JPH104510A - Camera - Google Patents
CameraInfo
- Publication number
- JPH104510A JPH104510A JP8155234A JP15523496A JPH104510A JP H104510 A JPH104510 A JP H104510A JP 8155234 A JP8155234 A JP 8155234A JP 15523496 A JP15523496 A JP 15523496A JP H104510 A JPH104510 A JP H104510A
- Authority
- JP
- Japan
- Prior art keywords
- light
- chip
- shielding case
- camera
- solid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、カメラ、特に基板
の一表面上に固体撮像素子と、その周辺回路を成すＩＣ
チップ及び／又はその他の電子部品が形成され、該基板
の上記表面側を、上記固体撮像素子への被写体側からの
光を通す開口を有する遮光ケースで覆い、内部に被写体
を上記固体撮像素子の表面に結像するレンズを有するカ
メラに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a camera, in particular, a solid-state image pickup device on one surface of a substrate and an IC forming a peripheral circuit thereof.
A chip and / or other electronic components are formed, and the front surface side of the substrate is covered with a light-shielding case having an opening for transmitting light from the subject side to the solid-state imaging device. The present invention relates to a camera having a lens that forms an image on a surface.
【０００２】[0002]
【従来の技術】カメラとして、図５に示すように、基板
ａの一表面に配線膜ｂを形成し、その一部分上に固体撮
像素子ｃをマウントし、更に、該固体撮像素子ｃの周辺
回路を成すＩＣチップｄ、ｄ、・・・をマウントし、更
に、レンズｅを固体撮像素子ｃに対して所定の位置関係
を持つように該レンズｅの脚部ｆ、ｆにてマウントし、
その基板ａの上記表面に、上記固体撮像素子ｃ、ＩＣチ
ップｄ、ｄ、・・・、レンズｅを外部から遮る遮光ケー
スｇを取り付けたものがある。2. Description of the Related Art As a camera, as shown in FIG. 5, a wiring film b is formed on one surface of a substrate a, a solid-state image sensor c is mounted on a part of the film, and a peripheral circuit of the solid-state image sensor c is further mounted. Are mounted, and the lens e is mounted on the legs f of the lens e so as to have a predetermined positional relationship with the solid-state imaging device c.
In some cases, a light-shielding case g that shields the solid-state imaging device c, the IC chips d, d,...
【０００３】ｈは該遮光ケースｇに設けられた開口（絞
り孔）で、被写体からの光は該開口ｈを通り、そしてレ
ンズｅにより上記固体撮像素子ｃ表面に被写体象として
結像される。ｉは上記開口ｈを閉塞する光学フィルタで
ある。また、ｊはボンディングワイヤ、ｋはポッティン
グにより形成されたところのＩＣチップｄ、ｄ、・・・
を封止する樹脂、ｌはレンズｅの脚ｆ、ｆと基板ａとを
接着する接着剤である。Reference numeral h denotes an aperture (aperture hole) provided in the light-shielding case g. Light from a subject passes through the aperture h, and is formed as an image of the subject on the surface of the solid-state image pickup device c by a lens e. i is an optical filter for closing the opening h. Also, j is a bonding wire, k is an IC chip d, d,... Formed by potting.
Is an adhesive for bonding the legs f, f of the lens e to the substrate a.
【０００４】[0004]
【発明が解決しようとする課題】ところで、図５に示す
ようなカメラによれば、小型化の要請に応えることに限
界があった。というのは、固体撮像素子を用いたカメラ
は用途が多岐に渡り、例えば放送局用等の業務用カメラ
等には小型化の要請はさほど強くないが、家庭用カメラ
等には小型化の要請が極めて強く、また、それ以外のも
の、例えば監視用カメラ等にも小型化の要請の強いもの
が多くなっている。それでいて、固体撮像素子を中心と
したカメラには高性能、多機能が要求され、それに伴っ
て多くの周辺回路が必要である。特に、ディジタルタイ
プの場合には必要な周辺回路が相当に多い。However, according to the camera as shown in FIG. 5, there is a limit in meeting the demand for miniaturization. This is because cameras using solid-state imaging devices have a wide variety of applications. For example, demands for miniaturization are not so strong for commercial cameras for broadcast stations, etc. In addition, there is an increasing demand for miniaturization of other cameras, such as surveillance cameras. Nevertheless, cameras with a focus on solid-state imaging devices are required to have high performance and multiple functions, and accordingly many peripheral circuits are required. In particular, in the case of the digital type, the necessary peripheral circuits are considerably large.
【０００５】本発明はこのような問題点を解決すべく為
されたものであり、固体撮像素子を用いたカメラおい
て、周辺回路が多くても小型化を図ることができるよう
にすることを目的とする。SUMMARY OF THE INVENTION The present invention has been made to solve such a problem, and it is an object of the present invention to reduce the size of a camera using a solid-state image pickup device even if there are many peripheral circuits. Aim.
【０００６】[0006]
【課題を解決するための手段】請求項１のカメラは、遮
光ケースの内面に上記固体撮像素子の周辺回路を成すＩ
Ｃチップ及び／又はそれ以外の電子部品を設けてなるこ
とを特徴とする。According to a first aspect of the present invention, there is provided a camera having a peripheral circuit of the solid-state imaging device on an inner surface of a light-shielding case.
It is characterized by being provided with a C chip and / or other electronic components.
【０００７】従って、請求項１のカメラによれば、遮光
ケースの内面にもＩＣチップ及び／又はその他の電子部
品を設けるので、基板と遮光ケースにより形成された内
部空間を有効に活用することができる。依って、周辺回
路が多くても小型化を図ることができる。Therefore, according to the first aspect of the present invention, since the IC chip and / or other electronic components are provided on the inner surface of the light-shielding case, the internal space formed by the substrate and the light-shielding case can be effectively utilized. it can. Therefore, downsizing can be achieved even if there are many peripheral circuits.
【０００８】[0008]
【発明の実施の形態】以下、本発明を図示実施の形態に
従って詳細に説明する。図１は本発明カメラの第１の実
施の形態の概略を示す断面図である。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to the illustrated embodiments. FIG. 1 is a sectional view schematically showing a first embodiment of the camera of the present invention.
【０００９】１は配線基板、２、２、・・・は該配線基
板１の表面に形成された配線膜、３は該基板１の該表面
上にマウンティングされた固体撮像素子、４、４、・・
・は該固体撮像素子３がマウントされた表面と同じ表面
にマウントされたＩＣチップ、５、５、・・・は該ＩＣ
チップ４、４、・・・の電極と配線膜２、２、・・・と
の間を接続するボンディングワイヤ、６、６、・・・は
ポッティングにより形成された樹脂で、各ＩＣチップ
４、４、・・・を封止する。尚、該基板１表面上には例
えば図示はしないが、例えばコンデンサ、水晶発振子等
ＩＣチップ以外の電子部品がマウントされ得る。また、
基板１表面の配線膜２の外部と接続すべき部分は基板１
の外側面に延出され、１４はその延出部分で、それが外
部と接続される外部端子になる。1 is a wiring film formed on the surface of the wiring substrate 1, 2 is a solid-state imaging device mounted on the surface of the substrate 1,・ ・
.. Indicate the IC chips mounted on the same surface as the surface on which the solid-state imaging device 3 is mounted.
The bonding wires connecting the electrodes of the chips 4, 4,... And the wiring films 2, 2,... Are resin formed by potting. 4, ... are sealed. Although not shown, for example, electronic components other than the IC chip such as a capacitor and a crystal oscillator can be mounted on the surface of the substrate 1. Also,
The part to be connected to the outside of the wiring film 2 on the surface of the substrate 1 is the substrate 1
And 14 is an extended portion thereof, which becomes an external terminal connected to the outside.
【００１０】７はレンズで、取付用の脚８、８（一般に
黒色である）が二色形成技術を駆使した一体成形により
又は別個に形成した部材の接着により形成されており、
固体撮像素子３に被写体を結像できるように位置決めさ
れて基板１に接着剤９を介して接着されている。Reference numeral 7 denotes a lens, and mounting legs 8, 8 (which are generally black) are formed by integral molding using a two-color forming technique or by bonding separately formed members.
The object is positioned so as to form an image of the subject on the solid-state imaging device 3 and is adhered to the substrate 1 via an adhesive 9.
【００１１】１０は遮光ケースで、開口（絞り孔）１１
を有し、その開口１１は光学フィルタ（赤外線カットフ
ィルタ）１２により閉塞されており、その下端面が基板
１の周縁部に接着されている。該遮光ケース１０は内面
に配線膜１３、１３、・・・が形成され、そして、天井
に当たる部分にはＩＣチップ４、４、・・・がマウント
されている。勿論、この遮光ケース１０の天井に当たる
部分にＩＣチップ以外の例えばコンデンサ、水晶発振子
等のＩＣチップ以外の電子部品もマウントするようにし
ても良いことは言うまでもない。Reference numeral 10 denotes a light-shielding case, and an opening (aperture hole) 11
The opening 11 is closed by an optical filter (infrared cut filter) 12, and the lower end surface is adhered to the periphery of the substrate 1. Are formed on the inner surface of the light-shielding case 10, and IC chips 4, 4,... Are mounted on portions corresponding to the ceiling. Of course, it goes without saying that electronic parts other than the IC chip, such as a capacitor and a crystal oscillator, may be mounted on the portion corresponding to the ceiling of the light shielding case 10.
【００１２】２０、２０・・・は遮光ケース１０の側面
に形成された外部端子で、遮光ケース１０の内面に形成
された配線膜１３、１３、・・・の外部と接続されるべ
き部分であって、遮光ケース１０の内側面に延設された
配線膜１３、１３、・・・の延設部分に該遮光ケース１
０の側部を貫通するように形成され、該延設部分と例え
ば半田により接続されて電気的導通がとられている。Are external terminals formed on the side surface of the light-shielding case 10, and are portions to be connected to the outside of the wiring films 13, 13,... Formed on the inner surface of the light-shielding case 10. The light-shielding case 1 is provided on an extended portion of the wiring films 13, 13,.
The extended portion is formed so as to penetrate therethrough, and is connected to the extended portion by, for example, solder to establish electrical continuity.
【００１３】図２は図１に示した第１の実施の形態をよ
り理解し易いように示す分解斜視図である。このような
カメラによれば、遮光ケース１０の内面に上記固体撮像
素子３の周辺回路を成すＩＣチップ４、４、・・・（更
にはそれ以外の電子部品）を設けてなるので、基板１と
遮光ケース１０により形成された内部空間を有効に活用
することができる。依って、周辺回路が多くても小型化
を図ることができ得る。FIG. 2 is an exploded perspective view showing the first embodiment shown in FIG. 1 for easier understanding. According to such a camera, IC chips 4, 4,... (And other electronic components) constituting a peripheral circuit of the solid-state imaging device 3 are provided on the inner surface of the light-shielding case 10, so that the substrate 1 And the internal space formed by the light shielding case 10 can be effectively utilized. Therefore, downsizing can be achieved even if there are many peripheral circuits.
【００１４】尚、遮光ケース１０の内面は凹部になって
おり、そのような凹部への配線の形成は、フレキシブル
配線基板を用意し、該フレキシブル配線基板を遮光ケー
ス１０の内面に接着することにより容易に行うことがで
きる。The inner surface of the light-shielding case 10 is a concave portion. Wiring in such a concave portion is formed by preparing a flexible wiring substrate and bonding the flexible wiring substrate to the inner surface of the light-shielding case 10. It can be done easily.
【００１５】しかし、遮光ケース１０の内面に直接配線
膜を形成するようにしても良い。但し、その場合、遮光
ケース１０の側部（基板１に接着されたとき天井になる
面に対して直角の部分）の内面への配線の形成には若干
高度の技術を要する。というのは、天井になる部分への
露光は容易であるが、側部内面への露光は比較的難しい
からである。However, a wiring film may be formed directly on the inner surface of the light shielding case 10. However, in this case, formation of wiring on the inner surface of the side portion of the light-shielding case 10 (the portion perpendicular to the surface that becomes the ceiling when bonded to the substrate 1) requires a slightly advanced technique. This is because it is easy to expose the ceiling, but relatively difficult to expose the inner side surface.
【００１６】そこで、遮光ケース１０の側部内面に配線
を形成しないようにし、外部への電気的導出を外部端子
を直接遮光ケース１０天井面の配線膜に接続するように
することにより行うようにしても良い。図３（Ａ）、
（Ｂ）はそのようなカメラ（本発明カメラの第２の実施
の形態）を示すもので、（Ａ）は遮光ケース１０を上下
逆さにして示す斜視図（但し、便宜上ＩＣチップ４、
４、・・・はワイヤボンディングやポッティングをしな
い状態で示す。）、（Ｂ）はカメラの斜視図である。同
図において、１６、１６、・・・は外部端子である。Therefore, no wiring is formed on the inner surface of the side portion of the light-shielding case 10, and the electrical leads to the outside are made by connecting the external terminals directly to the wiring film on the ceiling surface of the light-shielding case 10. May be. FIG. 3 (A),
(B) shows such a camera (a second embodiment of the camera of the present invention), and (A) is a perspective view showing the light shielding case 10 upside down (however, for convenience, the IC chip 4,
4,... Are shown without wire bonding or potting. (B) is a perspective view of the camera. In the figure, reference numerals 16, 16, ... denote external terminals.
【００１７】また、外部端子１６、１６、・・・に代え
てフレキシブル配線基板を用いるようにしても良く、図
４（Ａ）、（Ｂ）はそのようなカメラ（本発明カメラの
第３の実施の形態）を示すもので、（Ａ）は遮光ケース
１０を上下逆さにして示す斜視図（但し、便宜上ＩＣチ
ップ４、４、・・・はワイヤボンディングやポッティン
グをしない状態で示す。）、（Ｂ）はカメラの斜視図で
ある。同図において、１７はフレキシブル配線基板であ
る。Further, a flexible wiring board may be used in place of the external terminals 16, 16,..., And FIGS. 4A and 4B show such a camera (third camera of the present invention). (A) is a perspective view showing the light-shielding case 10 upside down (however, for convenience, the IC chips 4, 4,... Are shown without wire bonding or potting), (B) is a perspective view of the camera. In the figure, reference numeral 17 denotes a flexible wiring board.
【００１８】尚、遮光ケース１０の側部（基板１に接着
されたとき天井になる部分に対して直角の部分）の内面
への露光が比較的難しいけれど、その側部の遮光ケース
１０に対する角度を９０度より大きく、即ち鈍角にする
と、露光の難しさが軽減し、例えば１３５度程度だと比
較的容易であるので、遮光ケース１０の内面にそして、
側部内面に配線膜を形成するようにしても良い。Although it is relatively difficult to expose the inner surface of the side of the light-shielding case 10 (the portion perpendicular to the ceiling when adhered to the substrate 1), the angle of the side to the light-shielding case 10 is relatively difficult. Is larger than 90 degrees, that is, an obtuse angle reduces the difficulty of exposure. For example, if the angle is about 135 degrees, it is relatively easy.
A wiring film may be formed on the inner surface of the side part.
【００１９】また、上記各実施の形態においては、結像
レンズ７は基板１側に取り付けられていたが、しかし、
必ずしもそのようにする必要はなく、遮光ケース１０側
に取り付けるようにしても良いことは言うまでもない。
また、遮光ケース１０の側部内面にＩＣチップあるいは
その他の電子部品をマウントするようにしても良い。そ
して、基板１の裏面側にもＩＣチップを設けることによ
り、より周辺回路の多いタイプのカメラを小型につくる
ことができる。In each of the above embodiments, the imaging lens 7 is attached to the substrate 1 side.
It is not always necessary to do so, and it goes without saying that it may be attached to the light shielding case 10 side.
Further, an IC chip or other electronic components may be mounted on the inner surface of the side portion of the light shielding case 10. By providing an IC chip also on the back side of the substrate 1, a camera having more peripheral circuits can be made smaller.
【００２０】このように、本発明は種々の形態で実施す
ることができる。As described above, the present invention can be implemented in various modes.
【００２１】[0021]
【発明の効果】本発明カメラによれば、遮光ケースの内
面にもＩＣチップ及び／又はその他の電子部品を設ける
ので、基板と遮光ケースにより形成された内部空間を有
効に活用することができる。依って、周辺回路が多くて
も小型化を図ることができる。According to the camera of the present invention, since the IC chip and / or other electronic parts are provided on the inner surface of the light shielding case, the internal space formed by the substrate and the light shielding case can be effectively utilized. Therefore, downsizing can be achieved even if there are many peripheral circuits.
【図１】本発明カメラの第１の実施の形態を示す断面図
である。FIG. 1 is a cross-sectional view showing a first embodiment of the camera of the present invention.
【図２】上記第１の実施の形態を分かりやすく示すため
の分解斜視図である。FIG. 2 is an exploded perspective view showing the first embodiment in an easily understandable manner.
【図３】（Ａ）、（Ｂ）は本発明カメラの第２の実施の
形態を示すもので、（Ａ）は遮光ケースを上下逆さにし
た状態で示す斜視図、（Ｂ）はカメラの斜視図である。FIGS. 3A and 3B are views showing a second embodiment of the camera of the present invention, in which FIG. 3A is a perspective view showing a state in which a light-shielding case is turned upside down, and FIG. It is a perspective view.
【図４】（Ａ）、（Ｂ）は本発明カメラの第３の実施の
形態を示すもので、（Ａ）は遮光ケースを上下逆さにし
た状態で示す斜視図、（Ｂ）はカメラの斜視図である。FIGS. 4A and 4B show a third embodiment of the camera of the present invention, wherein FIG. 4A is a perspective view showing a light-shielding case in an upside down state, and FIG. It is a perspective view.
【図５】一つの従来例を示す断面図である。FIG. 5 is a cross-sectional view showing one conventional example.
１・・・基板、２・・・配線膜、３・・・固体撮像素
子、４・・・ＩＣチップ、７・・・レンズ、１０・・・
遮光ケース、１１・・・開口（絞り孔）、１３・・・遮
光ケース内面の配線膜、１４、１５、１６・・・外部端
子。DESCRIPTION OF SYMBOLS 1 ... Substrate, 2 ... Wiring film, 3 ... Solid-state image sensor, 4 ... IC chip, 7 ... Lens, 10 ...
Light-shielding case, 11 ... opening (diaphragm hole), 13 ... wiring film on the inner surface of the light-shielding case, 14, 15, 16 ... external terminals.
Claims (3)
周辺回路を成すＩＣチップ及び／又はその他の電子部品
が形成され、該基板の上記表面側を、上記固体撮像素子
への被写体側からの光を通す開口を有する遮光ケースで
覆い、被写体を上記固体撮像素子の表面に結像するレン
ズを内蔵するカメラであって、 上記遮光ケースの内面に上記固体撮像素子の周辺回路を
成すＩＣチップ及び／又はそれ以外の電子部品を設けて
なることを特徴とするカメラ。1. A solid-state imaging device and an IC chip and / or other electronic components forming a peripheral circuit thereof are formed on one surface of a substrate, and the front surface side of the substrate is connected to a subject side to the solid-state imaging device. A camera that covers a solid-state imaging device with a lens and covers the object with a light-shielding case having an opening for transmitting light from the camera, and forms a peripheral circuit of the solid-state imaging device on the inner surface of the light-shielding case. A camera comprising a chip and / or other electronic components.
を接着し、該フレキシブル配線板の表面にＩＣチップ及
び／又はその他の電子部品が設けられてなることを特徴
とする請求項１記載のカメラ。2. The camera according to claim 1, wherein a flexible wiring board is adhered to an inner surface of the light shielding case, and an IC chip and / or other electronic components are provided on a surface of the flexible wiring board.
れ、該配線膜が形成された内面上にＩＣチップ及び／又
はその他の電子部品が設けられてなることを特徴とする
請求項１記載のカメラ。3. The light-shielding case according to claim 1, wherein a wiring film is formed directly on an inner surface of the light-shielding case, and an IC chip and / or other electronic components are provided on the inner surface on which the wiring film is formed. Camera.
Priority Applications (11)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8155234A JPH104510A (en) | 1996-06-17 | 1996-06-17 | Camera |
| US08/855,637 US6795120B2 (en) | 1996-05-17 | 1997-05-13 | Solid-state imaging apparatus and camera using the same |
| EP06014848.3A EP1715526B1 (en) | 1996-05-17 | 1997-05-14 | Solid-state imaging apparatus and camera using the same |
| EP06014847A EP1715525B1 (en) | 1996-05-17 | 1997-05-14 | Solid-state imaging apparatus |
| DE69739498T DE69739498D1 (en) | 1996-05-17 | 1997-05-14 | Solid state imaging apparatus and use in a camera |
| EP97107881A EP0807976B1 (en) | 1996-05-17 | 1997-05-14 | Solid-state imaging apparatus and camera using the same |
| EP06014846.7A EP1715524B1 (en) | 1996-05-17 | 1997-05-14 | Solid-state imaging apparatus |
| DE69739708T DE69739708D1 (en) | 1996-05-17 | 1997-05-14 | The solid state imaging device |
| US10/891,633 US8098309B2 (en) | 1996-05-17 | 2004-07-15 | Solid-state imaging apparatus and camera using the same |
| US13/213,777 US8564702B2 (en) | 1996-05-17 | 2011-08-19 | Solid-state imaging apparatus and camera using the same |
| US14/032,366 US20140042578A1 (en) | 1996-05-17 | 2013-09-20 | Solid-state imaging apparatus and camera using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8155234A JPH104510A (en) | 1996-06-17 | 1996-06-17 | Camera |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH104510A true JPH104510A (en) | 1998-01-06 |
Family
ID=15601477
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8155234A Abandoned JPH104510A (en) | 1996-05-17 | 1996-06-17 | Camera |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH104510A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001319985A (en) * | 2000-02-29 | 2001-11-16 | Agilent Technol Inc | Chip-mount sealing structure body |
| FR2824953A1 (en) * | 2001-05-18 | 2002-11-22 | St Microelectronics Sa | Optical semiconductor casing with incorporated lens and screening network |
| JP2011035458A (en) * | 2009-07-29 | 2011-02-17 | Fujifilm Corp | Camera module |
| US8008761B2 (en) | 2008-07-30 | 2011-08-30 | Fibest Limited | Optical semiconductor apparatus |
| JP2011229023A (en) * | 2010-04-21 | 2011-11-10 | Fujifilm Corp | Semiconductor unit and imaging apparatus |
-
1996
- 1996-06-17 JP JP8155234A patent/JPH104510A/en not_active Abandoned
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001319985A (en) * | 2000-02-29 | 2001-11-16 | Agilent Technol Inc | Chip-mount sealing structure body |
| FR2824953A1 (en) * | 2001-05-18 | 2002-11-22 | St Microelectronics Sa | Optical semiconductor casing with incorporated lens and screening network |
| WO2002095796A3 (en) * | 2001-05-18 | 2003-10-30 | St Microelectronics Sa | Optical semiconductor housing with incorporated lens and shielding |
| US8008761B2 (en) | 2008-07-30 | 2011-08-30 | Fibest Limited | Optical semiconductor apparatus |
| JP2011035458A (en) * | 2009-07-29 | 2011-02-17 | Fujifilm Corp | Camera module |
| JP2011229023A (en) * | 2010-04-21 | 2011-11-10 | Fujifilm Corp | Semiconductor unit and imaging apparatus |
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