CN205158411U - Prevent tearing open RFID electronic tags - Google Patents

Prevent tearing open RFID electronic tags Download PDF

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Publication number
CN205158411U
CN205158411U CN201520969241.7U CN201520969241U CN205158411U CN 205158411 U CN205158411 U CN 205158411U CN 201520969241 U CN201520969241 U CN 201520969241U CN 205158411 U CN205158411 U CN 205158411U
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CN
China
Prior art keywords
label
hard shell
inlay
chip
recess
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201520969241.7U
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Chinese (zh)
Inventor
赵军伟
马纪丰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huada Hengxin Technology Co.,Ltd.
Original Assignee
Huada Semiconductor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huada Semiconductor Co Ltd filed Critical Huada Semiconductor Co Ltd
Priority to CN201520969241.7U priority Critical patent/CN205158411U/en
Application granted granted Critical
Publication of CN205158411U publication Critical patent/CN205158411U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a prevent tearing open RFID electronic tags, this label includes: label inlay, the antenna is adhered to at the back, links to each other with the object through the inner circle double faced adhesive tape, hard shell, for the multilayer recess, wherein, label inlay places in outer recess, and the chip is located the inlayer recess, glues through the solidifiable in the inlayer recess is powerful, solidifies label inlay in hard shell. Adopt the method, satisfy the application demand of different occasions, hard shell can play protection label inlay's effect in the installation, make things convenient for the application of label in various occasions.

Description

A kind of tamper RFID
Technical field:
The utility model relates to RFID field, particularly a kind of tamper RFID.
Background technology:
Along with the continuous popularization of technology of Internet of things, RFID (RadioFrequencyIdentification, radio-frequency (RF) identification) have also been obtained as its indispensable ingredient and applies more and more widely.RFID, because having the functions such as remote and wireless read/write, is widely adopted at present in motor vehicle and traffic administration.Example is applied as with current mobile management, in the application, RFID is installed in the inner face of windshield, to apply in the field such as statistics, management, hypervelocity inspection, charge, the employing of RFID can significantly improve vehicle management and traffic management level.But owing to relating to charge and hypervelocity inspection etc., may be someone will the illegal RFID that administrative authority installs privately being dismantled and escape management, inspection, charge etc., can have a strong impact on the normal and proper use of of electronic tag, therefore the tamper of RFID just seems most important.
Utility model content:
Fundamental purpose of the present utility model is to provide a kind of tamper RFID, is intended to solve RFID tamper problem in actual applications.
The utility model is a kind of tamper RFID, is made up of sandwich construction.Comprise double faced adhesive tape, label inlay, tamper hard shell, seccotine.Wherein said label inlay comprises label substrate, antenna and chip, and antenna and chip are positioned at the same face of base material.Described double faced adhesive tape is arranged on the back side of antenna on base material, is used for label to be pasted onto body surface during use.Described hard shell can contain the projection of label substrate on its surface, and shell is multi-layer groove structure.Seccotine is used for fixed labels inlay and tamper hard shell, is generally used for chip surface and surrounding.
Described double faced adhesive tape can be usually said double faced adhesive tape, the glue having two-sided effect also having liquid glue brush to be formed on surface, or other colloidal materials.
Described label Inlay comprises label substrate, antenna and chip, and antenna and chip are positioned at the same face of base material.
Described base material can be fragile base material, comprises the one in following material: other friable materials such as brittle ceramic, fragile paper, plain paper; Also can being that other base materials realize frangible by adding dark line etc., comprising other special materials such as conventional ceramic, FR4, PET.
Described tamper hard shell material can be rigid plastic, the FR4 etc. passing through processing, and label also can adopt metal shell etc. after treatment, can also be the shell with certain degree of hardness be combined to form of multiple material simultaneously.
Described hard shell can contain the projection of label substrate on its surface, and shell is multi-layer groove structure.
Described seccotine comprises the one in following material: epoxide resin AB glue, other curable seccotines such as double faced adhesive tape.
Chip on described label inlay is positioned at the one side near hard shell on base material, and in the little groove of chip, be full of seccotine at hard shell during use, chip is solidificated on hard shell the most at last.
Edge >=the 2mm of all back gauge label inlay base materials of described hard shell.
Described hard shell is furnished with the disjunct double faced adhesive tape of double faced adhesive tape on same label inlay with the surrounding between object, also can not cloth glue, but is directly attached to body surface, also can only at the both sides cloth glue of symmetry.
Described hard shell can be circular groove near the little groove of chip also can be square, rhombus, ellipse, triangle, polygon etc.
Described hard shell, when ensureing chip respective slot and outer cover intensity, can reduce the cost of sheathing material by other ways such as adding strengthening muscle.
Described hard shell, when ensureing chip respective slot and outer cover intensity, can be able to be cross spider bar shaped by the shape adding strengthening muscle, intersect circular, cross ellipse tube shape, crossing polygon etc.
Accompanying drawing illustrates:
Fig. 1 is the structure vertical view of a kind of RFID tamper method in an embodiment of the present utility model.
Fig. 2 is the section of structure of a kind of RFID tamper method in this embodiment of the present utility model.
Fig. 3 is structure vertical view and the section of structure of a kind of RFID tamper method in another embodiment of the present utility model.
Fig. 4 is structure vertical view and the section of structure of a kind of RFID tamper method in another embodiment of the present utility model.
Embodiment:
Concrete embodiment described herein only in order to explain the utility model, and is not used in restriction the utility model.
With reference to figure 1,2, in the present embodiment, the back side of label inlay2 attachment antenna is provided with a circle inner ring double faced adhesive tape 1, and arranges hard shell 3 at the another side relative with inner ring double faced adhesive tape 1, and hard shell 3 can contain the projection of label substrate on its surface.Hard shell 3 is arranged in multi-layer groove, wherein label inlay2 is placed in one deck groove, the corresponding one deck groove of chip 5, curable seccotine 4 is full of in this groove, after seccotine solidification, label inlay2 is solidificated in hard shell, be furnished with the disjunct outer double glue 6 of same inner ring double faced adhesive tape 1 between the same glass of hard shell, the effect of outer double glue 6 be prevent hard shell 3 due to vibration etc. come off.
In above-described embodiment, the size of each several part and material can be arranged according to the material of the label of application request and size, after seccotine 4 solidifies, can directly be pasted onto the inner face of windshield by inner circle double faced adhesive tape 1, also reliable inner ring double faced adhesive tape 1, outer double glue 6 are pasted onto the inner face of windshield together.
Above-mentioned inner ring double faced adhesive tape 1, label inlay2, hard shell 3, seccotine 4, double faced adhesive tape 6 is provided with in a kind of RFID tamper method
The foregoing is only preferred embodiment of the present utility model; not thereby the scope of the claims of the present utility model is limited; every equivalent structure transformation utilizing the utility model instructions and accompanying drawing content to do; or directly, be indirectly used in the technical field that other is relevant, be all in like manner included in the scope of patent protection of utility model.

Claims (8)

1. a tamper RFID, is characterized in that, this label comprises:
Label inlay, back side attachment antenna, is connected with object by inner ring double faced adhesive tape;
Hard shell is multi-layer groove, and wherein, label inlay is placed in outer groove, and chip is positioned at internal layer groove, by the curable seccotine in internal layer groove, is solidificated in hard shell by label inlay.
2. label according to claim 1, is characterized in that, described hard shell, is connected with object by outer double glue.
3. label according to claim 2, is characterized in that, described label inlay comprises label substrate, antenna and chip; Wherein, the edge of all back gauge label substrate of hard shell is more than or equal to 2mm.
4. label according to claim 3, is characterized in that, described outer double glue is symmetrical both sides or four limits.
5. according to the arbitrary described label of Claims 1-4, it is characterized in that, described internal layer groove, is square or rhombus or oval or triangle or polygon.
6. label according to claim 5, is characterized in that, described hard shell is for adding strengthening muscle.
7. label according to claim 6, is characterized in that, described in add strengthening muscle shape be cross spider bar shaped or intersect circular or cross ellipse tube shape or crossing polygon.
8. label according to claim 7, is characterized in that, described label substrate is fragile base material.
CN201520969241.7U 2015-11-30 2015-11-30 Prevent tearing open RFID electronic tags Active CN205158411U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201520969241.7U CN205158411U (en) 2015-11-30 2015-11-30 Prevent tearing open RFID electronic tags

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201520969241.7U CN205158411U (en) 2015-11-30 2015-11-30 Prevent tearing open RFID electronic tags

Publications (1)

Publication Number Publication Date
CN205158411U true CN205158411U (en) 2016-04-13

Family

ID=55694081

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201520969241.7U Active CN205158411U (en) 2015-11-30 2015-11-30 Prevent tearing open RFID electronic tags

Country Status (1)

Country Link
CN (1) CN205158411U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108320008A (en) * 2017-01-17 2018-07-24 华大半导体有限公司 Electronic tag tamper method
CN112183685A (en) * 2020-09-18 2021-01-05 中国石油天然气集团有限公司 Rotary guide part identification method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108320008A (en) * 2017-01-17 2018-07-24 华大半导体有限公司 Electronic tag tamper method
CN112183685A (en) * 2020-09-18 2021-01-05 中国石油天然气集团有限公司 Rotary guide part identification method

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20190916

Address after: 610015 China (Sichuan) Free Trade Pilot Zone, Chengdu City, Sichuan Province

Patentee after: Sichuan Huada Hengxin Technology Co., Ltd.

Address before: 201203, Shanghai, Pudong New Area, Liang Xiu Road, No. 112, block Y1, Room 305, room three

Patentee before: HUADA SEMICONDUCTOR CO., LTD.

CP03 Change of name, title or address
CP03 Change of name, title or address

Address after: Floor 17, unit 2, building 6, 171 hele 2nd Street, Chengdu hi tech Zone, Chengdu pilot Free Trade Zone, Sichuan 610212

Patentee after: Huada Hengxin Technology Co.,Ltd.

Address before: 610015 1-3 / F, block B, building 4, No. 200, Tianfu 5th Street, Chengdu hi tech Zone, China (Sichuan) pilot Free Trade Zone, Chengdu, Sichuan

Patentee before: Sichuan Huada Hengxin Technology Co.,Ltd.