JP2011035458A5 - - Google Patents
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- JP2011035458A5 JP2011035458A5 JP2009176807A JP2009176807A JP2011035458A5 JP 2011035458 A5 JP2011035458 A5 JP 2011035458A5 JP 2009176807 A JP2009176807 A JP 2009176807A JP 2009176807 A JP2009176807 A JP 2009176807A JP 2011035458 A5 JP2011035458 A5 JP 2011035458A5
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- JP
- Japan
- Prior art keywords
- top plate
- case
- light receiving
- circuit pattern
- image sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Description
本発明のカメラモジュールは、天板と天板の端縁から下方に延ばされた側板とを有し、天板及び側板の内面に導電性材料からなる回路パターンが設けられたケースと、ケースの底面に接合されて回路パターンと電気的に接続された基板と、天板に設けられた撮像開口に受光部が対面するように前記基板の上面に実装された撮像素子と、ケースの天板に取り付けられたレンズ筐体及び撮像開口を通して受光部に被写体像を結像する撮影レンズとを有するレンズユニットと、撮像素子の受光部に直交する方向における投影面積内でかつ撮影レンズの入射光路外に配置されるように天板の回路パターンに実装された実装部品と、ケースを保持するためのソケットにケースがその底面側から挿入されたときにソケット内の端子と電気的に接続するソケット接続電極とを備えている。 The camera module of the present invention includes a top plate and a side plate extending downward from an edge of the top plate, and a case in which a circuit pattern made of a conductive material is provided on the inner surface of the top plate and the side plate, and the case of a substrate is bonded is connected circuit pattern electrically to the bottom surface, and an imaging element mounted on the upper surface of the substrate so as to face the light receiving unit in the imaging opening provided in the top plate, the to case A lens unit having a lens housing attached to the top plate and a photographing lens for forming a subject image on the light receiving portion through the image pickup opening , and within a projection area in a direction orthogonal to the light receiving portion of the image pickup device and incident on the photographing lens When the case is inserted into the socket for holding the case and the mounting part mounted on the circuit pattern of the top plate so as to be placed outside the optical path , the terminal in the socket is electrically connected. Salmon And a preparative connection electrode.
撮像素子の受光部に直交する方向における投影面積には、基板に撮像素子を電気的に接続するための配線の投影面積が含まれていることが好ましい。 The projected area in the direction orthogonal to the light receiving portion of the image sensor preferably includes the projected area of the wiring for electrically connecting the image sensor to the substrate .
Claims (2)
前記ケースの底面に接合され、前記回路パターンと電気的に接続された基板と、
前記天板に設けられた撮像開口に受光部が対面するように前記基板の上面に実装された撮像素子と、
前記ケースの天板に取り付けられたレンズ筐体と、前記撮像開口を通して前記受光部に被写体像を結像する撮影レンズとを有するレンズユニットと、
前記撮像素子の前記受光部に直交する方向における投影面積内で、かつ前記撮影レンズの入射光路外に配置されるように、前記天板の回路パターンに実装された実装部品と、
前記ケースを保持するためのソケットに前記ケースがその底面側から挿入されたときに、前記ソケット内の端子と電気的に接続するソケット接続電極とを備えたことを特徴とするカメラモジュール。 A case having a top plate and a side plate extending downward from an edge of the top plate, and a circuit pattern made of a conductive material on the inner surface of the top plate and the side plate;
A substrate bonded to the bottom surface of the case and electrically connected to the circuit pattern;
An imaging device mounted on the upper surface of the substrate such that a light receiving portion faces an imaging opening provided in the top plate;
A lens unit having a lens housing attached to the top plate of the case, and a photographic lens that forms a subject image on the light receiving unit through the imaging aperture;
A mounting component mounted on the circuit pattern of the top plate so as to be disposed within a projected area in a direction orthogonal to the light receiving portion of the image sensor and outside the incident optical path of the photographing lens;
A camera module comprising: a socket for holding the case; and a socket connection electrode that is electrically connected to a terminal in the socket when the case is inserted from the bottom side thereof.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009176807A JP5277105B2 (en) | 2009-07-29 | 2009-07-29 | The camera module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009176807A JP5277105B2 (en) | 2009-07-29 | 2009-07-29 | The camera module |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011035458A JP2011035458A (en) | 2011-02-17 |
| JP2011035458A5 true JP2011035458A5 (en) | 2012-03-08 |
| JP5277105B2 JP5277105B2 (en) | 2013-08-28 |
Family
ID=43764131
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009176807A Active JP5277105B2 (en) | 2009-07-29 | 2009-07-29 | The camera module |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5277105B2 (en) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102033171B1 (en) * | 2012-06-22 | 2019-10-16 | 엘지이노텍 주식회사 | Camera Module |
| KR101983014B1 (en) * | 2012-09-28 | 2019-05-28 | 엘지이노텍 주식회사 | Camera module |
| JP5797182B2 (en) * | 2012-11-14 | 2015-10-21 | 台湾東電化股▲ふん▼有限公司 | Matched substrate structure to prevent camera shake |
| JP5904957B2 (en) * | 2013-02-28 | 2016-04-20 | キヤノン株式会社 | Electronic components and electronic equipment. |
| JP2014170893A (en) | 2013-03-05 | 2014-09-18 | Taiyo Yuden Co Ltd | Camera module |
| JP6034725B2 (en) | 2013-03-05 | 2016-11-30 | 太陽誘電株式会社 | The camera module |
| KR102055840B1 (en) | 2014-02-20 | 2019-12-17 | 삼성전자 주식회사 | Image sensor package |
| KR101814546B1 (en) * | 2014-09-19 | 2018-01-04 | 쿄세라 코포레이션 | Substrate for mounting electronic element, and electronic device |
| KR20180093963A (en) * | 2015-12-01 | 2018-08-22 | 닝보 써니 오포테크 코., 엘티디. | An imaging module and its electrical support |
| EP3419275A4 (en) | 2016-02-18 | 2019-12-18 | Ningbo Sunny Opotech Co., Ltd. | Integral packaging process-based camera module, integral base component of same, and manufacturing method therefor |
| JP6865232B2 (en) * | 2016-04-28 | 2021-04-28 | ▲寧▼波舜宇光▲電▼信息有限公司 | Imaging modules, their molding photosensitive assemblies, semi-finished products of molding photosensitive assemblies, their manufacturing methods, and electronic devices. |
| JP6677595B2 (en) * | 2016-07-11 | 2020-04-08 | 京セラ株式会社 | Electronic element mounting substrate, electronic device, and electronic module |
| KR20230020308A (en) * | 2021-08-03 | 2023-02-10 | 엘지이노텍 주식회사 | Camera module |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH104510A (en) * | 1996-06-17 | 1998-01-06 | Sony Corp | Camera |
| JP2003060180A (en) * | 2001-08-16 | 2003-02-28 | Shinko Electric Ind Co Ltd | Semiconductor device |
| JP3923780B2 (en) * | 2001-10-31 | 2007-06-06 | シチズンミヨタ株式会社 | Compact solid-state imaging device and manufacturing method thereof |
| JP2003209332A (en) * | 2002-01-11 | 2003-07-25 | Fujikura Ltd | Printed wiring board, manufacturing method thereof and mounting board |
| JP2005051535A (en) * | 2003-07-29 | 2005-02-24 | Mitsubishi Electric Corp | Imaging apparatus and manufacturing method therefor |
| JP2005086100A (en) * | 2003-09-10 | 2005-03-31 | Fuji Photo Film Co Ltd | Solid state imaging apparatus |
| JP2005094105A (en) * | 2003-09-12 | 2005-04-07 | Olympus Corp | Imaging apparatus |
| KR100724885B1 (en) * | 2005-03-23 | 2007-06-04 | 삼성전자주식회사 | Camera lens module |
| JP4950542B2 (en) * | 2006-04-07 | 2012-06-13 | 岩手東芝エレクトロニクス株式会社 | Solid-state imaging device and manufacturing method thereof |
| JP4413956B2 (en) * | 2007-08-21 | 2010-02-10 | 新光電気工業株式会社 | Camera module and portable terminal |
| JP2009060380A (en) * | 2007-08-31 | 2009-03-19 | Alps Electric Co Ltd | Camera module |
-
2009
- 2009-07-29 JP JP2009176807A patent/JP5277105B2/en active Active
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