WO2017059588A1 - Multi-functional smart card and manufacturing method therefor - Google Patents

Multi-functional smart card and manufacturing method therefor Download PDF

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Publication number
WO2017059588A1
WO2017059588A1 PCT/CN2015/091618 CN2015091618W WO2017059588A1 WO 2017059588 A1 WO2017059588 A1 WO 2017059588A1 CN 2015091618 W CN2015091618 W CN 2015091618W WO 2017059588 A1 WO2017059588 A1 WO 2017059588A1
Authority
WO
WIPO (PCT)
Prior art keywords
battery
smart card
circuit board
functional component
receiving slot
Prior art date
Application number
PCT/CN2015/091618
Other languages
French (fr)
Chinese (zh)
Inventor
吴志勇
Original Assignee
深圳市奥星澳科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市奥星澳科技有限公司 filed Critical 深圳市奥星澳科技有限公司
Priority to PCT/CN2015/091618 priority Critical patent/WO2017059588A1/en
Priority to CN201580000628.4A priority patent/CN105518718B/en
Publication of WO2017059588A1 publication Critical patent/WO2017059588A1/en

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/02Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
    • G06K19/022Processes or apparatus therefor
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/0701Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising an arrangement for power management
    • G06K19/0702Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising an arrangement for power management the arrangement including a battery
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/0701Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising an arrangement for power management
    • G06K19/0702Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising an arrangement for power management the arrangement including a battery
    • G06K19/0704Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising an arrangement for power management the arrangement including a battery the battery being rechargeable, e.g. solar batteries
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/0716Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising a sensor or an interface to a sensor
    • G06K19/0717Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising a sensor or an interface to a sensor the sensor being capable of sensing environmental conditions such as temperature history or pressure
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier

Definitions

  • Multifunctional smart card and manufacturing method thereof Multifunctional smart card and manufacturing method thereof
  • the present invention relates to the technical field of smart cards, and in particular, to a multifunctional smart card and a method for fabricating the same.
  • the conventional smart card manufacturing method is as follows: First, the chip is mounted on the carrier tape of the smart card by using a chip mounting device, and then the function pad of the chip and the pad of the carrier tape are electrically connected by using a wire bonding device. After the sexual connection, the smart card module with the wire bonding is glued or molded, and then the packaged smart card module is punched. Finally, the smart card module is formed into a card form by using a card making device.
  • this packaging method has many disadvantages: such as complicated production process, high production cost, poor product reliability, thick overall thickness of the smart card, and low production efficiency.
  • the object of the present invention is to overcome the deficiencies of the prior art described above, and provide a multifunctional smart card and a manufacturing method thereof, wherein the smart card has a simple structure, high reliability, and extremely thin, and the manufacturing method thereof realizes the ultra-thin effect of the smart card, and The process is simple, efficient and low cost.
  • An embodiment of the present invention provides a multi-functional smart card, including a substrate, a battery, a functional component, and a sealing film, wherein a side surface of the substrate is provided with a receiving groove and a sinking groove surrounding the periphery of the receiving groove.
  • the battery and the functional component are electrically connected and housed in the cavity, and a gap between the battery and the functional component and the cavity is filled with glue, and the sealing film is accommodated Inside the sink and the battery and the The functional component seals the cover.
  • the functional component includes a circuit board, a function module and a switch disposed on the circuit board, and a buzzer disposed on one side of the circuit board and electrically connected thereto, the battery and the battery
  • the circuit board is electrically connected.
  • the housing includes a first receiving slot, a second receiving slot, and a third receiving slot, wherein the first receiving slot is for receiving the battery, and the second receiving slot is for receiving The circuit board, the third receiving slot is configured to receive the buzzer.
  • a side of the substrate has a glue injection port communicating with the cavity, and the glue injection port is used for injecting glue into the cavity to fix the battery and the functional component.
  • the substrate has a thickness of from 1 mm to 1.8 mm.
  • a frosted layer is disposed on an outer surface of the sealing film.
  • the sealing film is a PC piece.
  • the battery is a rechargeable battery.
  • the circuit board is a flexible circuit board.
  • the embodiment of the invention further provides a method for manufacturing a multifunctional smart card, comprising the following steps:
  • the sealing film is pasted into the sink by a film laminating machine, and the battery and the functional component are sealed in the cavity.
  • the substrate has a thickness of from 1 mm to 1.8 mm.
  • the circuit board is a flexible circuit board.
  • the functional component includes a circuit board, a function module and a switch disposed on the circuit board, and a buzzer disposed on one side of the circuit board and electrically connected thereto, the battery and the battery The circuit board is electrically connected.
  • the receiving tank includes a first receiving slot, a second receiving slot and a third receiving slot, wherein the first receiving slot is for receiving the battery, and the second receiving slot is for receiving The circuit board, the third pocket is used for accommodating The buzzer is described.
  • a frosted layer is disposed on an outer surface of the sealing film.
  • the multifunctional smart card and the manufacturing method thereof are provided by the embodiment of the present invention, and the multifunctional smart card electrically connects and accommodates the battery and the functional component by arranging a cavity on one side of the substrate thereof In the cavity, the gap between the battery and the functional component and the cavity is filled with glue, and then adhered to the sinking groove on the side of the substrate through the sealing film, and the battery and the functional component are sealed and sealed.
  • the multifunctional smart card is extremely thin, and has a simple structure and high reliability.
  • the multifunctional smart card manufacturing method not only realizes the ultra-thin effect of the smart card, but also has a simple, high-efficiency process and low cost. Brief description of the drawing
  • FIG. 1 is a schematic diagram of an explosion of a multi-function smart card according to an embodiment of the present invention
  • FIG. 2 is a second schematic diagram of an explosion of a multi-function smart card according to an embodiment of the present invention.
  • FIG. 3 is a schematic perspective structural view of a substrate according to an embodiment of the present invention.
  • FIG. 4 is a schematic diagram of assembly of a multi-function smart card inserted into a charger according to an embodiment of the present invention
  • FIG. 5 is a schematic exploded view of a multi-function smart card and a charger according to an embodiment of the present invention
  • FIG. 6 is a flowchart of a method for fabricating a multifunctional smart card according to an embodiment of the present invention.
  • the embodiment of the invention provides a multifunctional smart card and a manufacturing method thereof, wherein the multifunctional smart card can integrate an important information card such as a bank card and a proximity card, and the multifunctional smart card can be very compatible with the mobile phone.
  • the multi-function smart card can integrate an important information card such as a bank card and a proximity card, and the multifunctional smart card can be very compatible with the mobile phone.
  • the mobile phone and the multi-function smart card have corresponding warning functions to effectively prevent loss.
  • You can also put this multi-function smart card in your wallet to prevent the loss of your wallet or related important items.
  • This multi-function smart card can also detect the current environment's temperature/humidity, the intensity of ultraviolet light, personal exercise/sleep health, etc. .
  • the multi-function smart card can also be used as an electronic business card, as well as a terminal point of the smart object, etc.; the multi-function smart card can also have functions such as iBea COn , Eddy stone, NFC, bank electronic security chip, and can be customized by private
  • the communication protocol and the international standard communication protocol carry out data transmission; further, the multifunctional smart card can embed different function chips as needed, and ensure that the overall appearance of the smart card is fine and the thickness is extremely thin.
  • a multi-function smart card includes a substrate 1, a battery 2, a functional component 3, and a sealing film 4, wherein the substrate 1 is a credit card-sized injection-molded panel.
  • a side surface of the substrate 1 (here, referred to as the front surface of the substrate 1) is provided with a housing 11 adapted to the battery 2 and the functional component 3, and the battery 2 and the functional component 3 are housed in the housing 11.
  • a peripheral groove 1 of the casing 1 is provided with a sinking groove 114 adapted to the shape of the sealing film 4. The periphery of the sealing film 4 is completely adhered and received in the sinking groove 114, and the battery 2 and the functional component 3 are sealed and sealed in the receiving groove 11
  • the multifunctional smart card proposed by the embodiment of the present invention has the following features:
  • the multi-function smart card electrically connects and accommodates the battery 2 and the functional component 3 in the cavity 11 by arranging the receptacle 11 on one side of the substrate 1, and the substrate is effectively utilized.
  • 1 thickness space reducing the overall thickness of the smart card; and, through the gap between the battery 2 and the functional component 3 and the cavity 11
  • the glue is filled therein, so that the glue can make the gaps in the cavity 11 be effectively filled, and the battery 2 and the functional component 3 are kept flat in the cavity 11, ensuring the overall flatness of the smart card and ensuring
  • the toughness of the smart card also achieves a waterproof effect; in addition, by squeezing the sinking groove 114 in the periphery of the cavity 11, and sealing the sealing film 4 in the sinking groove 114, the battery 2 and the functional component 3 are sealed and sealed. In this way, the space of the substrate 1 is further utilized, the overall thickness of the smart card is reduced, and the ultra-thin effect of the multifunctional smart card is realized, and the multi
  • the above functional component 3 may include a circuit board 31, a function module 3, a switch 33, and a buzzer 34.
  • the function module 32 is integrated on the circuit board 31.
  • 33 is fixedly and electrically connected to the circuit board 31, and the user presses the position of the sealing film 4 corresponding to the closing point 33 by the finger, so that the sealing film 4 is pressed against the closing point 33, so that the entire multifunctional smart card can be controlled.
  • the buzzer 34 is used for sounding alarms.
  • the buzzer 34 is disposed on one side of the circuit board 31 and electrically connected thereto.
  • the battery 2 is electrically connected to the circuit board 31, and the battery 2 supplies power to the entire smart card.
  • the functional component 3 may further include other components or modules, etc., which are not limited herein.
  • the receiving tank 11 includes a first receiving slot 111, a second receiving slot 112, and a third receiving slot 113, and the first receiving slot 111, the second receiving slot 112, and the first slot
  • the three-capacity slot 113 is connected, wherein the first pocket 111 is for accommodating the battery 2, and the second pocket 112 is for accommodating the circuit board 31 and the function module 32 and the gate 33 thereon. 113 is used to accommodate the buzzer 34 described above.
  • the first tank 11 1 By providing the first tank 11 1 , the second tank 112 and the third tank 113 , the battery 2 , the circuit board 31 , the function module 32 and the shut-off 33 and the buzzer 34 can be accommodated in the corresponding grooves
  • the space of the substrate 1 is fully utilized, and the overall thickness of the multi-function smart card is effectively reduced.
  • the side surface of the substrate 1 has a glue injection port 10, and the glue injection port 10 communicates with the cavity 11 , that is, communicates with the first cavity 111 and the second volume.
  • the tank 112 and the third tank 113 are used for injecting glue into the tank 11 to fix the battery 2 and the functional component 3, and to keep the battery 2 and the functional component 3 flat in the tank 11.
  • the substrate 1 has a thickness of 1 mm to 1.8 mm
  • the sealing film 4 has a thickness of 0.3 mm
  • the sinking groove 114 has a depth of 0.3 mm.
  • the sealing film 4 is adhered and received in the sinking groove 114 and the substrate 1 The edges of the surface are flush, so that the entire multi-function smart card has a thickness of 1mm to 1.8mm and has an extremely thin effect.
  • the outer surface of the sealing film 4 ie, the front surface of the substrate 1 is provided with a frosted layer (not shown in the drawing).
  • the sealing film 4 is provided with anti-scratch resistance, which ensures the aesthetics of the smart card, and the sealing film 4 is made of PC material, so that it has the functions of resisting high and low temperature and acid and alkali corrosion resistance. , to ensure the service life of the multi-function smart card.
  • the sealing film 4 is preferably a PC (Polycarbonate) piece;
  • the substrate 1 is preferably made of a mixed material of PC and glass fiber, such that the substrate 1 and the sealing film 4 It has the properties of resistance to bending, cracking and breakage, as well as high and low temperature resistance and acid and alkali corrosion resistance, ensuring the performance and service life.
  • the substrate 1 may be made of other materials according to actual conditions and specific requirements, which are not limited herein.
  • the battery 2 is preferably a rechargeable battery.
  • the smart card can be recharged and used multiple times, increasing its service life. When the battery 2 is exhausted, it is charged by an external charging accessory to charge it for recycling.
  • the battery 2 may also be a non-rechargeable battery, which is not limited herein.
  • the outer surface of the sealing film 4 is provided with a contact hole 40 for the positive and negative electrodes of the battery 2, and the multifunctional smart card is inserted into the charger 5 adapted thereto.
  • the contact 51 of the charger 5 is electrically connected to the positive and negative electrodes of the battery 2 through the contact hole 40; when the battery 2 is a non-rechargeable battery, the outer surface of the sealing film 4 does not need to be touched. Do not need a charger for point holes.
  • the circuit board 31 is preferably FPC (Flexible Printed).
  • the FPC board has the characteristics of high wiring density, light weight, thin thickness, and good bending property, by selecting the circuit board 31 as an FPC board, not only the electrical performance thereof is ensured, but also, compared with the conventional printed circuit board, It has the characteristics of light weight, thin thickness and good bending property, which reduces the overall thickness of the smart card and improves the space utilization ratio of the substrate 1.
  • a method for manufacturing a multifunctional smart card includes the following steps:
  • S200 the battery 2 and the functional component 3 are welded to form a single piece, and the two are electrically connected by welding;
  • S300 the integral piece formed by welding the battery 2 and the functional component 3 is placed in the cavity 11;
  • S400 filling the gap between the battery 2 and the functional component 3 and the cavity with glue, so that the battery 2 and the functional component 3 are fixedly received in the cavity 11 and maintained in a flat state;
  • the sealing film 4 is pasted into the sinking groove 114 by a film laminating machine, and the battery 2 and the functional component 3 are sealed in the cavity 11 by the sealing film 4.
  • the substrate 1 has a thickness of 1 mm to 1.8 mm
  • the sealing film 4 has a thickness of 0.3 mm
  • the sinking groove 114 has a depth of 0.3 mm.
  • the sealing film 4 is adhered and received in the sinking groove 114.
  • the inside is flush with the edge of the surface of the substrate 1, and thus, the entire multifunctional smart card has a thickness of 1 mm to 1.8 mm, and has an extremely thin effect.
  • the circuit board 31 is preferably an FPC (Flexible Printed Circuit) flexible circuit board. Since the FPC board has the characteristics of high wiring density, light weight, thin thickness, and good bending property, by selecting the circuit board 31 as an FPC board, not only the electrical performance thereof but also the conventional printing is ensured.
  • the circuit board has the characteristics of light weight, thin thickness and good bending property, which reduces the overall thickness of the smart card and improves the space utilization ratio of the substrate 1.
  • the above functional component 3 may include a circuit board 31, a function module 32, a switch 33, and a buzzer 34.
  • the function module 32 is integrated on the circuit board 31, and the switch 33 is soldered and fixed. Electrically connected to the circuit board 31, the user presses the position of the sealing film 4 corresponding to the closing point 33 by the finger, so that the sealing film 4 is pressed against the closing point 33, so that the opening or closing of the entire multifunctional smart card can be controlled.
  • the buzzer 34 is used for a sounding alarm.
  • the buzzer 34 is disposed on one side of the circuit board 31 and electrically connected thereto.
  • the battery 2 is electrically connected to the circuit board 31, and the battery 2 supplies power to the entire smart card.
  • the receiving tank 11 may include a first receiving slot 111, a second receiving slot 112, and a third receiving slot 113.
  • the first receiving slot 111, the second receiving slot 112, and the third receiving slot The slot 113 is in communication, wherein the first slot 111 is configured to receive the battery 2, and the second slot 112 is configured to receive the circuit board 31 and the function module 3 2 and the switch 33 thereon, and the third slot 113 It is used to accommodate the above buzzer 34.
  • the first pocket 111, the second pocket 112 and the third pocket 113, the battery 2, the circuit board 31, the function module 32 and the switch 33, and the buzzer 34 can be accommodated in the corresponding grooves.
  • the space of the substrate 1 is fully utilized, and the overall thickness of the multifunctional smart card is effectively reduced.
  • the outer surface of the sealing film 4 (ie, the front surface of the substrate 1) is provided with a frosted layer.
  • the sealing film 4 has a scratch-resistant function, which ensures the aesthetics of the smart card, and the sealing film 4 is made of PC material, so that it has high temperature resistance and acid resistance.
  • the function of alkali corrosion guarantees the service life of the multi-function smart card.
  • the multi-function smart card and the manufacturing method thereof are provided in the embodiment of the present invention, wherein the multi-function smart card electrically charges the battery 2 and the functional component 3 by arranging the receptacle 11 on one side of the substrate 1 It is connected and accommodated in the cavity 11 , and is filled with glue in the gap between the battery 2 and the functional component 3 and the cavity 11 , and then adhered to the sinking groove 114 on the side of the substrate 1 through the sealing film 4 .
  • the battery 2 and the functional component 3 are sealed and sealed, so that the multifunctional smart card is extremely thin overall, and has a simple structure and high reliability; the multifunctional smart card manufacturing method not only realizes the ultra-thin effect of the multifunctional smart card, And the production process is simple, convenient, efficient, and low in cost.

Abstract

Provided are a multi-functional smart card and a manufacturing method therefor. The multi-functional smart card comprises a substrate (1), a battery (2), a functional component (3) and a sealing film (4). An accommodating groove (11) and a sinking groove (114) surrounding the accommodating groove (11) are provided in one side of the substrate (1). The battery (2) and the functional component (3) are electrically connected to each other and are accommodated in the accommodating groove (11), and gaps between the two and the accommodating groove (11) are filled with glue. The sealing film (4) is accommodated in the sinking groove (114) and seals the battery (2) and the functional component (3). The manufacturing method for the multi-functional smart card comprises the following steps: S100, injection moulding the substrate (1) and forming the accommodating groove (11) and the sinking groove (114); S200, welding the battery (2) and the functional component (3); S300, placing the battery (2) and the functional component (3) into the accommodating groove (11); S400, filling gaps between the battery (2) and the functional component (3) and the accommodating groove (11) with glue; and S500, adhering the sealing film (4) to the sinking groove (114) to seal the battery (2) and the functional component (3) in the accommodating groove (11). The multi-functional smart card is simple in structure, high in reliability and extremely thin, and the manufacturing method therefor achieves the effect of an extremely thin smart card, and is simple and efficient in process and low in cost.

Description

多功能智能卡及其制作方法  Multifunctional smart card and manufacturing method thereof
技术领域  Technical field
[0001] 本发明涉及智能卡的技术领域, 尤其涉及一种多功能智能卡及其制作方法。  [0001] The present invention relates to the technical field of smart cards, and in particular, to a multifunctional smart card and a method for fabricating the same.
背景技术  Background technique
[0002] 随着集成电路封装技术的不断进步, 集成电路的集成度日益提高, 功能也越来 越丰富, 而且对于产品应用领域的要求也越来越苛刻, 这就要求集成电路封装 企业能幵发出新型的封装形式来配合新的需求。 在智能卡封装领域, 国内及国 外市场对智能卡的需求量都非常大, 目前, 智能卡行业正朝着技术创新的路线 发展, 新技术不断涌现, 新型制造技术也越来越多, 许多老的制造技术也不断 改进和加强, 从而对智能卡的功能和性能的提升要求也不可避免。  [0002] With the continuous advancement of integrated circuit packaging technology, the integration of integrated circuits is increasing, functions are becoming more and more abundant, and the requirements for product application fields are becoming more and more demanding, which requires integrated circuit packaging enterprises to A new package form is issued to meet new demands. In the field of smart card packaging, the demand for smart cards in domestic and foreign markets is very large. At present, the smart card industry is developing towards a technological innovation route, new technologies are emerging, new manufacturing technologies are also increasing, and many old manufacturing technologies It is also constantly improving and strengthening, so that the requirements for the function and performance of smart cards are inevitable.
[0003] 传统的智能卡的制作方法是: 首先, 用芯片贴装设备将芯片贴装在智能卡的载 带上, 然后, 使用引线键合设备将芯片的功能焊盘与载带的焊盘进行电性连接 , 之后再对引线键合完的智能卡模块进行注胶或者模塑封装, 再将封装好的智 能卡模块进行冲切, 最后采用制卡设备将智能卡模块制成卡片形式。 但是这种 封装方法存在许多缺点: 如生产工艺复杂, 生产成本高, 产品可靠性差, 智能 卡整体厚度偏厚, 生产效率低下等。  [0003] The conventional smart card manufacturing method is as follows: First, the chip is mounted on the carrier tape of the smart card by using a chip mounting device, and then the function pad of the chip and the pad of the carrier tape are electrically connected by using a wire bonding device. After the sexual connection, the smart card module with the wire bonding is glued or molded, and then the packaged smart card module is punched. Finally, the smart card module is formed into a card form by using a card making device. However, this packaging method has many disadvantages: such as complicated production process, high production cost, poor product reliability, thick overall thickness of the smart card, and low production efficiency.
技术问题  technical problem
[0004] 本发明的目的在于克服上述现有技术的不足, 提供一种多功能智能卡及其制作 方法, 其智能卡结构简单, 可靠性高, 极致薄, 其制作方法实现了智能卡极致 薄效果, 且工艺简单、 高效, 成本低。  [0004] The object of the present invention is to overcome the deficiencies of the prior art described above, and provide a multifunctional smart card and a manufacturing method thereof, wherein the smart card has a simple structure, high reliability, and extremely thin, and the manufacturing method thereof realizes the ultra-thin effect of the smart card, and The process is simple, efficient and low cost.
问题的解决方案  Problem solution
技术解决方案  Technical solution
[0005] 本发明实施例提供了一种多功能智能卡, 包括基板、 电池、 功能组件以及封膜 , 所述基板的一侧面上幵设有容槽和环绕于所述容槽外围的沉槽, 所述电池和 所述功能组件电连接并容置于所述容槽内, 且所述电池和所述功能组件与所述 容槽之间的缝隙内填充有胶水, 所述封膜容置于所述沉槽内并将所述电池和所 述功能组件密封封盖。 An embodiment of the present invention provides a multi-functional smart card, including a substrate, a battery, a functional component, and a sealing film, wherein a side surface of the substrate is provided with a receiving groove and a sinking groove surrounding the periphery of the receiving groove. The battery and the functional component are electrically connected and housed in the cavity, and a gap between the battery and the functional component and the cavity is filled with glue, and the sealing film is accommodated Inside the sink and the battery and the The functional component seals the cover.
[0006] 进一步地, 所述功能组件包括电路板, 设置于所述电路板上的功能模块和幵关 , 以及设置于所述电路板一侧并与其电连接的蜂鸣器, 所述电池与所述电路板 电连接。  [0006] Further, the functional component includes a circuit board, a function module and a switch disposed on the circuit board, and a buzzer disposed on one side of the circuit board and electrically connected thereto, the battery and the battery The circuit board is electrically connected.
[0007] 进一步地, 所述容槽包括第一容槽、 第二容槽和第三容槽, 所述第一容槽用于 容置所述电池, 所述第二容槽用于容置所述电路板, 所述第三容槽用于容置所 述蜂鸣器。  [0007] Further, the housing includes a first receiving slot, a second receiving slot, and a third receiving slot, wherein the first receiving slot is for receiving the battery, and the second receiving slot is for receiving The circuit board, the third receiving slot is configured to receive the buzzer.
[0008] 进一步地, 所述基板的侧面上具有与所述容槽连通的注胶口, 所述注胶口用于 向所述容槽内注胶以固定所述电池和所述功能组件。  [0008] Further, a side of the substrate has a glue injection port communicating with the cavity, and the glue injection port is used for injecting glue into the cavity to fix the battery and the functional component.
[0009] 进一步地, 所述基板的厚度为 lmm至 1.8mm。 Further, the substrate has a thickness of from 1 mm to 1.8 mm.
[0010] 进一步地, 所述封膜的外表面上设置有磨砂层。 [0010] Further, a frosted layer is disposed on an outer surface of the sealing film.
[0011] 优选地, 所述封膜为 PC件。 [0011] Preferably, the sealing film is a PC piece.
[0012] 优选地, 所述电池为充电电池。 [0012] Preferably, the battery is a rechargeable battery.
[0013] 优选地, 所述电路板为柔性电路板。 [0013] Preferably, the circuit board is a flexible circuit board.
[0014] 本发明实施例还提供了一种多功能智能卡制作方法, 包括如下步骤:  [0014] The embodiment of the invention further provides a method for manufacturing a multifunctional smart card, comprising the following steps:
[0015] S100, 通过注塑机注塑基板, 并在基板的一侧面上形成容槽和沉槽; [0015] S100, injecting a substrate through an injection molding machine, and forming a receiving groove and a sinking groove on one side of the substrate;
[0016] S200, 将电池和功能组件焊接形成一体件, 并形成电连接; [0016] S200, welding the battery and the functional component into a single piece, and forming an electrical connection;
[0017] S300, 将由电池和功能组件焊接形成的一体件置于容槽内; [0017] S300, placing an integral piece formed by welding the battery and the functional component into the cavity;
[0018] S400, 向电池和功能组件与容槽之间的缝隙内填充胶水, 使电池和功能组件固 定容置在容槽内; [0018] S400, filling a gap between the battery and the functional component and the cavity with glue, so that the battery and the functional component are fixedly accommodated in the cavity;
[0019] S500, 通过贴膜机将封膜粘贴于沉槽内, 使电池和功能组件密封于容槽内。  [0019] S500, the sealing film is pasted into the sink by a film laminating machine, and the battery and the functional component are sealed in the cavity.
[0020] 进一步地, 所述基板的厚度为 lmm至 1.8mm。 [0020] Further, the substrate has a thickness of from 1 mm to 1.8 mm.
[0021] 优选地, 所述电路板为柔性电路板。 [0021] Preferably, the circuit board is a flexible circuit board.
[0022] 进一步地, 所述功能组件包括电路板, 设置于所述电路板上的功能模块和幵关 , 以及设置于所述电路板一侧并与其电连接的蜂鸣器, 所述电池与所述电路板 电连接。  [0022] Further, the functional component includes a circuit board, a function module and a switch disposed on the circuit board, and a buzzer disposed on one side of the circuit board and electrically connected thereto, the battery and the battery The circuit board is electrically connected.
[0023] 进一步地, 所述容槽包括第一容槽、 第二容槽和第三容槽, 所述第一容槽用于 容置所述电池, 所述第二容槽用于容置所述电路板, 所述第三容槽用于容置所 述蜂鸣器。 [0023] Further, the receiving tank includes a first receiving slot, a second receiving slot and a third receiving slot, wherein the first receiving slot is for receiving the battery, and the second receiving slot is for receiving The circuit board, the third pocket is used for accommodating The buzzer is described.
[0024] 进一步地, 所述封膜的外表面上设置有磨砂层。  [0024] Further, a frosted layer is disposed on an outer surface of the sealing film.
发明的有益效果  Advantageous effects of the invention
有益效果  Beneficial effect
[0025] 基于上述技术方案, 本发明实施例提出的多功能智能卡及其制作方法, 多功能 智能卡通过在其基板的一侧面上幵设容槽, 将电池和功能组件电连接并容置于 该容槽内, 且在电池和功能组件与该容槽之间的缝隙内填充满胶水, 再通过封 膜粘贴于基板的侧面上的沉槽内, 并将电池和功能组件密封封盖, 如此, 使得 该多功能智能卡整体极致薄, 且其结构简单, 可靠性高; 多功能智能卡制作方 法, 不仅实现了智能卡的极致薄效果, 且其工艺过程简单、 高效, 成本低。 对附图的简要说明  [0025] Based on the above technical solution, the multifunctional smart card and the manufacturing method thereof are provided by the embodiment of the present invention, and the multifunctional smart card electrically connects and accommodates the battery and the functional component by arranging a cavity on one side of the substrate thereof In the cavity, the gap between the battery and the functional component and the cavity is filled with glue, and then adhered to the sinking groove on the side of the substrate through the sealing film, and the battery and the functional component are sealed and sealed. The multifunctional smart card is extremely thin, and has a simple structure and high reliability. The multifunctional smart card manufacturing method not only realizes the ultra-thin effect of the smart card, but also has a simple, high-efficiency process and low cost. Brief description of the drawing
附图说明  DRAWINGS
[0026] 图 1为本发明实施例提出的多功能智能卡的爆炸示意图之一;  1 is a schematic diagram of an explosion of a multi-function smart card according to an embodiment of the present invention;
[0027] 图 2为本发明实施例提出的多功能智能卡的爆炸示意图之二; 2 is a second schematic diagram of an explosion of a multi-function smart card according to an embodiment of the present invention;
[0028] 图 3为本发明实施例中的基板的立体结构示意图; 3 is a schematic perspective structural view of a substrate according to an embodiment of the present invention;
[0029] 图 4为本发明实施例中的多功能智能卡插入充电器的装配示意图; 4 is a schematic diagram of assembly of a multi-function smart card inserted into a charger according to an embodiment of the present invention;
[0030] 图 5为本发明实施例中的多功能智能卡与充电器配合的爆炸示意图; 5 is a schematic exploded view of a multi-function smart card and a charger according to an embodiment of the present invention;
[0031] 图 6为本发明实施例提出的多功能智能卡制作方法的流程图。 6 is a flowchart of a method for fabricating a multifunctional smart card according to an embodiment of the present invention.
本发明的实施方式 Embodiments of the invention
[0032] 为了使本发明的目的、 技术方案及优点更加清楚明白, 以下结合附图及实施例 , 对本发明进行进一步详细说明。 应当理解, 此处所描述的具体实施例仅仅用 以解释本发明, 并不用于限定本发明。  The present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It is understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
[0033] 需要说明的是, 当元件被称为 "固定于"或"设置于"另一个元件, 它可以直接在 另一个元件上或可能同吋存在居中元件。 当一个元件被称为是 "连接于"另一个元 件, 它可以是直接连接到另一个元件或者可能同吋存在居中元件。  [0033] It should be noted that when an element is referred to as being "fixed" or "in" another element, it can be directly on the other element or possibly the same. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or the same element.
[0034] 另外, 还需要说明的是, 本发明实施例中的左、 右、 上、 下等方位用语, 仅是 互为相对概念或是以产品的正常使用状态为参考的, 而不应该认为是具有限制 性的。 以下结合具体实施例对本发明的实现进行详细的描述。 [0034] In addition, it should be noted that the left, right, upper, lower, and the like directions in the embodiment of the present invention are only Mutual relative concepts or reference to the normal use of the product, and should not be considered limiting. The implementation of the present invention will be described in detail below with reference to specific embodiments.
[0035] 本发明实施例提出了一种多功能智能卡及其制作方法, 其中, 该多功能智能卡 可将银行卡、 感应卡等重要的信息卡集成于一体, 且此多功能智能卡能与手机 很好的连接, 当此多功能智能卡离幵手机, 或者手机离幵此多功能智能卡一定 范围吋, 手机和此多功能智能卡都有相应的警示作用, 有效防止丢失。 也可以 把此多功能智能卡放在钱包里, 防止钱包或者相应的重要物品的丢失, 此多功 能智能卡还能检测当前环境的温 /湿度、 紫外光线的强度、 个人的运动 /睡眠健康 状况等等。 另外, 该多功能智能卡还可作为电子名片, 以及智能物联的终端点 等等; 该多功能智能卡还可具备 iBeaCOn、 Eddy stone、 NFC、 银行电子安全芯片 等功能, 以及可通过自定义私有通讯协议、 国际标准通讯协议进行数据传输; 再者, 该多功能智能卡可根据需要嵌入不同的功能芯片, 同吋保证智能卡整体 外观精细, 厚度极致薄的效果。 [0035] The embodiment of the invention provides a multifunctional smart card and a manufacturing method thereof, wherein the multifunctional smart card can integrate an important information card such as a bank card and a proximity card, and the multifunctional smart card can be very compatible with the mobile phone. Good connection, when the multi-function smart card leaves the mobile phone, or the mobile phone leaves the multi-function smart card within a certain range, the mobile phone and the multi-function smart card have corresponding warning functions to effectively prevent loss. You can also put this multi-function smart card in your wallet to prevent the loss of your wallet or related important items. This multi-function smart card can also detect the current environment's temperature/humidity, the intensity of ultraviolet light, personal exercise/sleep health, etc. . In addition, the multi-function smart card can also be used as an electronic business card, as well as a terminal point of the smart object, etc.; the multi-function smart card can also have functions such as iBea COn , Eddy stone, NFC, bank electronic security chip, and can be customized by private The communication protocol and the international standard communication protocol carry out data transmission; further, the multifunctional smart card can embed different function chips as needed, and ensure that the overall appearance of the smart card is fine and the thickness is extremely thin.
[0036] 如图 1至图 6所示, 本发明实施例提出的多功能智能卡, 其包括基板 1、 电池 2、 功能组件 3以及封膜 4, 其中, 基板 1为信用卡大小的注塑板件, 该基板 1的一侧 面上 (此处, 指的是基板 1的正面) 幵设有适配于电池 2和功能组件 3的容槽 11, 电池 2和功能组件 3容置于该容槽 11内, 同吋, 电池 2和功能组件 3之间电连接, 并且, 在电池 2和功能组件 3与容槽 11之间的缝隙内填充有胶水 (附图中未画出 ) , 此处, 通过在三者的缝隙内填充胶水, 不仅使得电池 2和功能组件 3能够被 胶接固定在容槽 11内, 而且, 由于凝固前的胶水具备流动性, 这样, 注胶使得 容槽 11内各处缝隙可被有效地填满, 并使得电池 2和功能组件 3在容槽 11内保持 平整, 保证了该智能卡的整体平整性, 并保证了该智能卡的韧性, 也实现了防 水效果; 另外, 容槽 11的外围环绕幵设有适配于封膜 4形状的沉槽 114, 封膜 4的 四周完全粘贴容置于该沉槽 114内, 并将电池 2和功能组件 3密封封盖在容槽 11内 [0036] As shown in FIG. 1 to FIG. 6 , a multi-function smart card according to an embodiment of the present invention includes a substrate 1, a battery 2, a functional component 3, and a sealing film 4, wherein the substrate 1 is a credit card-sized injection-molded panel. A side surface of the substrate 1 (here, referred to as the front surface of the substrate 1) is provided with a housing 11 adapted to the battery 2 and the functional component 3, and the battery 2 and the functional component 3 are housed in the housing 11. , the same, the battery 2 and the functional component 3 are electrically connected, and the gap between the battery 2 and the functional component 3 and the cavity 11 is filled with glue (not shown in the drawing), here, by The glue is filled in the gap between the three, so that the battery 2 and the functional component 3 can be glued and fixed in the cavity 11, and since the glue before solidification has fluidity, the glue can make the gap in the cavity 11 Can be effectively filled, and the battery 2 and the functional component 3 are kept flat in the cavity 11, ensuring the overall flatness of the smart card, and ensuring the toughness of the smart card, and achieving a waterproof effect; 1 A peripheral groove 1 of the casing 1 is provided with a sinking groove 114 adapted to the shape of the sealing film 4. The periphery of the sealing film 4 is completely adhered and received in the sinking groove 114, and the battery 2 and the functional component 3 are sealed and sealed in the receiving groove 11 Inside
[0037] 如上所述, 本发明实施例提出的多功能智能卡, 具有如下特点: [0037] As described above, the multifunctional smart card proposed by the embodiment of the present invention has the following features:
[0038] 本发明实施例提出的多功能智能卡, 其通过在基板 1一侧面上幵设容槽 11, 将 电池 2和功能组件 3电连接并容置于该容槽 11内, 有效利用的基板 1的厚度空间, 降低了智能卡整体厚度; 并且, 通过在电池 2和功能组件 3与容槽 11之间的缝隙 内填充胶水, 这样, 注胶使得容槽 11内各处缝隙可被有效地填满, 并使得电池 2 和功能组件 3在容槽 11内保持平整, 保证了智能卡的整体平整性, 并保证了该智 能卡的韧性, 也实现了防水效果; 另外, 通过在容槽 11外围幵设沉槽 114, 并将 封膜 4粘贴在该沉槽 114内, 使得电池 2和功能组件 3被密封封盖, 如此, 进一步 利用了基板 1的空间, 降低了该智能卡的整体厚度, 实现了多功能智能卡的极致 薄效果, 且该多功能智能卡的结构简单, 可靠性高。 [0038] The multi-function smart card according to the embodiment of the present invention electrically connects and accommodates the battery 2 and the functional component 3 in the cavity 11 by arranging the receptacle 11 on one side of the substrate 1, and the substrate is effectively utilized. 1 thickness space, reducing the overall thickness of the smart card; and, through the gap between the battery 2 and the functional component 3 and the cavity 11 The glue is filled therein, so that the glue can make the gaps in the cavity 11 be effectively filled, and the battery 2 and the functional component 3 are kept flat in the cavity 11, ensuring the overall flatness of the smart card and ensuring The toughness of the smart card also achieves a waterproof effect; in addition, by squeezing the sinking groove 114 in the periphery of the cavity 11, and sealing the sealing film 4 in the sinking groove 114, the battery 2 and the functional component 3 are sealed and sealed. In this way, the space of the substrate 1 is further utilized, the overall thickness of the smart card is reduced, and the ultra-thin effect of the multifunctional smart card is realized, and the multifunctional smart card has a simple structure and high reliability.
[0039] 进一步地, 在本发明的实施例中, 上述功能组件 3可包括电路板 31、 功能模块 3 2、 幵关 33和蜂鸣器 34, 功能模块 32集成在电路板 31上, 幵关 33焊接固定并电连 接在电路板 31上, 用户通过手指按压封膜 4上对应于幵关 33的位置, 使得该封膜 4挤压幵关 33, 如此, 即可控制整个多功能智能卡的幵启或者关闭, 蜂鸣器 34用 于发音报警, 该蜂鸣器 34设置在电路板 31的一侧并与其电连接, 上述电池 2与电 路板 31电连接, 该电池 2为整个智能卡提供电能。 当然, 根据实际情况和具体需 求, 在本发明的其他实施例中, 上述功能组件 3还可包括其他的零部件或者模块 等等, 此处不作唯一限定。  [0039] Further, in the embodiment of the present invention, the above functional component 3 may include a circuit board 31, a function module 3, a switch 33, and a buzzer 34. The function module 32 is integrated on the circuit board 31. 33 is fixedly and electrically connected to the circuit board 31, and the user presses the position of the sealing film 4 corresponding to the closing point 33 by the finger, so that the sealing film 4 is pressed against the closing point 33, so that the entire multifunctional smart card can be controlled. The buzzer 34 is used for sounding alarms. The buzzer 34 is disposed on one side of the circuit board 31 and electrically connected thereto. The battery 2 is electrically connected to the circuit board 31, and the battery 2 supplies power to the entire smart card. Of course, in the other embodiments of the present invention, the functional component 3 may further include other components or modules, etc., which are not limited herein.
[0040] 进一步地, 在本发明的实施例中, 上述容槽 11包括第一容槽 111、 第二容槽 112 和第三容槽 113, 第一容槽 111、 第二容槽 112和第三容槽 113连通, 其中, 第一 容槽 111用于容置上述电池 2, 第二容槽 112用于容置上述电路板 31以及其上的功 能模块 32和幵关 33, 第三容槽 113用于容置上述蜂鸣器 34。 通过设置第一容槽 11 1、 第二容槽 112和第三容槽 113, 使得电池 2、 电路板 31、 功能模块 32和幵关 33 以及蜂鸣器 34能够容置在对应地凹槽内, 这样, 充分利用了基板 1的空间, 有效 地降低了该多功能智能卡的整体厚度。  [0040] Further, in the embodiment of the present invention, the receiving tank 11 includes a first receiving slot 111, a second receiving slot 112, and a third receiving slot 113, and the first receiving slot 111, the second receiving slot 112, and the first slot The three-capacity slot 113 is connected, wherein the first pocket 111 is for accommodating the battery 2, and the second pocket 112 is for accommodating the circuit board 31 and the function module 32 and the gate 33 thereon. 113 is used to accommodate the buzzer 34 described above. By providing the first tank 11 1 , the second tank 112 and the third tank 113 , the battery 2 , the circuit board 31 , the function module 32 and the shut-off 33 and the buzzer 34 can be accommodated in the corresponding grooves Thus, the space of the substrate 1 is fully utilized, and the overall thickness of the multi-function smart card is effectively reduced.
[0041] 进一步地, 在本发明的实施例中, 基板 1的上述侧面上具有注胶口 10, 该注胶 口 10连通于上述容槽 11, 即连通于第一容槽 111、 第二容槽 112和第三容槽 113, 该注胶口 10用于向容槽 11内注入胶水以固定上述电池 2和功能组件 3, 并使电池 2 和功能组件 3在容槽 11内保持平整。  [0041] Further, in the embodiment of the present invention, the side surface of the substrate 1 has a glue injection port 10, and the glue injection port 10 communicates with the cavity 11 , that is, communicates with the first cavity 111 and the second volume. The tank 112 and the third tank 113 are used for injecting glue into the tank 11 to fix the battery 2 and the functional component 3, and to keep the battery 2 and the functional component 3 flat in the tank 11.
[0042] 进一步地, 上述基板 1的厚度为 lmm至 1.8mm, 封膜 4的厚度为 0.3mm, 沉槽 114 的深度为 0.3mm, 封膜 4粘贴容置在沉槽 114内并与基板 1表面的边缘平齐, 如此 , 整个多功能智能卡的厚度为 lmm至 1.8mm, 具有极致薄效果。 [0043] 进一步地, 在本发明的实施例中, 上述封膜 4的外表面上 (即基板 1的正面) 设 置有磨砂层 (附图中未画出) 。 通过设置磨砂层, 使得该封膜 4具备了抗划痕功 育 , 保证了该智能卡的美观性, 且该封膜 4采用 PC材料制作, 使得其具备了抗高 低温、 耐酸碱腐蚀的功能, 保证了该多功能智能卡的使用寿命。 [0042] Further, the substrate 1 has a thickness of 1 mm to 1.8 mm, the sealing film 4 has a thickness of 0.3 mm, and the sinking groove 114 has a depth of 0.3 mm. The sealing film 4 is adhered and received in the sinking groove 114 and the substrate 1 The edges of the surface are flush, so that the entire multi-function smart card has a thickness of 1mm to 1.8mm and has an extremely thin effect. Further, in the embodiment of the present invention, the outer surface of the sealing film 4 (ie, the front surface of the substrate 1) is provided with a frosted layer (not shown in the drawing). By providing a frosted layer, the sealing film 4 is provided with anti-scratch resistance, which ensures the aesthetics of the smart card, and the sealing film 4 is made of PC material, so that it has the functions of resisting high and low temperature and acid and alkali corrosion resistance. , to ensure the service life of the multi-function smart card.
[0044] 优选地, 在本发明的实施例中, 上述封膜 4优选为 PC (Polycarbonate, 聚碳酸 酯) 件; 上述基板 1优选为 PC和玻璃纤维混合材料制作, 如此, 基板 1和封膜 4均 具备了抗弯折、 抗断裂和破损的性能, 以及抗高低温、 耐酸碱腐蚀的性能, 保 证了使用性能和使用寿命。 当然, 根据实际情况和具体需求, 在本发明的其他 实施例中, 上述基板 1还可选用其他材料制作, 此处不作唯一限定。  [0044] Preferably, in the embodiment of the present invention, the sealing film 4 is preferably a PC (Polycarbonate) piece; the substrate 1 is preferably made of a mixed material of PC and glass fiber, such that the substrate 1 and the sealing film 4 It has the properties of resistance to bending, cracking and breakage, as well as high and low temperature resistance and acid and alkali corrosion resistance, ensuring the performance and service life. Of course, in the other embodiments of the present invention, the substrate 1 may be made of other materials according to actual conditions and specific requirements, which are not limited herein.
[0045] 优选地, 在本发明的实施例中, 上述电池 2优选为充电电池。 这样, 使得该智 能卡可以多次循环充电使用, 增加了其使用寿命。 当电池 2电量耗尽后, 通过外 部充电配件连接电源对其进行充电以实现循环使用。 当然, 根据实际情况和具 体需求, 在本发明的其他实施例中, 电池 2也可为非充电电池, 此处不作唯一限 定。 另外, 当电池 2优选为充电电池吋, 上述封膜 4的外表面上幵设有供该电池 2 的正、 负极外露的触点孔 40, 当该多功能智能卡插入与其适配的充电器 5内吋, 该充电器 5的触片 51透过触点孔 40与电池 2的正负极接触形成电连接; 当电池 2为 非充电电池吋, 封膜 4的外表面上不需要幵设触点孔, 也不需要配备充电器。  [0045] Preferably, in the embodiment of the invention, the battery 2 is preferably a rechargeable battery. In this way, the smart card can be recharged and used multiple times, increasing its service life. When the battery 2 is exhausted, it is charged by an external charging accessory to charge it for recycling. Of course, in other embodiments of the present invention, the battery 2 may also be a non-rechargeable battery, which is not limited herein. In addition, when the battery 2 is preferably a rechargeable battery pack, the outer surface of the sealing film 4 is provided with a contact hole 40 for the positive and negative electrodes of the battery 2, and the multifunctional smart card is inserted into the charger 5 adapted thereto. The contact 51 of the charger 5 is electrically connected to the positive and negative electrodes of the battery 2 through the contact hole 40; when the battery 2 is a non-rechargeable battery, the outer surface of the sealing film 4 does not need to be touched. Do not need a charger for point holes.
[0046] 优选地, 在本发明的实施例中, 上述电路板 31优选为 FPC (Flexible Printed [0046] Preferably, in the embodiment of the present invention, the circuit board 31 is preferably FPC (Flexible Printed).
Circuit) 柔性电路板。 由于 FPC板具有配线密度高、 重量轻、 厚度薄、 弯折性好 的特点, 通过将电路板 31选用为 FPC板, 不仅保证了其电气性能, 而且, 相对于 传统的印制电路板, 使其具备了重量轻、 厚度薄、 弯折性好的特性, 降低了智 能卡整体厚度, 提高了基板 1的空间利用率。 Circuit) Flexible circuit board. Since the FPC board has the characteristics of high wiring density, light weight, thin thickness, and good bending property, by selecting the circuit board 31 as an FPC board, not only the electrical performance thereof is ensured, but also, compared with the conventional printed circuit board, It has the characteristics of light weight, thin thickness and good bending property, which reduces the overall thickness of the smart card and improves the space utilization ratio of the substrate 1.
[0047] 如图 1至图 6所示, 本发明实施例提出的多功能智能卡制作方法, 其包括如下步 骤:  [0047] As shown in FIG. 1 to FIG. 6 , a method for manufacturing a multifunctional smart card according to an embodiment of the present invention includes the following steps:
[0048] S100, 通过注塑机注塑形成基板 1, 与此同吋, 在该基板 1的一侧面上形成用于 容置电池 2和功能组件 3的容槽 11, 以及用于容置封膜 4的沉槽 114;  [0048] S100, forming the substrate 1 by injection molding, and forming a cavity 11 for accommodating the battery 2 and the functional component 3 on one side of the substrate 1, and for accommodating the sealing film 4 Sink 114
[0049] S200, 将电池 2和功能组件 3焊接形成一体件, 两者通过焊接形成电连接; [0050] S300, 将由电池 2和功能组件 3焊接形成的一体件置于容槽 11内; [0051] S400, 向电池 2和功能组件 3与容槽之间的缝隙内填充胶水, 使电池 2和功能组 件 3固定容置在容槽 11内, 并保持平整状态; [0049] S200, the battery 2 and the functional component 3 are welded to form a single piece, and the two are electrically connected by welding; [0050] S300, the integral piece formed by welding the battery 2 and the functional component 3 is placed in the cavity 11; [0051] S400, filling the gap between the battery 2 and the functional component 3 and the cavity with glue, so that the battery 2 and the functional component 3 are fixedly received in the cavity 11 and maintained in a flat state;
[0052] S500, 通过贴膜机将封膜 4粘贴于沉槽 114内, 通过封膜 4使电池 2和功能组件 3 密封于容槽 11内。 [0052] S500, the sealing film 4 is pasted into the sinking groove 114 by a film laminating machine, and the battery 2 and the functional component 3 are sealed in the cavity 11 by the sealing film 4.
[0053] 在本发明的实施例中, 上述基板 1的厚度为 lmm至 1.8mm, 封膜 4的厚度为 0.3m m, 沉槽 114的深度为 0.3mm, 封膜 4粘贴容置在沉槽 114内并与基板 1表面的边缘 平齐, 如此, 整个多功能智能卡的厚度为 lmm至 1.8mm, 具有极致薄效果。  In the embodiment of the present invention, the substrate 1 has a thickness of 1 mm to 1.8 mm, the sealing film 4 has a thickness of 0.3 mm, and the sinking groove 114 has a depth of 0.3 mm. The sealing film 4 is adhered and received in the sinking groove 114. The inside is flush with the edge of the surface of the substrate 1, and thus, the entire multifunctional smart card has a thickness of 1 mm to 1.8 mm, and has an extremely thin effect.
[0054] 在本发明的实施例中, 上述电路板 31优选为 FPC (Flexible Printed Circuit) 柔性 电路板。 由于 FPC板具有配线密度高、 重量轻、 厚度薄、 弯折性好的特点, 因此 , 通过将该电路板 31选用为 FPC板, 不仅保证了其电气性能, 而且, 相对于传统 的印制电路板, 使其具备了重量轻、 厚度薄、 弯折性好的特性, 降低了智能卡 整体厚度, 提高了基板 1的空间利用率。  In the embodiment of the present invention, the circuit board 31 is preferably an FPC (Flexible Printed Circuit) flexible circuit board. Since the FPC board has the characteristics of high wiring density, light weight, thin thickness, and good bending property, by selecting the circuit board 31 as an FPC board, not only the electrical performance thereof but also the conventional printing is ensured. The circuit board has the characteristics of light weight, thin thickness and good bending property, which reduces the overall thickness of the smart card and improves the space utilization ratio of the substrate 1.
[0055] 在本发明的实施例中, 上述功能组件 3可包括电路板 31、 功能模块 32、 幵关 33 和蜂鸣器 34, 功能模块 32集成在电路板 31上, 幵关 33焊接固定并电连接在电路 板 31上, 用户通过手指按压封膜 4上对应于幵关 33的位置, 使得该封膜 4挤压幵 关 33, 如此, 即可控制整个多功能智能卡的幵启或者关闭, 蜂鸣器 34用于发音 报警, 该蜂鸣器 34设置在电路板 31的一侧并与其电连接, 上述电池 2与电路板 31 电连接, 该电池 2为整个智能卡提供电能。  [0055] In an embodiment of the present invention, the above functional component 3 may include a circuit board 31, a function module 32, a switch 33, and a buzzer 34. The function module 32 is integrated on the circuit board 31, and the switch 33 is soldered and fixed. Electrically connected to the circuit board 31, the user presses the position of the sealing film 4 corresponding to the closing point 33 by the finger, so that the sealing film 4 is pressed against the closing point 33, so that the opening or closing of the entire multifunctional smart card can be controlled. The buzzer 34 is used for a sounding alarm. The buzzer 34 is disposed on one side of the circuit board 31 and electrically connected thereto. The battery 2 is electrically connected to the circuit board 31, and the battery 2 supplies power to the entire smart card.
[0056] 在本发明的实施例中, 上述容槽 11可包括第一容槽 111、 第二容槽 112以及第三 容槽 113, 第一容槽 111、 第二容槽 112和第三容槽 113连通, 其中, 第一容槽 111 用于容置上述电池 2, 第二容槽 112用于容置上述电路板 31以及其上的功能模块 3 2和幵关 33, 第三容槽 113用于容置上述蜂鸣器 34。 通过设置第一容槽 111、 第二 容槽 112和第三容槽 113, 使得电池 2、 电路板 31、 功能模块 32和幵关 33以及蜂鸣 器 34能够容置在对应地凹槽内, 充分利用了基板 1的空间, 有效地降低了该多功 能智能卡的整体厚度。  In the embodiment of the present invention, the receiving tank 11 may include a first receiving slot 111, a second receiving slot 112, and a third receiving slot 113. The first receiving slot 111, the second receiving slot 112, and the third receiving slot The slot 113 is in communication, wherein the first slot 111 is configured to receive the battery 2, and the second slot 112 is configured to receive the circuit board 31 and the function module 3 2 and the switch 33 thereon, and the third slot 113 It is used to accommodate the above buzzer 34. By providing the first pocket 111, the second pocket 112 and the third pocket 113, the battery 2, the circuit board 31, the function module 32 and the switch 33, and the buzzer 34 can be accommodated in the corresponding grooves. The space of the substrate 1 is fully utilized, and the overall thickness of the multifunctional smart card is effectively reduced.
[0057] 在本发明的实施例中, 上述封膜 4的外表面上 (即基板 1的正面) 设置有磨砂层  In the embodiment of the present invention, the outer surface of the sealing film 4 (ie, the front surface of the substrate 1) is provided with a frosted layer.
(附图中未画出) 。 通过设置磨砂层, 使得该封膜 4具备了抗划痕功能, 保证了 该智能卡的美观性, 且该封膜 4采用 PC材料制作, 使得其具备了抗高低温、 耐酸 碱腐蚀的功能, 保证了该多功能智能卡的使用寿命。 (not shown in the drawing). By providing a frosted layer, the sealing film 4 has a scratch-resistant function, which ensures the aesthetics of the smart card, and the sealing film 4 is made of PC material, so that it has high temperature resistance and acid resistance. The function of alkali corrosion guarantees the service life of the multi-function smart card.
[0058] 基于上述技术方案, 本发明实施例提出的多功能智能卡及其制作方法, 其中, 多功能智能卡通过在其基板 1的一侧面上幵设容槽 11, 将电池 2和功能组件 3电连 接并容置于该容槽 11内, 且在电池 2和功能组件 3与该容槽 11之间的缝隙内填充 满胶水, 再通过封膜 4粘贴于基板 1的侧面上的沉槽 114内, 并将电池 2和功能组 件 3密封封盖, 如此, 使得该多功能智能卡整体极致薄, 且其结构简单, 可靠性 高; 多功能智能卡制作方法, 不仅实现了多功能智能卡的极致薄效果, 且其制 作过程简单、 方便、 高效, 成本低。  [0058] Based on the above technical solution, the multi-function smart card and the manufacturing method thereof are provided in the embodiment of the present invention, wherein the multi-function smart card electrically charges the battery 2 and the functional component 3 by arranging the receptacle 11 on one side of the substrate 1 It is connected and accommodated in the cavity 11 , and is filled with glue in the gap between the battery 2 and the functional component 3 and the cavity 11 , and then adhered to the sinking groove 114 on the side of the substrate 1 through the sealing film 4 . The battery 2 and the functional component 3 are sealed and sealed, so that the multifunctional smart card is extremely thin overall, and has a simple structure and high reliability; the multifunctional smart card manufacturing method not only realizes the ultra-thin effect of the multifunctional smart card, And the production process is simple, convenient, efficient, and low in cost.
[0059] 以上所述, 仅为本发明的具体实施方式, 但本发明的保护范围并不局限于此, 任何熟悉本技术领域的技术人员在本发明揭露的技术范围内, 可轻易想到各种 等效的修改、 替换和改进等, 这些修改、 替换和改进都应涵盖在本发明的保护 范围之内。 因此, 本发明的保护范围应以权利要求的保护范围为准。  The above description is only the specific embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily think of various kinds within the technical scope disclosed by the present invention. Equivalent modifications, substitutions and improvements, etc., are intended to be included within the scope of the present invention. Therefore, the scope of the invention should be determined by the scope of the claims.

Claims

权利要求书 Claim
多功能智能卡, 其特征在于, 包括基板、 电池、 功能组件以及封膜, 所述基板的一侧面上幵设有容槽和环绕于所述容槽外围的沉槽, 所述 电池和所述功能组件电连接并容置于所述容槽内, 且所述电池和所述 功能组件与所述容槽之间的缝隙内填充有胶水, 所述封膜容置于所述 沉槽内并将所述电池和所述功能组件密封封盖。 a multifunctional smart card, comprising: a substrate, a battery, a functional component, and a sealing film, wherein a side surface of the substrate is provided with a receiving groove and a sinking groove surrounding the periphery of the receiving groove, the battery and the function The component is electrically connected and received in the cavity, and a gap between the battery and the functional component and the cavity is filled with glue, and the sealing film is accommodated in the sinking groove and The battery and the functional component seal the closure.
如权利要求 1所述的多功能智能卡, 其特征在于, 所述功能组件包括 电路板, 设置于所述电路板上的功能模块和幵关, 以及设置于所述电 路板一侧并与其电连接的蜂鸣器, 所述电池与所述电路板电连接。 如权利要求 2所述的多功能智能卡, 其特征在于, 所述容槽包括第一 容槽、 第二容槽和第三容槽, 所述第一容槽用于容置所述电池, 所述 第二容槽用于容置所述电路板, 所述第三容槽用于容置所述蜂鸣器。 如权利要求 1所述的多功能智能卡, 其特征在于, 所述基板的侧面上 具有与所述容槽连通的注胶口, 所述注胶口用于向所述容槽内注胶以 固定所述电池和所述功能组件。 The multi-function smart card according to claim 1, wherein the functional component comprises a circuit board, a function module and a switch disposed on the circuit board, and is disposed on one side of the circuit board and electrically connected thereto a buzzer, the battery being electrically connected to the circuit board. The multi-function smart card according to claim 2, wherein the receiving slot comprises a first receiving slot, a second receiving slot and a third receiving slot, wherein the first receiving slot is configured to receive the battery, The second receiving slot is configured to receive the circuit board, and the third receiving slot is configured to receive the buzzer. The multi-function smart card according to claim 1, wherein a side of the substrate has a glue injection port communicating with the cavity, and the glue injection port is used for injecting glue into the cavity to fix The battery and the functional component.
如权利要求 1至 4任一项所述的多功能智能卡, 其特征在于, 所述基板 的厚度为 1 mm至 1.8mm。 The multi-function smart card according to any one of claims 1 to 4, wherein the substrate has a thickness of 1 mm to 1.8 mm.
如权利要求 1至 4任一项所述的多功能智能卡, 其特征在于, 所述封膜 的外表面上设置有磨砂层。 The multi-function smart card according to any one of claims 1 to 4, characterized in that the outer surface of the sealing film is provided with a frosted layer.
如权利要求 1至 4任一项所述的多功能智能卡, 其特征在于, 所述封膜 为 PC件。 The multi-function smart card according to any one of claims 1 to 4, wherein the sealing film is a PC piece.
如权利要求 1至 4任一项所述的多功能智能卡, 其特征在于, 所述电池 为充电电池。 The multi-function smart card according to any one of claims 1 to 4, wherein the battery is a rechargeable battery.
如权利要求 2至 4任一项所述的多功能智能卡, 其特征在于, 所述电路 板为柔性电路板。 The multi-function smart card according to any one of claims 2 to 4, wherein the circuit board is a flexible circuit board.
多功能智能卡制作方法, 其特征在于, 包括如下步骤: The multifunctional smart card making method is characterized in that it comprises the following steps:
S100, 通过注塑机注塑基板, 并在基板的一侧面上形成容槽和沉槽; S100, injecting a substrate through an injection molding machine, and forming a receiving groove and a sinking groove on one side of the substrate;
S200, 将电池和功能组件焊接形成一体件, 并形成电连接; S300, 将由电池和功能组件焊接形成的一体件置于容槽内; S200, welding the battery and the functional component into a single piece, and forming an electrical connection; S300, placing an integral piece formed by welding the battery and the functional component into the cavity;
S400, 向电池和功能组件与容槽之间的缝隙内填充胶水, 使电池和功 能组件固定容置在容槽内;  S400, filling a gap between the battery and the functional component and the cavity, so that the battery and the functional component are fixedly received in the cavity;
S500, 通过贴膜机将封膜粘贴于沉槽内, 使电池和功能组件密封于容 槽内。  In S500, the sealing film is pasted into the sink by a laminating machine to seal the battery and functional components in the tank.
[权利要求 11] 如权利要求 10所述的多功能智能卡制作方法, 其特征在于, 所述基板 的厚度为 lmm至 1.8mm。  [Claim 11] The multifunction smart card manufacturing method according to claim 10, wherein the substrate has a thickness of from 1 mm to 1.8 mm.
[权利要求 12] 如权利要求 10所述的多功能智能卡制作方法, 其特征在于, 所述电路 板为柔性电路板。 [Claim 12] The multifunction smart card manufacturing method according to claim 10, wherein the circuit board is a flexible circuit board.
[权利要求 13] 如权利要求 10至 12任一项所述的多功能智能卡制作方法, 其特征在于 , 所述功能组件包括电路板, 设置于所述电路板上的功能模块和幵关 , 以及设置于所述电路板一侧并与其电连接的蜂鸣器, 所述电池与所 述电路板电连接。 [Claim 13] The multi-function smart card manufacturing method according to any one of claims 10 to 12, wherein the functional component comprises a circuit board, a function module and a switch disposed on the circuit board, and A buzzer is disposed on a side of the circuit board and electrically connected thereto, and the battery is electrically connected to the circuit board.
[权利要求 14] 如权利要求 13所述的多功能智能卡制作方法, 其特征在于, 所述容槽 包括第一容槽、 第二容槽和第三容槽, 所述第一容槽用于容置所述电 池, 所述第二容槽用于容置所述电路板, 所述第三容槽用于容置所述 蜂鸣器。  The method of claim 13 , wherein the receiving slot comprises a first receiving slot, a second receiving slot and a third receiving slot, wherein the first receiving slot is used for The battery is received, the second receiving slot is configured to receive the circuit board, and the third receiving slot is configured to receive the buzzer.
[权利要求 15] 如权利要求 10至 12任一项所述的多功能智能卡制作方法, 其特征在于 [Claim 15] The method for fabricating a multifunctional smart card according to any one of claims 10 to 12, characterized in that
, 所述封膜的外表面上设置有磨砂层。 The outer surface of the sealing film is provided with a frosted layer.
PCT/CN2015/091618 2015-10-10 2015-10-10 Multi-functional smart card and manufacturing method therefor WO2017059588A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/CN2015/091618 WO2017059588A1 (en) 2015-10-10 2015-10-10 Multi-functional smart card and manufacturing method therefor
CN201580000628.4A CN105518718B (en) 2015-10-10 2015-10-10 Multi-function intelligent card and preparation method thereof

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CN101281618A (en) * 2008-05-27 2008-10-08 北京海升天达科技有限公司 Smart card and method for manufacturing the same
KR20100039581A (en) * 2008-10-08 2010-04-16 주식회사 제이디씨텍 A process of manufacture for display card
CN102289700A (en) * 2011-07-20 2011-12-21 上海浦江智能卡系统有限公司 Contact-type smart card
CN204189185U (en) * 2014-11-11 2015-03-04 深圳市金溢科技股份有限公司 There is compound visa card and the smart card of ambiguity path recognition function

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CN101493902B (en) * 2009-03-06 2012-04-25 北京海升天达科技有限公司 Method for manufacturing card
CN104537410A (en) * 2014-12-11 2015-04-22 苏州海博智能系统有限公司 Manufacturing method for intelligent pass card

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CN101169836A (en) * 2006-10-25 2008-04-30 刘钦栋 Memory card structure
CN101281618A (en) * 2008-05-27 2008-10-08 北京海升天达科技有限公司 Smart card and method for manufacturing the same
KR20100039581A (en) * 2008-10-08 2010-04-16 주식회사 제이디씨텍 A process of manufacture for display card
CN102289700A (en) * 2011-07-20 2011-12-21 上海浦江智能卡系统有限公司 Contact-type smart card
CN204189185U (en) * 2014-11-11 2015-03-04 深圳市金溢科技股份有限公司 There is compound visa card and the smart card of ambiguity path recognition function

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