JP2011035458A - Camera module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a camera module wherein mounting components are incorporated, the ratio of the area of an image sensor to the projection area of the camera module in the view from a direction perpendicular to the light receiving part of the image sensor is large, and the thickness in a photographing optical axis direction is small. <P>SOLUTION: A case 15 whose bottom surface is opened is bonded to the upper surface of a substrate 16 where the image sensor 20 is mounted, and a lens unit 12 is attached onto the case 15. For the case 15, a three-dimensional printed circuit board with a circuit pattern comprising a conductive material formed on the inner surface is used. On an electrode 28 provided on the inner surface of the top plate 15a of the case 15, the plurality of mounting components 32 are mounted in a direction facing the surface provided with the light receiving part 20a of the image sensor 20. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a camera module in which a photographic lens and an image sensor are integrated with a mounting component used for driving or controlling the photographic lens or the image sensor.

  2. Description of the Related Art A camera module is known as an apparatus used for imparting a photographing function to a small electronic device such as a mobile phone or a notebook computer. The camera module integrates a photographic lens, an image sensor such as a CCD or a CMOS that photoelectrically converts an image formed by the photographic lens, and a mounting component used to drive or control the photographic lens or the image sensor. It is miniaturized so that it can be installed in a small space. A general camera module has a configuration in which a substrate on which an imaging element and various mounting components are mounted is bonded to a lens holder that holds a photographing lens.

  As a new movement surrounding the camera module, the “Standard Mobile Imaging Architecture (SMIA)” standard, which aims to increase the compatibility by sharing the electrical and mechanical interfaces of the camera module, has been announced.

  In order to improve the image quality while maintaining the small size of the camera module, it is desired to mount a large-size image sensor on the camera module. That is, the camera module has a large area (contrast area) with respect to the projected area when the camera module is viewed from the orthogonal direction of the light receiving unit. However, since the camera module is mounted on a small electronic device, the outer shape of the light receiving unit viewed from the orthogonal direction is regulated to a certain size. Otherwise, an image sensor with a large contrast area cannot be mounted.

  As a miniaturized camera module, a 3D printed board with a wiring pattern made of a conductive material is formed on the surface of the board on which the image sensor is mounted, and the image sensor is mounted face down on this 3D printed board. There is what was attached (for example, refer to patent documents 1). In addition, a camera module in which a three-dimensional wiring board containing wiring made of a conductive material is disposed between a substrate on which an imaging element is mounted and a lens holder, and the three-dimensional wiring board and the imaging element are connected by wire bonding. Is also known (see, for example, Patent Document 2).

  In addition, there is a camera module in which a mounting component is not disposed around an imaging element by using a component-embedded substrate in which the mounting component is embedded as a substrate on which the imaging element is mounted (see, for example, Patent Document 3). Also known is a camera module having a two-story substrate with an image sensor mounted on an upper substrate and various mounting components mounted on a lower substrate (see, for example, Patent Document 4).

JP 2001-245186 A JP-A-2005-229609 JP 2007-306307 A JP-A-11-146284

  In the camera modules described in Patent Documents 1 and 2, since other mounting components are mounted together on the mounting surface on which the image sensor is mounted, the outer shape of the camera module viewed from the orthogonal direction of the light receiving unit is reduced. It is difficult to mount an image sensor with a large contrast area. Further, in the camera module described in Patent Document 2, since the wire-bonding is used to electrically connect the three-dimensional wiring board having a shape surrounding the outer periphery of the image pickup element and the image pickup element, It is necessary to provide substantially the same large opening, and it is still difficult to reduce the size, and it is impossible to mount an imaging device having a large comparison area.

  The camera modules described in Patent Documents 3 and 4 do not have mounting components on the same mounting surface as the image sensor, so that the outer shape viewed from the orthogonal direction of the light receiving unit can be reduced, and an image sensor having a large comparison area can be obtained. Although it can be mounted, the thickness dimension in the orthogonal direction of the light receiving portion is increased. In particular, the component-embedded substrate has a thickness larger than that of a general substrate for the purpose of incorporating a mounting component, and thus the height from the back surface of the substrate to the light receiving portion of the image sensor cannot be reduced. Accordingly, there arises a problem that the distance between the photographing lens and the image pickup element becomes short and lens design becomes difficult.

  It is an object of the present invention to incorporate mounting components related to an image sensor and the like, to have a large area of the image sensor with respect to the projected area of the camera module when viewed from a direction orthogonal to the light receiving portion of the image sensor, and to a photographing optical axis The object is to provide a camera module having a small directional thickness.

  The camera module of the present invention includes a top plate and a side plate extending downward from an edge of the top plate, and a case in which a circuit pattern made of a conductive material is provided on the inner surface of the top plate and the side plate, and the case A substrate that is bonded to the bottom surface of the substrate and electrically connected to the circuit pattern, an image sensor that is mounted on the upper surface of the substrate so that the light receiving portion faces an imaging opening provided on the top plate, and light reception of the image sensor A mounting part mounted on the circuit pattern in a direction opposite to the surface on which the part is provided, a lens housing attached to the top plate of the case, and a photographing lens that forms a subject image on the light receiving part through the imaging opening The lens unit and a socket for holding the case are provided with a socket connection electrode that is electrically connected to a terminal in the socket when the case is inserted from the bottom surface side.

  The mounting component is preferably mounted within the projection area of the image sensor in the direction orthogonal to the light receiving unit and outside the incident optical path of the photographing lens.

  In addition, the mounting part may be mounted on the extended circuit pattern so that the circuit pattern is extended to the top surface of the top board and the mounting part is arranged between the top board and the lens housing.

  An optical filter that closes the imaging aperture may be attached to the top surface of the top plate. You may attach this optical filter to the lower surface of a top plate.

  A ground shield pattern made of a conductive material may be provided on the upper surface of the plate and the outer surface of the side plate. In this case, it is preferable that at least the surface of the lens housing has electrical conductivity, and the electrically conductive surface is electrically connected to the ground shield pattern.

  When the lens unit has a lens driving actuator that moves the photographing lens in a direction orthogonal to the light receiving portion, a connection port for electrically connecting the mounting component and the lens driving actuator to the case is provided. Is preferred.

  A frame-shaped rib may be provided on the lower surface of the top plate so as to surround the outer periphery of the imaging aperture outside the effective pixels of the image sensor and extend to the position where the tip is close to the upper surface of the image sensor.

  When a bare chip having a connection pad is used as the image sensor, the connection pad and the wiring pattern of the substrate may be electrically connected by wire bonding.

  When the connection pad is provided along at least one side of the image sensor, the connection pad and the wiring pattern of the substrate are electrically connected by wire bonding, and the image sensor is wire bonded. The mounting component may be mounted so as to face the non-side.

  Moreover, it is preferable to coat the bonding wire used for wire bonding and the wiring pattern of the connection pad and the substrate with an anisotropic conductive film or an anisotropic conductive adhesive.

  When a bare chip having a through electrode is used as the imaging element, the through electrode and the wiring pattern of the substrate may be electrically connected by a conductive connecting material.

  When an image sensor package in which a bare chip is accommodated in the package is used as the image sensor, the image sensor may be electrically connected to the substrate with a conductive connection material.

  An anisotropic conductive film may be used for bonding the case and the substrate. In place of the anisotropic conductive film, an anisotropic conductive adhesive or solder may be used.

  As the substrate, any of a resin substrate, a ceramic substrate, or a component built-in substrate incorporating a mounting component may be used.

  According to the present invention, since the mounting component is mounted in the case so as to face the image sensor, the area of the image sensor relative to the projected area of the camera module when viewed from the direction orthogonal to the light receiving portion of the image sensor is increased. be able to. In addition, since a normal substrate is used, the thickness dimension of the camera module in the orthogonal direction of the light receiving unit can be reduced. Furthermore, when the camera module of the present invention and the camera module using the component-embedded substrate have the same thickness dimension, the present invention can increase the distance between the light receiving unit and the photographic lens, so that the lens design is easy to perform. Become.

  Since the mounting components are arranged within the projected area of the image sensor in the orthogonal direction of the light receiving unit, the space in the case can be used effectively, and more mounting components or larger mounting components can be mounted. In particular, a large effect can be obtained in a CMOS sensor in which the area of the light receiving portion relative to the projected area of the image sensor is small.

  Since a mounting component can be arranged between the top plate of the case and the lens housing, a gap existing in the camera module can be used effectively, and more mounting components can be mounted.

  By attaching the optical filter to the top surface of the top plate, the distance between the optical filter and the image sensor can be increased, so that even when the optical filter has a defect, the defect is prevented from being imaged by the image sensor. be able to. Furthermore, the mounting area of the mounting components in the case can be increased by attaching the optical filter to the top surface of the top plate.

  When the optical filter is attached to the lower surface of the top plate, that is, the same surface as the mounting surface of the mounting component, the optical filter can be mounted using a mounter for mounting the mounting component on the case, so that the manufacturing efficiency is improved.

  Since the ground shield pattern is provided on the outer surface of the case, the influence on unnecessary radiation of electromagnetic waves can be reduced, and EMC (EMI, electrostatic) characteristics can be improved. Further, it is possible to further improve EMC characteristics by imparting conductivity to at least the surface of the lens housing and connecting it to a ground shield pattern.

  Since the lens driving actuator of the lens unit and the mounting component of the case are connected by the connection port, it is not necessary to provide another wiring such as an FPC outside the camera module. Therefore, the camera module can be downsized and handled.

  Since a frame-shaped rib is provided that surrounds the outer periphery of the imaging aperture outside the effective pixels of the image sensor and the tip extends to a position close to the upper surface of the image sensor, dust generated from the periphery of the mounted component is captured by the image sensor. Can be prevented from adhering to the light receiving part. In addition, since the rigidity of the case is improved by the rib, the reliability of the camera module is also increased. Furthermore, since the light incident in the case is not reflected on the mounting component and incident on the light receiving portion, it is possible to prevent the image quality from being deteriorated by the reflected light.

  As the image sensor, various package types such as a bare chip and an image sensor package can be used, and the application range is wide. In addition, various types of devices such as wire bonding, through electrodes, and conductive connection materials can be used for electrical connection between the image sensor and the substrate, and the most appropriate one should be selected according to the type of image sensor. Can do.

  When wire bonding is used to connect the image sensor and the substrate, the mounting component is mounted so as to face the side of the image sensor that is not wire-bonded. The thickness dimension can be further reduced. Further, since the bonding wire or the like is covered with an anisotropic conductive film or the like, the reliability of the connecting portion by wire bonding and the strength against dropping, vibration or impact can be improved.

  Since the anisotropic conductive film or the anisotropic conductive adhesive is used for the connection between the case and the substrate, the case and the substrate can be mechanically and electrically connected in a short time. Further, when solder is used for connection between the case and the substrate, for example, if a reflow method is used, it is possible to connect together with the mounted components, thereby improving manufacturing efficiency.

  Since a resin substrate is used as the substrate, the cost and weight of the camera module can be reduced. In addition, when a ceramic substrate is used, the amount of dust that comes out of the substrate is reduced, so that it is possible to prevent image quality deterioration due to dust. Furthermore, when a component built-in substrate is used, a larger number of mounted components can be built in the camera module.

It is the perspective view which looked at the camera module from the lens unit side. It is the perspective view which looked at the camera module from the substrate side. It is sectional drawing of the camera module of 1st Embodiment. It is a perspective view which shows the circuit pattern provided in the inner surface of the case. It is a perspective view which shows the state by which the mounting component was mounted in the circuit pattern. It is sectional drawing of the camera module which shows the structure of a connection port. It is sectional drawing of the camera module of 2nd Embodiment which has arrange | positioned mounting components in the projection area of an image pick-up element. It is sectional drawing of the camera module of 3rd Embodiment which mounted mounting components on the upper surface of the top plate. It is sectional drawing of the camera module of 4th Embodiment which attached the optical filter to the lower surface of a top plate. It is sectional drawing of the camera module of 5th Embodiment which provided the ground shield pattern in the outer surface of a case. It is sectional drawing of the camera module of 6th Embodiment which provided the rib which surrounds a light-receiving part in the lower surface of a top plate. It is sectional drawing of the camera module of 7th Embodiment which made the case height low by wire-bonding only one side of an image sensor. It is sectional drawing of the camera module of 8th Embodiment which coat | covered the bonding wire etc. with the anisotropic conductive film. It is sectional drawing of the camera module of 9th Embodiment using the bare chip type image pick-up element which has a penetration electrode. It is sectional drawing of the camera module of 10th Embodiment using an image pick-up element package. It is sectional drawing of the camera module of 11th Embodiment using the component built-in board | substrate.

[First Embodiment]
Hereinafter, a first embodiment of a camera module embodying the present invention will be described. A camera module 10 shown in FIG. 1 includes a rectangular element unit 11 and a cylindrical lens unit 12 fixed to the upper surface of the element unit 11. The camera module 10 is mechanically fixed by being inserted from the element unit 11 side into a socket provided in an electronic device such as a mobile phone.

  The element unit 11 includes a case 15 and a substrate 16 bonded to the bottom surface of the case 15. For the substrate 16, for example, a resin substrate is used in order to reduce the cost and weight of the camera module 10. As shown in FIG. 2, a plurality of socket connection electrodes 17 arranged along two opposing sides are provided on the bottom surface of the substrate 16. The socket connection electrode 17 is made of, for example, copper foil, and comes into contact with and electrically connects to a terminal in the socket when the camera module 10 is inserted into the socket.

  As shown in FIG. 3, the image sensor 20 is mounted on the upper surface of the substrate 16 so that the light receiving portion 20a faces upward. The image sensor 20 is, for example, a bare chip CCD image area sensor, and is provided with a plurality of connection pads 20b arranged along two opposing sides. The connection pads 20 b and the wiring pattern 21 provided on the upper surface of the substrate 16 are connected by bonding wires 22. The wiring pattern 21 goes around the side surface of the substrate 16 and is connected to the socket connection electrode 17 on the bottom surface.

The case 15 is a box-like body with an open bottom surface to which the substrate 16 is joined, and includes a top plate 15a parallel to the light receiving unit 20a and a side plate 15b extending downward from an edge of the top plate 15a. ing.
The reason why the case 15 is a box-shaped body is that it is easy to make a chamfer at the time of processing and to easily align it at the time of mounting. The top plate 15 a is provided with an imaging opening 15 c at a position facing the light receiving unit 20 a of the imaging device 20. An optical filter 25 such as an IR cut filter is attached to the top surface of the top plate 15a so as to close the imaging opening 15c.

  In the optical filter 25, for example, since the filter layer is formed on the surface of transparent glass by vapor deposition or the like, vapor deposition unevenness or dot-like vapor deposition defects may occur. When this deposition unevenness or deposition failure is imaged by the imaging device 20, it becomes fixed pattern noise of the imaging signal output from the imaging device 20. However, in this embodiment, since the optical filter 25 is attached to the upper surface of the top plate 15a and the distance from the image sensor 20 is long, uneven deposition or poor vapor deposition is not imaged on the image sensor 20. .

  The case 15 is a so-called three-dimensional injection molded circuit component, and a circuit pattern formed at the same time when the case 15 is formed by plastic injection molding is integrally provided on the inner surface thereof. As shown in FIG. 4, the circuit pattern includes a plurality of electrodes 28 provided on the inner surface of the top plate 15a and a plurality of electric lines 29 provided on the inner surfaces of the top plate 15a and the side plate 15b. The electrical line 29 connects between the electrodes 28, and the end portion is exposed from the bottom surface of the case 15.

  As shown in FIG. 5, a plurality of mounting components 32 such as an IC, a capacitor, an inductor, and a resistor are mounted on each electrode 28 of the case 15. These mounting components 32 are mounted so as to face the surface on which the light receiving portion 20 a of the image sensor 20 is provided and do not face the image sensor 20.

  As shown in FIG. 3, the case 15 and the substrate 16 are mechanically joined by an anisotropic conductive film (ACF) 35. The ACF 35 is pressurized at the time of joining to electrically connect the electrical line 29 of the case 15 and the wiring pattern 21 of the substrate 16. By joining the case 15 and the substrate 16 using the anisotropic conductive film 35, mechanical joining and electrical connection can be performed at the same time, so that the working efficiency at the time of manufacture is improved.

  The lens unit 12 includes, for example, a cylindrical lens housing 38 made of plastic, a lens barrel 40 that holds the photographing lens 39 and is accommodated in the lens housing 38, and is arranged around the lens barrel 40. Voice coil motor (VCM) 41. The VCM 41 is composed of, for example, a coil attached to the lens barrel 40 and a permanent magnet attached to the lens housing 38, and the coil placed in the magnetic field of the permanent magnet moves linearly by passing a current through the coil. The lens barrel 40 is moved in the direction of the photographing optical axis S.

  The element unit 11 and the lens unit 12 are, for example, adjusted in position while imaging a test chart, and joined by an adhesive 44 after the adjustment is completed.

  Reference numeral 47 shown in FIGS. 4 and 5 is a convex portion generated by providing a concave connection port 48 on the outer surface of the case 15 as shown in FIG. As shown in FIG. 6, one end of VCM electric lines 49a and 49b connected to the VCM driver IC 32a is drawn out to the connection port 48. The flexible printed circuit board 50 drawn from the VCM 41 of the lens unit 12 is electrically connected to the VCM electric lines 49a and 49b.

  The operation of the above embodiment will be described. The camera module 10 is inserted from a substrate 16 side into a socket provided in an electronic device such as a mobile phone and is mechanically fixed by the socket. The socket connection electrode 17 on the bottom surface of the substrate 16 is in contact with and electrically connected to the terminal of the socket. Accordingly, the camera module 10 can be controlled by the control circuit on the electronic device side. For example, the mounting component 32 is controlled by a control circuit on the electronic device side, and the imaging element 20 performs imaging. Further, the VCM driver IC 32a is controlled by the control circuit on the electronic device side to drive the VCM 41, and the photographing lens 39 moves in the photographing optical axis S direction.

  According to the camera module, since the mounting component 32 is mounted in the case 15 so as to face the imaging device 20, the imaging device 20 has a projected area of the camera module 10 when viewed from the direction orthogonal to the light receiving unit 20a. The area can be increased. Moreover, since the normal board | substrate 16 is used, the thickness dimension of the camera module 10 in the orthogonal direction of the light-receiving part 20a can be made small. Furthermore, when the thickness dimensions of the camera module 10 of the present embodiment and the conventional camera module using the component-embedded substrate are the same, the distance between the light receiving unit 20a and the photographic lens 39 can be increased in the present embodiment. This makes it easier to design the lens.

  Further, since the VCM driver IC 32a and the VCM 41 are connected by the connection port 48, it is not necessary to provide another wiring such as an FPC outside the camera module 10. Therefore, the camera module 10 can be downsized and handled.

  Below, 2nd-11th embodiment of this invention is described. In addition, about the same thing as the structure demonstrated in 1st Embodiment, detailed description is abbreviate | omitted using a same sign.

[Second Embodiment]
As shown in FIG. 7, the camera module 60 according to the second embodiment uses an image sensor 61 composed of, for example, a bare chip state CMOS image area sensor (hereinafter referred to as a CMOS sensor), and within the projected area of the image sensor 61. In addition, the mounting component 32 is mounted so as to face the outside of the incident optical path of the photographic lens 39, that is, the portion other than the light receiving portion 61a.

  As is well known, the CMOS sensor has a light receiving portion 61 a and a control circuit built in the chip. Therefore, when the mounting component 32 is mounted so as not to face the image sensor 61, the mounting component 32 is mounted in the case 15. The possible area is reduced. However, the mounting area can be increased to the same extent as in the first embodiment by mounting the mounting component 32 so as to face a portion other than the light receiving portion 61a as in the present embodiment. As a result, the space in the case 15 can be used effectively, and more mounting components 32 or larger mounting components 32 can be mounted.

[Third Embodiment]
As shown in FIG. 8, in the camera module 65 of the third embodiment, an electrode 66 is formed on the upper surface of the top plate 15a, and the electrode 66 and the electrode 28 or the electric line 29 on the inner surface of the case are provided on the outer surface of the side plate 15b. The electrical lines 67 are connected. A mounting component 68 is mounted on the electrode 66 so as to be disposed in a gap between the top plate 15 a and the lens housing 38.

  According to this embodiment, since the mounting component 68 can be mounted by effectively using the gap existing in the camera module 65, more mounting components can be mounted on the camera module 65.

[Fourth Embodiment]
As shown in FIG. 9, in the camera module 70 of the fourth embodiment, the optical filter 25 is attached to the lower surface of the top plate 15a to close the imaging opening 15c. According to this, since the optical filter 25 can be mounted together in the case 15 using the mounter for mounting the mounting component 32 on the electrode 28 of the case 15, the manufacturing efficiency is improved.

[Fifth Embodiment]
As shown in FIG. 10, the camera module 75 of the fifth embodiment is provided with a ground shield pattern 76 made of a conductive material on the outer surface of the case 15. According to this, since the influence of electromagnetic waves on unnecessary radiation is reduced, electromagnetic compatibility (EMC characteristics) is improved, and the occurrence of electromagnetic interference (EMI) can be prevented.

  Also, a ground shield pattern 77 a may be provided on the surface of the lens housing 77, and the ground shield pattern 77 a and the ground shield pattern 76 of the case 15 may be connected by an anisotropic conductive film 78. According to this, EMC characteristics can be further improved. The ground shield pattern 77a of the lens housing 77 may be formed on the surface of the lens housing 77 made of plastic by using metal plating, metal vapor deposition, or the like. The lens housing 77 may be formed by a molded circuit component. Further, the entire lens housing 77 may be formed of a conductive metal.

[Sixth Embodiment]
As shown in FIG. 11, the camera module 80 of the sixth embodiment surrounds the outer periphery of the imaging opening 15 c outside the effective pixels of the image sensor 20 on the lower surface of the top plate 15 a, and the tip is close to the upper surface of the image sensor 20. A frame-like rib 81 extending to the position is provided. Thereby, it is possible to prevent dust generated from the periphery of the mounting component 32 from adhering to the light receiving unit 20a of the image sensor 20. Further, since the rigidity of the case 15 is improved by the rib 81, the reliability of the camera module 80 is also increased. Furthermore, since the light incident in the case 15 is not reflected by the mounting component 32 and incident on the light receiving unit 20a, it is possible to prevent the image quality from being deteriorated by the reflected light. In addition, it is preferable that the tip of the rib 81 has an appropriate clearance (for example, about 0 to 0.1 mm) between the imaging element 20.

[Seventh Embodiment]
As shown in FIG. 12, the camera module 85 of the seventh embodiment uses an image sensor 87 provided with a connection pad 86 along at least one side of the chip, and connects the connection pad 86 and the wiring pattern 21 to a bonding wire. 22 is electrically connected. Further, the mounting component 32 is mounted so as to face the side of the image sensor 87 that is not wire-bonded. Furthermore, since it is not necessary for the case 88 to avoid interference between the mounting component 32 and the bonding wire 22, the height of the case 88 is lowered so that the mounting component 32 is close to the image sensor 87. Thereby, the thickness dimension of the camera module 85 whole can be made small. Also, a large-sized mounting component can be mounted.

[Eighth Embodiment]
As shown in FIG. 13, the camera module 90 of the eighth embodiment uses an anisotropic conductive film 91 for joining the case 15 and the substrate 16, and the anisotropic conductive film 91 allows the connection pads 20 b and the wiring pattern 21 to be connected. And the bonding wire 22 is covered. Since the anisotropic conductive film 91 does not have conductivity in a normal state and has a property of exhibiting conductivity when pressed, the anisotropic conductive film 91 is used to connect the connection pads 20b and the like. Even if covered, the circuit will not short-circuit. According to the present embodiment, it is possible to improve the connection reliability by the bonding wire 22 and the strength against vibration or impact.

[Ninth Embodiment]
As shown in FIG. 14, the camera module 95 of the ninth embodiment uses a bare chip type imaging device 97 having a through electrode 96, and connects the through electrode 96 and the wiring pattern 21 of the substrate 16 to the anisotropic conductive paste 98. Connected by. According to this, it is possible to connect the image sensor 97 and the substrate 16 more firmly than wire bonding.

[Tenth embodiment]
As illustrated in FIG. 15, the camera module 100 according to the tenth embodiment uses an image sensor package 103 in which a bare chip image sensor 102 is accommodated in a package 101, and a wiring pattern between the electrodes 104 of the image sensor package 103 and the substrate 16. 21 is connected by an anisotropic conductive paste 105. According to this, the camera module of the present invention can be configured using an inexpensive image pickup device package 103.

[Eleventh embodiment]
As shown in FIG. 16, in the camera module 110 of the eleventh embodiment, a component built-in substrate 112 in which a plurality of mounted components 111 are embedded is bonded to a case 15, and the imaging element 20 is mounted on the component built-in substrate 112. . According to this, it is possible to increase the number of mounted components without reducing the distance between the imaging element 20 and the photographic lens 39.

  In each said embodiment, although the anisotropic conductive film was used for joining of a case and a board | substrate, you may use anisotropic conductive paste. Further, solder may be used for connection between the case and the substrate. For example, if soldering is performed using a reflow method, it is possible to connect together with the mounted components, thereby improving manufacturing efficiency. In the first to tenth embodiments, the resin substrate is used, but a ceramic substrate may be used. Since less dust comes out of the substrate, image quality deterioration due to dust can be prevented.

10, 60, 65, 70, 75, 80, 85, 90, 95, 100, 110 Camera module 11 Element unit 12 Lens unit 15 Case 16 Substrate 17 Socket connection electrode 20, 61, 97 Image sensor 25 Optical filter 28, 66 Electrode 29, 67 Electrical line 32, 68 Mounting component 35, 78, 91, 98 Anisotropic conductive film 39 Shooting lens 41 VCM
48 connection port 50 FPC
76 Ground shield pattern 81 Rib 96 Through electrode 103 Image sensor package 112 Component built-in substrate

Claims (20)

A case having a top plate and a side plate extending downward from an edge of the top plate, and a circuit pattern made of a conductive material on the inner surface of the top plate and the side plate;
A substrate bonded to the bottom surface of the case and electrically connected to the circuit pattern;
An imaging device mounted on the upper surface of the substrate such that a light receiving portion faces an imaging opening provided in the top plate;
A mounting component mounted on the circuit pattern in a direction facing the surface on which the light receiving portion of the image sensor is provided;
A lens unit having a lens housing attached to the top plate of the case, and a photographic lens that forms a subject image on the light receiving unit through the imaging aperture;
A camera module comprising: a socket for holding the case; and a socket connection electrode that is electrically connected to a terminal in the socket when the case is inserted from the bottom side thereof.   2. The camera module according to claim 1, wherein the mounting component is mounted within a projection area of the imaging element and outside an incident optical path of the photographing lens in a direction orthogonal to the light receiving unit.   The mounting component is mounted on the extended circuit pattern so that the circuit pattern extends to the top surface of the top plate and the mounting component is disposed between the top plate and the lens housing. The camera module according to claim 1 or 2.   The camera module according to claim 1, wherein an optical filter that closes the imaging opening is attached to an upper surface of the top plate.   The camera module according to claim 1, wherein an optical filter that closes the imaging opening is attached to a lower surface of the top plate.   6. The camera module according to claim 1, wherein a ground shield pattern made of a conductive material is provided on an upper surface of the top plate and an outer surface of the side plate.   The camera module according to claim 6, wherein at least a surface of the lens housing has conductivity, and the surface is electrically connected to the ground shield pattern.   The lens unit includes a lens driving actuator that moves the photographing lens in a direction orthogonal to the light receiving unit, and a connection for electrically connecting the mounting component and the lens driving actuator to the case. 8. The camera module according to claim 1, further comprising a port.   The lower surface of the top plate is provided with a frame-shaped rib that surrounds the outer periphery of the imaging aperture outside the effective pixels of the imaging device and whose tip extends to a position close to the upper surface of the imaging device. The camera module according to claim 1.   The camera module according to claim 1, wherein the imaging element is a bare chip having a connection pad, and the connection pad and the wiring pattern of the substrate are electrically connected by wire bonding.   The connection pads provided along at least one side of the image pickup device and the wiring pattern of the substrate are electrically connected by wire bonding so as to face the side of the image pickup device that is not wire bonded. The camera module according to claim 10, wherein the mounting component is mounted.   12. The camera according to claim 10, wherein the bonding wire used for the wire bonding and the connection pad and the wiring pattern of the substrate are covered with an anisotropic conductive film or an anisotropic conductive adhesive. module.   The camera module according to claim 1, wherein the imaging element is a bare chip having a through electrode, and the through electrode and the wiring pattern of the substrate are electrically connected by a conductive connecting material. .   The camera module according to claim 1, wherein the image sensor is an image sensor package in which a bare chip is accommodated in a package, and is electrically connected to the substrate by a conductive connection material.   The camera module according to claim 1, wherein an anisotropic conductive film is used for joining the case and the substrate.   The camera module according to claim 1, wherein an anisotropic conductive adhesive is used for joining the case and the substrate.   15. The camera module according to claim 1, wherein solder is used for joining the case and the substrate.   The camera module according to claim 1, wherein the substrate is a resin substrate.   The camera module according to claim 1, wherein the substrate is a ceramic substrate.   The camera module according to claim 1, wherein the substrate is a component built-in substrate in which a mounting component used for driving or controlling the imaging element is built.

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