KR101058657B1 - Camera module - Google Patents

Abstract

The present invention relates to a camera module, comprising: a first substrate; An image sensor mounted on the first substrate and provided with a light receiving unit; A second substrate mounted on the first substrate and accommodating the image sensor and electrically connected to the image sensor; A housing mounted on an upper portion of the second substrate; And a lens barrel coupled to the housing.

Camera Module, Ceramic Board, Rigid Board, Opening

Description

Camera module {Camera module}

The present invention relates to a camera module, and more particularly, to a camera module having a first substrate on which an image sensor is mounted and a second substrate on which an image sensor is received and electrically connected to the image sensor.

Nowadays, portable terminals such as mobile phones and PDAs are being used as a multi-convergence with music, movies, TV, and games as well as simple telephone functions with the development of the technology. The camera module is the most representative.

The camera module is changing from the existing 300,000 pixels (VGA level) to the center of the high pixel, and is being changed to implement various additional functions such as auto focusing (AF) and optical zoom.

In general, a compact camera module (CCM) is a small size, and is applied to various IT devices such as a camera phone, a PDA, a smart phone, and a portable mobile communication device. The market is gradually increasing the number of devices equipped with camera modules.

A typical camera module is composed of a lens barrel in which a plurality of lens groups are stacked, a housing into which the lens barrel is inserted, and a sequential coupling of a substrate coupled to a lower portion of the housing and mounted with an image sensor.

However, the camera module configured as described above has a problem in that the overall module size is increased due to an additional space such as a space for mounting the image sensor on the upper surface of the substrate and an installation space for wires for connecting the image sensor and the substrate.

Accordingly, the present invention is to solve the various disadvantages and problems raised in the camera module, by having a first substrate on which the image sensor is mounted and a second substrate accommodated by the image sensor and electrically connected to the image sensor, The purpose is to provide a camera module that can minimize the overall size and height of the module.

The present invention for achieving the above object is a first substrate; An image sensor mounted on the first substrate and provided with a light receiving unit; A second substrate mounted on the first substrate and accommodating the image sensor and electrically connected to the image sensor; A housing mounted on an upper portion of the second substrate; It is an object of the present invention to provide a camera module comprising; and a lens barrel coupled to the housing.

In this case, the second substrate may include a first opening exposing the light receiving unit of the image sensor and a second opening exposing the bonding pad of the image sensor.

In addition, both ends of the second substrate and the image sensor may be electrically connected to the upper surface of the second substrate and the upper surface of the image sensor by a wire passing through the second opening.

The first substrate may be a rigid substrate, and the second substrate may be a ceramic substrate.

In addition, a plurality of connection pads may be provided on an upper surface of the first substrate.

The second substrate may have a plurality of connection holes formed at positions corresponding to the connection pads, and the connection holes may include side pads electrically connected to the connection pads.

The first substrate and the second substrate may be electrically connected to each other by a conductive adhesive applied to a bonding interface between the connection pad and the side pad.

In addition, an infrared blocking member covering the first opening may be further included on the second substrate.

In addition, a plurality of passive elements may be mounted on the second substrate.

As described above, the camera module according to the present invention includes a first substrate on which the image sensor is mounted and a first opening for accommodating the image sensor to expose the light receiving unit of the image sensor, and a bonding pad of the image sensor. By providing the second substrate, the overall size and height of the camera module can be minimized to increase the degree of freedom in designing other components, thereby preventing mechanical and circuit interference.

In addition, since the second substrate and the image sensor are wire-bonded through the second opening, the height of the camera module can be further lowered.

In addition, the infrared blocking member is provided on the upper surface of the second substrate, thereby covering the first opening, thereby preventing foreign substances from entering the image sensor light receiving unit.

Details regarding the operational effects including the technical configuration of the camera module according to the present invention will be clearly understood by the following detailed description with reference to the drawings in which preferred embodiments of the present invention are shown.

1 to 3 will be described in detail with respect to the camera module according to an embodiment of the present invention.

1 is an exploded perspective view of a camera module according to an embodiment of the present invention, Figure 2 is a cross-sectional view according to the embodiment of the present invention, Figure 3 is an enlarged view of the first substrate and the second substrate employed in the embodiment of the present invention It is a cross section.

1 to 3, the camera module 100 according to the embodiment of the present invention includes a first substrate 110, a second substrate 130 mounted on the first substrate 110, It may include a housing 150 and a lens barrel 160.

The first substrate 110 is composed of a rigid substrate, the image sensor 120 is mounted on the upper surface. Conductive circuit patterns electrically connected to each other are formed in the first substrate 110, and a plurality of connection pads 113 are provided on an upper surface thereof. The connection pad 113 is connected to the side pad 133 provided on the side of the second substrate 130, so that the first substrate 110 and the second substrate 130 may be electrically connected to each other. have. This will be described later in detail.

The image sensor 120 is made of a CCD or a CMOS, and the light receiving unit 123 is provided on the upper surface of the image sensor 120 in a predetermined width. The light receiver 123 collects light incident through the lens barrel 160 to generate an image signal. The image signal generated by the light receiver 123 is sent to an external device electrically connected through the first substrate and the second substrate 130 and displayed as an image.

In this case, the electrical connection between the image sensor 120 and the second substrate 130 is provided on the bonding pad 124 provided on one side of the light receiving unit 123 of the image sensor 120 and the upper surface of the second substrate. Connected pads (not shown) may be made by wire bonding. The connection method thereof will be described in detail later.

The second substrate 130 is formed of a ceramic substrate and is mounted on the first substrate 110. In this case, an accommodation space 136 for accommodating the image sensor is provided inside the second substrate 130 so that the image is mounted when the second substrate 130 is mounted on the first substrate 110. The sensor 120 may be inserted into the second substrate 130. The size and height of the accommodation space 136 may be formed in consideration of the size and height of the image sensor 120.

As such, the image sensor 120 is inserted into the second substrate 130, thereby reducing the overall size and height of the camera module 100.

A plurality of connection holes 131 are formed on a side surface of the second substrate 130 at a position corresponding to the connection pad 113 provided on the first substrate 110, and a side surface of the connection hole 131 is formed. The pad 133 is provided.

In this case, the electrical connection between the first substrate 110 and the second substrate 130 may be made by a conductive adhesive 170 applied to the bonding interface of the connection pad 113 and the side pad 133. . The conductive adhesive 170 may be made of solder.

In addition, a first opening 135 through which the light receiving unit 123 of the image sensor 120 is exposed is formed at the center of the second substrate 130. In this case, the size of the first opening 135 may be formed in consideration of the size of the light receiving unit 123 of the image sensor 120.

Both sides of the first opening 135 are provided with second openings 157 exposing the bonding pads 124 of the image sensor 120. The second opening 157 is formed to pass through a wire 139 for electrical connection between the second substrate 130 and the image sensor 120.

The wires 139 may connect both ends of the connection pads provided on the upper surface of the second substrate 130 and the bonding pads 124 provided on the image sensor 120 through the second opening 137. Bonding serves to electrically connect the second substrate 130 and the image sensor 120 with each other.

As such, the second substrate 130 and the image sensor 120 are wire-bonded through the second opening 137 to further lower the height of the camera module 100.

A plurality of passive elements 138 may be mounted on an upper surface of the second substrate 130, that is, an area where the first opening 135 and the second opening 137 are not provided.

The passive element 138 refers to various components such as a resistor and a capacitor mounted to drive the image sensor 120. The passive element 138 is formed on the second substrate 130 through a conductive material. Can be mounted.

The infrared blocking member 140 may be further provided on the second substrate 130 configured as described above. At this time, the infrared blocking member 140 is composed of an IR filter or an IR film in the form of a glass with an infrared blocking layer formed on one surface, and is attached to the upper surface of the second substrate 130 by UV adhesive or thermosetting bond.

The infrared blocking member 140 serves to block infrared rays from the light incident through the lens L in the lens barrel 160. In addition, the infrared ray blocking member 140 covers the first opening 135 of the second substrate 130 to prevent foreign substances from entering the image sensor 120 inserted therein.

The housing 150 is mounted on an upper surface of the second substrate 130. In addition, a through hole 153 is provided at an upper portion of the housing 150, and the cylindrical lens barrel 160 may be coupled through the through hole 153.

The lens barrel 160 is configured by stacking and combining a plurality of lenses L including an aspherical lens L therein, and light reflected from an external subject is introduced through the lens L, thereby allowing the image sensor ( 120).

When the housing 150 and the lens barrel 160 are vertically coupled as described above, a focusing process for focusing the camera module 100 is performed by rotating the lens barrel 160 about an optical axis. That is, the lens barrel 160 is rotated to the left and right in the upper portion of the housing 150 to be optimal by adjusting the distance between the image sensor 120 and the lens L provided at the lower end of the housing 150. To adjust the focus.

In addition, an adhesive member (not shown) may be further provided between the inner circumferential surface of the housing 150 and the clearance of the outer circumferential surface of the lens barrel 160.

At this time, the adhesive member may be injected along the edge portion is formed spaced apart from the UV curable resin that reacts to the UV irradiation. However, in the present embodiment is not limited to the material of the adhesive member, for example, the adhesive member may be made of a thermosetting resin.

The camera module 100 in the state where the housing 150 and the lens barrel 160 are temporarily bonded is transferred to a UV curing furnace, and the UV curing resin is cured in the UV curing furnace to cure the housing 150 and the lens. When the barrel 160 is fixed, the manufacturing of the camera module 100 may be completed.

Although the preferred embodiments of the present invention described above have been described in detail, those skilled in the art will understand that various modifications and equivalent other embodiments are possible therefrom.

Accordingly, the scope of the present invention should not be limited to the disclosed embodiments but should be regarded as belonging to various modifications and improvements of those skilled in the art using the basic concept of the present invention as defined in the following claims, or the scope of the present invention. .

1 is an exploded perspective view of a camera module according to an embodiment of the present invention.

2 is a cross-sectional view according to an embodiment of the present invention.

3 is an enlarged cross-sectional view of the first substrate and the second substrate employed in the embodiment of the present invention.

<Explanation of Signs of Major Parts of Drawings>

100: camera module 110: first substrate

120: image sensor 130: second substrate

135: first opening 137: second opening

140: infrared ray blocking member 150: housing

160: lens barrel

Claims (10)

A first substrate; An image sensor mounted on the first substrate and provided with a light receiving unit; A second substrate mounted on the first substrate and accommodating the image sensor and electrically connected to the image sensor; A housing mounted on an upper portion of the second substrate; And It includes a lens barrel coupled to the housing, The second substrate has a first opening for exposing a light receiving unit of the image sensor and a second opening for exposing a bonding pad of the image sensor. delete The method of claim 1, The second substrate and the image sensor, the camera module is electrically connected to both ends of the upper surface of the second substrate and the bonding pad of the image sensor by a wire passing through the second opening. The method of claim 1, And the first substrate is a rigid substrate. The method of claim 1, The second substrate is a camera module. The method of claim 1, A camera module having a plurality of connection pads on the upper surface of the first substrate. The method of claim 6, A plurality of connection holes are formed on a side surface of the second substrate corresponding to the connection pads, and the connection holes are provided with side pads electrically connected to the connection pads. The method of claim 7, wherein And the first substrate and the second substrate are electrically connected to each other by a conductive adhesive applied to a bonding interface between the connection pad and the side pad. The method of claim 1, The camera module further comprises an infrared ray blocking member covering the first opening on the second substrate. The method of claim 1, The camera module is mounted on the second substrate a plurality of passive elements.

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