KR100813599B1 - Camera module using a circuit board builted-in integrated circuit - Google Patents

Abstract

The present invention relates to a camera module using a chip embedded substrate.

The present invention provides a substrate having a groove formed in a central portion of an upper surface thereof, a pad surface formed at equal intervals on each side thereof, and having a loop forming the pad surface and the stepped portion, an electronic component mounted inside the groove of the substrate, and An image sensor module formed in the groove and having an image sensor wire bonded to the substrate; A housing coupled to the image sensor module; And a lens barrel having a plurality of lenses stacked therein and coupled to an upper end of the housing. The lens module includes a groove formed in the lower substrate of the image sensor, and includes a chip-shaped electronic component and a manual groove in the groove. By mounting the devices, the area occupied by the camera module can be reduced.

Chip embedded, FPCB, camera module, image sensor module, passive element

Description

CAMERA MODULE USING A CIRCUIT BOARD BUILTED-IN INTEGRATED CIRCUIT}

1 is a perspective view of a substrate mounted to a camera module according to the prior art.

Figure 2 is a perspective view showing a substrate of the camera module according to the present invention.

Figure 3 is a bottom perspective view showing a substrate of the camera module according to the present invention.

4 is an assembled perspective view of the camera module according to the present invention.

5 is a cross-sectional view showing an assembly state of the camera module according to the present invention.

<Description of Symbols for Major Parts of Drawings>

210: substrate 220: passive element

230: chip-shaped electronic component 240: image sensor

250: IR filter 260: housing

270 lens barrel

The present invention relates to a camera module using a chip-embedded substrate, and more particularly, a camera module capable of reducing the size of the camera module on which the substrate is mounted by mounting a passive element or an electronic component in a chip form on a substrate under the image sensor. It is about.

Currently, portable terminals such as mobile phones and PDAs are being used not only for simple phone functions but also for multi-convergence of music, movies, TVs, games, etc., as one of leading the development of such multi-convergence. The camera module is the most representative. The camera module is changing from the existing 300,000 pixels (VGA level) to the high pixel center of 8 million pixels, and at the same time, it is changing to a device capable of implementing various additional functions such as auto focusing (AF) and optical zoom.

Such a camera module is manufactured by an image sensor mounting method such as COB (CHIP ON BOARD), COF (CHIP ON FLEXIBLE), COG (CHIP ON GLASS), and a socket and flexible printing on a main board mounted inside the portable terminal. It is coupled in electrical connection via a circuit board.

In particular, the camera module of the COB type is mainly coupled to the main board mounted in the form of a plate in the main body of the portable terminal by the socket type, the camera module into the socket attached to the electrical connection to any point of the main board By mounting the housing and the printed circuit board of the camera module is mounted on the main board.

In addition, according to the trend of miniaturization and slimming of the mobile phone, the size of the main board mounted in the mobile phone is inevitably reduced, which limits the parts that can be mounted on the main board.

Accordingly, as the components are mounted in the camera module, the size of the image sensor attached to the upper surface of the printed circuit board of the camera module is recently increased as the camera module is reorganized around a high pixel and functional elements are added accordingly. As the size of the overall camera module is increased and the miniaturization is continually pursued, the number of components mounted on the printed circuit board is further limited.

Therefore, it is pointed out that the limitation of the size of the printed circuit board is limited as the mounting space of components on the printed circuit board of the camera module is limited.

Referring to Figure 1 shown below with respect to the conventional camera module that can cause such a problem briefly described as follows.

1 is a perspective view of a substrate mounted to a camera module according to the prior art.

As shown in the drawing, on the printed circuit board 110 having a housing (not shown) mounted thereon, an image sensor 120 for capturing an image and a chip which is an essential component for the image sensor 120 to operate. The electronic component 140 and the passive element 150 of the type are mounted around the image sensor 120.

Here, the image sensor 120 is electrically connected to the printed circuit board 110 through a wire (130), the electronic component 140 and the passive element 150 of the chip form is the printed circuit board By soldering to (110), it is electrically connected to the image sensor 120.

In this case, a lens barrel equipped with a housing and a plurality of lenses are sequentially coupled to the image sensor 120, the chip-shaped electronic component 140, and the printed circuit board 110 on which the passive element 150 is mounted. It is composed of a module, as the camera module is developed to a high pixel center, the size of the image sensor 120 is inevitably increased, the adhesive space of the housing is reduced, there is a disadvantage that the assembly reliability of the housing is lowered.

Accordingly, the size of the printed circuit board 110 for mounting the electronic component 140 and the passive element 150 in the form of a chip mounted around the image sensor 120 is relatively large. There was a problem that the overall size increases.

Accordingly, the present invention has been made to solve the problems raised in the conventional camera module, by forming a groove in the lower substrate of the image sensor, by mounting the chip-shaped electronic components and passive elements inside the groove, An object of the present invention is to provide a camera module that can be reduced in size, thereby reducing the size of the camera module on which the substrate is mounted.

The object of the present invention is an image sensor module comprising a substrate having a groove formed in the upper center portion, an electronic component mounted inside the groove of the substrate, and an image sensor covered in the groove of the substrate and wire-bonded with the substrate; ; A housing coupled to the image sensor module; And a lens barrel having a plurality of lenses stacked therein and coupled to an upper end of the housing.

In addition, in the camera module using a chip embedded substrate according to the present invention, the electronic component is characterized by consisting of a passive element or an active element in the form of an IC chip.

The substrate has a pad surface formed at equal intervals on each side surface, and a loop forming the pad surface and the stepped portion.

In addition, the groove of the substrate is characterized in that it is formed the same or deeper than the height of the electronic component mounted in the groove.

According to the present invention of the technical configuration, a passive element and an electronic component in the form of a chip are mounted in a groove formed in the substrate, and an image sensor is mounted on the groove to reduce the size of the substrate and space of the substrate. The technical feature is that the efficiency of use can be maximized.

Matters relating to the operational effects including the technical configuration for the above object of the camera module using the chip embedded substrate according to the present invention will be clearly understood by the following detailed description with reference to the drawings showing preferred embodiments of the present invention.

First, Figure 2 is a perspective view showing a substrate of the camera module according to the invention, Figure 3 is a bottom perspective view showing a substrate of the camera module according to the invention, Figure 4 is an assembled perspective view of the camera module according to the invention, Figure 5 Is a cross-sectional view showing an assembled state of the camera module according to the present invention.

As shown, the substrate 210 of the camera module according to the present invention is cut into a rectangular plate shape is formed with a groove 214 of a predetermined depth at the center of the upper end, a plurality of pads 211 at equal intervals on the side ) Is formed.

In particular, the passive element 220 and the chip-shaped electronic component 230 are mounted in the groove 214 formed on the top of the substrate 210. In this case, the passive element 220 and the electronic component 230 in the form of a chip are soldered and electrically connected to the inside of the groove 214 of the substrate 210, and the depth of the groove 214 is the passive element ( 220 and the height of the electronic component 230 in the form of a chip, or preferably have a depth that can be completely embedded.

The reason for this is that an image sensor, which will be described later, is mounted on the top of the groove 214 of the substrate 210. The depth of the groove 214 is lower than the height of the passive element 220 and the electronic component 230 in the form of a chip. In other words, since they are mounted higher than the top surface of the substrate 210, the image sensor cannot be mounted on the groove 214. Accordingly, the depth of the groove 214 is preferably equal to the height of the passive element 220 and the electronic component 230 in the form of a chip, or have a depth in which they can be completely embedded.

In this case, the electronic component 230 in the form of a chip is an active element in the form of an IC chip such as a gyro sensor IC, an angular velocity sensor, a signal processing element, and the like, and is a semiconductor device for controlling the image sensor. The device 220 is an electronic component that operates together with the electronic component 230 in the form of a chip such as a resistor, a coil, a capacitor, and the like.

As such, the passive element 220 and the chip-shaped electronic component 230, which are conventionally mounted on the substrate 210, are mounted in the groove 214 of the substrate 210, thereby forming the upper portion of the substrate 210. The area occupied by the passive element 220 and the electronic component 230 in the form of a chip can be reduced.

In addition, since the passive element 220 is mounted at an adjacent position of the image sensor to be mounted on the substrate 210, that is, directly below, it is possible to minimize the generation of noise that may occur during the operation of the image sensor. Accordingly, there is an advantage that the image sensor can perform a normal operation.

Meanwhile, a loop 213 forming a pad surface and a stepped portion is formed at an upper side of each pad 211 formed at a side surface of the substrate 210. At this time, the pad 211 is preferably made of a metal material for the electrical connection between the main board (not shown), such as a mobile phone and the substrate 210.

In addition, the substrate 210 is bonded by an adhesive such as a UV curing agent to a socket (not shown) for coupling to a main board such as a mobile phone, in which case the adhesive may flow somewhat into the pad 211. As the inflow into the pad surface is primarily blocked by the loop 213 on the upper portion of the pad 211, damage to the pad 211 by the adhesive flowing through the loop 213 can be reliably prevented.

As shown in FIG. 3, the pad 211 is formed of a lower pad 212 extending to a lower portion of the substrate 210 and thus may be more easily connected to the outside. That is, the lower pad 212 formed at the bottom of the substrate 210, when the pad 211 on the side surface of the substrate 210 is inevitably contaminated, uses the lower pad 212 extended to the lower surface of the lower pad 212. The connection can be made easily.

In addition, an upper pad 215 is formed at an upper edge of the substrate 210 to electrically connect the image sensor to the substrate 210 using wire bonding.

In the substrate 210 of the camera module having such a configuration, a plurality of passive elements 220 and a chip-shaped electronic component 230 are mounted in the groove 214 formed therein, and reflected from an external subject. An image sensor 240 for detecting a light to be applied is mounted to cover the upper front surface thereof, and is electrically connected by wire bonding through an upper pad 215 formed on an upper side of the substrate 210. The substrate 210 and the image sensor 210 are electrically connected to each other to constitute one image sensor module 250.

In addition, a housing 260 is coupled to an upper edge of the substrate 210 of the image sensor module 250, and an upper end of the housing 260 includes a lens barrel 270 having a plurality of lenses L stacked therein. Is coupled to the housing 260.

In the camera module assembled as described above, as illustrated in FIG. 5, the image sensor 240 is mounted on the substrate 210 in which the passive element 220 and the electronic component 230 in a chip form are embedded. In this case, the image sensor 240 is wire-bonded and electrically connected through the substrate 210 and the upper pad 215, and the upper edge of the substrate 210 is coupled to the housing 260. An IR filter 262 is mounted at an arbitrary point inside the housing 260, and the IR filter 262 blocks infrared rays of incident light incident through the lens L of the lens barrel 270.

In addition, the housing 260 is coupled to the lens barrel 270 is equipped with a plurality of lenses (L), the light reflected from the external subject flows through the lens (L) mounted on the substrate 210 The light is received by the sensor 240.

The camera module having such a configuration includes the passive element 220 and the chip-shaped electronic component 230 mounted on the substrate 210 of the camera module in the groove 214 formed at the center of the upper portion of the substrate 210. By mounting, the space occupied by the passive element 220 and the chip-shaped electronic component 230 in a main board such as a mobile phone can be reduced.

Accordingly, since the size of the substrate 210 of the camera module can be reduced, the size of the camera module provided with the substrate 210 can be reduced.

Preferred embodiments of the present invention described above are disclosed for the purpose of illustration, and various substitutions, modifications, and changes within the scope without departing from the spirit of the present invention for those skilled in the art to which the present invention pertains. It will be possible, but such substitutions, changes and the like should be regarded as belonging to the following claims.

As described above, the camera module using the chip-embedded substrate according to the present invention forms a groove in the lower substrate of the image sensor, and the chip-shaped electronic components and passive elements are mounted in the groove, thereby increasing the size of the substrate. At the same time, space efficiency can be maximized and the overall size of the camera module can be reduced.

Claims (4)

A groove is formed in the center of the upper surface, and the pad surface is formed on each side at equal intervals, and the substrate is formed with a loop forming the pad surface and the stepped portion, an electronic component mounted in the groove of the substrate, and the groove of the substrate is covered. An image sensor module comprising an image sensor coupled to the substrate by wire bonding; A housing coupled to the image sensor module; And A plurality of lenses stacked therein, the lens barrel being coupled to an upper end of the housing; Camera module comprising a. delete The method of claim 1, The electronic component is a camera module, characterized in that composed of passive elements or active elements in the form of IC chips. The method of claim 1, The groove of the substrate, the camera module, characterized in that formed in the same or deeper than the height of the electronic component mounted therein.

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