KR20110030091A - Camera module - Google Patents

Abstract

PURPOSE: A camera module is provided to reduce the size thereof by being directly ground a shield case to a lateral plane of a substrate. CONSTITUTION: An image sensor is mounted at an upper plane of a substrate(110), and a ground terminal groove(111) is prepared in a lateral plane of the substrate. At a central portion of a housing(120), a barrel insertion hole(121) is formed. A lens barrel(130) is installed at the lens barrel insertion hole and allows the vertical operation thereof. A connection pad(141) is extended from one lower portion of a shield case(140).

Description

Camera module {Camera module}

The present invention relates to a camera module, and more particularly, to a camera module in which the shield case is directly grounded to the side of the substrate to reduce the size of the camera module.

In recent years, portable terminals such as mobile phones and PDAs have a built-in camera, and cameras embedded in such portable terminals use an image sensor such as CCD or CMOS to photograph a subject by light incident through a lens. The photographed image data is recorded on a predetermined recording medium and the image can be output through the display.

Such a portable terminal enables a subject to be photographed by mounting a camera module, and the camera module changes from an initial 300,000 pixels (VGA level) to a center of a high pixel of more than millions of pixels at the same time. Various additional functions such as optical zoom are changing to essential parts.

Recently, a camera module in which autofocus is performed by causing the lens driving unit mounted on the camera module to be driven up and down by an electromagnetic force generated by the interaction of a magnetic field generated by an electromagnet and an electric field generated by a coil is performed. Mainly applied.

As described above, the camera module to which the auto focusing is performed is influenced by the driving of the lens driving unit by the electromagnetic waves generated from the outside of the camera module, that is, the electromagnetic waves generated by the exchange of electrical signals between the other electronic components of the electronic device on which the camera module is mounted. It can be directly received, in order to minimize the electrical impact thereon is provided with a shield case for blocking electromagnetic waves (EMI).

The shield case, which is mainly made of metal, is grounded with the ground terminal of the board to extend the ground to the exterior of the camera module, thereby blocking electromagnetic waves from the outside. To prevent leakage.

Such a shield case is installed at the outermost side of the camera module so that a part of the lower end is connected to the ground terminal of the board, and a terminal formed on the upper surface of the board and a pad extending laterally from the lower end of the shield case are joined by soldering and electrically Connected.

However, the conventional camera module has a problem in that a short defect occurs due to soldering contact between terminals formed on the substrate when the pad of the shield case is bonded to the upper surface of the substrate, and the pad itself protrudes outward from the lower end of the shield case. Since the size of the substrate is inevitably increased, many problems are pointed out in miniaturizing the overall size of the camera module.

Therefore, the present invention was devised to solve the above-mentioned disadvantages and problems in the conventional camera module, and by allowing the lower end of the shield case constituting the exterior of the camera module to be directly grounded to the ground terminal formed on the side of the substrate, An object of the present invention is to provide a camera module that can minimize the overall size of the camera module and simplify the manufacturing process.

The object of the present invention, the image sensor is mounted on the upper surface, the substrate having a ground terminal groove on the side; A housing having a barrel insertion hole provided at a center thereof and mounted to an upper surface of the substrate; Provided is a camera module including a lens barrel mounted to the barrel insertion opening of the housing and a shield case surrounding the outside of the housing, the connection case extending from a portion of the lower end to be connected to the ground terminal groove of the housing; There is an object of the invention.

The substrate may be electrically coupled to an image sensor mounted on an upper surface by wire bonding, and a ground terminal groove may be formed on a portion of the side surface, and the ground terminal groove may be formed on at least one side of the side of the substrate.

In this case, a plating layer using gold (Au) or copper (Cu) is formed on the exposed surface inside the ground terminal groove.

The housing is coupled to the upper front surface of the substrate to be coupled to block the image sensor mounted on the substrate from the outside, and the lens barrel inserted through the barrel insertion hole in the center to the inner surface of the barrel insertion hole to enable the up and down driving. The driving means of the lens barrel is provided.

In addition, the housing may be provided with a shield case coupling hook on the side.

In addition, the lens barrel is driven up and down by the vertical driving force of the driving means in the barrel insertion hole of the housing, the driving means generates the driving force of the lens barrel by applying external power.

In this case, the driving means of the lens barrel may be applied to the VCA method or piezoelectric drive method using an electromagnetic force.

The shield case is mounted to surround the outer circumferential surface of the housing at the top of the substrate, and is closely coupled to the hook and the hook coupling hole formed in the housing. In addition, the shield case is provided with a through hole in which the upper surface of the lens barrel is exposed at the center of the upper surface.

The shield case has a connection pad extending downward to a lower side of the side surface, and the connection pad extends at a position corresponding to a formation position of the ground terminal groove of the substrate and is inserted into the ground terminal groove.

In this case, the connection pad may be electrically connected to the ground terminal groove by injecting a conductive adhesive or by soldering using solder.

As described above, the camera module of the present invention allows the lower end of the shield case constituting the exterior of the camera module to be directly grounded in the ground terminal groove formed on the side of the substrate, thereby facilitating the management of the outer dimensions of the camera module and the overall size. There is an advantage that can be minimized.

In addition, according to the present invention, since the connection part extending to the lower end of the shield case is inserted into the ground terminal groove formed on the side of the board and bonded by soldering, the shield case is completed only by the soldering process that proceeds with the mounting of the shield case. Effects can be exerted to simplify the manufacturing process.

In addition, the appearance of the shield case may be improved through the ground terminal groove formed on the side of the substrate, thereby improving appearance quality. The pads may be blocked by inherently blocking electrical connection between the exposed pad and the shield case for driving the lens barrel. There is an effect that the occurrence of short of the liver can be prevented.

Matters relating to the operational effects including the technical configuration of the camera module according to the present invention will be clearly understood by the following detailed description with reference to the drawings showing preferred embodiments of the present invention.

First, Figure 1 is an assembled perspective view of a camera module according to an embodiment of the present invention, Figure 2 is a perspective view of a camera module according to an embodiment of the present invention, Figure 3 is a camera module according to an embodiment of the present invention 4 is a side perspective view of a part of a camera module according to an embodiment of the present invention.

As shown, the camera module 100 of the present embodiment has a substrate 110 on which an image sensor (not shown) is mounted, a housing 120 coupled to the substrate 110, and an exterior of the housing 120. Wrapping may include a shield case 140 electrically connected to the substrate 110.

The substrate 110 is mounted with an image sensor that receives the light incident from the outside in the center of the upper surface to generate image data, and various electronic components such as a resistor including a driver IC for driving the image sensor are mounted around the image sensor. Can be.

In this case, the image sensor may be electrically connected on the upper surface of the substrate 110 by wire bonding, and may be configured of a CCD or a CMOS to convert light incident into the housing into a digital image signal.

In addition, the substrate 100 includes a plurality of pads and a ground terminal GND on which an image sensor is wire-bonded, and a ground terminal groove 111 electrically connected to the ground terminal on each side thereof. In this case, the ground terminal groove 111 may be formed on at least one or more of the side surfaces formed on all sides of the substrate 110, and may be formed at any point that is easily connected to the ground terminal formed on the substrate 110. have.

The inner wall surface of the ground terminal groove 110 may be formed of a conductive material, ie, gold (Cu) or copper (Cu) plating layer 112, which may be electrically connected to the ground terminal to allow external expansion of the ground. The plating layer 112 may be formed by various plating methods such as electrolytic plating, electroless plating and deposition.

In this case, the ground pad groove 111 may be electrically connected to the connection pad 141 to which the shield case 140 will be described later to extend the role of the ground limited to the upper surface of the substrate 110 to the shield case 140. In addition, when static electricity flows from the outside, the static electricity is sucked and the suctioned static electricity flows to the outside, thereby minimizing the generation of noise due to the static charge when the image sensor is driven.

In addition, the housing 120 is mounted on the upper surface of the substrate 110. The housing 120 is mounted so that the entire surface of the substrate 110 is covered so that the image sensor mounted on the upper surface of the substrate 110 is blocked from the outside, and a cylindrical barrel insertion hole 121 is provided at the center thereof.

In the barrel insertion hole 121, a driving means (not shown) for driving the lens barrel 130 up and down may be mounted around the lens barrel 130, and is driven by a power applied from the substrate 110. By driving the means, the lens barrel 130 is driven up and down, so that auto focusing is performed.

On the other hand, a hook 122 is further provided on the outer circumferential surface of the housing 120 to closely couple the shield case 140.

At this time, the lens barrel 130 is driven up and down by the driving means, the driving means may be applied to the VCA method or the piezo (pizzo) driving method using an electromagnetic force, the piezo drive method The silver driving means may be electrically connected to the substrate 110 through the flexible printed circuit board (FPCB).

The lens barrel 130 may have one or more lenses L stacked therein, and light reflected from an external subject is introduced into the lens barrel through the lens L to an image sensor mounted on an upper surface of the substrate 110. It is received.

At this time, although not shown in the drawings, the lens barrel 130 may be assembled into a focus adjustment type and a focus adjustment type, in the case of the focus adjustment type, the housing 120 and the lens barrel 130 are integrally formed. The lens L in the image sensor and the lens barrel 130 may be formed at a predetermined interval, and in the case of the focus adjustment type, the driving means as described above may be further provided.

On the other hand, the shield case 140 is coupled to the upper portion of the substrate 110 to surround the outer peripheral surface of the housing 120 is formed in a structure surrounding the four sides and the upper surface of the housing 120 as a whole, the lens barrel 130 in the center of the upper surface The through hole 142 is provided to expose the upper surface of the.

In addition, a hook coupling hole 143 is provided at a lower side of an arbitrary side of the shield case 140 so that the hook 122 and the hook coupling hole 142 formed at the housing 120 when the outer peripheral surface is coupled to the housing 120 are fastened to the housing. 120 may be tightly coupled to the outer peripheral surface.

In addition, the shield case 140 has a connection pad 141 extending downward from a random point at each lower end of the shield case 140. The connection pad 141 serves to electrically connect the substrate 110 and the shield case 140, and is electrically connected to the ground terminal groove 111 formed on the side surface of the substrate 110.

That is, the connection pad 141 is formed at a point corresponding to the formation point of the ground terminal groove 111 provided on the side surface of the substrate 110, so that the connection pad 141 is coupled to the housing 120 of the shield case 140. ) Is positioned in the ground terminal groove 111 of the substrate 110.

As described above, the connection pad 141 extending downward from the shield case 140 is located in the ground terminal groove 111 without protruding to the outside of the substrate 110, thereby minimizing the overall size of the camera module 100. In addition, the appearance quality can be improved, and the outer dimension can be easily managed.

In this case, a conductive adhesive or solder may be injected between the spaces in which the connection pad 141 is inserted into the ground terminal groove 111, and the substrate 110 may be electrically connected to the ground terminal groove 111 by the connection pad 141. ) May be extended to the shield case 140.

Therefore, the shield case 140 may be electrically connected to the ground pad groove 111 to effectively block the electrostatic charges generated from the inside of the camera module to radiate to the outside or from devices and components adjacent to the camera module.

In addition, as the conductive adhesive or solder injected into the ground terminal groove 111 is injected into the connection pad 141 vertically extended from the shield case 140, electrical connection with other pads of the substrate 111 is prevented and short. The occurrence can be blocked at source.

Preferred embodiments of the present invention described above are disclosed for the purpose of illustration, and various substitutions, modifications, and changes within the scope without departing from the spirit of the present invention for those skilled in the art to which the present invention belongs. It will be possible, but such substitutions, changes and the like should be regarded as belonging to the following claims.

1 is an assembled perspective view of a camera module according to an embodiment of the present invention.

2 is a perspective view of a camera module according to an embodiment of the present invention.

3 is a side view of the camera module according to an embodiment of the present invention.

4 is a bottom perspective view of a portion of the camera module according to an embodiment of the present invention.

Description of the Related Art [0002]

100. Camera Module 110. Board

120. Housing 130. Lens Barrel

140. Shield case 141. Connecting member

Claims (8)

A substrate having an image sensor mounted on an upper surface thereof and a ground terminal groove provided on a side thereof; A housing having a barrel insertion hole provided at a center thereof and mounted to an upper surface of the substrate; A lens barrel mounted vertically to the barrel insertion hole of the housing; And A shield case surrounding the outside of the housing and having a connection pad extending from a portion of the lower end portion to be connected to the ground terminal groove of the housing; Camera module comprising a. The method of claim 1, The substrate is a camera module, the ground terminal groove is formed in at least one side portion of each side of each side. The method of claim 2, The ground terminal groove is a camera module formed with a plating layer using gold (Au) or copper (Cu) inside. The method of claim 1, The housing is a camera module, the drive means is installed on the inner surface of the barrel insertion port so that the lens barrel inserted through the barrel insertion port can be vertically driven. The method of claim 4, wherein The housing, the shield case coupling hook is provided on the side The method of claim 1, The shield case is provided with a hook coupling hole in the lower portion is tightly coupled through the hook formed in the housing, the camera module is provided with a through hole in which the upper surface of the lens barrel is exposed in the center of the upper surface. 7. The method according to claim 1 or 6, The connection pads are formed to extend directly below the shield case lower end of the position corresponding to the position of the ground terminal groove of the substrate. The method of claim 1, The connection pad is a camera module electrically connected through a conductive adhesive or solder injected into the ground terminal groove.

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