CN104537410A - Manufacturing method for intelligent pass card - Google Patents
Manufacturing method for intelligent pass card Download PDFInfo
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- CN104537410A CN104537410A CN201410763597.5A CN201410763597A CN104537410A CN 104537410 A CN104537410 A CN 104537410A CN 201410763597 A CN201410763597 A CN 201410763597A CN 104537410 A CN104537410 A CN 104537410A
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- card
- visa card
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Abstract
The invention provides a manufacturing method for an intelligent pass card. The manufacturing method is suitable for an intelligent pass card with a middle layer and covering layers. The middle layer comprises a card substrate, electronic module sets and transparent centrifugal pieces. The method includes the following steps that (1), multiple groove positions corresponding to the electronic module sets are formed in the card substrate; (2), the electronic module sets are fixed inside the corresponding groove positions; (3), the surface of the card substrate and the surfaces of the electronic module sets are coated with adhesives, and the transparent centrifugal pieces are attached to the two faces of the card substrate; (4), low-temperature lamination solidification is performed for the first time on the card substrate which the transparent centrifugal pieces are attached to in the step (3); (5), heat treatment film covering is performed on the covering layers; (6), the two faces of each covering layer are coated with adhesives; (7), the middle layer is attached to the covering layers in an alignment mode, and then low-temperature solidification is performed for the second time, so that the intelligent pass card is obtained. The low-temperature lamination treatment is adopted for manufacturing the intelligent pass card, and therefore while it can be ensured that the electronic module sets are not damaged, the thickness of the card is decreased.
Description
Technical field
The present invention relates to technical field of intelligent traffic, be specifically related to a kind of method for making of intelligent visa card.
Background technology
In technical field of intelligent traffic, the compound visa card used at present can only carry out one-way communication, cannot carry out vehicle flowrate investigation and vehicle testing, cannot meet the needs of existing market.Prior art notification number is propose one in the utility model patent of CN 203786762U can efficiently to charge compound visa card, the routing information of road measuring device transmission can be received and preserve, the path of vehicle traveling can be calculated according to routing information at expressway exit simultaneously and charge.The thickness of the intelligent visa card used in the market is generally at about 5mm, and the card thickness of the visa card that the relevant device of the card sending system of existing highway is suitable for is generally 0.2-2.0mm, and the two cannot be compatible.
The manufacture craft of existing intelligent visa card inserts in upper lower casing by electronic module group, encapsulated by the mode of ultrasound wave process or buckle, due to the restriction of manufacture craft itself, makes the intelligent visa card made thus cannot reduce thickness further.
And the manufacture craft of traditional visa card is the PROCESS FOR TREATMENT adopting heat lamination solidification, although can meet thickness requirement, in its manufacturing process, temperature is generally more than 130 degree, pressure about 8mpa, can not directly be used on the Intelligent Communication Adapter containing flexible power supply.
Therefore, a kind of effective intelligent visa card manufacture craft is not had can to solve the problem of function and thickness opposition in prior art.
Summary of the invention
For the shortcoming problem in above-mentioned existing intelligent visa card manufacture craft, the object of the invention is to the method for making proposing a kind of intelligent visa card, the thickness of the intelligent visa card manufactured by the method can meet the compatibility coupling requirement of the relevant device of existing highway card sending system.
For achieving the above object, the concrete scheme that the present invention takes is:
A method for making for intelligent visa card, be applicable to have middle layer and tectal intelligent visa card, wherein middle layer comprises card base, electronic module group and transparent centrifugal film; Said method comprising the steps of:
1) on card base, the some slots corresponding with electronic module group are formed;
2) electronic module group is fixed in corresponding slot;
3) at card base, electronic module group surface coating transparent centrifugal film of fitting;
4) to step 3) in the fitted card base of transparent centrifugal film carry out first that cryosphere is cured;
5) overlay film is carried out to tectal side;
6) to tectal opposite side gluing;
7) fitted in middle layer and described tectal opposite side contraposition, carry out secondary low-temperature setting, obtain intelligent visa card.
Further, described overlayer comprises upper strata and lower floor, and described upper strata and lower floor are specially the printing bed of material.
Further, step 4) in cryosphere is cured first laminating temperature be 30-45 DEG C, pressure is 0.3-1mpa.
Further, step 7) in the cured laminating temperature of secondary cryosphere be 25-35 DEG C, pressure is 0-0.5mpa.
Further, described electronic module group comprises: flexible rechargeable battery, pcb board and electronic devices and components.
Further, step 3) described in the glue selected of gluing be epoxy resin A/B glue, ratio is 1:1-1.3.
Further, step 6) described in the glue selected of gluing be epoxy resin A/B glue, ratio is 2-2.5:1.
Further, step 2) described in electronic module group be fixed in corresponding slot by the mode of ultrasound wave or glued membrane bonding.
Further, described card base thickness is 0.1-0.5mm, and its material is synthetic resin material.
Further, described cover thickness is 0.1-0.5mm, and its material is synthetic resin material.
Further, step 5) described in the detailed process of overlay film be: cover layer of transparent film by thermal treatment in cover surface.
As mentioned above, the method for making of the intelligent visa card that the present invention proposes, by adopting the mode of low temperature lamination treatment, the thickness reducing card while electronic module group is not destroyed can be ensured, thus solve the compatible matching problem of card sending system relevant device further, reduce the card sending system relevant device that configuration is new, or to the expense expenditure that existing relevant device is transformed, be especially convenient to the penetration and promotion of intelligent visa card.
Accompanying drawing explanation
Fig. 1 is the process chart of the method for making of intelligent visa card in the embodiment of the present invention.
Fig. 2 is the floor map in middle layer in the embodiment of the present invention.
Fig. 3 is middle layer, overlayer and the transparent membrane position relationship schematic diagram in manufacturing process in the embodiment of the present invention.
Description of reference numerals: 1-transparent membrane; 2-overlayer; 3-middle layer.
Embodiment
For making above-mentioned feature and advantage of the present invention become apparent, special embodiment below, and coordinate institute's accompanying drawing to be described in detail below.
As described in background technology above, the Core Feature of intelligent visa card relies on electronic module group to realize, and described electronic module group generally comprises: flexible rechargeable battery, pcb board and electronic devices and components.These electronic components all can not tolerate the temperature and pressure in conventional fabrication laminating technology, therefore in the present embodiment, adopt the cured means of cryosphere to be destroyed in the manufacturing process of intelligent visa card to avoid above-mentioned electronic module group, be particularly useful for chargeable intelligent visa card and make.
The method for making of intelligent visa card of the present invention, realize according to process chart as shown in Figure 1, composition graphs 2 and Fig. 3 are described as follows its concrete implementation step in the lump:
1) on card base, the some slots corresponding with electronic module group are formed;
Select the synthetic resin material of certain thickness (being generally between 0.1-0.5mm), if PVC (Polyvinylchloride) or PET (polyethylene terephthalate) or PC (polycarbonate) or ABS (acrylonitrile-butadiene-styrene copolymer) is as card matrix material, use groove milling equipment or finishing impression equipment to mill out or undercut the slot of definite shape, specifically mill out or undercut corresponding slot according to the shape of the electronic module group containing power supply.The degree of depth of described slot is generally determined according to the plate thickness of electronic module group, such as, on card base, offer through hole or closed pore according to the thickness of pcb board in electronic module group.
2) electronic module group is fixed in corresponding slot;
Use mechanical arm or manually electronic module group put into the slot that milling is good or carved, fixing electronic module group in slot by the mode of ultrasound wave or glued membrane bonding.
3) at card base, electronic module group surface coating, fit transparent centrifugal film in card base one or both sides;
The mode of spraying or blade coating is used glue to be evenly coated in the card primary surface filling in electronic module group, according to actual conditions, to fit transparent centrifugal film at card base one or both sides, the thickness of described transparent centrifugal film is 0.1-0.6mm, re-use and catch up with gluing equipment to drive unnecessary glue out of, leveling.Wherein, epoxy resin A/B glue selected by glue, and ratio is 1:1-1.3, choosing above-mentioned glue can meet in the object that can realize reliable solidification without the need to High Temperature High Pressure, and in the curing process, Ka Ji and transparent centrifugal film all can not deform, thus affect the flatness of middle layer entirety.
4) to step 3) in the fitted card base of transparent centrifugal film carry out first that cryosphere is cured;
By the card base filling in electronic module group after leveling, put into laminating apparatus cryosphere cured, its laminating temperature 30-45 DEG C, pressure 0.3-1mpa, aforesaid glue can realize solidification at this temperature and pressure condition, and can not damage the various components and parts in electronic module group.So far, complete the lamination in middle layer 3 is solidified.
5) overlay film is heat-treated to the side of overlayer 2;
Select the synthetic resin material of certain thickness (being generally between 0.1-0.5mm), if PVC (Polyvinylchloride) or PET (polyethylene terephthalate) or PC (polycarbonate) or ABS (acrylonitrile-butadiene-styrene copolymer) is as the overlayer 2 of intelligent visa card, adopt the mode of high-temperature hot lamination, the transparent membrane 1 of one deck certain thickness (being generally between 0.03-0.08mm) is covered on the surface of overlayer 2 side, its material is selected from PVC (Polyvinylchloride) or PET (polyethylene terephthalate) or PC (polycarbonate) or ABS (acrylonitrile-butadiene-styrene copolymer), after its heat lamination aluminum coated steel, by choosing the transparent membrane 1 of different size, the surface effect of overlayer 2 can be light face, mute, half mute or frosting, the demand of different user to outward appearance can be met.
6) by the opposite side gluing of overlayer 2;
The side of the non-overlay film of overlayer 2 is adopted to the mode uniform gluing of silk-screen gluing.Epoxy resin A/B glue selected by glue, and ratio is 2-2.5:1.Choose above-mentioned glue can meet in the object that can realize reliable solidification without the need to High Temperature High Pressure, and in the curing process, Ka Ji and transparent centrifugal film all can not deform, thus affect the flatness of middle layer entirety.
7) the side contraposition of middle layer 3 with overlayer 2 gluing is fitted, carry out secondary low-temperature setting, obtain intelligent visa card.
Middle layer 3 is put on localization tool by the method for location, passing hole position, then the method for location, passing hole position is by overlayer 2 and middle layer 3 contraposition laminating.As shown in Figure 3, overlayer 2 comprises upper strata and lower floor, is fitted in the both sides in middle layer 3 respectively, and upper strata and lower floor are specially the printing bed of material in the present embodiment.Use puts into laminating apparatus cryosphere cured, its laminating temperature 25-35 DEG C, pressure 0-0.5mpa after catching up with gluing equipment to catch up with glue, leveling.Above-mentioned glue can realize solidification at this temperature and pressure condition, and can not damage the various components and parts in electronic module group.
Tradition visa card be divided into contact card and non-contact card according to manufacture craft, contact card adopt once hot-forming, non-contact card need twice hot-forming, the invention belongs to non-contact card.The fusing point of the selected card matrix material of tradition non-contact card is more than 70 degree, and time hot-forming, laminating temperature is more than 120 degree, lower than said temperature, then cannot complete the making in middle layer.And containing electronic module group in intelligent visa card of the present invention, High Temperature High Pressure can not be born, therefore, after selecting specific glue package, re-using the pressure intensity not destroying electronic module group carries out low temperature lamination and can realize solidification, makes intelligent visa card shaping.In order to select suitable laminating parameters, applicant carried out a large amount of theoretical analysises and experiment, under the prerequisite ensureing reliable solidification, reducing the temperature and pressure realized needed for solidification as best one can.The color of the glue selected must be water white, and solidification hardness is at Shao more than D80, after the mixing of epoxy resin A/B glue, operable time is at more than 30min, low temperature 20-40 DEG C, curable after 24h, coordinate the glue of above-mentioned specification, can card-like reliability testing be passed through, the laminating degree such as between lamella, bending test, distortion test etc. again by the intelligent visa card that lamination solidification is obtained.
Be expressed as follows obtaining experimental data in different embodiment below by form:
The making optimum configurations 1 of the intelligent visa card of table 1
The making optimum configurations 2 of the intelligent visa card of table 2
Table 3 intelligent visa card finished product reliability test result
As implied above, table 1 and table 2 are listed in 4 embodiments respectively, the optimum configurations of intelligent visa card in manufacturing process, and table 3 lists the reliability test result of the intelligent visa card finished product making gained according to the parameter in table 1 and table 2 accordingly.
Enclose by the manufacture craft of traditional visa card, the reliability test result of the visa card namely adopting the means of heat lamination solidification to obtain, is generally respectively laminating degree: 4.8N/cm, beaming limit 2000 times, buckling limit 2000 times.
To sum up, it is known that the performance parameter of the visa card obtained by experimental result and the traditional handicraft of above-described embodiment carries out contrast, the present invention makes intelligent visa card by adopting laminating technology, its reliability can reach the level of the visa card obtained with traditional handicraft completely, under some specific Parameter Conditions, even can obtain the performance that the visa card that obtains than traditional handicraft is more superior.That is, the present invention is under the prerequisite ensureing card bulk strength, the destruction to electronic module group in lamination process can be avoided, again the card integral thickness of finished product is controlled between 0.8-1.5mm, enable the intelligent visa card obtained meet the thickness compliance of existing card sending system, be conducive to applying of intelligent visa card.
Although the present invention describes as above with aforesaid embodiment, it can not in order to limit the present invention.The ordinary technical staff in the technical field of the invention, without departing from the spirit and scope of the present invention, does a little change and modification, in protection scope of the present invention.Therefore protection scope of the present invention is when being as the criterion with the claim person of defining.
Claims (10)
1. a method for making for intelligent visa card, be applicable to have middle layer and tectal intelligent visa card, wherein middle layer comprises Ka Ji and transparent centrifugal film; Comprise the following steps:
1) at card primary surface gluing and transparent centrifugal film of fitting;
2) to step 1) in the fitted card base of transparent centrifugal film carry out first that cryosphere is cured, obtain middle layer;
3) overlay film is carried out to tectal side;
4) to tectal opposite side gluing;
5) fitted in middle layer and described tectal opposite side contraposition, it is cured to carry out secondary cryosphere, obtains intelligent visa card.
2. the method for making of intelligent visa card as claimed in claim 1, it is characterized in that, described middle layer also comprises electronic module group, and described method also comprises, in step 1) between described electronic module group is fixed in some slots of described card base.
3. the method for making of intelligent visa card as claimed in claim 2, is characterized in that, step 2) described in electronic module group be fixed in corresponding slot by the mode of ultrasound wave or glued membrane bonding.
4. the method for making of intelligent visa card as claimed in claim 2, it is characterized in that, described electronic module group comprises: flexible rechargeable battery, pcb board and electronic devices and components.
5. the method for making of intelligent visa card as claimed in claim 1, it is characterized in that, described overlayer comprises upper strata and lower floor, and described upper strata and lower floor are specially the printing bed of material.
6. the method for making of intelligent visa card as claimed in claim 1, is characterized in that, step 1) described in the glue selected of gluing be epoxy resin A/B glue, ratio is 1:1-1.3; Step 4) described in the glue selected of gluing be epoxy resin A/B glue, ratio is 2-2.5:1.
7. the method for making of intelligent visa card as claimed in claim 1, is characterized in that, step 2) in cryosphere is cured first laminating temperature be 30-45 DEG C, pressure is 0.3-1mpa; Step 5) in the cured laminating temperature of secondary cryosphere be 25-35 DEG C, pressure is 0-0.5mpa.
8. the method for making of intelligent visa card as claimed in claim 1, it is characterized in that, described card base thickness is 0.1-0.5mm, and its material is synthetic resin material.
9. the method for making of intelligent visa card as claimed in claim 1, it is characterized in that, described cover thickness is 0.1-0.5mm, and its material is synthetic resin material.
10. the method for making of intelligent visa card as claimed in claim 1, is characterized in that, step 3) described in the detailed process of overlay film be: cover layer of transparent film by thermal treatment in cover surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410763597.5A CN104537410A (en) | 2014-12-11 | 2014-12-11 | Manufacturing method for intelligent pass card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410763597.5A CN104537410A (en) | 2014-12-11 | 2014-12-11 | Manufacturing method for intelligent pass card |
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| Publication Number | Publication Date |
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| CN104537410A true CN104537410A (en) | 2015-04-22 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410763597.5A Pending CN104537410A (en) | 2014-12-11 | 2014-12-11 | Manufacturing method for intelligent pass card |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105335777A (en) * | 2015-11-11 | 2016-02-17 | 苏州海博智能系统有限公司 | Intelligent card with temperature measurement function and manufacturing method thereof |
| CN105518718A (en) * | 2015-10-10 | 2016-04-20 | 深圳市奥星澳科技有限公司 | Multi-functional smart card and manufacturing method thereof |
| CN107160818A (en) * | 2017-05-15 | 2017-09-15 | 苏州海博智能系统有限公司 | Gluing fabrication method |
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Patent Citations (5)
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| US20020007906A1 (en) * | 1996-11-12 | 2002-01-24 | Francois Droz | Method for making cards and cards obtained by this method |
| CN1258252A (en) * | 1997-05-27 | 2000-06-28 | 三菱树脂株式会社 | Non-contact IC card and method for mfg. same |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105518718A (en) * | 2015-10-10 | 2016-04-20 | 深圳市奥星澳科技有限公司 | Multi-functional smart card and manufacturing method thereof |
| CN105518718B (en) * | 2015-10-10 | 2018-06-12 | 深圳市奥星澳科技有限公司 | Multi-function intelligent card and preparation method thereof |
| CN105335777A (en) * | 2015-11-11 | 2016-02-17 | 苏州海博智能系统有限公司 | Intelligent card with temperature measurement function and manufacturing method thereof |
| CN107160818A (en) * | 2017-05-15 | 2017-09-15 | 苏州海博智能系统有限公司 | Gluing fabrication method |
| CN107160818B (en) * | 2017-05-15 | 2020-08-04 | 苏州海博智能系统有限公司 | Gluing card making method |
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Application publication date: 20150422 |
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