JP2003303944A - Manufacturing method of solid-state image pickup device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain a solid-state image pickup device having a small capacity and a high accuracy, while being equipped with a solid-state image pickup element and an optical lens, retained in a casing on a flexible wiring board. <P>SOLUTION: A locating unit and a fixing unit for the casing and the flexible wiring board are separated in a process, wherein the casing is fixed to the flexible wiring board, the positioning unit and a fixing unit for the casing and the flexible wiring board are provided separately, and the locating unit is separated from the solid-state image pickup device, after fixing the casing to manufacture the solid-state image pickup device. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a solid-state image pickup device having a flexible wiring board having a solid-state image pickup element and an optical lens held by a housing, and more specifically, it enables highly accurate assembly. In addition, the present invention relates to a method for manufacturing a solid-state imaging device that realizes miniaturization.

[0002]

2. Description of the Related Art As an example of the prior art, a flexible wiring board (hereinafter referred to as FP
FIG. 18 shows an external view of a solid-state image pickup device configured by flip-chip connecting the solid-state image pickup element and IC parts to each other (abbreviated as C). In FIG. 18, 101 is a flexible wiring board (FPC), 101a is an FPC lead portion, 103
Is an external connection terminal of the FPC, 104 is a fixed base, 104a
Is a fixed pedestal alignment part, 5 is a fixed cap, 8 is a diaphragm part, and 13 is a housing. Here, the fixed pedestal alignment section 104a is for accurately fixing the FPC 101 and the fixed pedestal 104.

FIG. 17 is a sectional view of the solid-state image pickup device shown in FIG. In FIG. 17, 104 is a fixed pedestal that holds the optical filter 7 and is adhesively fixed to the FPC 101. A fixed cap 5 holds the optical lens 6, and is installed in a movable state for adjusting the focus with the fixed base 104. Here, the fixed pedestal 104 and the fixed cap 5
And form a housing 13 that holds the optical lens 6 and the optical filter 7. Further, 9 is a solid-state imaging device, which is connected to the wiring of the FPC 101 via the flip-chip electrode connection portion of 11, and 10 is an IC component, which is connected to the wiring of the FPC 101 via the flip-chip electrode connection portion of 11. Furthermore, 12 is a chip component connected to the wiring of the FPC 101. 114 is an opening of the FPC 101.
Here, 15 is used to bond the solid-state image sensor 9 and the IC component 10 with an adhesive and to fix the bent state of the FPC 101.

11, FIG. 12, FIG. 13, FIG.
An example of the conventional technique will be described in detail with reference to FIGS. 15 and 16. FIG. 11 shows an FPC that constitutes a conventional solid-state imaging device.
The development view of 101 is shown. Here, 101a is FP
C lead portion, 101b indicates an FPC bending position, 114 indicates an FPC opening, and 121 indicates an FPC alignment hole. Here, the alignment hole 121 of the FPC is the FPC.
Will be provided adjacent to the opening 114.

FIG. 12 shows an F which constitutes a conventional solid-state image pickup device.
The development view in which the solid-state imaging device 9, the IC component 10, and the chip component 12 are mounted on the PC 101 is shown. Where FPC
The alignment hole 121 of the solid-state imaging device 9 and the chip component 1
2 will be provided adjacent to.

FIG. 13 shows the mounted FP shown in FIG.
The back side development view which turned upside down the front and back of C101 is shown. The fixed pedestal 104 which is the optical system unit shown in FIG. 14 is placed on this, and it is installed using the alignment hole of the FPC 121. FIG. 14 is a view showing the shape of the fixed pedestal 104. Here, 104a is a fixed pedestal alignment part, 104b is a fixed pedestal alignment protrusion, 5 is a fixed cap, and 8 is a throttle part. Here, the protrusion of 104b of FIG. 14 is dropped into the hole of 121 of FIG. 13, and the fixed pedestal of 104 is placed and installed.

FIG. 15 is a diagram in which the fixed pedestal 104 is mounted on the mounted FPC 101 and is installed. Although not shown in the figure, the contact portion is fixed using an adhesive. 16
16 is a drawing of a conventional solid-state imaging device showing a state in which an FPC is bent at a bending position 101b in FIG. 15 and fixed with an adhesive.

Next, as an example of a conventional technique, a conventional operation will be described with reference to FIGS. 17 and 18. Diaphragm 8
The light that has passed through passes through the optical lens 6 and then the optical filter 7 and is irradiated onto the image pickup area of the solid-state image pickup device 9 to form an image. The imaged imaged information is converted into an electric signal and is transmitted through the flip chip electrode connection portion 11 of the solid-state image pickup device 9 to the FP.
An image pickup signal is sent to the IC component 10 through the flip chip electrode connection portion 11 of the IC component 10 via the wiring of the FPC 101, and the signal processed electric signal is again connected to the flip chip electrode. It is electrically connected to the FPC 101 via the portion 11 and is configured to take out an imaging electric signal from the external connection terminal 103 of the FPC through the FPC lead portion 101a.

[0009]

The conventional solid-state image pickup device is constructed as described above, and as shown in FIG. 12 and FIG. When routing the wiring connected to the external connection terminal 103 on the FPC 101 from the flip-chip connection portion 11 of the image sensor 9, it is necessary to avoid the alignment hole 121 and pass the wiring.
It was necessary to secure a large wiring space on the first line. Therefore,
Since the FPC 101 requires a large area, there is a problem in downsizing the solid-state imaging device.

Similarly, it is necessary to arrange the chip component 12 near the flip chip connection portion 11 of the solid-state image pickup device 9 to connect the wiring, and the mounting position of the chip component 12 is the alignment hole 121. When the chip parts 12 are arranged near each other, it is necessary to avoid the alignment hole 121 and arrange and wire the FPC 10.
Arrangement space of chip component 12 on 1 and chip component 12
It was necessary to take a large wiring space. Here, the reason why it is necessary to dispose the chip component 12 near the solid-state imaging device 9 and connect the wiring is that the flip-chip connection part of the solid-state imaging device 9 is provided as much as possible because the chip component 12 has a function of a bypass capacitor. This is because the shorter the wiring connection to 11, the better the bypass characteristic, and as a result, a more beautiful captured image can be obtained.

Further, as miniaturization of the solid-state image pickup device is advanced, there is a problem that the distance between the two holes of the alignment hole 121 becomes short and the installation accuracy of the optical system unit 104 deteriorates. Therefore, if it is attempted to improve the installation accuracy of the fixed bearing 104, the alignment hole 121
It is better to set the distance between the two holes of
The PC 101 has a large area, which is a problem against the downsizing of the solid-state imaging device.

The present invention has been made in order to solve the above-mentioned problems. While maintaining a high-performance image pickup function, the area of the FPC 101 can be kept small to reduce the size of the solid-state image pickup device (small volume). The purpose is to achieve

[0013]

According to a method of manufacturing a solid-state image pickup device according to the present invention, in a step of fixing a housing to a flexible wiring board, a positioning portion and a fixing portion of the housing and the flexible wiring board are separated from each other. And the positioning section is separated from the solid-state imaging device after the housing is fixed.

In the step of fixing the housing to the flexible wiring board, a reinforcing plate is further fixed to the surface of the flexible wiring board on the back side of the surface to which the housing is fixed.

Further, in the step of providing the reinforcing plate between the housing and the flexible wiring board and fixing the housing to the reinforcing plate, the alignment portion and the fixing portion of the housing and the reinforcing plate are provided separately. After the housing is fixed, the alignment section is separated from the solid-state imaging device and manufactured.

Further, the reinforcing plate and the flexible wiring board have an aligning portion and a fixing portion having an integrated structure, and in the step of fixing the casing to the reinforcing plate, the aligning portion and the fixing portion between the casing and the reinforcing plate are fixed. The unit is provided separately, and the alignment unit is separated from the solid-state imaging device after being fixed.

Further, the positioning section is composed of a positioning hole section and a positioning projection section.

[0018]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiment 1. Embodiment 1 of the present invention will be described below with reference to the drawings. FIG. 1 is a development view of a flexible wiring board (FPC) of a solid-state image pickup device according to the present invention. Here, 1 is an FPC using a film material such as polyimide, which is shown in a state of being developed on a plane, and a printed wiring (not shown in the figure) is shown on this FPC 1.
Has been applied. Further, 1a is an FPC lead portion provided in a part of the FPC 1, and 1b is an FPC provided in a part of the FPC 1.
Bending position, 3 is an external connection terminal provided at one end of the FPC 1, 14 is an opening provided with a rectangular hole in the FPC 1 for allowing imaging light of the solid-state imaging device provided in a part of the FPC 1 to pass through, 21 Is an alignment hole in which a hole is formed in the FPC 1 used for alignment when installing the casing (optical system unit) of the solid-state imaging device provided in a part of the FPC 1.

Next, FIG. 2 is a diagram showing an electronic component mounted on the FPC 1 of FIG. 1 and developed on a plane. The electronic component is electrically connected by a printed wiring (not shown in the figure) provided on the FPC 1. It shows the state of being performed. Here, FP of FIG.
C1 shows a state in which the solid-state image pickup device 9 for picking up an image of a subject is flip-chip mounted with the image pickup pixel area facing downward so as to cover the opening 14 of FIG. Further, an IC component (semiconductor chip) 10 is flip-chip mounted on the FPC 1, and a chip component (chip capacitor etc.)
12 shows a state in which three of them are mounted.

Next, FIG. 3 shows a state in which the mounted FPC 1 of FIG. 2 is viewed from the back side. Since the case of single-sided printed wiring is used here, there is no printed wiring on the side shown in FIG. FIG. 4 shows a housing (optical system unit) 13 according to the present invention.
FIG. Here, 4 is a fixed pedestal, which has an optical filter (infrared cut filter) built therein.
Reference numeral a denotes a fixed pedestal position aligning portion, 4b denotes a fixed pedestal position aligning protrusion, and the portion 4a is long. In this long portion 4a, a portion close to 4b becomes a "positioning portion", and a portion close to 4 in this 4a becomes a "fixing portion".

Next, referring to FIG. 5, the housing (optical system unit) 13 of FIG. 4 is placed on the back surface of the mounted FPC 1 of FIG.
Fixed pedestal alignment protrusion 4 in alignment hole 21 of C1
FIG. 3 is a development view showing a state in which b is dropped, fixed with an adhesive, and the housing (optical system unit) 13 is installed on the FPC 1.

Next, FIG. 6 shows a state in which the housing (optical system unit) 13 is installed on the mounted FPC 1 shown in FIG.
And the fixed pedestal alignment section 4a are cut along the outline of the FPC 1, and the fixed pedestal alignment protrusion 4b is formed.
The development view of the state where the portion of the alignment hole 21 is cut off is shown. Here, the thick line portion of 22 indicates the cut portion of the FPC 1 and the fixed base 4 in an emphasized manner, and is the FPC / fixed base cutting portion 22.

Next, FIG. 7 shows an FPC of the FPC 1 shown in FIG.
It shows a state of bending at the PC bending position 1b.
A cross-sectional view before bending at this time is shown in FIG. 8, and a cross-sectional view after bending is shown in FIG. 6, FIG. 7, FIG. 8, and FIG. 9, 8 is a diaphragm part, 6 is an optical lens, 5 is a fixed cap, and these are mounted on a fixed pedestal 4 and this fixed pedestal 4 is made of an adhesive agent to the FPC 1 Fixed to. In addition, the solid-state imaging device 9 is the flip chip connection unit 1.
1 is electrically connected to the FPC 1 via
The component 10 is also electrically connected to the FPC 1 via the flip chip connection portion 11, and underfill is poured into the periphery of the flip chip connection portion 11, and the gap between the FPC 1 and the solid-state image pickup device 9 and the FPC 1 and the IC component 10 are separated. Underfill is also poured into the gaps and these gaps, and is cured and fixed by heat treatment. Here, the chip component 1
2 is electrically soldered to the FPC 1, and the back surface of the solid-state imaging device 9 and the back surface of the IC component 10 are adhesively fixed with an adhesive 15 so that the FPC 1 is fixed in a bent state. Show.

FIG. 10 is an external view according to the present invention, 4a.
It is necessary to pay attention to the fact that the side surface portion of 1 and the cross-sectional portion of 1 are aligned and flush with each other. Here, 4a is a fixed pedestal alignment portion, and 1 is an FPC, which is manufactured by cutting along a thick line 22 in FIG. 6, so that the cut surface is flush.

FIG. 9 is a cross-sectional view of the solid-state image pickup device according to the first embodiment, in which a fixed cap 5 holds the optical lens 6, while the fixed pedestal 4 and the fixed lens 4 are movably installed for focus adjustment. Here, the fixed pedestal 4 and the fixed cap 5 form a housing 13 that holds the optical lens 6 and the optical filter 7. The fixed pedestal 4 and the fixed cap 5 are in a movable state in order to adjust the light coming from the diaphragm 8 so as to focus the light on the solid-state image sensor 9 through the optical filter 7, but of course the fixed focus is fixed. In some cases it is not necessary. Further, the moving method may be a slide mechanism simply by fitting or a screw type. In general, after the focus adjustment is performed, the movable part for the focus adjustment is fixed with a semi-fixed adhesive in many cases to become a solid-state imaging device with the focus adjustment fixed.

[0026]

As described above, according to the present invention, in the step of fixing the housing to the flexible wiring board, the positioning portion for the housing and the flexible wiring board and the fixing portion are separately provided, and the housing is fixed. By separating the alignment unit from the solid-state image pickup device later, the wiring area of the FPC 1 can be effectively used, and the solid-state image pickup device can be downsized (small volume) while maintaining a high-performance image pickup function. it can.

Further, in the step of fixing the housing to the flexible wiring board, a reinforcing plate is further fixed to the flexible wiring board surface on the back side with respect to the surface to which the housing is fixed, so that good mechanical strength can be obtained. To be

Further, in the step of providing the reinforcing plate between the housing and the flexible wiring board and fixing the housing to the reinforcing plate, the surface on which the housing is fixed serves as the reinforcing plate and is fixed to the surface.
Good mechanical strength is obtained.

Further, the reinforcing plate is provided with a positioning portion for fixing to the flexible wiring board and a fixing portion separately, and the fixing portion is separated from the solid-state image pickup device after fixing, so that the solid-state image pickup device can be made smaller (smaller volume). ) And the flip-chip mounting of the solid-state imaging device can be easily and accurately performed.

Further, since the alignment portion is composed of the alignment hole portion and the alignment protrusion portion,
It can be easily aligned.

[Brief description of drawings]

FIG. 1 is a development view of an FPC according to a first embodiment of the present invention.

FIG. 2 is a mounted FPC according to the first embodiment of the present invention.
FIG.

FIG. 3 is a mounted FPC according to the first embodiment of the present invention.
FIG.

FIG. 4 is an external view of a housing (optical system unit) according to the first embodiment of the present invention.

FIG. 5 is a development view in which a housing (optical system unit) is attached to the FPC according to the first embodiment of the present invention.

FIG. 6 is a development view of an FPC showing a cut portion according to the first embodiment of the present invention.

FIG. 7 is an external view of the solid-state imaging device according to the first embodiment of the present invention.

FIG. 8 is a developed sectional view of the solid-state imaging device according to the first embodiment of the present invention.

FIG. 9 is a sectional view of the solid-state imaging device according to the first embodiment of the present invention.

FIG. 10 is an external view of the solid-state imaging device according to the first embodiment of the present invention.

FIG. 11 is a development view of a conventional FPC.

FIG. 12 is a development view of a conventional mounted FPC.

FIG. 13 is a rear surface development view of a conventional mounted FPC.

FIG. 14 is an external view of a conventional housing (optical system unit).

FIG. 15 is a development view in which a conventional housing (optical system unit) is installed on a conventional FPC.

FIG. 16 is a drawing of a conventional solid-state imaging device.

FIG. 17 is a sectional view of a conventional solid-state imaging device.

FIG. 18 is an external view of a conventional solid-state imaging device.

[Explanation of symbols]

1 flexible wiring board (FPC), 1a FPC lead part, 1b FPC bending position, 3 external connection terminal,
4 fixed pedestal, 4a fixed pedestal alignment section, 4b fixed pedestal alignment protrusion, 5 fixed cap, 6 optical lens, 7 optical filter, 8 diaphragm section, 9 solid-state image sensor, 10 IC component, 11 flip chip connection section,
12 chip parts, 13 housing (optical system unit), 1
4 openings, 15 adhesive, 21 alignment holes, 22
FPC / fixed pedestal cutting part, 101 conventional FPC, 1
01a Conventional FPC lead part, 101b Conventional FP
C bending position, 103 external connection terminal of conventional FPC,
104 Conventional fixed pedestal, 104a Conventional fixed pedestal alignment section, 104b Conventional fixed pedestal alignment protrusion, 114 Conventional FPC opening, 121 Conventional FPC
Alignment holes.

Claims (5)

[Claims] 1. A method for manufacturing a solid-state imaging device, comprising: a flexible wiring board including a solid-state imaging element and an optical lens held by the housing; and a step of fixing the housing to the flexible wiring board. A method for manufacturing a solid-state imaging device, comprising: separately providing an alignment part and a fixing part for the flexible wiring board, and separating the alignment part from the solid-state imaging device after fixing the housing. 2. The step of fixing the housing to the flexible wiring board, wherein a reinforcing plate is further fixed to the surface of the flexible wiring board on the back side with respect to the surface to which the housing is fixed. The method for manufacturing the solid-state imaging device according to claim 1. 3. A method for manufacturing a solid-state imaging device, comprising a flexible wiring board including a solid-state imaging device and an optical lens held by a housing, wherein a reinforcing plate is provided between the housing and the flexible wiring board. In the step of fixing the casing to the reinforcing plate, the alignment portion and the fixing portion of the casing and the reinforcing plate are provided separately, and the alignment portion is separated from the solid-state imaging device after fixing the casing. A method for manufacturing a solid-state imaging device, comprising: 4. The reinforcing plate and the flexible wiring board have an alignment portion and a fixing portion that are integrated with each other,
In the step of fixing the housing to the reinforcing plate, a positioning portion and a fixing portion of the housing and the reinforcing plate are provided separately, and after the fixing, the positioning portion is separated from the solid-state imaging device. The method for manufacturing a solid-state imaging device according to claim 2, wherein 5. The solid-state image pickup device according to claim 1, wherein the alignment section includes a hole for alignment and a protrusion for alignment. Production method.