JPH10302040A - Manufacture of thin type electronic equipment and thin type electronic equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To thin the whole without inviting the generation of defective items by sticking an exterior sheet to a packaging sheet by an adhesive material, hardening the adhesive material and joining and fixing the respective sheets. SOLUTION: An IC chip is positioned to the device hole of the packaging sheet and the IC chip is buried in the device hole and held by the adhesive surface of an adhesive sheet. An antenna coil is adhered to the upper surface of the packaging sheet and both ends of the antenna coil are connected to the IC chip. A releasing sheet is supplied to the upper surface of the packaging sheet by a releasing sheet roll and laminated to thermosetting resin on the upper surface of the packaging sheet and the thermosetting resin applied to the packaging sheet is heated and hardened. Then, a front exterior sheet 32 and a back exterior sheet 33 are laminated on the upper surface and lower surface of the packaging sheet and carried to a heating part 35, the adhesive material 43 is heated and they are joined and fixed. The joined and fixed three- layer sheets 32 and 33 are punched to the IC card of a prescribed shape in a punching process.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a thin electronic device formed by punching out a plurality of bonded sheets and a thin electronic device.

[0002]

2. Description of the Related Art Recently, IC cards having built-in IC chips as electronic parts have been used in various fields as thin electronic devices. In such an IC card, an IC chip is mounted on a resin mounting sheet, the IC chip is sealed with a resin, and an exterior sheet is bonded and fixed to the mounting tape. The IC card having a predetermined shape is punched out of the sheet.

In the case of manufacturing an IC card having the above structure, it is required that a mounting sheet and an exterior sheet are bonded and fixed with high strength. Conventionally, to bond and fix the mounting sheet and the exterior sheet, an adhesive is applied to one of the sheets, and two sheets are attached to each other. The predetermined bonding strength was obtained by pressurizing the joint.

[0004] In order to press the two joined sheets,
Usually, a pressure roller is used. In that case, if dust is attached to the outer surface of the sheet or the outer peripheral surface of the pressure roller,
Since the dust is strongly pressed against the outer surface of the sheet by the pressure roller, the outer surface of the sheet may be damaged. There are cases where various characters, pictures, and the like are printed on the outer surface of the sheet in advance, and in such a case, the printed state is impaired.

[0005]

As described above, in the conventional IC card as a thin electronic device, when the mounting sheet and the exterior sheet are joined and fixed, an adhesive is applied to one of the surfaces. Was applied, and these sheets were attached to each other and then pressed to obtain a predetermined bonding strength. Therefore, when the pressure was applied, there was a gap between the pressure roller and the outer surface of the sheet. If dust is present, the dust may damage the outer surface of the sheet. SUMMARY OF THE INVENTION It is an object of the present invention to provide a method of manufacturing a thin electronic device and a thin electronic device which can avoid applying a strong pressing force to a plurality of joined sheets.

[0006]

According to a first aspect of the present invention, in a method of manufacturing a thin electronic device formed by bonding a plurality of sheets, an electronic component is inserted into a device hole formed in a mounting sheet. A mounting step of mounting and electronically sealing the electronic component, and laminating a predetermined thickness by bonding an exterior sheet to one side and the other side of the mounting sheet with an adhesive.
A bonding step of forming a sheet body, a fixing step of curing the adhesive and bonding and fixing the mounting sheet and the package sheet, and a bonding step of bonding and fixing the package sheet and the package sheet.
And a punching step of punching the thin electronic device having a predetermined shape from the device.

According to a second aspect of the present invention, there is provided a method for manufacturing a thin electronic device formed by bonding a plurality of sheets, wherein a mounting step of mounting an electronic component on a mounting sheet and sealing the electronic component with a resin. A bonding step of bonding an exterior sheet to the mounting sheet with an adhesive in synchronism with the transport of the mounting sheet to form a laminate having a predetermined thickness, and curing the adhesive. A fixing step of bonding and fixing the mounting sheet and the exterior sheet; and mounting and fixing the mounting sheet.
A punching step of punching the thin electronic device having a predetermined shape from the sheet and the exterior sheet.

According to a third aspect of the present invention, in a method for manufacturing a thin electronic device formed by bonding a plurality of sheets, an electronic component is mounted in a device hole formed in a mounting sheet, and the electronic component is mounted. A mounting step of resin-sealing with an adhesive resin, and bonding an exterior sheet to the surface of the mounting sheet sealed with the adhesive resin in synchronization with the conveyance of the mounting sheet. And a punching step of punching the laminated body to a predetermined size.

The invention according to claim 4 is the invention according to claims 1 to 3.
In the invention described in any one of the above, in the mounting step, a material that restricts fluidity is added to the resin.

A fifth aspect of the present invention is characterized in that, in the fourth aspect of the present invention, the resin used in the mounting step is a resin which is cured by heat or ultraviolet rays. According to a sixth aspect of the present invention, in the first or second aspect, the adhesive used in the bonding step is:
It is a resin that is cured by heat or ultraviolet light.

According to a seventh aspect of the present invention, in the second aspect of the present invention, in the mounting step, the electronic component mounted on the holding sheet piece having a predetermined size in advance is mounted together with the holding sheet piece. It is characterized in that it is mounted on a sheet.

The invention according to claim 8 is that the electronic component is locked in the device hole and is packaged at a predetermined position on both sides of the mounting sheet conveyed in a predetermined direction in synchronization with the conveyance of the mounting sheet. A laminating step of laminating the sheets to form a laminated body having a predetermined thickness, and a punching step of punching the laminated body formed in the laminating step to a predetermined size. .

According to a ninth aspect of the present invention, there is provided a thin electronic device formed by laminating a plurality of sheet pieces, having a device hole, wherein the electronic component is mounted in the device hole and the electronic component is mounted. A resin-sealed mounting sheet piece;
An exterior sheet that is bonded to one surface and the other surface of the mounting sheet piece with an adhesive to form a laminated body.
And a contact piece.

According to a tenth aspect of the present invention, there is provided a thin electronic device formed by laminating a plurality of sheet pieces, wherein the electronic parts are mounted and the electronic parts are resin-sealed. And an exterior sheet piece bonded to the resin-sealed surface of the mounting sheet piece with an adhesive to form a laminated body.

According to an eleventh aspect of the present invention, there is provided a thin electronic device formed by laminating a plurality of sheet pieces, having a device hole, wherein the electronic component is mounted in the device hole and the electronic component is mounted. A mounting sheet piece resin-sealed with an adhesive resin, and a laminate body bonded to one surface and the other surface of the mounting sheet piece with the adhesive resin, respectively. And an exterior sheet piece to be formed.

According to a twelfth aspect of the present invention, in a thin electronic device formed by bonding a plurality of sheet pieces, the electronic component is mounted and the electronic component is resin-sealed with an adhesive resin. Mounting sheet piece and this mounting sheet
And an exterior sheet piece bonded to the surface of the piece sealed with the resin having the adhesive property by the resin having the adhesive property to form a laminated body.

According to the first aspect of the present invention, when a thin electronic device having a three-layer sheet structure is manufactured, an exterior sheet is attached to a mounting sheet with an adhesive to have a predetermined thickness. Lamine
Each sheet is joined and fixed by forming a sheet body and then curing the adhesive, so that these sheets can be firmly joined and fixed without applying a large pressing force to the bonded sheets. In addition, since electronic components are provided in the device holes,
The whole can be reduced in thickness.

According to a second aspect of the present invention, when manufacturing a thin electronic device having a multi-layered sheet structure, an exterior sheet is adhered to a mounting sheet with an adhesive to form a laminate having a predetermined thickness. Each body is formed by curing the adhesive and then curing the adhesive.
Since the sheets are joined and fixed, these sheets can be joined and fixed firmly without applying a large pressing force to the bonded sheets.

According to the third aspect of the present invention, the electronic component mounted in the device hole of the mounting sheet is resin-sealed with a resin having an adhesive property, and the exterior sheet is formed using the resin. Since the bonding is performed, only one application of the resin is required to perform the resin sealing of the electronic component and the bonding of the exterior sheet.

According to the fourth aspect of the present invention, when the electronic component is sealed with a resin in the mounting step, the resin applied at the time of sealing is added to the resin by adding a material that restricts fluidity to the resin. Can be prevented from flowing to portions other than the above-mentioned portion.

According to the fifth and sixth aspects of the present invention, in the mounting step, the use of an adhesive which is cured by heat or ultraviolet rays makes it possible to form a large laminated body without applying pressure. Can be.

According to the present invention, the electronic component is mounted on the holding sheet piece having a predetermined size, and then the mounting sheet is mounted.
In this case, the mounting work can be performed efficiently.

According to the eighth aspect of the present invention, since the step of forming the laminate and the step of punching the electronic component can be performed continuously, the productivity of the thin electronic device can be improved. According to the ninth aspect of the present invention, in a thin electronic device having a three-layer sheet structure, a mounting sheet piece and an exterior sheet piece are bonded with an adhesive to form a thin electronic device. -The sheet piece and the exterior sheet piece can be configured so as not to be easily scratched, and the mounting sheet piece has a device hole for mounting an electronic component. It becomes possible.

According to the tenth aspect of the present invention, in a multi-layer sheet electronic device, a thin electronic device is formed by bonding a mounting sheet piece and an exterior sheet piece with an adhesive. A configuration in which the mounting sheet piece and the exterior sheet piece are not easily damaged can be provided.

According to the eleventh and twelfth aspects of the invention,
Since the electronic components mounted on the mounting sheet piece are sealed with an adhesive resin, an adhesive is applied when the exterior sheet piece is laminated on the mounting sheet piece. Since it is possible to perform lamination without using any other material, the manufacturing process can be simplified.

[0026]

Embodiments of the present invention will be described below with reference to the drawings. 1 to 6 show a first embodiment of the present invention.
An embodiment will be described. FIG. 5 shows a flow chart for manufacturing an IC card C1 (shown in FIG. 6) as a thin electronic device having a three-layered sheet structure. It can be roughly divided into a bonding step and a punching step.

In the mounting step, first, a sheet punching step indicated by S1 is performed. In this sheet punching step S1, FIG.
As shown in (a), device holes 13 for embedding IC chips 12 as electronic components are mounted in a matrix at predetermined intervals on a mounting sheet 11 made of synthetic resin such as vinyl chloride. In this embodiment, the size of one mounting sheet 11 is set to 1 m in length and 350 mm in width, so that 85
IC card C1 of standard size of mm x 54mm, 6 rows, 10 rows
Be able to make in rows.

After the device hole 13 is formed in the mounting sheet 11, the mounting sheet 11 is formed as shown in FIG.
An adhesive sheet 14 is attached to the lower surface of the substrate. Thereby, the adhesive sheet 14 is provided on the inner bottom surface of the device hole 13.
The adhesive surface of is exposed. This step is indicated by S2 in FIG. If the IC chip 12 inserted into the device hole 13 is fitted into the device hole 13 so as not to come off the mounting sheet 11, the adhesive sheet 14 is unnecessary.

Next, as shown in S3 of FIG. 5 and FIG. 1C, the IC chip 12 is aligned with the device hole 13 of the mounting sheet 11, and then S4 and FIG.
The IC chip 12 is buried in the device hole 13 and held by the adhesive surface of the adhesive sheet 14 as shown by. As the embedding method, there is a method of inserting the IC chips 12 one by one into the device holes 13 or a method of simultaneously inserting a plurality of IC chips.

After the IC chip 12 is embedded in the device hole 13 of the mounting sheet 11, the antenna coil 15 is bonded to the upper surface of the mounting sheet 11 at step S5 and as shown in FIG. Connect both ends of the antenna coil 15 to the I
Connect to C chip 12. FIG. 2 is a plan view of the mounting sheet 11 to which the antenna coil 15 is attached.

Depending on the frequency band used by the IC card C1, the antenna coil 14 may be mounted on the mounting sheet 1.
It is also possible to form a print on the upper surface of the mounting sheet 1. In this case, the step of attaching the antenna coil 15 to the mounting sheet 11 with an adhesive is not required, so that productivity can be improved.

When the mounting of the antenna coil 15 is completed, resin sealing shown in S6 is performed. This resin sealing is shown in FIG.
Is performed by a resin sealing device 21 shown in FIG. The resin sealing device 21 is provided with a transport roller for transporting the mounting sheet 11.
A pair of upper and lower heating rolls 23 for heating while transporting the mounting sheet 11 is provided on the downstream side in the transport direction of the transport roll 22 in the transport direction. They are arranged at predetermined intervals in the direction.

A release sheet 24 is disposed downstream of the transfer roll 22 and upstream of the release sheet 24 so as to face the upper surface of the mounting sheet 11. Die coater 25
Is arranged.

A thermosetting resin 26 is supplied from the die coater 25 to the upper surface of the mounting sheet 11 in a curtain form, and the release sheet 24 is mounted on the mounting sheet 11. The release sheet 27 is supplied to the upper surface to which the thermosetting resin 26 is supplied.

The thermosetting resin 26 is made of a mixture of, for example, a bisphenol A epoxy resin, a zirconic phenol resin, a latent catalyst and a filler.
100 μm, viscosity 10 to 30 Pa, application temperature ≦ 100 ° C.

The latent catalyst activates the thermosetting resin when the thermosetting resin 26 is heated to a predetermined temperature or more, for example, 120 ° C. or more, and starts a thermosetting reaction. The filler is made of silica or the like. This is for setting the viscosity of the thermosetting resin 25 before being heat-cured, and is set to a viscosity that can maintain a predetermined film thickness in a state of being applied to the upper surface of the mounting sheet 11. It has hardening to prevent shrinkage and flatness of thermosetting resin.

As shown in FIG. 3, when the mounting sheet 11 is transported by the transport roller 22, a thermosetting resin 26 is supplied to the upper surface thereof from the die coater 25 with a predetermined thickness. . Next, the release sheet 27 is supplied to the upper surface of the mounting sheet 11 by the release sheet 24, and the mounting sheet 11 is mounted.
Is laminated on the thermosetting resin 26 on the upper surface of the substrate 11.
This step is shown in FIG. The release sheet 27 is provided with a heating roll 23 for improving the smoothness of the resin 26 described later.
This is to prevent the resin from adhering to the substrate.

The mounting sheet 11 on which the release sheet 27 is laminated is conveyed to the heating roll 23. This heating ro
In the mounting sheet 23, the release sheet 27 is laminated.
The thermosetting resin 26 is heated to 120 ° C. or more and cured while maintaining the thickness and smoothness of the thermosetting resin 26 while holding the thermosetting resin 11 therebetween. This step is indicated by S8 in FIG.

When the thermosetting resin 26 applied to the mounting sheet 11 is cured by heating, the mounting process is completed. I
The top and bottom exterior sheets 32 and 33 are attached to the upper and lower surfaces of the mounting sheet 11 on which the mounting of the C chip 12 has been completed by a bonding apparatus 31 shown in FIG. Note that the release sheet 27 is peeled off before bonding is performed.

Before being supplied to the bonding apparatus 31, an image forming layer is formed by printing on the front exterior sheet 32 as shown by S9, and a character is formed on the back exterior sheet 33 by S10 as shown by S10. The recording layer is printed.

The laminating device 31 has a laminating section composed of a pair of laminating rolls 34a and a heating section 35 composed of a plurality of pairs of heating rolls 34 forming two pairs. The front and outer sheets 32 and 33 are supplied to the unit by a first transport roll 36 and a second transport roll 37, respectively. Further, the mounting sheet 11 is provided by a third transfer roll 38. Note that the mounting sheet 11 is a release sheet 2
7 is peeled off and supplied.

[0042] The surface and exterior sheets supplied to the bonding section
S11 on the inner surface of the rear exterior sheet 33 and the inner surface of the back exterior sheet 33, respectively.
As shown in S12, a thermosetting adhesive 43 is supplied and applied from the first adhesive coater 40A and the second adhesive coater 40B.

The front exterior sheet 32 and the back exterior sheet 33
Is aligned with the mounting sheet 11 as shown in S13. In addition, the positioning is performed by the front and outer sheet 32.
This is particularly necessary when the processing such as printing has already been performed on the front and back exterior sheets 33, but particularly when the front and rear exterior sheets 32 and 33 have not been processed. It is not necessary that the position of each sheet in the width direction be shifted.

Next, as shown in S14, the front exterior sheet 32 and the back exterior sheet 33 are bonded to the upper surface and the lower surface (one side surface and the other side surface) of the mounting sheet 11 by a reel 34a. Laminated to form a laminated body of a predetermined thickness,
After that, it is supplied to the heating unit 35 and is conveyed by being passed between a plurality of pairs of heating rolls 34 of the heating unit 35, so that S
The adhesive 43 is heated as shown at 15. As a result, the adhesive 43 is hardened, so that the front exterior sheet 32 and the rear exterior sheet 3 are provided on the upper and lower surfaces of the mounting sheet 11.
3 is fixedly joined.

By mounting and fixing the front exterior sheet 32 and the rear exterior sheet 33 to the mounting sheet 11 with a thermosetting adhesive 43, 3
Bonding and fixing can be performed without applying a large pressure to 2, 33. That is, a pair of bonding rolls 34a
In this method, the gap between the rolls is adjusted such that the front exterior sheet 32 and the rear exterior sheet 33 are attached to each other so that the laminated body has a predetermined thickness.

Therefore, even if dirt or the like adheres to the outer surface of the front and outer sheets 32 and 33 or the outer peripheral surface of the heating roll 34, the debris is removed. Since the outer surfaces of the outer sheets 33 are not strongly pressed, the outer surfaces of the sheets 32 and 33 are hardly damaged by dust or the like. Moreover,
The prints formed on the outer surfaces of the sheets 32 and 33 are not damaged.

The three-layer sheets 11, 32, and 33 joined and fixed as described above are punched into an IC card C1 having a predetermined shape in a punching step shown in S16, and then subjected to a visual inspection as shown in S17. By doing so, the manufacturing process ends,
After that, the IC card C1 is initialized to produce a product.

The IC card C1 is a mounting sheet piece 11A punched from the mounting sheet 11 as shown in FIG.
And a front exterior sheet piece 32A punched from the front exterior sheet 32 and a back exterior sheet piece 33A punched from the back exterior sheet 33. Note that an adhesive tape piece 11A is attached to the mounting sheet piece 11A.

The IC chip 12 is mounted on the mounting sheet 11A.
Embedded in the device hole 13. Therefore, IC
The card C1 can be reduced in thickness as much as the IC chip 12 is embedded in the mounting sheet 11A.

Further, the front exterior sheet 32 and the rear exterior sheet 33 are attached to the mounting sheet 11 with a thermosetting adhesive 43.
Since the IC card C1 is formed by adhesive bonding, the exterior sheets 32 and 33 are prevented from being damaged during the bonding and fixing. As a result, the surface of the IC card C1 stamped and formed from the laminated three-layer sheet is hardly damaged.

In the first embodiment, in the case where the front exterior sheet 32 and the rear exterior sheet 33 are bonded to the mounting sheet 11 by the bonding device 31, the mounting sheet 1 is used.
The adhesive 43 may be supplied and applied to both upper and lower surfaces (both side surfaces).

In this case, the application of the adhesive 43 to the surface of the mounting sheet 11 in contact with the third transport roll 38 is performed downstream of the third transport roll 38. Further, at this time, if a resin having adhesiveness is used instead of the adhesive 43, the sealing step of the resin 26 shown in FIG. That is, the IC chip 1 is attached to the mounting sheet 11.
2 is held without using the adhesive sheet 14, and in this state, a sealing resin having an adhesive property is applied to both surfaces of the mounting sheet 11 so that the front and outer sheets 32 and the back and outer sheets are provided. Laminate 33
May be used.

FIGS. 7 to 9 show a second embodiment of the present invention. The second embodiment is an IC car shown in FIG.
C2 is replaced with a front exterior sheet piece 41A and a rear exterior sheet piece 42A.
And a two-layer sheet structure. That is, as shown in FIG.
Mounted on the inner surface of the sheet 41,
Of the resin sealing device 2 similar to that of the first embodiment.
1 and sealed with a thermosetting resin 26. In addition,
7, the same parts as those in the first embodiment shown in FIG. 3 are denoted by the same reference numerals, and description thereof will be omitted.

The front and outer sheet 41, on which the IC chip 12 is mounted and the IC chip 12 is sealed with the thermosetting resin 26, is attached to the inner surface of the front and outer sheet 41 by a bonding apparatus 31A shown in FIG. G is fixedly connected. Similar to the bonding apparatus 31 of the first embodiment, the bonding apparatus 31A has a bonding section having a pair of bonding rolls 34a and a plurality of pairs of heating rolls. A heating unit 35 comprises a heating unit 35, and a front and exterior sheet 41 is supplied to the bonding unit by a first transport roll 36, and a back and exterior sheet 42 is supplied to a second transport roll. 37.

A thermosetting adhesive 43 is supplied and applied by an adhesive coater 45 to the inner surface of the back exterior sheet 42 supplied to the bonding roll 34a. After the front exterior sheet 41 and the rear exterior sheet 42 are aligned (position corrected) with each other, the inner surfaces of the front exterior sheet 41 and the rear exterior sheet 42 are joined to each other via an adhesive 43 by a bonding roll 34a. The adhesive 43 is heated by being adhered to the heating section 35, being supplied to the heating section 35, and being conveyed between the heating rollers 34 forming a pair of the heating section 35.

It is to be noted that the alignment is particularly necessary when the front exterior sheet 41 and the back exterior sheet 42 have already been subjected to processing such as printing. If not, there is no particular need for alignment,
It is only necessary that there be no deviation from each other in the width direction.

As a result, the adhesive 43 is hardened, so that the inner surface of the front exterior sheet 41 and the inner surface of the rear exterior sheet 42 are joined and fixed, and finally the sheet I having a predetermined pressure is formed.
A C card C2 is formed.

The two-layer sheets 41 and 42 thus joined are strongly pressed by bonding the above-mentioned outer package sheet 41 and back package sheet 42 using a thermosetting adhesive 43. It can be fixed without joining. The adhesive 43
May be applied to the inner surface of the front exterior sheet 41 instead of the back exterior sheet 42.

Therefore, even if dirt or the like adheres to the outer surfaces of the sheets 41 and 42 and the outer peripheral surface of the heating roll 34, the dirt or the like may damage the surfaces of the sheets 41 and 42. Therefore, the sheets 41 and 42 can be joined and fixed.

From the bonded and fixed front exterior sheet 41 and back exterior sheet 42, the I
A C card C2 is stamped and formed, and is subjected to an appearance inspection and an initialization process to become a product. When the front exterior sheet 41 and the back exterior sheet 42 which have not been subjected to printing or the like are used, they can be punched in a card form and then printed on the surface. After laminating the front exterior sheet 41 and the back exterior sheet 42, a process such as printing may be applied to the punched eyes.

The IC card C2 is a sheet 41 of the front and outer sheets.
By mounting the IC chip 12 on the inner surface of A, a two-layer sheet structure of the front exterior sheet piece 41A and the back exterior sheet piece 42A can be obtained. That is, the front and outer sheet pieces 41A
Can also be used for the mounting sheet piece 11A shown in the first embodiment. Therefore, the number of sheets can be reduced by one sheet as compared with the IC card C1 having the three-layered sheet structure shown in the first embodiment. Not only can it be achieved, but also the labor for manufacturing the mounting sheet 11 can be omitted, so that the cost can be reduced.

In the second embodiment, the IC chip 12 and the antenna coil 15 are mounted on the inner surface of the front exterior sheet 41, but may be mounted on the inner surface of the rear exterior sheet 42. The electronic component may be mounted on the inner surface of one of the two sheets, and the adhesive 43 may be applied to the inner surface of the unmounted sheet. That is, one of the exterior sheets on which the electronic components are mounted is also used as a mounting sheet.

In the second embodiment, the mounting of the electronic components is not performed directly on the inner surface of the front exterior sheet 41 or the rear exterior sheet 42, but as shown in FIG. The IC chip 12 and the antenna coil 14 are attached to the holding sheet piece 45 in advance, and the holding sheet piece 45 is attached.
May be mounted on the inner surface of the front exterior sheet 41 or the back exterior sheet 42.

If such a holding sheet piece 45 is used, the front exterior sheet 41 or the back exterior sheet 42 is used.
In contrast, the mounting of electronic components can be performed easily and reliably via the holding sheet 45, so that productivity can be improved.

The present invention is not limited to the first embodiment and the second embodiment but can be variously modified. For example, in each of the above embodiments, a thermosetting resin is used as a resin for encapsulating an electronic component mounted on a mounting sheet, and the resin is cured by a heating roll. Instead, a hot melt resin that cures at a predetermined temperature or lower, or an ultraviolet curable resin that cures by irradiating ultraviolet light may be used.

As a means for heating and curing the thermosetting resin, a heating furnace may be used instead of a heating roll. Further, in the first embodiment, an adhesive for adhering the front exterior sheet and the rear exterior sheet to the mounting sheet, or in the second embodiment, the front exterior sheet and the rear exterior sheet. A hot-melt resin or an ultraviolet curable resin may be used as the adhesive for adhering the resin.

When an ultraviolet-curable sealing resin or adhesive is used, heat is not applied to each sheet when the resin or adhesive is cured, so that heat distortion occurs in each sheet. Can be prevented.

In the first and second embodiments,
After sealing the mounting sheet 11 with the resin 26, an adhesive 43 is further applied to bond the front and back exterior sheets and the back exterior sheet, but if the resin 26 has an adhesive action. , Adhesive 43
Does not need to be applied again, the first embodiment eliminates the need for one of the adhesive coaters 40A and 40B, and the second embodiment eliminates the need for the adhesive coater 45. Also,
As the resin having this adhesive property, a resin which is cured by heat or ultraviolet rays is used.

In each of the above embodiments, the type in which the IC chip is embedded in the IC card has been described. However, the IC with contacts in which a part of the IC chip is exposed on the surface is described.
The present invention can be applied to a card. In this case, after the bonding step of bonding the front and exterior sheets and the back and back sheets, a mounting step of mounting the IC chip in the device hole seated on the front and outer sheets is performed. become. Alternatively, make holes in the front and exterior sheets in advance,
After the holes and the device holes are aligned and bonded, an IC chip may be mounted.

FIG. 11 shows a third embodiment of the present invention. In this embodiment, in FIG. 7 of the second embodiment, the IC chip 12
When the electronic components are sealed with a thermosetting resin 26 having an adhesive function after mounting the antenna coil 15 and the backing sheet 42 instead of the release sheet 27 on the sealing surface, the back package sheet 42 is supplied. Then, the front exterior sheet 41 and the rear exterior sheet 42 are bonded to each other by adjusting the gap between the rollers 24 and 22 adjusted to a predetermined gap, and the rear exterior sheet 42 is joined. The above-mentioned thermosetting resin 26 having an adhesive action is heated by a heating roller 2.
Adhesion and fixation by heating and curing in step 3
Is formed. At this time, the resin 26 is placed on the front exterior sheet 4.
One having an effect of bonding the back sheet 1 to the back exterior sheet 42 is used. According to such a manufacturing method, the resin sealing step and the bonding step can be performed in the same step, so that productivity can be improved.

[0071]

According to the first aspect of the present invention, when a thin electronic device having a three-layer sheet structure is manufactured, an exterior sheet is attached to a mounting sheet with an adhesive, and then the electronic device is mounted. The sheets were joined and fixed by curing the adhesive.

[0072] Therefore, these sheets can be firmly joined and fixed without applying a large pressing force to the bonded sheets, which may damage the outer surface of the sheets and cause defective products. In addition, since the electronic components are provided in the device holes, the overall thickness can be reduced.

According to a second aspect of the present invention, when manufacturing a thin electronic device having a multi-layer sheet structure, an exterior sheet is attached to a mounting sheet with an adhesive, and the adhesive is cured. Since the sheets are joined and fixed by this, these sheets can be joined and fixed firmly without applying a large pressing force to the bonded sheets.

Therefore, it is possible not only to prevent the mounting sheet and the exterior sheet from being damaged and to prevent the occurrence of defective products, but also to provide a two-layer sheet including the mounting sheet and the exterior sheet. Therefore, the structure can be simplified and the cost can be reduced as compared with the three-layer structure.

According to the third aspect of the present invention, the electronic component mounted in the device hole of the mounting sheet is resin-sealed with a resin having an adhesive property, and the exterior sheet is formed using the resin. I stuck them together.

Therefore, the resin sealing of the electronic component and the outer sheath
Since only one application of the resin is required to perform the bonding, the productivity can be improved and the cost can be reduced.

According to the fourth aspect of the present invention, when the electronic component is sealed with a resin, a material that limits fluidity is added to the resin. Therefore, it is possible to prevent the resin applied at the time of sealing from flowing to a portion other than the predetermined portion, so that the resin sealing of the electronic component provided on the sheet can be reliably performed.

According to the fifth and sixth aspects of the present invention, in the mounting step, the adhesive which is cured by heat or ultraviolet rays is used, so that the laminate can be formed without applying a large pressure. Can be obtained, the above-mentioned lamine
The outer surface of the body can be prevented from being damaged.

According to the seventh aspect of the present invention, the electronic component is mounted on the holding sheet piece having a predetermined size, and the holding sheet piece is mounted on the mounting sheet. For this reason, the mounting operation can be performed more efficiently than in the case where the electronic component is handled and mounted by itself, and the productivity can be improved.

According to the eighth aspect of the present invention, since the step of forming the laminate and the step of punching out the electronic component can be performed continuously, the productivity of the thin electronic device can be improved. According to the ninth aspect of the present invention, in a thin electronic device having a three-layer sheet structure, a mounting sheet piece and an exterior sheet piece are bonded with an adhesive to form a thin electronic device. -The sheet piece and the exterior sheet piece can be configured so as not to be easily scratched, and the mounting sheet piece has a device hole for mounting an electronic component. It becomes possible.

According to the tenth aspect of the present invention, in a multi-layer sheet electronic device, a thin electronic device is formed by bonding a mounting sheet piece and an exterior sheet piece with an adhesive. A configuration in which the mounting sheet piece and the exterior sheet piece are not easily damaged can be provided.

According to the eleventh and twelfth aspects of the invention,
Since the electronic components mounted on the mounting sheet piece are sealed with an adhesive resin, an adhesive is applied when the exterior sheet piece is laminated on the mounting sheet piece. Can be laminated without the need for lamination. Therefore, a thin electronic device with a simple manufacturing process can be provided.

[Brief description of the drawings]

FIG. 1 is an explanatory view of mounting an electronic component on a mounting sheet according to a first embodiment of the present invention.

FIG. 2 is a plan view of a mounting sheet on which electronic components are mounted.

FIG. 3 is an explanatory diagram of sealing an electronic component mounted on a mounting sheet with resin.

FIG. 4 is an explanatory view of a bonding step of bonding and fixing an exterior sheet to the upper surface and the lower surface of the mounting sheet.

FIG. 5 is a flowchart for explaining the whole manufacturing process of the IC card.

FIG. 6 is an enlarged sectional view of a part of the manufactured IC card.

FIG. 7 is a front exterior sheath showing a second embodiment of the present invention.
FIG. 4 is an explanatory diagram for sealing an electronic component mounted on an inner surface of the module with a resin.

FIG. 8 is an explanatory view of a step of bonding a back exterior sheet to a front exterior sheet in the same manner.

FIG. 9 is an enlarged cross-sectional view of a part of the IC card formed by punching.

FIG. 10 is an explanatory diagram of a case where an electronic component is mounted on an inner surface of an exterior sheet using a holding sheet piece.

FIG. 11 is an explanatory view showing a third embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 ... Mounting sheet 12 ... IC chip (electronic component) 13 ... Device hole 26 ... Thermosetting resin 32 ... Front and exterior sheet 33 ... Back and exterior sheet 43 ... Thermosetting adhesive

Claims (12)

[Claims] 1. A method for manufacturing a thin electronic device formed by bonding a plurality of sheets together, wherein an electronic component is mounted in a device hole formed in a mounting sheet, and the electronic component is sealed with a resin. A bonding step of bonding an exterior sheet to one surface and the other surface of the mounting sheet with an adhesive to form a laminated body having a predetermined thickness; After curing, the mounting sheet and the exterior sheet
A method for manufacturing a thin electronic device, comprising: a fixing step of bonding and fixing the electronic device; and a punching step of punching the thin electronic device having a predetermined shape from the mounting sheet and the exterior sheet fixed and bonded. . 2. A method for manufacturing a thin electronic device formed by laminating a plurality of sheets, a mounting step of mounting an electronic component on a mounting sheet and sealing the electronic component with a resin. A bonding step of bonding an exterior sheet to the mounting sheet with an adhesive in synchronism with the transport of the sheet to form a laminated body having a predetermined thickness; and curing the adhesive to mount the mounting sheet. -And the exterior sheet
A method for manufacturing a thin electronic device, comprising: a fixing step of bonding and fixing the electronic device; and a punching step of punching the thin electronic device having a predetermined shape from the mounting sheet and the exterior sheet fixed and bonded. . 3. A method of manufacturing a thin electronic device formed by bonding a plurality of sheets together, wherein the electronic component is mounted in a device hole formed in a mounting sheet, and the electronic component is bonded to a resin having an adhesive property. A mounting step of sealing with a resin, and attaching an exterior sheet to a surface of the mounting sheet sealed with a resin having an adhesive property in synchronization with the conveyance of the mounting sheet. A method for producing a thin electronic component, comprising: a laminating step of forming a laminated body; and a punching step of punching the laminated body to a predetermined size. 4. The method for producing a thin electronic component according to claim 1, wherein a material that limits fluidity is added to the resin in the mounting step. 5. The method according to claim 4, wherein the resin used in the mounting step is a resin that is cured by heat or ultraviolet rays. 6. The method for producing a thin electronic component according to claim 1, wherein the adhesive used in the bonding step is a resin that is cured by heat or ultraviolet rays. 7. The mounting step, wherein an electronic component previously attached to a holding sheet piece having a predetermined size is mounted on the mounting sheet together with the holding sheet piece. Item 3. A method for producing a thin electronic device according to Item 2. 8. An exterior sheet is attached at a predetermined position in synchronization with the transport of the mounting sheet on both surfaces of the mounting sheet in which electronic components are locked in the device holes and transported in a predetermined direction. A method for manufacturing an electronic device, comprising: a bonding step of forming a laminated body having a predetermined thickness together; and a punching step of punching the laminated body formed in the bonding step into a predetermined size. 9. A thin electronic device formed by laminating a plurality of sheet pieces, wherein a device hole is provided, an electronic component is mounted in the device hole, and the electronic component is resin-sealed. A mounting sheet piece, and an exterior sheet that is bonded to one surface and the other surface of the mounting sheet piece with an adhesive to form a laminate.
A thin electronic device comprising: 10. A thin electronic device formed by laminating a plurality of sheet pieces, wherein when the electronic parts are mounted, the electronic parts are sealed with a resin. A thin electronic device having an exterior sheet piece that is bonded to the resin-sealed surface of the sheet piece with an adhesive to form a laminate body; 11. A thin electronic device formed by laminating a plurality of sheet pieces, a resin having a device hole, an electronic component mounted in the device hole, and the electronic component having adhesiveness. The mounting sheet piece resin-sealed with the resin sheet, and one surface and the other surface of the mounting sheet piece are bonded to each other with the above-mentioned adhesive resin to form a laminate.
A thin electronic device having an exterior sheet piece forming a sheet body. 12. A thin electronic device formed by laminating a plurality of sheet pieces, wherein the electronic component is mounted and the electronic component is resin-sealed with an adhesive resin. And an exterior sheet piece bonded to the surface of the mounting sheet piece resin-sealed with the adhesive resin with the above-mentioned adhesive resin to form a laminated body. Characterized thin electronic devices.