CN112888150B - Circuit board, display device and wearable device - Google Patents
Circuit board, display device and wearable device Download PDFInfo
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- CN112888150B CN112888150B CN202110038607.9A CN202110038607A CN112888150B CN 112888150 B CN112888150 B CN 112888150B CN 202110038607 A CN202110038607 A CN 202110038607A CN 112888150 B CN112888150 B CN 112888150B
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- hole structure
- layer
- circuit board
- ambient light
- light sensor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
Abstract
The invention provides a circuit board, a display device and a wearable device, and relates to the technical field of circuits. The circuit board comprises a substrate layer and a first hole structure, wherein the substrate layer is provided with the first hole structure; the first wiring layer is arranged on the base material layer, and is provided with a second hole structure which is positioned in the first hole structure; the ambient light sensor comprises a photosensitive surface, and contact pins around the photosensitive surface are arranged in the second hole structure and are connected with the first wiring layer. In the invention, the first hole structure forms a space for accommodating the second hole structure, and the second hole structure forms a space for accommodating the contact pin of the ambient light sensor, so that the first wiring layer and the ambient light sensor can be connected in the first hole structure. Because the contact pin of the ambient light sensor can be inserted into the second hole structure, no gap exists between the ambient light sensor main body and the first wiring layer, the reinforcing glue around the ambient light sensor can be prevented from flowing into the photosensitive surface, and the photosensitive performance of the ambient light sensor is prevented from being reduced or losing efficacy.
Description
Technical Field
The invention relates to the technical field of circuits, in particular to a circuit board, a display device and a wearable device.
Background
An Ambient Light Sensor (ALS) can automatically adjust the screen brightness according to the intensity of Ambient Light, and many display devices include the ALS.
In the current technology, the bonding pad of the ambient light sensor and the routing layer on the flexible circuit board are usually soldered together by soldering tin, so as to achieve the functions of conducting current and fixing the ambient light sensor. In the direction perpendicular to the flexible circuit board, the height of the soldering tin enables a gap to exist between the ambient light sensor and the surface of the flexible circuit board. Generally, the periphery of the ambient light sensor is fixed by dispensing, the glue has strong fluidity, and a part of the glue flows onto the photosensitive surface of the ambient light sensor through the gap between the ambient light sensor and the surface of the flexible circuit board, so that the photosensitive performance of the ambient light sensor is reduced or the ambient light sensor fails.
Disclosure of Invention
The invention provides a circuit board, a display device and a wearable device, and aims to solve the problem that glue around an ambient light sensor easily flows into a photosensitive surface of the ambient light sensor through a gap between the ambient light sensor and the surface of the circuit board due to the existence of the gap between the ambient light sensor and the surface of the circuit board, so that the photosensitive performance of the ambient light sensor is reduced or fails.
In order to solve the above problems, the present invention discloses a circuit board, comprising:
the substrate layer is provided with a first hole structure;
the first routing layer is arranged on the substrate layer, a second hole structure is arranged on the first routing layer, and the second hole structure is positioned in the first hole structure;
the environment light sensor comprises a photosensitive surface, wherein contact pins are arranged around the photosensitive surface, are arranged in the second hole structure and are connected with the first wiring layer.
Optionally, the first hole structure is a through hole structure, the circuit board further includes a first insulating layer, and the substrate layer is disposed on the first insulating layer.
Optionally, the first hole structure is a blind hole structure, the circuit board further includes a second routing layer and a first insulating layer, the substrate layer is disposed on the second routing layer, and the second routing layer is disposed on the first insulating layer.
Optionally, the height of the first pore structure in a direction perpendicular to the substrate layer is greater than or equal to 12.5 microns, less than or equal to 50 microns.
Optionally, the first pore structure has an inner diameter greater than or equal to 1.2 millimeters and less than or equal to 1.5 millimeters in a direction parallel to the substrate layer.
Optionally, the second pore structure has an inner diameter greater than or equal to 0.9 millimeters and less than or equal to 1.2 millimeters in a direction parallel to the substrate layer.
Optionally, the outer diameter of the contact pin in a direction parallel to the substrate layer is greater than or equal to 0.4 mm and less than or equal to 0.6 mm.
Optionally, a solder or a conductive adhesive is disposed between the contact pin and the second hole structure, and the contact pin is connected to the first trace layer through the solder or the conductive adhesive.
Optionally, in a direction parallel to the substrate layer, a distance between the contact pin and the second hole structure is greater than or equal to 0.1 mm, and less than or equal to 0.5 mm.
In order to solve the problems, the invention also discloses a display device which comprises the circuit board.
In order to solve the problem, the invention also discloses a wearable device which comprises the display device.
Compared with the prior art, the invention has the following advantages:
in the embodiment of the invention, the first hole structure on the substrate layer forms a space for accommodating the second hole structure on the first wiring layer, and the second hole structure forms a space for accommodating the contact pin of the ambient light sensor, so that the first wiring layer and the ambient light sensor can be connected in the first hole structure. Because the contact pin of the ambient light sensor can be inserted into the second hole structure on the first routing layer, no gap exists between the ambient light sensor main body and the first routing layer, so that the reinforcing glue around the ambient light sensor can be prevented from flowing into the photosensitive surface of the ambient light sensor, and the photosensitive performance of the ambient light sensor is prevented from being reduced or losing efficacy.
Drawings
FIG. 1 is a top view of a prior art ambient light sensor mounted on a circuit board;
FIG. 2 illustrates a cross-sectional view of a prior art ambient light sensor mounted on a circuit board;
fig. 3 shows a cross-sectional view of a circuit board according to a first embodiment of the invention;
fig. 4 is a partial structural view of a circuit board according to a first embodiment of the present invention;
fig. 5 is another partial structural view of the circuit board according to the first embodiment of the present invention;
fig. 6 shows another cross-sectional view of a circuit board of the first embodiment of the invention;
fig. 7 shows a further cross-sectional view of a circuit board according to a first embodiment of the invention;
fig. 8 shows a further cross-sectional view of a circuit board according to a first embodiment of the invention;
fig. 9 shows a partial schematic view of a circuit board according to a first embodiment of the invention;
FIG. 10 is a schematic diagram of soldering or gluing contact pins of an ambient light sensor according to a first embodiment of the invention;
fig. 11 shows a schematic diagram of an installed ambient light sensor according to a first embodiment of the invention.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in further detail below.
Before describing an embodiment of the present invention in detail, a conventional ambient light sensor (hereinafter referred to as an ALS device) and its mounting on a flexible circuit board (hereinafter referred to as an FPC) will be described.
Fig. 1 is a plan view showing a conventional ALS device mounted on an FPC, and referring to fig. 1, a is an FPC main body, 30 is an ALS device, b is a pad of the ALS device, and c is a trace of the FPC. Typically, trace c is connected to ALS device 30 through pad b.
Referring to fig. 2, 10 is a substrate layer of the FPC, 20 is a first routing layer of the FPC, 30 is an ALS device of the FPC, 31 is a light sensing surface of the ALS device, and the ALS device 30 receives the ambient light L through the light sensing surface 31. 40 is a first insulation layer of the FPC, 50 is a second wiring layer of the FPC, 60 is a first electromagnetic shielding layer of the FPC, 70 is a second insulation layer of the FPC, 80 is a second electromagnetic shielding layer of the FPC, and 02 is solder resist ink. The first electromagnetic shielding layer 60, the first insulating layer 40, the second routing layer 50, the substrate layer 10, the first routing layer 20, the second insulating layer 70, and the second electromagnetic shielding layer 80 are sequentially stacked.
The ALS device 30 is a larger device than a resistor, a capacitor, and the like on the FPC, and therefore, a dispensing is usually performed around the ALS device 30, that is, the reinforcing adhesive 01 is provided, and the reinforcing adhesive 01 has a reinforcing and waterproof function.
In the current process, the pad b and the trace c of the FPC are usually soldered together by the solder 03, and referring to fig. 2, in the direction perpendicular to the FPC, the height of the solder 03 causes a gap to exist between the ALS device 30 and the surface of the FPC, the fluidity of the reinforcement paste 01 is strong, a part of the reinforcement paste 01 flows onto the photosensitive surface 31 of the ALS device 30 through the gap, and the paste overflow direction S is as shown in fig. 2, thereby causing the photosensitive performance of the ALS device 30 to be reduced or to fail.
In summary, the circuit board, the display device and the wearable device in the embodiments of the present invention are provided for the existing circuit board provided with the ambient light sensor, so as to solve the problem that the existing ambient light sensor has a gap with the surface of the circuit board due to the solder, so that the glue around the ambient light sensor easily flows into the photosensitive surface of the ambient light sensor through the gap, and the photosensitive performance of the ambient light sensor is reduced or fails.
Example one
Fig. 3 shows a cross-sectional view of a circuit board according to a first embodiment of the present invention, fig. 4 shows a partial structure diagram of the circuit board according to the first embodiment of the present invention, fig. 5 shows another partial structure diagram of the circuit board according to the first embodiment of the present invention, in an embodiment of the present invention, the circuit board may specifically be a flexible circuit board, and referring to fig. 3, the circuit board includes:
a substrate layer 10, as shown in fig. 4, a first hole structure 11 is disposed on the substrate layer 10;
the first routing layer 20 is arranged on the substrate layer 10, and as shown in fig. 5, a second hole structure 21 is arranged on the first routing layer 20, and the second hole structure 21 is located in the first hole structure 11;
the ambient light sensor 30 includes a light sensing surface 31, a contact pin 32 is disposed around the light sensing surface 31, and the contact pin 32 is disposed in the second hole structure 21 and connected to the first wiring layer 20.
The substrate layer 10 may be made of PI (polyimide) material. First routing layer 20 may be made of a metal material such as copper, and may be used to connect various electrical devices. The photosensitive surface 31 of the ambient light sensor 30 may be used to receive ambient light. In practical applications, the contact pin 31 of the ambient light sensor 30 is used to connect with the first routing layer 20, and the contact pin 31 may be a separate structure disposed on a pad of the ambient light sensor 30, or may be a modified structure of the pad, which is not limited in this embodiment of the present invention.
In the embodiment of the present invention, the first hole structure 11 on the substrate layer 10 forms a space for accommodating the second hole structure 21 on the first wiring layer 20, and the second hole structure 21 forms a space for accommodating the contact pin 32 of the ambient light sensor 30, so that the first wiring layer 20 and the ambient light sensor 30 can be connected in the first hole structure 11. Referring to fig. 3, since the contact pins 32 of the ambient light sensor 30 can be inserted into the second hole structures 21 on the first wiring layer 20, there is no gap between the body of the ambient light sensor 30 and the first wiring layer 20, so that the reinforcement paste 01 around the ambient light sensor 30 can be prevented from flowing onto the photosensitive surface 31, and the photosensitive performance of the ambient light sensor 30 is prevented from being reduced or deteriorated.
Referring to fig. 3, in an alternative implementation, the first hole structure 11 is a through hole structure, the circuit board further includes a first insulating layer 40, and the substrate layer 10 is disposed on the first insulating layer 40.
The first insulating layer 40 may also be referred to as a cover layer or a cover film (CVL).
A typical circuit board, as shown in fig. 1, has a double-layer routing structure, that is, two routing layers, and in the case that the first hole structure 11 is a through hole structure, if the circuit board includes two routing layers, the first routing layer 20 will be conducted with the second routing layer 50 through the first hole structure 11, and since the second routing layer 50 that is not connected to a device is usually grounded, the circuit board will have a short circuit problem due to conduction of the two routing layers. Therefore, when the first hole structure 11 is a through hole structure, the substrate layer 10 can be directly disposed on the first insulating layer 40, that is, the second wiring layer 50 can be eliminated between the substrate layer 10 and the first insulating layer 40, so that a short circuit of the circuit board can be avoided, and the thickness of the circuit board can be reduced.
Referring to fig. 6, in another alternative implementation, the first hole structure 11 is a blind hole structure, the circuit board further includes a second routing layer 50 and a first insulating layer 40, the substrate layer 10 is disposed on the second routing layer 50, and the second routing layer 50 is disposed on the first insulating layer 40.
Under the condition that first hole structure 11 is the blind hole structure, if the circuit board includes two routing layers, then first routing layer 20 can not switch on with second routing layer 50 through first hole structure 11, consequently, the circuit board can not appear the short circuit problem because of switching on of two routing layers. Therefore, when the first hole structure 11 is a blind hole structure, the circuit board may further include a second routing layer 50, the substrate layer 10 may be disposed on the second routing layer 50, and the second routing layer 50 may be disposed on the first insulating layer 40, that is, the routing layer between the substrate layer 10 and the first insulating layer 40 may be reserved, so that the present invention may be implemented by using an existing circuit board, so that the ambient light sensor arrangement mode in the embodiment of the present invention is not limited to a circuit board with a single-layer routing, and the versatility of the ambient light sensor arrangement mode in the embodiment of the present invention is improved.
Of course, referring to fig. 7, in another alternative implementation, in the case that the first hole structure 11 is a blind hole structure, only the first routing layer 20 may be left, the second routing layer 50 is eliminated, that is, the first hole structure 11 is a blind hole structure, and the substrate layer 10 is disposed on the first insulating layer 40.
Referring to fig. 8, in yet another alternative implementation, the first hole structure 11 is a through hole structure, and the second hole structure 21 is a blind hole structure, in which case, the substrate layer 10 needs to be directly disposed on the first insulating layer 40 to avoid a short circuit phenomenon.
In practical applications, the second hole structure 21 may be a through hole structure, as shown in fig. 3, 6 and 7. Of course, the second hole structure 21 may also be a blind hole structure, as shown in fig. 8.
In the embodiment of the present invention, in a case where the circuit board is a single-layer trace, that is, the circuit board includes the first trace layer 20 but does not include the second trace layer 50, the first hole structure 11 may be any one of a through hole structure and a blind via structure, and similarly, the second hole structure 21 may also be any one of a through hole structure and a blind via structure. In the case that the circuit board is a dual-layer trace, that is, the circuit board includes the first trace layer 20 and the second trace layer 50, in order to avoid the dual-layer trace conducting, the first hole structure 11 may be only a blind hole structure, and the second hole structure 21 may be any one of a through hole structure and a blind hole structure.
Furthermore, as shown in fig. 3, 6, 7 and 8, the circuit board may further include a first electromagnetic shielding layer 60, a second insulating layer 70 and a second electromagnetic shielding layer 80, wherein the second insulating layer 70 is disposed on the first wiring layer 20, and the second electromagnetic shielding layer 80 is disposed on the second insulating layer 70. In case the circuit board comprises the first routing layer 20 but not the second routing layer 50, the first insulating layer 40 is arranged on the first electromagnetic shield layer 60. In case of a circuit board comprising a first routing layer 20 and a second routing layer 50, a first insulating layer 40 is provided on the first electromagnetic shield layer 60 and the second routing layer 50 is provided on the first insulating layer 40.
Further, the circuit board may further include solder resist ink 02, and the solder resist ink 02 may be coated on a portion of the first routing layer 20 where the second insulating layer 70 and the second electromagnetic shielding layer 80 are exposed, so as to protect the first routing layer 20 and prevent conduction.
In the direction perpendicular to the substrate layer 10, the height of the contact pin 32 is less than or equal to the height of the second hole structure 21, so that the contact pin 32 can be completely inserted into the second hole structure 21, and the main body of the ambient light sensor 30 can be overlapped on the first wiring layer 20, and thus, there is no gap between the ambient light sensor 30 and the first wiring layer 20, and the reinforcement adhesive 01 can be prevented from flowing into the gap between the ambient light sensor 30 and the first wiring layer 20.
Optionally, the height of the first pore structure 11 in a direction perpendicular to the substrate layer 10 is greater than or equal to 12.5 micrometers, less than or equal to 50 micrometers.
Alternatively, referring to fig. 9, the inner diameter B of the first pore structure 21 is greater than or equal to 1.2 mm, and less than or equal to 1.5 mm in a direction parallel to the substrate layer 10. The first hole structure 21 may be a circular hole, a rectangular hole, an elliptical hole, and the like, which is not particularly limited in this embodiment of the present invention.
Alternatively, referring to fig. 9, the inner diameter C of the second pore structure 21 is greater than or equal to 0.9 mm, and less than or equal to 1.2 mm in a direction parallel to the substrate layer 10. The shape of the periphery of the second hole structure 21 is related to the shape of the inside of the first hole structure 21, and the shape of the inside of the second hole structure 21 may be circular, rectangular, oval, and the like, which is not particularly limited in the embodiment of the present invention.
Alternatively, referring to fig. 9, the outer diameter D of the contact pin 32 is greater than or equal to 0.4 mm and less than or equal to 0.6 mm in a direction parallel to the substrate layer 10.
Alternatively, referring to fig. 3, 6, 7 and 8, solder 03 or conductive paste 04 is disposed between the contact pin 32 and the second hole structure 21, and the contact pin 32 is connected to the first wiring layer 20 through the solder 03 or the conductive paste 04.
Alternatively, referring to fig. 9, the distance E between the contact pin 32 and the second hole structure 21 in a direction parallel to the substrate layer 10 is greater than or equal to 0.1 mm, and less than or equal to 0.5 mm. Since solder 03 or conductive paste 04 needs to be provided between contact pin 32 and second hole structure 21, a certain distance needs to be left between contact pin 32 and second hole structure 21.
Referring to fig. 10, the ambient light sensor 30 may be fixed and conducted to the first routing layer 20 by soldering 03 or applying a conductive paste 04 around the contact pins 32 of the ambient light sensor 30 by a soldering or paste applying apparatus M. The contact pins 32 of the ambient light sensor 30 may then be inserted into the second hole structure 21, thereby enabling the mounting of the ambient light sensor 30, as shown in fig. 11.
In addition, referring to fig. 9, F is an overflow width of the reinforcement adhesive 01 in a direction parallel to the substrate layer 10, and F is greater than or equal to 0.5 mm and less than or equal to 1 mm. G is a distance between an edge of the ambient light sensor 30 and a lowest portion of a slope of the first routing layer 20 in a direction parallel to the substrate layer 10, the distance G mainly takes assembly tolerance of the ambient light sensor 30 into consideration, and G may be greater than or equal to 0.2 mm and less than or equal to 0.4 mm.
In addition, in a direction perpendicular to the substrate layer 10, the thickness of the substrate layer 10 is greater than or equal to 12.5 micrometers and less than or equal to 50 micrometers, the thicknesses of the first routing layer 20 and the second routing layer 50 are greater than or equal to 10 micrometers and less than or equal to 20 micrometers, the thicknesses of the first insulating layer 40 and the second insulating layer 70 are greater than or equal to 20 micrometers and less than or equal to 30 micrometers, and the thicknesses of the first electromagnetic shielding layer 60 and the second electromagnetic shielding layer 80 are greater than or equal to 5 micrometers and less than or equal to 15 micrometers.
In the embodiment of the invention, the first hole structure on the substrate layer forms a space for accommodating the second hole structure on the first wiring layer, and the second hole structure forms a space for accommodating the contact pin of the ambient light sensor, so that the first wiring layer and the ambient light sensor can be connected in the first hole structure. Because the contact pin of the ambient light sensor can be inserted into the second hole structure on the first routing layer, no gap exists between the ambient light sensor main body and the first routing layer, so that the reinforcing glue around the ambient light sensor can be prevented from flowing into the photosensitive surface of the ambient light sensor, and the photosensitive performance of the ambient light sensor is prevented from being reduced or losing efficacy.
Example two
The embodiment of the invention also discloses a display device which comprises the circuit board.
In the embodiment of the invention, the first hole structure on the circuit board substrate layer forms a space for accommodating the second hole structure on the first wiring layer, and the second hole structure forms a space for accommodating the contact pin of the ambient light sensor, so that the first wiring layer and the ambient light sensor can be connected in the first hole structure. Because the contact pin of the ambient light sensor can be inserted into the second hole structure on the first routing layer, no gap exists between the ambient light sensor main body and the first routing layer, so that the reinforcing glue around the ambient light sensor can be prevented from flowing into the photosensitive surface of the ambient light sensor, and the photosensitive performance of the ambient light sensor is prevented from being reduced or losing efficacy.
EXAMPLE III
The embodiment of the invention also discloses a wearable device which comprises the display device.
The wearable device is, for example, a wearable watch, a wearable bracelet, and the like, and the embodiment of the invention is not limited thereto.
In the embodiment of the invention, the first hole structure on the substrate layer of the display device circuit board forms a space for accommodating the second hole structure on the first wiring layer, and the second hole structure forms a space for accommodating the contact pin of the ambient light sensor, so that the first wiring layer and the ambient light sensor can be connected in the first hole structure. Because the contact pin of the ambient light sensor can be inserted into the second hole structure on the first routing layer, no gap exists between the ambient light sensor main body and the first routing layer, so that the reinforcing glue around the ambient light sensor can be prevented from flowing into the photosensitive surface of the ambient light sensor, and the photosensitive performance of the ambient light sensor is prevented from being reduced or losing efficacy.
While, for purposes of simplicity of explanation, the foregoing method embodiments have been described as a series of acts or combination of acts, it will be appreciated by those skilled in the art that the present invention is not limited by the illustrated ordering of acts, as some steps may occur in other orders or concurrently with other steps in accordance with the invention. Further, those skilled in the art will appreciate that the embodiments described in this specification are presently preferred and that no acts or modules are required by the invention.
The embodiments in the present specification are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.
Finally, it should also be noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
The circuit board, the display device and the wearable device provided by the invention are described in detail, specific examples are applied in the description to explain the principle and the implementation mode of the invention, and the description of the embodiments is only used for helping to understand the method and the core idea of the invention; meanwhile, for a person skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention.
Claims (11)
1. A circuit board, comprising:
the substrate layer is provided with a first hole structure;
the first routing layer is arranged on the substrate layer, a second hole structure is arranged on the first routing layer, and the second hole structure is positioned in the first hole structure;
the ambient light sensor comprises a photosensitive surface, contact pins are arranged around the photosensitive surface, and the contact pins are arranged in the second hole structure and are connected with the first wiring layer;
one side of the first routing layer, which is close to the photosensitive surface, is contacted with the ambient light sensor;
one side of the substrate layer, which is close to the photosensitive surface, is in contact with the ambient light sensor.
2. The circuit board of claim 1, wherein the first hole structure is a through-hole structure, the circuit board further comprising a first insulating layer, the substrate layer being disposed on the first insulating layer.
3. The circuit board of claim 1, wherein the first via structure is a blind via structure, the circuit board further comprising a second routing layer and a first insulating layer, the substrate layer being disposed on the second routing layer, the second routing layer being disposed on the first insulating layer.
4. The circuit board of claim 1, wherein the first hole structure has a height greater than or equal to 12.5 microns and less than or equal to 50 microns in a direction perpendicular to the substrate layer.
5. The circuit board of claim 1, wherein the first hole structure has an inner diameter greater than or equal to 1.2 mm and less than or equal to 1.5 mm in a direction parallel to the substrate layer.
6. The circuit board of claim 1, wherein the second hole structure has an inner diameter greater than or equal to 0.9 mm and less than or equal to 1.2 mm in a direction parallel to the substrate layer.
7. The circuit board of claim 1, wherein the outer diameter of the contact pin is greater than or equal to 0.4 mm and less than or equal to 0.6 mm in a direction parallel to the substrate layer.
8. The circuit board of claim 1, wherein a solder or a conductive adhesive is disposed between the contact pin and the second hole structure, and the contact pin is connected to the first trace layer through the solder or the conductive adhesive.
9. The circuit board of claim 8, wherein a distance between the contact pin and the second hole structure in a direction parallel to the substrate layer is greater than or equal to 0.1 mm and less than or equal to 0.5 mm.
10. A display device comprising the circuit board according to any one of claims 1 to 9.
11. A wearable device comprising the display device of claim 10.
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Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55124251A (en) * | 1979-03-20 | 1980-09-25 | Matsushita Electric Ind Co Ltd | Method of fabricating package |
| JPH0843843A (en) * | 1994-07-26 | 1996-02-16 | Mitsubishi Electric Corp | Liquid crystal display device and its production |
| JP2004172436A (en) * | 2002-11-21 | 2004-06-17 | Kyocera Corp | Imaging device package, camera module, and camera |
| CN2807476Y (en) * | 2005-04-14 | 2006-08-16 | 菱生精密工业股份有限公司 | Glue overflow preventing construction of package carrying plate used for integrated circuit |
| DE102009002196A1 (en) * | 2009-04-06 | 2010-10-14 | Robert Bosch Gmbh | Optoelectronic device for e.g. mobile phone, has free space emission units for emission of light beams in different space directions arranged on optical conductor plate and optically coupled with light conductors of conductor plate |
| TW201535548A (en) * | 2014-03-12 | 2015-09-16 | Unimicron Technology Corp | Embedded component structure and process thereof |
| CN108347822A (en) * | 2018-01-31 | 2018-07-31 | 维沃移动通信有限公司 | A kind of manufacturing method of circuit board, terminal device and circuit board |
| CN110493954A (en) * | 2019-08-28 | 2019-11-22 | 成都傅立叶电子科技有限公司 | PCB construction and preparation method thereof is buried in a kind of QFN device |
| CN110783304A (en) * | 2019-11-19 | 2020-02-11 | 广东气派科技有限公司 | Packaging welding structure for solving high reliability requirement of 5G GaN chip welding |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3527166B2 (en) * | 2000-03-15 | 2004-05-17 | シャープ株式会社 | Solid-state imaging device and method of manufacturing the same |
| TW566067B (en) * | 2003-04-16 | 2003-12-11 | Hung-Ren Wang | Package method of CMOS/CCD image sensor |
| CN208386640U (en) * | 2018-06-04 | 2019-01-15 | Oppo广东移动通信有限公司 | Imaging sensor, camera and electronic equipment with projecting function |
| US10614752B1 (en) * | 2018-09-27 | 2020-04-07 | Apple Inc. | Electronic device with polarized ambient light sensor |
| US11456324B2 (en) * | 2019-05-24 | 2022-09-27 | Spring Rainbow Optics Co., Ltd | Image sensor package |
-
2021
- 2021-01-12 CN CN202110038607.9A patent/CN112888150B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55124251A (en) * | 1979-03-20 | 1980-09-25 | Matsushita Electric Ind Co Ltd | Method of fabricating package |
| JPH0843843A (en) * | 1994-07-26 | 1996-02-16 | Mitsubishi Electric Corp | Liquid crystal display device and its production |
| JP2004172436A (en) * | 2002-11-21 | 2004-06-17 | Kyocera Corp | Imaging device package, camera module, and camera |
| CN2807476Y (en) * | 2005-04-14 | 2006-08-16 | 菱生精密工业股份有限公司 | Glue overflow preventing construction of package carrying plate used for integrated circuit |
| DE102009002196A1 (en) * | 2009-04-06 | 2010-10-14 | Robert Bosch Gmbh | Optoelectronic device for e.g. mobile phone, has free space emission units for emission of light beams in different space directions arranged on optical conductor plate and optically coupled with light conductors of conductor plate |
| TW201535548A (en) * | 2014-03-12 | 2015-09-16 | Unimicron Technology Corp | Embedded component structure and process thereof |
| CN108347822A (en) * | 2018-01-31 | 2018-07-31 | 维沃移动通信有限公司 | A kind of manufacturing method of circuit board, terminal device and circuit board |
| CN110493954A (en) * | 2019-08-28 | 2019-11-22 | 成都傅立叶电子科技有限公司 | PCB construction and preparation method thereof is buried in a kind of QFN device |
| CN110783304A (en) * | 2019-11-19 | 2020-02-11 | 广东气派科技有限公司 | Packaging welding structure for solving high reliability requirement of 5G GaN chip welding |
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