CN204332960U - A kind of mobile phone camera module sensitive chip encapsulating structure - Google Patents
A kind of mobile phone camera module sensitive chip encapsulating structure Download PDFInfo
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- CN204332960U CN204332960U CN201520048754.4U CN201520048754U CN204332960U CN 204332960 U CN204332960 U CN 204332960U CN 201520048754 U CN201520048754 U CN 201520048754U CN 204332960 U CN204332960 U CN 204332960U
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Abstract
A kind of mobile phone camera module sensitive chip encapsulating structure, substrate is connected with the support of top, is provided with filter above support; Substrate is combined shaped, and substrate top is rectangle, and rectangular top top is provided with capacitance resistance assembly, and rectangular top left part is provided with driving chip; Substrate bottom is inverted trapezoidal, trapezoidal end face is provided with capacitance resistance assembly; The profile of support is identical with contour substrate, and the centre of support is provided with rectangular through-hole, and cradle top surface is provided with guide vane end stop, and guide vane end stop is around rectangular through-hole tandem array and opposite side is symmetrical between two; Substrate adopts BT hard substrate, and layers of copper surface treatment has NiPdAu composition; Support adopts LCP E473i exotic material.The utility model reduces operating cost and the equipment cost of current small-sized module factory, and the high pixel module achieving CSP technique is produced, and decreases traditional CSP explained hereafter flow process; Module total height height change is little, case chip and module easy to maintenance.
Description
Technical field
The utility model belongs to camera field, particularly a kind of mobile phone camera module sensitive chip PLCC encapsulating structure.
Background technology
Mobile phone camera module CMOS integrated images acquisition and processing function is in one chip.
At present, the encapsulation mode of image module has COB (Chip On Board) and CSP(Chip Scale Package) two kinds.The advantage of CSP encapsulation is that encapsulation section is completed by FEOL, CSP covers owing to there being glass,, yield lower to purity requirements also better, process apparatus cost is low, processing time is short, and facing challenges is that light penetration rate is not good, price is more expensive, height Z Height is higher, backlight penetrates ghost phenomenon; The advantage of COB comprises that packaging cost is lower, height Z Height is lower, shortcoming be higher to purity requirements, need improve processing procedure to promote yield, process apparatus cost is high, processing time is long, COB processing procedure is by means of having the advantage that the quality of image is better and module height is lower, add the large factory of brand and require that module manufacturer need with COB processing procedure assembling shipment gradually, following COB processing procedure will become a kind of trend of mobile phone camera module group procedure development.Current China's Mainland module manufacturer major part of being correlated with is all CSP processing procedure assembling shipment, and the numerous manufacturer of foreign capitals and Taiwan actively drops into COB procedure for producing.But for whole cell-phone camera module cost be more or less the same, CSP has just given process portion COB chip packaging factory to do, but the price of transducer just improves comparatively speaking.COB processing procedure is more much higher than CSP for the requirement of module manufacturer, is not only cost aspect, and management and quality aspect require also much higher.
There is following defect in the PLCC case chip of prior art: 1), due to PLCC is applied in CCM module, needs back segment SMT paster, so need the high temperature of resistance to more than 260 DEG C; 2), the PLCC motor dimension that uses support and filter need consider to mate and lens parameters, therefore need customization die sinking support, require high for the operating cost of small-sized module factory and equipment cost; 3), base plate bottom PIN comparatively defines needs to consider its electrical property, the ESD design of especially signal of telecommunication interference and the right designing impedance matching of MIPI line; 4), PLCC encapsulates the attachment of inner wafer and back segment SMT attachment has impact for whole module, in order to make imaging surface parallel with camera lens, high to the flatness requirement of substrate.
Summary of the invention
The purpose of this utility model to solve the problems of the technologies described above.
The purpose of this utility model is achieved in that a kind of mobile phone camera module sensitive chip encapsulating structure, comprises on substrate, substrate and is provided with wafer, it is characterized in that: described substrate is connected with the support of top, is provided with filter above support; Substrate is combined shaped, and substrate top is rectangle, and rectangular top top is provided with capacitance resistance assembly, and rectangular top left part is provided with driving chip; Substrate bottom is inverted trapezoidal, trapezoidal end face is provided with capacitance resistance assembly.
The profile of described support is identical with contour substrate, and the centre of support is provided with rectangular through-hole, and cradle top surface is provided with guide vane end stop, and guide vane end stop is around rectangular through-hole tandem array and opposite side is symmetrical between two; Support bottom surface is provided with divider, and wafer, capacitance resistance assembly, driving chip separate by divider respectively.
Described substrate adopts BT hard substrate, and layers of copper surface treatment has NiPdAu composition.
Described support adopts LCP E473i exotic material.
The utility model reduces operating cost and the equipment cost of small-sized module factory, and the high pixel module achieving CSP technique is produced, and decreases traditional CSP explained hereafter flow process; Also can select COB camera lens (minimizing filter) during camera lens type selecting, for module height, camera lens decreases the height of filter, too increases the height of substrate simultaneously, therefore module total height height change is little; Case chip is inner at substrate by COB wafer level packaging, outside seal and design becomes welding mount formats, case chip and module easy to maintenance, apply and there is good economic and social benefit.
Accompanying drawing explanation
Fig. 1 is three-dimensional explosive view of the present utility model.
Fig. 2 is general assembly drawing of the present utility model.
In figure: 1. substrate; 2. wafer; 3. capacitance resistance assembly; 4. support; 5. filter; 6. driving chip.
Embodiment
Below in conjunction with accompanying drawing, the utility model is described in further detail, but not as to restriction of the present utility model:
A kind of mobile phone camera module sensitive chip encapsulating structure, comprise on substrate 1, substrate 1 and be provided with wafer 2, described substrate 1 is connected with the support 4 of top, is provided with filter 5 above support 4; Substrate 1 is combined shaped, and substrate 1 top is rectangle, and rectangular top top is provided with capacitance resistance assembly 3, and rectangular top left part is provided with driving chip 6; Substrate 1 bottom is inverted trapezoidal, trapezoidal end face is provided with capacitance resistance assembly 3; The profile of described support 4 is identical with substrate 1 profile, and the centre of support 4 is provided with rectangular through-hole, and support 4 end face is provided with guide vane end stop, and guide vane end stop is around rectangular through-hole tandem array and opposite side is symmetrical between two; Support 4 bottom surface is provided with divider, and wafer 2, capacitance resistance assembly 3, driving chip 6 separate by divider respectively; Described substrate 1 adopts BT hard substrate, and layers of copper surface treatment has NiPdAu composition, and substrate flatness is good; Described support 4 adopts LCP E473i exotic material, ability 270 DEG C of high temperature.
During concrete enforcement, 1), wafer 2 cleans on wafer cleaning machine; 2), substrate 1 carries out plasma cleaning on plasma cleaner; 3) MIPI line need, be made during substrate 1 making sheet to testing impedance, therefore the line corresponding when layout is to doing isometric coupling, and twoly cover copper ground connection, base plate bottom center is covered copper ground connection and is windowed, be convenient to the earth loop that back segment SMT connects module entirety, reach the ESD requirement of PLCC itself; 4), by the existing motor of coupling and camera lens specification, die sinking customization support; 5), in case chip processing procedure, plate need be divided to reach the standard grade, and a point plate can not divide plate by hand, must laser cutting, the substrate slight deformation that the first avoids manual point plate to cause, affects the planarization bottom it; It two is finished size tolerances that manual point of plate can affect case chip; 6), wafer 2, capacitance resistance assembly 3, driving chip 6 separately encapsulate, and are isolated by support 4; 7), driving chip 6 and substrate 1 are bonded, load (Die Bonding) lime light: a. chip direction; B. glue amount; C. thimble and suction nozzle print; D. chip angle; E. chip position; F. chip tilts; 8), by gold thread weld, make driving chip 6 and substrate 1 line conduction, ball bonding (Wire Bonding) lime light: whether a. wiring is correct; B. bank; C. gold goal size; D. gold goal thickness; E. gold thread pulling force; F. gold goal thrust; 9), PLCC Function detection need adopt thimble measurement jig, accurate special fixture, prevents base plate bottom PAD from wearing and tearing and bad generation, thus affects back segment assembling function.
Obviously, above-described embodiment is only for the utility model example is clearly described, and the restriction not to execution mode.For those of ordinary skill in the field, can also make other changes in different forms on the basis of the above description.Here exhaustive without the need to also giving all execution modes.And thus the apparent change of amplifying out or variation be still among protection range of the present utility model.
Claims (4)
1. a mobile phone camera module sensitive chip encapsulating structure, comprise on substrate (1), substrate (1) and be provided with wafer (2), it is characterized in that: described substrate (1) is connected with the support (4) of top, support (4) top is provided with filter (5); Substrate (1) is combined shaped, and substrate (1) top is rectangle, and rectangular top top is provided with capacitance resistance assembly (3), and rectangular top left part is provided with driving chip (6); Substrate (1) bottom is inverted trapezoidal, trapezoidal end face is provided with capacitance resistance assembly (3).
2. a kind of mobile phone camera module sensitive chip encapsulating structure according to claim 1, it is characterized in that: the profile of described support (4) is identical with substrate (1) profile, the centre of support (4) is provided with rectangular through-hole, support (4) end face is provided with guide vane end stop, and guide vane end stop is around rectangular through-hole tandem array and opposite side is symmetrical between two; Support (4) bottom surface is provided with divider, and wafer (2), capacitance resistance assembly (3), driving chip (6) separate by divider respectively.
3. a kind of mobile phone camera module sensitive chip encapsulating structure according to claim 1, is characterized in that: described substrate (1) adopts BT hard substrate, and layers of copper surface treatment has NiPdAu composition.
4. a kind of mobile phone camera module sensitive chip encapsulating structure according to claim 2, is characterized in that: described support (4) adopts LCP E473i exotic material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520048754.4U CN204332960U (en) | 2015-01-24 | 2015-01-24 | A kind of mobile phone camera module sensitive chip encapsulating structure |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201520048754.4U CN204332960U (en) | 2015-01-24 | 2015-01-24 | A kind of mobile phone camera module sensitive chip encapsulating structure |
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| CN204332960U true CN204332960U (en) | 2015-05-13 |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017080526A1 (en) * | 2015-11-13 | 2017-05-18 | 宁波舜宇光电信息有限公司 | Camera module, electrical support thereof, and assembling method therefor |
| WO2018113179A1 (en) * | 2016-12-20 | 2018-06-28 | 广东欧珀移动通信有限公司 | Bracket assembly, functional module and mobile terminal |
| CN108769620A (en) * | 2018-06-25 | 2018-11-06 | 安徽水都信息技术有限公司 | A kind of freely adjustable monitoring device |
| US11086200B2 (en) | 2019-03-20 | 2021-08-10 | Ticona Llc | Polymer composition for use in a camera module |
| WO2023010703A1 (en) * | 2021-08-03 | 2023-02-09 | 深圳市群晖智能科技股份有限公司 | Fcm chip mounter manufacturing method, chip mounter, and camera module product |
| US11722759B2 (en) | 2019-03-20 | 2023-08-08 | Ticona Llc | Actuator assembly for a camera module |
-
2015
- 2015-01-24 CN CN201520048754.4U patent/CN204332960U/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017080526A1 (en) * | 2015-11-13 | 2017-05-18 | 宁波舜宇光电信息有限公司 | Camera module, electrical support thereof, and assembling method therefor |
| WO2018113179A1 (en) * | 2016-12-20 | 2018-06-28 | 广东欧珀移动通信有限公司 | Bracket assembly, functional module and mobile terminal |
| US10320961B2 (en) | 2016-12-20 | 2019-06-11 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Bracket assembly for functional component for mobile terminal |
| CN108769620A (en) * | 2018-06-25 | 2018-11-06 | 安徽水都信息技术有限公司 | A kind of freely adjustable monitoring device |
| US11086200B2 (en) | 2019-03-20 | 2021-08-10 | Ticona Llc | Polymer composition for use in a camera module |
| US11722759B2 (en) | 2019-03-20 | 2023-08-08 | Ticona Llc | Actuator assembly for a camera module |
| WO2023010703A1 (en) * | 2021-08-03 | 2023-02-09 | 深圳市群晖智能科技股份有限公司 | Fcm chip mounter manufacturing method, chip mounter, and camera module product |
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Legal Events
| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150513 Termination date: 20170124 |