CN104065858A - Camera and manufacturing method thereof - Google Patents
Camera and manufacturing method thereof Download PDFInfo
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- CN104065858A CN104065858A CN201410193736.5A CN201410193736A CN104065858A CN 104065858 A CN104065858 A CN 104065858A CN 201410193736 A CN201410193736 A CN 201410193736A CN 104065858 A CN104065858 A CN 104065858A
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- camera
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Abstract
The invention discloses a camera and a manufacturing method thereof. The camera comprises a motor, a lens and a lens mount, the lens is arranged in the motor, components of the lens and the motor are assembled at the upper part of the lens mount, the camera further comprises a photosensitive chip, a circuit board and a light filter, the light filter fits with the photosensitive chip, the photosensitive chip with the light filter and the circuit board make up an encapsulation component after being performed with COB encapsulation, and the encapsulation component is arranged at the lower part of the lens mount. According to the camera, the light filter directly fits with the photosensitive chip through glue and a fitting device, the photosensitive chip with the light filter is arranged at the lower part of the lens mount, the light filter closely fits with the photosensitive chip so as to prevent dust and protect the camera imaging from stains, and accordingly the camera image quality and the production yield are improved.
Description
Technical field
The present invention relates to camera and camera manufacturing technology, particularly relate to the camera and the manufacture method thereof that adopt the encapsulation of COB chip package process.
Background technology
The sensitive chip of camera and wiring board generally adopt wafer-level package, and (Chip Scale Package is called for short: CSP).
Along with the development of image sensing application, its encapsulation form has occurred repeatedly to change.From CSP, be encapsulated into COB encapsulation, COB encapsulation becomes the main flow packing forms of shooting industry gradually.
COB packaging technology was once widely used, because considered in the simplicity based on structure and application and cost advantage at that time, in recent years, the technology of COB encapsulation has had improvement further, manufacturing process is tending towards industrialization, material is supplied with good guarantee, and the Performance And Reliability of product has obtained significant raising.
COB encapsulation is compared and is had cost advantage with CSP encapsulation.CSP encapsulation is directly to buy the packaged upstream materials such as camera lens, and module factory adds other spare part and encapsulates together; COB directly chip package in module; because accurate spare part is without protection; COB packaging environment must be to carry out in dust free room; because the imageing sensor of high-resolution (conventionally more than 2,000,000 pixels) has relatively little elemental area; therefore, airborne dust particle just can cover the whole pixel of high resolution sensor.In addition, the surface of imageing sensor covers millions of colored lenticules conventionally, and the quality of the material that these lens use makes dust particle be easy to be adsorbed on its surface.So just make to adopt the investment of COB encapsulation relevant device procurement value very high.But, compared to conventional package technology, COB encapsulation has the advantages such as volume is little, cost, thereby meets people when pursuing high pixel, portable, the frivolous requirement to shooting product.
Fig. 1 is the structural representation of existing camera, and as shown in Figure 2, IR filter and lens mount laminating, assemble with sensitive chip and wiring board through COB encapsulation the flow process of employing COB chip package process manufacture camera, and lens mount is also assembled with camera lens, motor.Fig. 3 shows the assembling schematic diagram of camera, and IR filter is fitted on lens mount, between IR filter and sensitive chip, forms space, easily enters dust, causes the imaging of camera to occur stain.
Summary of the invention
The invention provides a kind of camera and manufacture method thereof, thereby solved, avoid the imaging of camera to occur that stain improves the image quality of camera and the technical problem of producing yield.
In order to solve the problems of the technologies described above, the technical solution used in the present invention is:
One aspect of the present invention provides a kind of camera, comprise motor, camera lens and lens mount, described camera lens is arranged on motor inside, the assembly of described camera lens and motor is assembled in described lens mount top, also comprise sensitive chip, wiring board and filter, described filter is fitted on sensitive chip, and the described sensitive chip and the wiring board that are fitted with filter carry out forming package assembling after COB encapsulation, and described package assembling is assembled in described lens mount bottom.
The present invention provides a kind of manufacture method of described camera on the other hand, comprising:
Described camera lens is arranged on to motor inside, the assembly of described camera lens and motor is assembled in to described lens mount top;
It is characterized in that, also comprise:
Filter is fitted on sensitive chip;
The described sensitive chip and the wiring board that are fitted with filter carry out COB encapsulation;
Package assembling is assembled in to lens mount bottom.
Further, described filter is fitted on sensitive chip by drawing glue.
Further, described COB encapsulation flow process comprises die bond step and Bang Ding step.
One aspect of the present invention provides another kind of camera, comprise motor, camera lens and lens mount, described camera lens is arranged on motor inside, the assembly of described camera lens and motor is assembled in described lens mount top, also comprise sensitive chip, wiring board and filter, described sensitive chip and wiring board carry out forming package assembling after COB encapsulation, and described filter is fitted on the sensitive chip of package assembling, and the package assembling that is fitted with filter is assembled in described lens mount bottom.
The present invention provides the manufacture method of another kind of described camera on the other hand, comprising:
Described camera lens is arranged on to motor inside, the assembly of described camera lens and motor is assembled in to described lens mount top;
Also comprise:
Sensitive chip and wiring board are carried out to COB encapsulation;
Filter is fitted on the sensitive chip of package assembling;
The package assembling that is fitted with filter is assembled in described lens mount bottom.
Further, described filter is fitted on sensitive chip by drawing glue.
Further, described COB encapsulation flow process comprises die bond step and Bang Ding step.
In the present invention, by filter by glue and abutted equipment directly and sensitive chip fit, be assembled in again lens mount bottom, avoided between filter and sensitive chip, existing in prior art the problem in gap, filter and sensitive chip fit tightly, prevent that dust from entering, avoid the imaging of camera to occur stain, improve the yields that camera is produced.
Accompanying drawing explanation
Fig. 1 is the structural representation of existing camera;
Fig. 2 is the manufacturing flow chart of existing camera;
Fig. 3 is the assembling schematic diagram of existing camera;
Fig. 4 is the structural representation of camera of the present invention;
Fig. 5 is the schematic flow sheet of embodiment mono-of the manufacture method of camera of the present invention;
Fig. 6 is the schematic flow sheet of embodiment bis-of the manufacture method of camera of the present invention;
Fig. 7 is the assembling schematic diagram of camera of the present invention.
Embodiment
Below in conjunction with accompanying drawing, specifically illustrate embodiments of the present invention, accompanying drawing is only for reference and use is described, does not form the restriction to scope of patent protection of the present invention.
Embodiment 1:
As shown in Figure 4, the present embodiment relates to a kind of camera, comprise motor 1, camera lens 2 and lens mount 3, described camera lens 2 is arranged on motor 1 inside, described camera lens 2 is assembled in described lens mount 3 tops with the assembly of motor 1, also comprises sensitive chip (wafer) 4, wiring board 5 and filter 6, and described filter 6 is fitted on sensitive chip 4, the described sensitive chip 4 that is fitted with filter 6 carries out forming package assembling after COB encapsulation with wiring board 5, and described package assembling is assembled in described lens mount bottom.
In an embodiment of the present invention, described filter 6 is IR filter or smalt etc.
As shown in Figure 5, the present embodiment also relates to a kind of manufacture method of described camera, comprising:
Described camera lens is arranged on to motor inside, the assembly of described camera lens and motor is assembled in to described lens mount top; Also comprise:
Filter is fitted on sensitive chip;
The described sensitive chip and the wiring board that are fitted with filter carry out COB encapsulation;
Package assembling is assembled in to lens mount bottom.
The manufacture method of this camera first carries out IR filter and sensitive chip bonding process carries out COB packaging process with wiring board again.
Fig. 7 is the assembling schematic diagram of camera of the present invention.In an embodiment of the present invention, described filter 6 is fitted on sensitive chip 4 by drawing glue.Described sensitive chip 4 comprises chip photosensitive area 40, and the periphery of described sensitive chip 4 is the pad PAD being arranged on FPC/PCB plate, and FPC/PCB plate periphery is also provided with gold thread.
Described COB encapsulation flow process comprises die bond step and Bang Ding step.Described COB encapsulation flow process specifically comprises: the first step: matting.By ultrasonic device, the FPC/PCB plate that is about to reach the standard grade is cleaned.
Second step: gum.A glue diffusion will be carried out on cleaned FPC/PCB plate.
The 3rd step: Die bonding (Die nation).Sensitive chip and FPC/PCB plate are stained with to the operation being combined.
The 4th step: die bond.By the chip posting and wiring board heating, carry out die bond processing.
The 5th step: Wire bonding (Wire nation).The circuit PAD of sensitive chip is electrically connected by the PAD beating on money and FPC/PCB wiring board.
The 6th step: two fluids clean.Ready-made COB plate is carried out to two fluid cleanings.
The 7th step: draw hot-setting adhesive.To on ready-made COB plate, carry out picture glue.
The 8th step: laminating lens mount or VCM.Lens mount or VCM are fitted on COB plate.
The 9th step: adhesive curing.To post the COB of lens mount (VCM), processing is heating and curing.
The tenth step: minute plate.Single product is separated from jigsaw.
Compare COB technical price cheap (being only 1/3 left and right of same chip), conserve space, technical maturity with other encapsulation technology.
Embodiment 2:
As shown in Figure 4, the present embodiment provides another kind of camera, comprise motor 1, camera lens 2 and lens mount 3, described camera lens 2 is arranged on motor 1 inside, described camera lens 2 is assembled in described lens mount 3 tops with the assembly of motor 1, also comprises sensitive chip 4, wiring board 5 and filter 6, and described sensitive chip 4 carries out forming package assembling after COB encapsulation with wiring board 5, described filter 6 is fitted on the sensitive chip 4 of package assembling, and the package assembling that is fitted with filter 6 is assembled in described lens mount 3 bottoms.
As shown in Figure 6, the present embodiment provides the manufacture method of another kind of described camera, comprising:
Described camera lens is arranged on to motor inside, the assembly of described camera lens and motor is assembled in to described lens mount top;
Also comprise:
Sensitive chip and wiring board are carried out to COB encapsulation;
Filter is fitted on the sensitive chip of package assembling;
The package assembling that is fitted with filter is assembled in described lens mount bottom.
The manufacture method of this camera is first carried out the COB packaging process of sensitive chip and wiring board, then carries out the bonding process with IR filter.
Fig. 7 is the assembling schematic diagram of camera of the present invention.In an embodiment of the present invention, described filter is fitted on sensitive chip by drawing glue.Described COB encapsulation flow process comprises die bond step and Bang Ding step.
Above disclosed is only preferred embodiment of the present invention, can not limit the scope of the present invention with this, and the equivalent variations of therefore doing according to the present patent application the scope of the claims, still belongs to the scope that the present invention is contained.
Claims (8)
1. a camera, comprise motor, camera lens and lens mount, described camera lens is arranged on motor inside, the assembly of described camera lens and motor is assembled in described lens mount top, it is characterized in that: also comprise sensitive chip, wiring board and filter, described filter is fitted on sensitive chip, and the described sensitive chip and the wiring board that are fitted with filter carry out forming package assembling after COB encapsulation, and described package assembling is assembled in described lens mount bottom.
2. a manufacture method for camera claimed in claim 1, is characterized in that, comprising:
Described camera lens is arranged on to motor inside, the assembly of described camera lens and motor is assembled in to described lens mount top;
It is characterized in that, also comprise:
Filter is fitted on sensitive chip;
The described sensitive chip and the wiring board that are fitted with filter carry out COB encapsulation;
Package assembling is assembled in to lens mount bottom.
3. the manufacture method of camera according to claim 2, is characterized in that:
Described filter is fitted on sensitive chip by drawing glue.
4. the manufacture method of camera according to claim 2, is characterized in that:
Described COB encapsulation flow process comprises die bond step and Bang Ding step.
5. a camera, comprise motor, camera lens and lens mount, described camera lens is arranged on motor inside, the assembly of described camera lens and motor is assembled in described lens mount top, it is characterized in that: also comprise sensitive chip, wiring board and filter, described sensitive chip and wiring board carry out forming package assembling after COB encapsulation, and described filter is fitted on the sensitive chip of package assembling, and the package assembling that is fitted with filter is assembled in described lens mount bottom.
6. a manufacture method for camera claimed in claim 5, comprising:
Described camera lens is arranged on to motor inside, the assembly of described camera lens and motor is assembled in to described lens mount top;
It is characterized in that, also comprise:
Sensitive chip and wiring board are carried out to COB encapsulation;
Filter is fitted on the sensitive chip of package assembling;
The package assembling that is fitted with filter is assembled in described lens mount bottom.
7. the manufacture method of camera according to claim 6, is characterized in that:
Described filter is fitted on sensitive chip by drawing glue.
8. the manufacture method of camera according to claim 6, is characterized in that:
Described COB encapsulation flow process comprises die bond step and Bang Ding step.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410193736.5A CN104065858A (en) | 2014-05-08 | 2014-05-08 | Camera and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410193736.5A CN104065858A (en) | 2014-05-08 | 2014-05-08 | Camera and manufacturing method thereof |
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| CN104065858A true CN104065858A (en) | 2014-09-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410193736.5A Pending CN104065858A (en) | 2014-05-08 | 2014-05-08 | Camera and manufacturing method thereof |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106973200A (en) * | 2017-01-21 | 2017-07-21 | 奇鋐科技股份有限公司 | Photography module |
| CN107094225A (en) * | 2017-05-15 | 2017-08-25 | 广东欧珀移动通信有限公司 | Image sensing module, camera module and mobile electronic terminal |
| CN107911587A (en) * | 2017-11-29 | 2018-04-13 | 信利光电股份有限公司 | A kind of camera module packaging technology and structure |
| CN110139019A (en) * | 2019-06-28 | 2019-08-16 | 信利光电股份有限公司 | Optical filter and sensitive chip assemble method in camera module and camera module |
| CN115499570A (en) * | 2022-09-14 | 2022-12-20 | 昆山丘钛微电子科技股份有限公司 | Packaging method and device of camera module |
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| CN101242117A (en) * | 2007-02-09 | 2008-08-13 | 富准精密工业(深圳)有限公司 | Motor driving structure |
| CN101782674A (en) * | 2010-03-18 | 2010-07-21 | 宁波舜宇光电信息有限公司 | Method for fabricating camera lens |
| CN102053336A (en) * | 2009-10-31 | 2011-05-11 | 比亚迪股份有限公司 | Automatic focusing camera module |
| CN202141849U (en) * | 2011-06-22 | 2012-02-08 | 翔德电子科技(深圳)有限公司 | Manual optical focusing lens |
| CN202652307U (en) * | 2012-06-29 | 2013-01-02 | 豪威科技(上海)有限公司 | GSP handset photograph module |
| CN202939401U (en) * | 2012-11-13 | 2013-05-15 | 丁小冬 | Fast-assembling self-locking optical filter switching device |
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| CN101242117A (en) * | 2007-02-09 | 2008-08-13 | 富准精密工业(深圳)有限公司 | Motor driving structure |
| CN102053336A (en) * | 2009-10-31 | 2011-05-11 | 比亚迪股份有限公司 | Automatic focusing camera module |
| CN101782674A (en) * | 2010-03-18 | 2010-07-21 | 宁波舜宇光电信息有限公司 | Method for fabricating camera lens |
| CN202141849U (en) * | 2011-06-22 | 2012-02-08 | 翔德电子科技(深圳)有限公司 | Manual optical focusing lens |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106973200A (en) * | 2017-01-21 | 2017-07-21 | 奇鋐科技股份有限公司 | Photography module |
| CN107094225A (en) * | 2017-05-15 | 2017-08-25 | 广东欧珀移动通信有限公司 | Image sensing module, camera module and mobile electronic terminal |
| CN107911587A (en) * | 2017-11-29 | 2018-04-13 | 信利光电股份有限公司 | A kind of camera module packaging technology and structure |
| CN110139019A (en) * | 2019-06-28 | 2019-08-16 | 信利光电股份有限公司 | Optical filter and sensitive chip assemble method in camera module and camera module |
| CN115499570A (en) * | 2022-09-14 | 2022-12-20 | 昆山丘钛微电子科技股份有限公司 | Packaging method and device of camera module |
| CN115499570B (en) * | 2022-09-14 | 2024-04-16 | 昆山丘钛微电子科技股份有限公司 | Packaging method and device for camera module |
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Application publication date: 20140924 |