied to the electronic component, and damage to the electronic component can be prevented.

The UV resin liquid 30 is flattened while the UV resin liquid 30 is applied to one side of the upper surface 13 of the jig 10 and the printing PET film 40 is adhered thereto using a roller so that the operation is convenient . The state after this step is shown in Fig. 2B.

Next, the step of planarizing the UV resin liquid 30 while applying the back surface of the circuit substrate element 20 with the UV resin liquid 30 'and attaching the printing PET film 40' thereon. In this step, the process of the front surface of the circuit board element 20 is completed, the jig 10 is turned over, the protective tape attached thereto is removed, and the same process as that in the front surface of the circuit board element 20 is performed thereon. The processes in this step are the same as the processes in the front side, so they are omitted. The state in which the PET film 40 'for printing is attached to the back side of the circuit substrate element 20 is shown in FIG. 2C. And irradiating UV light in this state to cure the UV resin liquids 30 and 30 '.

And printing on the PET film for upper and lower printing after the UV resin liquid 30 is completely cured. The state in which the printing step is completed, that is, the state in which the printing layers 50 and 50 'are formed is shown in Fig. The printing PET film 40 placed on the jig 10 is printed in accordance with the shape of the card, so that there is no need to manufacture and attach a separate printing paper.

And finally, if four cards are formed in the jig 10, it includes a step of cutting the card by CNC machining. Since the outer surface of the card is processed by a single cutting process, the outer surface of the card is also beautiful, and a part of the guide surface 11 of the jig 10 is also cut together to form the outer surface of the card. outstanding.

In a preferred embodiment, a contact terminal (not shown) that is in electrical contact with the circuit board element 20 inside the guide surface during CNC machining can also be machined. For example, a terminal that can charge the internal battery can be machined on the side of the card.

Although the present invention has been described based on the preferred embodiments, it is intended to exemplify the present invention. Those of ordinary skill in the art will recognize that the embodiments may be modified or modified in other forms. However, since the scope of the present invention is defined by the appended claims, such variations and modifications can be construed as being included in the following claims.

10: Jig
11: Hall
12: Guide face
13: upper surface
14: When you
15: Protective tape
20: Circuit substrate element
30, 30 ': UV resin
40, 40 ': PET film for printing
50, 50 ': Printed layer

Claims (5)

A method of sealing a card-type printed circuit board,
Preparing a jig including a plurality of holes corresponding to a card shape into which a printed circuit board element is to be inserted, a guide surface surrounding the holes, a lower surface on which the protective tape is to be placed,
Attaching a protective tape to a lower surface of the jig and mounting a printed circuit board element on the hole,
The jig was turned over and the protective tape attached to the lower surface was removed, and UV resin was poured into one side of the upper surface of the jig, and the PET film for printing was placed thereon. , ≪ / RTI >
Applying a UV resin to one side of the lower surface of the jig and applying the UV resin to the lower surface of the jig, placing a printing PET film thereon, and flattening the UV resin while adhering the printing PET film using a roller,
Wherein the circuit board element is provided with a support on the opposite side to which the electronic component is mounted,
Wherein the outer edge of the jig covers the hole of the jig and overflows to the upper surface but does not exceed the outer edge of the jig. The method according to claim 1,
Wherein the step of planarizing the UV resin is such that the UV resin liquid completely covers the front and back surfaces of the printed circuit element but does not completely cover the entire surface of the jig. The method according to claim 1,
Wherein the guide surface of the jig is thicker than the thickness of the printed circuit board. The method according to claim 1,
A step of curing the UV resin by irradiating UV light, a step of printing on the PET film for printing, and a step of cutting a card including a printed circuit board element which is sealed together with a part of the guide surface of the jig to form an outer surface The method further comprising the step of: The method according to claim 1,
And providing a contact terminal in contact with the circuit board element inside the guide surface.

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