JP2004172436A - Imaging device package, camera module, and camera - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an imaging device package, camera module, and camera suitable for mass production whose height can be reduced, capable of dealing with waste problem. <P>SOLUTION: A gold bump 4 is so fused on the bottom surface of an imaging device housing part 5a of a ceramic package 5 that each land of an imaging device 2 comes to each land position corresponding to the ceramic package 5, thereby electrically connecting patterns for the imaging device and mounting the imaging device 2 in a form of bare chip. A land is packed with an underfill agent while a glass 9 is mounted on a through hole 5b for packing a sealing agent 8, thus sealing up the through hole 5b for housing a light receiving part 3. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an image sensor package used for a portable communication device such as a mobile phone, a portable information terminal such as a PDA, a digital camera, and the like, a camera module and a camera using the package.
[0002]
[Prior art]
There is a demand for further miniaturization of a built-in camera module used for a mobile phone. The current camera module is miniaturized by using a method in which a bare chip is directly mounted on a substrate.
FIG. 5 is a cross-sectional view and a partial plan view showing a conventional example of the image sensor package.
The ceramic package 35 has an image sensor housing 35a having a step structure, and an image sensor (bare chip) 32 is provided at the bottom of the image sensor housing 35a. A light receiving portion 33 is arranged at the center of the image pickup device 32, and a gold land 40b is formed at the tip of each pattern 40a which is electrically connected to the light receiving portion 33 and drawn out around.
[0003]
A gold land 40c is formed on the step portion 35b of the imaging element housing portion 35a, and the gold land 40c is connected to a solder land 36 formed on the side surface of the ceramic package 35 by a pattern 40d. The gold lands 40b and 40c are electrically connected by wire bonding 41.
Glass 39 is mounted on the ceramic package 35, and the image pickup element housing 35 a is sealed by the sealant 38.
[0004]
6A and 6B show an example of a conventional camera module. FIG. 6A is a sectional view and FIG. 6B is an exploded perspective view.
In this example, the size is reduced by directly attaching a bare chip to a substrate.
A resistor R and a capacitor C are arranged on the right upper surface of the ceramic substrate 43, and a DSP (IC) 44 is arranged on the left lower surface. A through hole 43a is provided in the center left of the ceramic substrate 43.
[0005]
An image sensor (bare chip) 46 having an image area 45 is mounted on the lower surface of the ceramic substrate 43 so as to face the through hole 43a. Further, a lens unit 42 is attached to the upper surface of the ceramic substrate 43 so as to cover the through hole 43a, and a camera module is configured.
This camera module structure can be downsized in the height direction. However, since the bare chip is directly attached to the ceramic substrate, when the lens unit 42 is mounted, measures are taken to prevent dust from entering the image area 45. Must be given.
[Patent Document] Japanese Patent Application No. 2002-188942
[Problems to be solved by the invention]
In the former configuration (FIG. 5), a packaged image sensor by a wire bonding method is mounted on a substrate. Therefore, it is possible to secure the reliability of mounting on a substrate while taking measures against dust. There is a disadvantage that the dimensions of the camera module in the vertical and horizontal directions and the height direction are increased in order to secure a space for wire bonding.
Although the latter (FIG. 6) camera module can be downsized, when the number of pixels of the image sensor increases, it takes time to take measures against dust and the mass productivity cannot be improved. There is a disadvantage that the price is greatly affected by the increase or decrease in the number of pixels.
[0007]
SUMMARY OF THE INVENTION An object of the present invention is to provide an image sensor package capable of realizing miniaturization in the height direction and taking measures against dust to secure mass productivity, a camera module and a camera using the package.
[0008]
[Means for Solving the Problems]
In order to achieve the above object, an image sensor package according to the present invention includes a base having a through hole, and an image sensor in which a light receiving unit is mounted on one surface of the base at a position facing the through hole. A light-transmitting plate disposed so as to cover the through hole from the other surface of the base, and configured to seal the light receiving unit.
In the present invention, at least one or more solder lands reaching the one surface and the other surface are provided on the side surface of the base.
According to a second aspect of the present invention, there is provided a semiconductor device according to the second aspect, comprising: a groove that reaches the one surface and the other surface disposed on the side surface of the base; and the solder land that is disposed in the groove.
According to the present invention, in the first to third aspects, the base is made of ceramic, and a passive element such as a resistor or a capacitor is arranged in the ceramic.
Further, a camera module according to the present invention is a camera module provided with the imaging package according to any one of claims 1 to 4, wherein the substrate having a through-hole and the light-transmitting plate is provided on one surface of the substrate. The image pickup device package is provided to be accommodated in the hole, and the lens is provided on the other surface of the substrate so as to cover the through hole.
Further, a camera according to the present invention is provided with a camera module according to claim 5.
[0009]
[Action]
According to the above configuration, a compact and sealed image pickup device package can be realized, and a camera module that can be mass-produced by taking measures against dust can be realized.
[0010]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
1A and 1B are diagrams showing an embodiment of an image sensor package according to the present invention, wherein FIG. 1A is a cross-sectional view of the image sensor package, FIG. 1B is a plan view of the image sensor, and FIG. is there.
A ceramic package 5 is used as a package base. The ceramic package 5 has an imaging element housing 5a, and a through hole 5b is provided at the center thereof. A large number of solder lands 6 extending from the center of the side surface to the upper surface are provided on the side surface of the ceramic package 5.
[0011]
The image sensor (bare chip) 2 has a light receiving section 3 disposed at the center thereof, and a land 10b is formed at the tip of each pattern 10a connected to the light receiving section 3 and drawn out. The gold bump 4 is mounted on the land 10b.
On the other hand, lands 5c are provided at positions corresponding to the lands 10b of the image sensor 2 on the bottom surface of the image sensor housing 5a. Each pattern 5d connected to the land 5c is connected to each solder land 6 provided on the side surface of the ceramic package 5.
[0012]
To mount the image sensor 2 on the bottom surface of the image sensor accommodating portion 5a of the ceramic package 5, the lands 10b of the image sensor 2 are aligned with the corresponding lands 5c of the ceramic package 5 and gold bumps are formed. 4 is melted. The patterns are electrically connected to each other, and the image sensor 2 is fixed to the ceramic package 5. Thereafter, the land portion is filled with an underfill agent (or another sealing agent) 7, whereby the space between the imaging element 2 and the lower end surface of the through hole 5b can be sealed.
[0013]
After mounting the imaging device 5, the glass 9 is mounted on the through-hole 5b of the ceramic package 5 and filled with the sealing agent 8, thereby sealing the gap between the glass 9 and the upper end surface of the through-hole 5b, and 3 can be completely sealed. The through-hole 5b only needs to accommodate the light receiving section 3 alone, and the size of the through-hole can be reduced. Therefore, the glass size can be made smaller than that of the conventional image sensor package, and the cost can be reduced.
[0014]
FIG. 2A is a cross-sectional view showing another embodiment of the present invention.
This embodiment differs from FIG. 1 in the internal structure of the ceramic package and the shape of the solder lands on the side surfaces, and the other components are the same.
A resistor 20 and a capacitor 21 are formed inside the ceramic package 15, and a place where these passive elements are arranged can be set in the ceramic package, so that the mounting density of the elements can be increased.
The solder lands 16 provided on the side surfaces of the ceramic package 15 have a rectangular shape extending from the upper surface to the lower surface of the ceramic package 15.
With such a shape of the solder land 16, the image pickup device package 11 can be attached to both the upper surface and the lower surface of a substrate used for forming a camera module described later.
[0015]
FIG. 2B is a cross-sectional view illustrating still another embodiment of the present invention, and is a diagram illustrating a ceramic multilayer substrate on which an image pickup device is mounted on a bare chip.
This drawing omits glass and solder lands, and LTCC or HTCC is used for the ceramic multilayer substrate 15-1. FIG. 2A is different from FIG. 2A in the arrangement of passive elements formed inside the ceramic multilayer substrate, and the other configuration is the same.
A capacitor 21-1 is formed in a layer near the upper surface of the ceramic multilayer substrate 15-1, and a resistor 20-1 is formed in a layer below the capacitor 21-1.
[0016]
FIG. 3 is a perspective view showing the appearance of the image sensor package according to the present invention.
Glass 28 is attached to the center of the upper surface of the ceramic package 30 with a sealant. Three solder lands 29 are provided on each side surface of the ceramic package 30. The solder land 29 is formed in a long groove 31 provided from the upper surface to the lower surface of the ceramic package 30.
[0017]
4A and 4B are views showing an embodiment of a camera module using an imaging package according to the present invention, wherein FIG. 4A is a sectional view and FIG. 4B is an exploded perspective view.
A resistor R and a capacitor C are mounted on the right upper surface of the ceramic substrate 26, and a DSP (IC) 24 is mounted on the lower left surface, respectively. A through hole 26a is provided on the left side of the center of the ceramic substrate 26.
The image sensor package 27 is arranged on the lower surface of the substrate 26 so that the glass 28 is accommodated in the through hole 26a, and a pattern land (not shown) on the lower surface of the substrate 26 and a solder land 29 are attached by soldering. The lens unit 22 is mounted on the upper surface of the ceramic substrate 26 so as to cover the through-hole 26a, thereby forming a camera module.
Since the image sensor package 27 is sealed, dust does not enter the image sensor when attached to the substrate 26, mass productivity can be ensured, and downsizing can be realized.
[0018]
Next, a camera using the camera module of FIG. 4 will be described.
Any of a digital camera, a vehicle-mounted camera, a computer camera, a surveillance camera, and a door horn camera can incorporate the camera module as a camera.
In the case of configuring a digital camera, a control unit that mounts a lens unit of a camera module on the front of the camera body, which is a lens position, and has a control circuit that performs image processing on a flexible substrate electrically connected to a substrate on which the lens unit is mounted is mounted. Connect to circuit board. The subject image formed on the image pickup device package through the lens unit is subjected to electrical conversion and predetermined processing, and then sent to the control circuit. The control circuit temporarily stores the sent image data, converts the image data into a predetermined format, and displays it on the liquid crystal display. The subject image is captured according to the shutter release and stored in the memory.
[0019]
As described above, by mounting the image sensor directly on the package base by flip chip (FC), the size of the image sensor package can be reduced. The entire package can be downsized by the amount of the conventional wire bonding (W / B).
By sealing the through-hole with the cover glass on the upper surface and the image sensor on the lower surface facing each other, the image sensor package can be treated as a single part with dust measures taken, eliminating the need for dust measures in the camera module manufacturing process. It becomes.
The solder land of the image sensor package can be electrically connected and mounted regardless of whether the pattern exists on the upper surface or the lower surface of the substrate. The size of the camera module in the direction can be reduced, and the overall size of the camera module can be reduced.
[0020]
The camera module according to the present invention can be suitably used for a portable communication device such as a mobile phone and an information terminal device such as a PDA, and can also be used for a digital camera, a vehicle-mounted camera, a board camera for a computer, a surveillance camera and a door horn camera. Is also possible.
[0021]
【The invention's effect】
According to the present invention, the size of the image sensor package can be reduced. Further, downsizing of the camera module and the camera can be realized.
[Brief description of the drawings]
FIG. 1 is a diagram showing an embodiment of an image sensor package according to the present invention, wherein (a) is a cross-sectional view of the image sensor package, (b) is a plan view of the image sensor, and (c) is a bottom view of the ceramic package. is there.
FIG. 2A is a cross-sectional view showing another embodiment of the present invention.
FIG. 2B is a cross-sectional view showing still another embodiment of the present invention, and is a diagram showing a ceramic multilayer substrate on which an image sensor is mounted on a bare chip.
FIG. 3 is a perspective view showing an appearance of an image sensor package according to the present invention.
4A and 4B are diagrams showing an embodiment of a camera module using an imaging package according to the present invention, wherein FIG. 4A is a sectional view and FIG. 4B is an exploded perspective view.
FIG. 5 is a sectional view and a partial plan view showing a conventional example of an image sensor package.
6A and 6B are views showing an example of a conventional camera module, wherein FIG. 6A is a cross-sectional view and FIG. 6B is an exploded perspective view.
[Explanation of symbols]
1,11,27 Image sensor package 2,12 Image sensor 3,13 Light receiver 4,14 Bump (gold bump)
5,15,30 Ceramic package 6,16,29 Solder land 7,17 Underfill agent (sealing agent)
8, 18 Sealant 9, 19, 28 Glass 20 Resistor 21 Capacitor 22 Lens unit 23 Solder 24 DSP (Digital Signal Processor)
25 Flexible substrate 26 Substrate

Claims (6)

A base having a through hole,
An image sensor mounted at a position where the light receiving unit faces the through hole on one surface of the base,
A light-transmitting plate arranged to cover the through-hole from the other surface of the base,
An image sensor package, wherein the light receiving unit is sealed. The image pickup device package according to claim 1, wherein at least one or more solder lands reaching the one surface and the other surface are provided on a side surface of the base. A groove reaching the one surface and the other surface disposed on the side surface of the base;
The image pickup device package according to claim 2, further comprising the solder land disposed in the groove. 4. The image pickup device package according to claim 1, wherein the base is made of ceramic, and a passive element such as a resistor or a capacitor is arranged in the ceramic. A camera module comprising the imaging package according to claim 1, wherein:
A substrate having a through hole;
The imaging device package, wherein the light-transmitting plate is arranged on one surface of the substrate so as to be accommodated in the through-hole,
A camera module comprising: a lens disposed on the other surface of the substrate so as to cover the through hole. A camera comprising the camera module according to claim 5.

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