CN205039143U - Electron device and electronic equipment - Google Patents
Electron device and electronic equipment Download PDFInfo
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- CN205039143U CN205039143U CN201520631645.5U CN201520631645U CN205039143U CN 205039143 U CN205039143 U CN 205039143U CN 201520631645 U CN201520631645 U CN 201520631645U CN 205039143 U CN205039143 U CN 205039143U
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Abstract
The utility model provides an electron device and electronic equipment. Particularly, the utility model provides an electron device. This electron device includes: the flexible circuit board, the chip layer, the chip layer sets up the upper surface of flexible circuit board, and the chip layer with the flexible circuit board electricity is connected, the overburden, the overburden sets up the upper surface on chip layer, and thermoset coherent film, the thermoset coherent film sets up the chip layer with adhere between the overburden the chip layer with the overburden. Specifically, adhere chip layer and overburden through adopting the thermoset coherent film to replace glue, improved electron device's structure, can avoid the preparation in -process at this electron device effectively, owing to glue spills over the pollution that causes to improve the yield of product, and then improved this electron device's result of use and reduced this electron device's preparation cost.
Description
Technical field
The utility model relates to electronic device field, particularly, relates to electronic device and electronic equipment.
Background technology
In recent years, along with the development of electronics technology, the kind of electronic device and function are also abundanter.And, need under the prerequisite of production control cost, to meet between the high speed of service, each parts rational power division and overall device volume is little, have the multiple requirements such as transparent, flexible, thus the requirement of the connection encapsulation mode between the structure of all parts in electronic device and parts is also improved constantly.Therefore, electronic device structure reasonable in design and easy and simple to handle, the assembling of dependable performance, packaged type also become the emphasis that people pay close attention to.
But structural design and the assembling mode of current electronic device still have much room for improvement.
Utility model content
The utility model is intended to solve one of technical problem in correlation technique at least to a certain extent.
The utility model completes based on the following discovery of inventor:
In current electronic device manufacture process, the situation that ubiquity component assembling process product yield is undesirable, this causes adverse influence for reduction electronic device manufacturing cost.Inventor is found by large quantity research, usually can use various glue in an assembling process, and glue has stronger mobility usually, therefore, in an assembling process, glue easily overflows and pollutes product, thus reduces the decline of product yield in assembling process.
In view of this, in first aspect of the present utility model, the utility model proposes a kind of electronic device.Particularly, this electronic device comprises: flexible PCB; Chip layer, described chip layer is arranged on the upper surface of described flexible PCB, and described chip layer is electrically connected with described flexible PCB; Cover layer, described cover layer is arranged on the upper surface of described chip layer; And thermosetting coherent film, described thermosetting coherent film is arranged between described chip layer and described cover layer and bonds described chip layer and described cover layer.Particularly, substitute glue by adopting thermosetting coherent film chip layer and cover layer are bonded, improve the structure of electronic device, can effectively avoid in the preparation process of this electronic device, because glue overflows the pollution caused, thus improve the yield of product, and then improve the result of use of this electronic device and reduce the preparation cost of this electronic device.
In second aspect of the present utility model, the utility model proposes a kind of electronic equipment.Particularly, this electronic equipment comprises the previously described electronic device provided according to any one embodiment of the present utility model.Thus, can by previously described electronic device for this electronic equipment provide have rational in infrastructure, prepare easy element and form, and then the result of use of this electronic equipment can be improved.
Particularly, described electronic equipment is mobile phone, electron key, panel computer, door-control lock, fingerprint acquisition instrument or self-help drawing money machine.Thus, can difference according to the actual requirements, select suitable previously described electronic components to obtain this electronic equipment, and then while the feature having above-mentioned electronic device concurrently and advantage, the scope of application of this electronic equipment can be expanded further.
Accompanying drawing explanation
Fig. 1 shows the structural representation of the electronic device according to the utility model embodiment;
Fig. 2 shows the structural representation of the electronic device according to another embodiment of the utility model;
Fig. 3 shows the part-structure schematic diagram of the electronic device according to another embodiment of the utility model;
Fig. 4 shows the structural representation of the electronic device according to another embodiment of the utility model;
Fig. 5 shows the part-structure schematic diagram of the electronic device according to another embodiment of the utility model;
Fig. 6 shows the part-structure schematic diagram of the electronic device according to another embodiment of the utility model;
Fig. 7 shows the part-structure schematic diagram of the electronic device according to another embodiment of the utility model;
Fig. 8 shows the part-structure schematic diagram of the electronic device according to another embodiment of the utility model;
Fig. 9 shows the schematic flow sheet preparing the method for electronic device according to the utility model embodiment;
Figure 10 shows the schematic flow sheet preparing the method for electronic device according to another embodiment of the utility model;
Figure 11 shows the schematic flow sheet preparing the method for electronic device according to another embodiment of the utility model;
Figure 12 shows the schematic flow sheet preparing the method for electronic device according to another embodiment of the utility model; And
Figure 13 shows the structural representation of the electronic equipment according to the utility model embodiment.
Description of reference numerals:
100: flexible PCB
200: chip layer
300: cover layer
400: thermosetting coherent film
500: supporting layer
600: becket
700: hold cavity
1000: housing
2000: accessory
Embodiment
Be described below in detail embodiment of the present utility model, the example of described embodiment is shown in the drawings, and wherein same or similar label represents same or similar element or has element that is identical or similar functions from start to finish.Being exemplary below by the embodiment be described with reference to the drawings, only for explaining the utility model, and can not being interpreted as restriction of the present utility model.
The utility model completes based on the following discovery of inventor:
In current electronic device manufacture process, the situation that ubiquity component assembling process product yield is undesirable, this causes adverse influence for reduction electronic device manufacturing cost.Inventor is found by large quantity research, usually can use various glue in an assembling process, and glue has stronger mobility usually, therefore, in an assembling process, glue easily overflows and pollutes product, thus reduces the decline of product yield in assembling process.
In view of this, in first aspect of the present utility model, the utility model proposes a kind of electronic device.According to embodiment of the present utility model, with reference to figure 1, this electronic device comprises: flexible PCB 100, chip layer 200, cover layer 300 and thermosetting coherent film 400.Particularly, chip layer 200 is arranged on the upper surface of flexible PCB 100, and is formed between chip layer 200 with flexible PCB 100 and is electrically connected, to realize the electric function of chip layer 200 and flexible PCB 100; Cover layer 300 is arranged on the upper surface of chip layer 200, covers and protection, and between cover layer 300 and chip layer 200, be provided with thermosetting coherent film 400, for bonding cover layer 300 and chip layer 200 for providing for chip layer 200.According to embodiment of the present utility model, substitute glue by adopting thermosetting coherent film chip layer and cover layer are bonded, improve the structure of electronic device, can effectively avoid in the preparation process of this electronic device, because glue overflows the pollution caused, thus improve the yield of product, and then improve according to the result of use of the electronic device of embodiment of the present utility model or the preparation cost reducing this electronic device.Thus, according to embodiment of the present utility model, can by rational structural design, and adopt thermosetting coherent film 400 to carry out the effect of alternative glue when preparing the electronic device according to the utility model embodiment, reach and prevent from overflowing, simplify production process, improve the object of product yield, and then improve the result of use according to the electronic device of embodiment of the present utility model.
For convenience of understanding, below each several part of the electronic device according to the utility model embodiment is described in detail:
According to embodiment of the present utility model, flexible PCB 100 can adopt the flexible material such as polyimides or polyester to make as base material, has the features such as the frivolous and bent performance of simple and convenient assembly, volume, is therefore widely used in electronic device preparation field.Thus, can have that quality is light, thickness is thin and circuit board highly reliably by flexible PCB 100 for providing according to the electronic device of embodiment of the present utility model, thus under can realizing keeping smaller size smaller and better flexible prerequisite, for providing circuit base according to the electronic device of the utility model embodiment, and then improve the serviceability according to the electronic device of the utility model embodiment.In addition, those skilled in the art can understand, the particular type of flexible PCB 100 is not particularly limited, those skilled in the art can select corresponding circuit board to form flexible PCB 100 according to actual needs, as long as can meet for providing reliable flexible circuit according to embodiment of the present utility model.
According to embodiment of the present utility model, with reference to figure 2, this electronic device may further include supporting layer 500, and supporting layer 500 is arranged on the lower surface of flexible PCB 100.According to embodiment of the present utility model, the type of supporting layer 500 is also not particularly limited, and according to examples more of the present utility model, preferably, supporting layer 500 is made up of steel disc.Thus, by supporting layer 500 for flexible PCB 100 provides good support, and then the effect of protection flexible PCB 100 can be reached, thus improve the robustness according to the electronic device of the utility model embodiment further.
According to embodiment of the present utility model, the chip type comprised in chip layer 200 determines the function of the electronic device according to the utility model embodiment.Such as, according to embodiment of the present utility model, this chip can be fingerprint recognition chip or electron key chip.Thus; can difference according to the actual requirements; select the chip with difference in functionality; and by encapsulation; operator guards compositing chip layer 200 is formed to the chip selected; thus the result of use improved according to the electronic device of the utility model embodiment, and expansion is according to the range of application of the electronic device of the utility model embodiment.
According to embodiment of the present utility model, preferably, chip layer 200 can be formed by Background Grid array packages.Background Grid array packages chip, is also called LGA chip (LandGridArray), adopts contact encapsulation to replace needle-like pin, thus reduces the signal noise at the contact place brought due to the way of contact of needle-like pin.Further, Background Grid array packages chip under the prerequisite not increasing chip area, can also provide the contact point of more crypto set, thus can improve the processing speed of chip.Thus, by adopting the chip layer 200 of Background Grid array packages pattern for providing the chip layer with good signal-to noise ratio and higher position reason speed according to the electronic device of embodiment of the present utility model, thus the result of use according to the electronic device of embodiment of the present utility model can be improved further.
In addition, according to embodiment of the present utility model, between chip layer 200 and flexible PCB 100, electrical connection is formed with.According to embodiment of the present utility model, the mode be electrically connected also is not particularly limited, direct electrical connection can be realized by adopting between flexible PCB 100 and chip layer 200 modes such as wire connection, coated with conductive glue or welding, also can realize Indirect Electro by modes such as such as electric induction to connect, thus reach the object of UNICOM's flexible PCB 100 and chip layer 200, and then realize the using function according to the electronic device of embodiment of the present utility model.Particularly, according to embodiment of the present utility model, chip layer 200 can be connected by tin cream or anisotropic conductive with flexible PCB 100.Tin cream is owing to containing solder metal powder and scaling powder simultaneously, can welding process be simplified, not need complicated welding process equipment, by directly by solder paste coating on metal pad, configuration needs the parts realizing electrical connection, and reflux heat process can complete electrical connection.Because anisotropic conductive then only has conductive capability in particular directions, and there is lower curing temperature, therefore, it is less (according to embodiment of the present utility model that anisotropic conductive has gone for spacing between electronic component, this spacing minimumly can reach 50 microns) connection, have simple to operate, the advantages such as flexibility is better.Thus, those skilled in the art can according to the circuit distribution situation of the concrete structure of chip layer 200 and flexible PCB 100, select the electrical connection that suitable mode realizes between flexible PCB 100 and chip layer 200, thus under the prerequisite of operating efficiency not affecting flexible PCB 100 and chip layer 200, for providing easy and simple to handle, with low cost according to the electronic device of the utility model embodiment, connect be electrically connected reliably.
According to embodiment of the present utility model, cover layer 300 is arranged on the upper surface of chip layer 200, to be reached for the object that chip layer 200 provides protection.Those skilled in the art can understand; material and the method for composition cover layer 300 are not particularly limited; as long as under the prerequisite of result of use not affecting the electronic device according to the utility model embodiment, covering function can be protected for chip layer 200 provides.Particularly, according to embodiment of the present utility model, cover layer 300 can be formed by pottery, sapphire, glass, PMMA plate, PC plate or PET plate.Thus, can difference according to the actual requirements, select different materials to form cover layer 300, thus reach the different demands of electronic device for hardness, light transmittance and flexibility, thus expand the range of application according to the electronic device of the utility model embodiment further.
According to embodiment of the present utility model, by adopting thermosetting coherent film 400, chip layer 200 and cover layer 300 are bonded.Concrete, according to embodiment of the present utility model, thermosetting coherent film 400 can be formed by adopting hot-setting adhesive between chip layer 200 and cover layer 300, thus realize chip layer 200 and cover layer 300 to bond.Particularly, according to embodiment of the present utility model, hot-setting adhesive comprises DAF or FOW film.Wherein, DAF (DieAttachFilm) is the fexible film with bond properties that a class has the composition formations such as epoxy resin, curing agent and amorphous silicon, there is attachment process simple, the advantages such as solidification process can be completed by heating, and, can by removing the mode of redundance film body after solidification, easy formation has the coherent film of particular area and shape.FOW film (FlowOverWine) is a kind of glued membrane having load film and scribing film function concurrently, attaches process simple, has mobility flexible and certain preferably.Thus, the object bonding chip layer 200 and cover layer 300 can be completed by selecting suitable hot-setting adhesive to form thermosetting coherent film 400, and then the preparation technology simplified according to the electronic device of the utility model embodiment, and can avoid using the spilling brought of glue and cause preparing yield and decline, thus the cost performance improved further according to the electronic device of embodiment of the present utility model and result of use.It should be noted that, inventor's Late Cambrian of the present utility model is in the preparation process of electronic device, because traditional handicraft uses glue, therefore the remarkable decline of product yield can be caused, therefore, inventor of the present utility model carries out research to the adhesive of various adhesively bonded electric device element or bonding mode and finds, by arranging thermosetting coherent film 400 between chip layer 200 and cover layer 300, especially DAF or FOW film, effectively can improve yield prepared by product, thus reduce the cost of corresponding product, simultaneously, guarantee that electric property or the function of electronic device can not be affected.
In addition, according to embodiment of the present utility model, with reference to figure 3, thermosetting coherent film 400 can also have the thickness of 5 ~ 100 microns.Inventor finds the thermosetting coherent film by adopting this thickness, further while the bond strength improving chip layer 200 and cover layer 300, can guarantee that the electric property of electronic device or function can not be affected.
According to embodiment of the present utility model, with reference to figure 4, this electronic device can have becket 600 further.Becket 600 is arranged on the upper surface of flexible PCB 100, and around chip layer 200 and cover layer 300.According to an embodiment of the present utility model, with reference to figure 5, this electronic device can have the structure in vertical view as shown in Figure 5, namely becket 600 is looped around the outside of chip layer 200 and cover layer 300 and the sidewall of closed chip layer 200 and cover layer 300, and becket 600, chip layer 200 and cover layer 300 are all formed on the upper surface of flexible circuit layer 100.Thus, can pass through the upper surface of this becket vibrational power flow at described flexible PCB, and around described chip layer and cover layer, for described chip layer and cover layer provide protection further or decoration.
According to embodiment of the present utility model, with reference to figure 6, the inwall of becket 600 and the sidewall of chip layer 200 limit and hold cavity 700.Thus, can by accommodation cavity 700 for the jointing material of follow-up fixing metal ring 600 and chip layer 200 provides headspace, and then prevent from impacting the electronic device performance according to embodiment of the present utility model when fixing metal ring 600 and chip layer 200, thus improve the result of use according to the electronic device of embodiment of the present utility model.According to embodiment of the present utility model, can by transforming the structure of becket 600 or chip layer 200, to make the sidewall of the inwall of becket 600 and chip layer 200 limit hold cavity 700.Thus, in the process of this electronic device of preparation, becket 600 can be carried out bonding with the upper surface of flexible circuit layer 100 by adopting glue, in bonding process, the glue overflowed to enter in this accommodation cavity 700 and solidification and can not spill into other positions to electronic device and pollute, thus can improve the manufacturing yield of products of this electronic device significantly by arranging this accommodation cavity 700.Thus, can be implemented in while improving product yield, can guarantee that again the electric property of electronic device or function can not be affected.
According to embodiment of the present utility model, with reference to figure 7, the inwall of becket 600 can have at least one breach, to limit described accommodation cavity 700 by the sidewall of breach and chip layer 200.In other words, by forming breach at becket 600 towards chip layer 200 side, forming closed space with chip layer 200 towards the side of becket 600, holding cavity 700 for providing according to the electronic device of the utility model embodiment.Thus, cavity 700 can be held by making the glue used when fixing metal ring 600 and flexible circuit layer 100 enter, prevent from declining because glue overflows the yield caused, and then further raising is according to the preparation efficiency of the electronic device of the utility model embodiment and result of use.
According to embodiment of the present utility model, with reference to figure 8, the inwall of becket 600 can have hypotenuse.Described accommodation cavity 700 is limited by the sidewall of hypotenuse and chip layer 200.In other words, becket 600 has hypotenuse towards chip layer 200 side, and this hypotenuse and chip layer 200 form closed space towards the side of becket 600, holds cavity 700 for providing according to the electronic device of the utility model embodiment.Thus, cavity 700 can be held by making the glue used when fixing metal ring 600 and flexible circuit layer 100 enter, prevent from declining because glue overflows the yield caused, and then further raising is according to the preparation efficiency of the electronic device of the utility model embodiment and result of use.
In addition, it will be appreciated by those skilled in the art that becket 600 is except employing glue is bonding with flexible PCB 100, can also utilize the mode such as tin cream, anisotropic conductive bonding with flexible circuit board.Those skilled in the art can according to the actual requirements, select the bonding agent with binding function to complete the connection of becket 600 and flexible PCB 100, as long as can meet the anatomical connectivity relation according to the utility model embodiment.
According to embodiment of the present utility model, becket 600 has signal emission function, and is electrically connected with flexible PCB 100.Thus, can by electrical connection, be communicated with becket 600 and flexible PCB 100, and the function transmitted is completed by becket 600, and then becket 600 can be relied on to realize the additional function of the electronic device of the embodiment according to this, thus further expand the scope of application of the electronic device according to the utility model embodiment.
In second aspect of the present utility model, the utility model proposes a kind of electronic equipment.According to embodiment of the present utility model, this electronic equipment comprises the previously described electronic device provided according to any one embodiment of the present utility model.Thus, can by the previously described electronic device according to the utility model embodiment for provide according to electronic equipment of the present utility model have rational in infrastructure, prepare easy element and form, and then the result of use of the electronic equipment according to the utility model embodiment can be improved.
With reference to Figure 13, comprise housing 1000 and accessory 2000 according to the electronic equipment of embodiment of the present utility model, wherein, according to embodiment of the present utility model, accessory 2000 is arranged on housing 1000, and this accessory 2000 can be electronic device described above.According to embodiment of the present utility model, accessory 2000 can be arranged on any position of housing 1000 as required, such as, can be arranged on the bonnet of housing 1000, also can be arranged on other positions.
It should be noted that, it will be appreciated by those skilled in the art that the kind of this electronic equipment and purposes are not particularly limited, comprise the previously described electronic device provided according to any one embodiment of the present utility model as long as meet.Such as, according to embodiment of the present utility model, this electronic equipment can be mobile phone, electron key, panel computer, door-control lock, fingerprint acquisition instrument or self-help drawing money machine.Thus, can difference according to the actual requirements, select the electronic equipment that the suitable previously described electronic components provided according to any one embodiment of the utility model obtains according to the utility model embodiment, and then while the feature having above-mentioned electronic device concurrently and advantage, the scope of application according to the electronic equipment of the utility model embodiment can be expanded further.
In addition, this electronic equipment can be applicable to equally about the feature and advantage described by electronic device before it will be appreciated by those skilled in the art that, not repeat them here.
Conveniently understand, below preparation is described according to the method for the electronic device of the utility model embodiment.With reference to figure 9, the method comprises:
S100 arranges chip layer
According to embodiment of the present utility model, chip layer is set by the upper surface at flexible PCB, and this flexible PCB and chip layer are formed be electrically connected.Thus, for providing chip layer according to the electronic device of the utility model embodiment, and by forming electrical connection, realize the electric function of chip layer and flexible PCB.
In addition, according to embodiment of the present utility model, with reference to Figure 10, before chip layer is set, can further include:
S110 arranges supporting layer
According to embodiment of the present utility model, by the lower surface at flexible PCB, the supporting layer with steel sheet structure is set.Thus, for providing the supporting layer with good mechanical strength according to the electronic device of embodiment of the present utility model, and then the result of use according to the electronic device of the utility model embodiment can be improved further.
In addition, according to embodiment of the present utility model, chip layer can be fingerprint recognition chip.Thus, can difference according to the actual requirements, select the chip with difference in functionality, form the parts with specific function, and then the range of application of the electronic device according to the utility model embodiment can be expanded.Particularly, according to embodiment of the present utility model, that carries out chip when arranging chip layer is encapsulated as Background Grid array packages.Thus, can by Background Grid array packages for providing good encapsulating structure according to the electronic device of the utility model embodiment, and, because Background Grid array packages chip adopts contact encapsulation to replace needle-like pin, therefore can reduce the signal noise at the contact point place that needle-like pin brings, under the prerequisite not increasing described chip area, provide the contact point of more crypto set, and then raising processing speed, thus improve the result of use according to the electronic device of the utility model embodiment further.
In addition, according to embodiment of the present utility model, the concrete mode forming electrical connection between chip layer and flexible PCB is not particularly limited.Such as, the modes such as welding, coated with conductive glue and connection wire can be adopted to realize direct electrical connection, also can realize Indirect Electro by modes such as electric induction and connect.Preferably, be that upper surface chip layer being sticked to flexible PCB completes by using tin cream or anisotropic conductive.Thus, can by tin cream or anisotropic conductive for chip layer and flexible PCB provide the electrical connection with good conductive ability and suitable physical performance, and simplify production stage, reduce production cost, thus improve serviceability and the cost performance of the electronic device prepared according to the method for the utility model embodiment further.
S200 arranges cover layer
According to embodiment of the present utility model, by thermosetting coherent film, cover layer is set at the upper surface of chip layer, and utilizes thermosetting coherent film cover layer to be bonded in the upper surface of chip layer, thus obtain the electronic device prepared according to the method for the utility model embodiment.Wherein, thermosetting coherent film is DAF or FOW film.Feature and advantage about DAF and FOW film are previously detailed description, do not repeat them here.In addition, according to embodiment of the present utility model, thermosetting coherent film can have the thickness of 5 ~ 100 microns.In addition, because the coherent film according to the utility model embodiment is made up of thermosets or hot-setting adhesive, therefore, coherent film also can be called thermosetting coherent film, and in the utility model, the two can exchange use.It should be noted that, inventor's Late Cambrian of the present utility model is in the preparation process of electronic device, because traditional handicraft uses glue, therefore the remarkable decline of product yield can be caused, therefore, inventor of the present utility model carries out research to the adhesive of various adhesively bonded electric device element or bonding mode and finds, by using thermosetting coherent film, especially DAF or FOW film substitutes glue and completes bonding between chip layer and cover layer, effectively can improve yield prepared by product, thus reduce the cost of corresponding product, simultaneously, tectal setting is completed according to the coherent film of the thickness of the utility model embodiment by selecting to have, can while raising chip layer and cover layer bond strength, guarantee that electric property or the function of electronic device can not be affected.
In addition, according to embodiment of the present utility model, form tectal concrete material and method is not particularly limited, complete tectal setting as long as can meet according to the method for the utility model embodiment.Particularly, cover layer can be formed by pottery, sapphire, glass, PMMA plate, PC plate or PET plate.Thus, can difference according to the actual requirements, by above-mentioned material for providing the cover layer with suitable hardness, light transmittance and flexibility according to the electronic device of the utility model embodiment, and then further expansion is according to the range of application of the electronic device of the utility model embodiment and result of use.
In addition, according to another embodiment of the present utility model, also now thermosetting coherent film can be formed in tectal lower surface, then the cover layer with thermosetting coherent film is carried out heating with chip layer pressurize bonding, thus complete tectal setting.
In addition, according to embodiment of the present utility model, with reference to Figure 11, this method preparing electronic device can further include:
S300 arranges becket
According to embodiment of the present utility model, by becket being arranged on the upper surface of flexible PCB, and around chip layer and cover layer, complete the setting of the becket according to the utility model embodiment.In addition, becket has signal emission function.Thus; protection further or decoration can be provided for chip layer and cover layer; and by the setting of becket, for providing additional function according to the electronic device of the utility model embodiment, and then the range of application of the electronic equipment according to the utility model embodiment can be further expanded.
According to embodiment of the present utility model, with reference to Figure 12, this step can further include following steps:
S310 limits and holds cavity
According to embodiment of the present utility model, the inwall of becket and the sidewall of chip layer is utilized to limit accommodation cavity.Such as, according to embodiment of the present utility model, can, by transforming the structure of becket or chip layer, the inwall of becket and the sidewall of chip layer be utilized to limit accommodation cavity.Thus, in the process using glue bonded metal ring and flexible circuit layer, glue used can enter this accommodation cavity and solidify, and then other positions that can not spill into according to the electronic device of the utility model embodiment and polluting this electronic device.Thus, the accommodation cavity that can be provided by this step improves fine ratio of product significantly, and then improves preparation efficiency.
Particularly, according to embodiment of the present utility model, at least one breach can be formed at the inwall of becket, limit described accommodation cavity by the sidewall of breach and chip layer, the inwall of becket can also be made to have hypotenuse, to utilize the sidewall of hypotenuse and chip layer to limit described accommodation cavity.Thus, accommodation cavity can be entered by making the glue used when fixing metal ring and flexible circuit layer, preventing from declining because glue overflows the yield caused, and then improving the preparation efficiency according to the method for the utility model embodiment further.
S320 applies glue
According to embodiment of the present utility model, in this step, apply glue in the precalculated position of flexible PCB upper surface, and becket is pressed on glue, the spill portion of glue is divided and enters in above-mentioned accommodation cavity.In addition, according to embodiment of the present utility model, in this step, the glue of applying is conducting resinl.Thus, complete the electrical connection of flexible PCB and becket, and then realize the signal emission function of becket.Thus, the fixing of becket can be realized, and prevent from impacting the yield of the electronic device according to the utility model embodiment because glue overflows in fixation procedure.
In addition, according to embodiments more of the present utility model, can also utilize the mode such as tin cream, anisotropic conductive that becket is bonding with flexible circuit board.
S330 solidifies
In this step, the bonding agent solidifications such as glue, tin cream or anisotropic conductive are made.Thus, by solidification process, complete the preparation utilized according to the electronic device of the method for the utility model embodiment, thus improve the preparation efficiency according to the method for the utility model embodiment.
In description of the present utility model, term " longitudinal direction ", " transverse direction ", " on ", D score, "front", "rear", "left", "right", " vertically ", " level ", " top ", the orientation of the instruction such as " end " or position relationship be based on orientation shown in the drawings or position relationship, it is only the utility model instead of require that the utility model with specific azimuth configuration and operation, therefore can not must be interpreted as restriction of the present utility model for convenience of description.
In the description of this specification, specific features, structure, material or feature that the description of reference term " embodiment ", " another embodiment " etc. means to describe in conjunction with this embodiment are contained at least one embodiment of the present utility model.In this manual, to the schematic representation of above-mentioned term not must for be identical embodiment or example.And the specific features of description, structure, material or feature can combine in one or more embodiment in office or example in an appropriate manner.In addition, when not conflicting, the feature of the different embodiment described in this specification or example and different embodiment or example can carry out combining and combining by those skilled in the art.
Although illustrate and described embodiment of the present utility model above, be understandable that, above-described embodiment is exemplary, can not be interpreted as restriction of the present utility model, those of ordinary skill in the art can change above-described embodiment, revises, replace and modification in scope of the present utility model.
Claims (9)
1. an electronic device, is characterized in that, comprising:
Flexible PCB;
Chip layer, described chip layer is arranged on the upper surface of described flexible PCB, and described chip layer is electrically connected with described flexible PCB;
Cover layer, described cover layer is arranged on the upper surface of described chip layer; And
Thermosetting coherent film, described thermosetting coherent film is arranged between described chip layer and described cover layer and bonds described chip layer and described cover layer.
2. electronic device according to claim 1, is characterized in that, comprises further:
Supporting layer, described supporting layer is arranged on the lower surface of described flexible PCB, and described supporting layer is made up of steel disc.
3. electronic device according to claim 1, it is characterized in that, described chip layer is at least one chip of fingerprint recognition chip and electron key chip, and described chip is Background Grid array packages chip, and described chip layer is connected by tin cream or anisotropic conductive with described flexible PCB.
4. electronic device according to claim 1, it is characterized in that, described cover layer is formed by pottery, sapphire, glass, PMMA plate, PC plate or PET plate, and described thermosetting coherent film is DAF or FOW film, and the thickness of described thermosetting coherent film is 5 ~ 100 microns.
5. electronic device according to claim 1, is characterized in that, comprises further:
The becket be electrically connected with described flexible PCB, the inwall of described becket and the sidewall of described chip layer limit accommodation cavity, and described becket is arranged on the upper surface of described flexible PCB, and around described chip layer and cover layer.
6. electronic device according to claim 1, is characterized in that, comprises further:
The becket be electrically connected with described flexible PCB, the inwall of described becket has at least one breach, so that the sidewall of described breach and described chip layer limits accommodation cavity.
7. electronic device according to claim 1, is characterized in that, comprises further:
The becket be electrically connected with described flexible PCB, the inwall of described becket has hypotenuse, so that the sidewall of described hypotenuse and described chip layer limits accommodation cavity.
8. an electronic equipment, is characterized in that, comprises the electronic device described in any one of claim 1 ~ 7.
9. electronic equipment according to claim 8, is characterized in that, described electronic equipment is mobile phone, electron key, panel computer, door-control lock, fingerprint acquisition instrument and self-help drawing money machine.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520631645.5U CN205039143U (en) | 2015-08-20 | 2015-08-20 | Electron device and electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520631645.5U CN205039143U (en) | 2015-08-20 | 2015-08-20 | Electron device and electronic equipment |
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| Publication Number | Publication Date |
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| CN205039143U true CN205039143U (en) | 2016-02-17 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201520631645.5U Expired - Fee Related CN205039143U (en) | 2015-08-20 | 2015-08-20 | Electron device and electronic equipment |
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| Country | Link |
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| CN (1) | CN205039143U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106373935A (en) * | 2016-10-20 | 2017-02-01 | 江苏长电科技股份有限公司 | Paddle-free frame package process and package structure |
| CN112930106A (en) * | 2021-01-22 | 2021-06-08 | 杭州唯灵医疗科技有限公司 | Flexible electronic equipment and assembling method thereof |
-
2015
- 2015-08-20 CN CN201520631645.5U patent/CN205039143U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106373935A (en) * | 2016-10-20 | 2017-02-01 | 江苏长电科技股份有限公司 | Paddle-free frame package process and package structure |
| CN106373935B (en) * | 2016-10-20 | 2019-04-16 | 江苏长电科技股份有限公司 | A kind of island-free framework encapsulation technique and its encapsulating structure |
| CN112930106A (en) * | 2021-01-22 | 2021-06-08 | 杭州唯灵医疗科技有限公司 | Flexible electronic equipment and assembling method thereof |
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Address after: 330013 no.1189 Jingdong Avenue, high tech Zone, Nanchang City, Jiangxi Province Patentee after: OFilm Microelectronics Technology Co.,Ltd. Patentee after: Nanchang OFilm Tech. Co.,Ltd. Patentee after: OFilm Tech Co.,Ltd. Patentee after: SUZHOU OFILM TECH Co.,Ltd. Address before: 330013 no.1189 Jingdong Avenue, high tech Zone, Nanchang City, Jiangxi Province Patentee before: NANCHANG OFILM BIO-IDENTIFICATION TECHNOLOGY Co.,Ltd. Patentee before: Nanchang OFilm Tech. Co.,Ltd. Patentee before: Shenzhen OFilm Tech Co.,Ltd. Patentee before: SUZHOU OFILM TECH Co.,Ltd. |
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Address after: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Patentee after: Jiangxi OMS Microelectronics Co.,Ltd. Patentee after: Nanchang OFilm Tech. Co.,Ltd. Patentee after: Ophiguang Group Co.,Ltd. Patentee after: SUZHOU OFILM TECH Co.,Ltd. Address before: 330013 no.1189 Jingdong Avenue, high tech Zone, Nanchang City, Jiangxi Province Patentee before: OFilm Microelectronics Technology Co.,Ltd. Patentee before: Nanchang OFilm Tech. Co.,Ltd. Patentee before: OFilm Tech Co.,Ltd. Patentee before: SUZHOU OFILM TECH Co.,Ltd. |
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Effective date of registration: 20210603 Address after: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Patentee after: Jiangxi OMS Microelectronics Co.,Ltd. Address before: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Patentee before: Jiangxi OMS Microelectronics Co.,Ltd. Patentee before: Nanchang OFilm Tech. Co.,Ltd. Patentee before: Ophiguang Group Co.,Ltd. Patentee before: SUZHOU OFILM TECH Co.,Ltd. |
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