CN204272252U - A kind of camera module device not having circuit board - Google Patents
A kind of camera module device not having circuit board Download PDFInfo
- Publication number
- CN204272252U CN204272252U CN201420779447.9U CN201420779447U CN204272252U CN 204272252 U CN204272252 U CN 204272252U CN 201420779447 U CN201420779447 U CN 201420779447U CN 204272252 U CN204272252 U CN 204272252U
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- China
- Prior art keywords
- circuit board
- lens
- chip
- camera module
- module device
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Studio Devices (AREA)
Abstract
The utility model relates to a kind of camera module device not having circuit board.Wherein, chip assembly and lens assembly is comprised; Described chip assembly comprises sensitive chip and chip base; Described lens assembly comprises camera lens, flexible gaskets and lens bracket.The utility model has that structure is simple, low cost and easy-to-assemble effect.
Description
Technical field
The utility model relates to IMAQ apparatus, more particularly, relates to a kind of camera module device not having circuit board being applicable to the portable digital equipments such as mobile phone, palmtop PC, notebook.
Background technology
Traditional camera module is made up of lens assembly (lens), pedestal (holder), imageing sensor (CCD or CMOS) and circuit board, lens assembly is corresponding with the photosensitive region of imageing sensor by pedestal, and is together assembled in (Fig. 1) on circuit board; Imageing sensor is electrically connected with internal circuit on circuit board, and imageing sensor and circuit board convert the light signal collected to data image signal, then is connected with ancillary equipment (as mobile phone body) by the connector on circuit board.
Due to this camera lens module, to there is integrated level not high, and interface cannot be unified or standardization, cause module factory and terminal equipment manufacturer is hard put to cope with the situation various different interface, repeat die sinking and software development to adapt to the type of interface, cause and waste a large amount of human resources and production cost.
For overcoming the above problems, a kind of bonded type camera shooting head mould group (Fig. 2) of utility model in my utility model patent " bonded type camera shooting module " (patent No.: ZL200720053432.4), camera module is made up of lens assembly and image sensor (CCD or CMOS) chip; Lens assembly is made up of the lens packages of lens cover and 1 ~ n sheet, or is directly encapsulated by the eyeglass of 1 ~ n sheet and form.According to pixel and the chip photosensitive size decision number of lenses of chip.Adopt mounting technology by lens assembly directly together with chip package, as an electronic component form.Connection SMT paster between camera module and ancillary equipment main circuit board completes.Shortcoming is that this paster camera module easily bursts when mounting with chip mounter, and reason is that the material heat-resisting quantity of lens mount is lower, and defective products rate is high, and production cost does not reach expection.
Utility model content
In view of the above problems, the purpose of this utility model be to provide that a kind of structure is simple, low cost and the easy-to-assemble camera module device not having circuit board.
For achieving the above object, a kind of camera module device not having circuit board that the utility model provides, is characterized in that, comprise chip assembly and lens assembly; Described chip assembly comprises sensitive chip and chip base; Described lens assembly comprises camera lens, flexible gaskets and lens bracket.Due to chip assembly and lens assembly composition.Chip assembly is connected by snap close mode with lens assembly.Innovative point is: 1, whole camera module is divided into chip assembly and lens assembly two pieces semi-finished product, by chip mounter, chip assembly is mounted on digital product mainboard, lens assembly is directly buckled on chip assembly by snap close mode can completes whole group of assembling afterwards.2, carried out mounting and crossing stove separately through chip mounter by chip assembly, do not produce camera lens explosion problem.
In some embodiments, chip base and sensitive chip are bonding by adhesive curing.
In some embodiments, camera lens and lens bracket are threaded connection, and flexible gaskets is embedded in lens bracket.
In some embodiments, chip base has several metal stitch.
In some embodiments, lens bracket has four boxes.
In some embodiments, chip base has four pin threads.
In some embodiments, chip assembly and lens assembly are connected with four boxes of described lens bracket by four pin threads of described chip base.
In some embodiments, chip base is undertaken welding by metal stitch and digital product mainboard and mounts.
The beneficial effects of the utility model are: structure is simple, low cost, energy-saving and emission-reduction effect.Because entirety only has two assemblies, i.e. lens assembly and chip assembly, achieves the simple effect of structure.With traditional module ratio, the utility model can direct paster, and without the need to lead-in wire, to the basic free of losses of signal, handling ease, clean, easy to maintenance, rate of finished products is higher.In addition, the utility model, compared with traditional module, has lacked circuit board and connector, decreases material cost and technological process during production, and down-stream enterprise also will reduce corresponding connector, achieves the object of saving production cost.And producing connector and circuit board for saving, the nuclear interface standardizing in camera module field can be realized, there is the advantage that work is stable.What is more important: traditional module need communicate with digital product with circuit board, and the production of circuit board is a high pollution industry, the corrosion of soda acid is serious to environmental impact, and the utility model saves circuit board, will bring huge environmental protection effect.
Accompanying drawing explanation
Fig. 1 is the structural representation of traditional camera module;
Fig. 2 is the structural representation of bonded type camera shooting head mould group;
Fig. 3 is the structural representation of bonded type camera shooting head mould group;
Fig. 4 is structural representation of the present utility model;
Fig. 5 is structural blast schematic diagram of the present utility model.
Embodiment
Below in conjunction with accompanying drawing, utility model is described in further detail.
As shown in Figure 3-4, a kind of camera module device not having circuit board, comprises chip assembly 01 and lens assembly 02.Chip assembly 01 comprises sensitive chip 11 and chip base 12; Described lens assembly 02 comprises camera lens 21, flexible gaskets 23 and lens bracket 22.It is bonding that chip base 12 and sensitive chip 11 pass through adhesive curing.Camera lens 21 and lens bracket 22 are threaded connection, and flexible gaskets 23 is embedded in lens bracket 22.Chip base 12 has several metal stitch.Lens bracket 22 has four boxes, and chip base 12 has four pin threads.Chip assembly 01 and lens assembly 02 are connected with four boxes of described lens bracket 22 by four pin threads of described chip base 12.Chip base 12 is undertaken welding by metal stitch and digital product mainboard and mounts.
A kind of camera module assembling method for devices not having circuit board, concrete steps are as follows: (1) chip assembly 01 assemble method: fixed by chip base 12, with chip mounter, the photosurface of chip is pasted into the inner chamber of chip base 12, then the gap between chip base 12 and chip is cemented solid with glue.(2) lens assembly 02 assemble method: fixed by lens bracket 22, camera lens 21 is connected with lens bracket 22 by screw thread, and focuses solidification; (3) chip assembly 01 is directly mounted on digital product mainboard by chip mounter by client; (4) last, camera lens part group, flexible gaskets 23 are fixedly connected with chip assembly 01 buckle.
Entirety only has two assemblies, i.e. lens assembly 02 and chip assembly 01, achieves the simple effect of structure.With traditional module ratio, the utility model can direct paster, and without the need to lead-in wire, to the basic free of losses of signal, handling ease, clean, easy to maintenance, rate of finished products is higher.In addition, the utility model, compared with traditional module, has lacked circuit board 4 and connector, decreases material cost and technological process during production, and down-stream enterprise also will reduce corresponding connector, achieves the object of saving production cost.And producing connector and circuit board 4 for saving, the nuclear interface standardizing in camera module field can be realized, there is the advantage that work is stable.What is more important: traditional module need communicate with digital product with circuit board 4, and the production of circuit board 4 is high pollution industries, the corrosion of soda acid is serious to environmental impact, and the utility model saves circuit board 4, will bring huge environmental protection effect.
Above-described is only execution modes more of the present utility model.For the person of ordinary skill of the art, under the prerequisite not departing from the utility model creation design, can also make some distortion and improvement, these all belong to the protection range of utility model.
Claims (8)
1. there is no a camera module device for circuit board, it is characterized in that, comprise chip assembly and lens assembly; Described chip assembly comprises sensitive chip and chip base; Described lens assembly comprises camera lens, flexible gaskets and lens bracket.
2. a kind of camera module device not having circuit board according to claim 1, is characterized in that, it is bonding that described chip base and sensitive chip pass through adhesive curing.
3. a kind of camera module device not having circuit board according to claim 2, it is characterized in that, camera lens and lens bracket are threaded connection, and flexible gaskets is embedded in lens bracket.
4. a kind of camera module device not having circuit board according to claim 3, it is characterized in that, described chip base has several metal stitch.
5. a kind of camera module device not having circuit board according to claim 3, it is characterized in that, described lens bracket has four boxes.
6. a kind of camera module device not having circuit board according to claim 5, it is characterized in that, described chip base has four pin threads.
7. a kind of camera module device not having circuit board according to claim 6, is characterized in that, described chip assembly and lens assembly are connected with four boxes of described lens bracket by four pin threads of described chip base.
8. a kind of camera module device not having circuit board according to claim 4, is characterized in that, described chip base is undertaken welding by metal stitch and digital product mainboard and mounts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420779447.9U CN204272252U (en) | 2014-12-10 | 2014-12-10 | A kind of camera module device not having circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420779447.9U CN204272252U (en) | 2014-12-10 | 2014-12-10 | A kind of camera module device not having circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204272252U true CN204272252U (en) | 2015-04-15 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420779447.9U Expired - Fee Related CN204272252U (en) | 2014-12-10 | 2014-12-10 | A kind of camera module device not having circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204272252U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104506759A (en) * | 2014-12-10 | 2015-04-08 | 凌代年 | Circuit-board-free camera module device and assembling method thereof |
| CN105430249A (en) * | 2016-01-07 | 2016-03-23 | 广州大凌实业股份有限公司 | Substrate type shooting module standard device and assembling method thereof |
-
2014
- 2014-12-10 CN CN201420779447.9U patent/CN204272252U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104506759A (en) * | 2014-12-10 | 2015-04-08 | 凌代年 | Circuit-board-free camera module device and assembling method thereof |
| CN104506759B (en) * | 2014-12-10 | 2018-08-07 | 广州大凌实业股份有限公司 | A kind of the camera module device and its assemble method of not circuit board |
| CN105430249A (en) * | 2016-01-07 | 2016-03-23 | 广州大凌实业股份有限公司 | Substrate type shooting module standard device and assembling method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: GUANGZHOU DARLING INDUSTRIAL INC. Free format text: FORMER OWNER: LING DAINIAN Effective date: 20150604 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 510000 GUANGZHOU, GUANGDONG PROVINCE TO: 510700 GUANGZHOU, GUANGDONG PROVINCE |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20150604 Address after: 510700, No. 1, Xingda Road, Po Po Industrial Zone, Whampoa District, Guangdong, Guangzhou Patentee after: Guangzhou Darling Industrial Inc. Address before: 510000, No. 1, Xingda Road, Po Po Industrial Zone, Whampoa District, Guangdong, Guangzhou Patentee before: Ling Dainian |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150415 Termination date: 20191210 |