KR100823686B1 - Camera module pakage and assembly method thereof - Google Patents

Abstract

The present invention relates to a camera module package and an assembly method thereof.

In the camera module package of the present invention, an IR filter and an image sensor are bonded to and fixed on a lower surface of a flexible printed circuit board, and a bent portion extending to each side of the substrate is bent downward to cover each side of the image sensor. Image sensor module; A housing seated on an upper portion of a substrate portion of the image sensor module and tightly coupled to a lower surface of the image sensor module to an upper surface of a bent portion of the substrate portion; And a lens barrel coupled to the upper portion of the housing, and the size of the overall camera module can be reduced by reducing the thickness of the outer wall due to the shortening of the lower wall of the housing.

Image sensor module, flexible printed circuit board, image sensor, IR filter, housing, lens barrel,

Description

Camera module package and assembly method

1 is an assembled perspective view showing a state of assembly of a conventional COF camera module.

2 is a cross-sectional view of a part of the conventional COF-type camera module cut.

Figure 3 is a cross-sectional view showing the assembly sequence of a conventional camera module package.

4 is a perspective view of a camera module package according to the present invention.

5 is a cross-sectional view of the camera module package according to the present invention.

6 is a perspective view illustrating an assembly process of a camera module package according to the present invention;

<Explanation of symbols for the main parts of the drawings>

110. Image sensor module 111. Flexible printed circuit board

112. Substrate section 113. Bending section

114. Flexible portions 115a, 115b. reinforcement

115c. Incision 116. Image Sensor

IR filter 120.Housing

130. Lens Barrel L. Lens

The present invention relates to a camera module package and a method for assembling the same, and more particularly, a bent part of a substrate is in close contact with a lower end of the housing to form an outer wall of the camera module when the image sensor module is mounted below the housing. The present invention relates to a camera module package and an assembly method thereof so as to reduce the size of the camera module by reducing the outer wall thickness thereof.

In general, a compact camera module (CCM) is a small size and is applied to various IT devices such as a camera phone, a PDA, a smart phone, and a portable mobile communication device. The introduction of multifunction composite devices equipped with camera modules is increasing.

Such a camera module is manufactured using an image sensor such as a CCD or a CMOS as a main component, and collects an image of an object through the image sensor and stores it as data in a memory in the device, and the stored data is stored in the LCD or PC in the device. The image is displayed through a display medium such as a monitor.

A typical camera module is typically manufactured by a method such as a chip on board (COB), a chip on flexible (COF), and the brief structure will be described below with reference to the drawings shown below.

1 is an assembled perspective view illustrating a state of assembling a camera module of a conventional COF method, and FIG. 2 is a cross-sectional view of a part of the camera module of a conventional COF method.

As shown in the drawing, the conventional camera module 1 includes a housing 2 in which an image sensor 3 for converting an image signal input through a lens into an electrical signal is supported on a bottom thereof, and the image sensor 3 of the subject. The lens group 4 for collecting the video signal and the barrel 5 in which the lens group 4 is stacked in multiple stages are constituted by a sequential combination.

At this time, a mounting substrate (FPCB) 6 having a capacitor and a chip component of resistance, which is an electrical component for driving the image sensor 3 made of CCD or CMOS, is attached to the lower portion of the housing 2. ) Is electrically coupled.

The conventional camera module 1 configured as described above has an anisotropic conductive film (ACF) between the substrate 6 and the image sensor 3 in a state where a plurality of circuit components are mounted on the printed circuit board FPCB 6. Flim) (8) is inserted and adhesively fixed so that it is energized by applying heat and pressure, and the IR filter (7) is attached to the opposite side.

Further, as described above in the state in which the barrel 5 in which the plurality of lens groups 4 are built and the housing 2 are temporarily coupled by screwing, the pre-assembled mounting substrate 6 is placed on the bottom of the housing. It is adhesively fixed by a separate adhesive.

On the other hand, after fixing the mounting substrate 6 to which the image sensor 3 is attached and the housing 2 to which the barrel 5 is coupled, the subject (resolution chart) is placed at a predetermined distance in front of the barrel 5. The focus adjustment of the camera module 1 is performed by adjusting the vertical feed amount by the rotation of the barrel 5 screwed to the housing 2, thereby adjusting the lens group 4 and the image sensor ( 3) focusing is performed.

In this case, the distance of the subject is approximately 50 cm at an infinite distance from the focus adjustment is made, and after the final focus is adjusted by injecting an adhesive between the housing 2 and the barrel 5 in the focused state Adhesive is fixed.

An assembly process of the conventional camera module having such a structure will be briefly described with reference to FIG. 3 shown below.

FIG. 3 is a cross-sectional view illustrating a process of assembling a conventional camera module package. First, as shown in FIG. 3, a reinforcing material 9 is formed on one surface of a substrate portion of a flexible printed circuit board 6 having a light receiving area 6a formed therein. The image sensor 3 is bonded and fixed to the other surface of the substrate, and the IR filter 7 is tightly coupled to the opposite surface of the image sensor 3 to complete the image sensor module 10.

The image sensor module 10 is a housing in which the lens barrel 5 is coupled to the upper end in a state where the IR filter 7 and the image sensor 3 are bonded to and fixed to the lower part of the substrate of the flexible printed circuit board 6. (2) It is inserted and fixed in the lower portion, the bonding is bonded by the adhesive applied to the inner peripheral surface of the housing (2) and the image sensor module 10, the assembly of the camera module is completed.

Since the thickness of the outer wall of the lower end of the housing 2 surrounding the side is determined according to the thickness of the image sensor module 10, the camera module package assembled in this manner is increased as the height of the image sensor module 10 increases. Since the outer wall of the lower end of the housing 2 must be thickened, the overall appearance of the camera module package is increased.

That is, as the overall height of the image sensor module 10 increases, the lower end of the housing 2 surrounding the outer surface thereof becomes longer, and the difficulty of mold design and the injection using the mold during injection molding of the housing 2 are increased. Due to the difficulty of the condition, there is a limitation in forming the outer wall thickness thinly, which has been pointed out that the housing 2 having the outer wall thickness proportional to the length of the lower end of the housing 2 must be formed.

Accordingly, the present invention has been made to solve the above-mentioned disadvantages and problems in the conventional camera module package, by bending a portion extending from the edge of the substrate portion of the printed circuit board coupled to the housing upper surface And a lower portion of the flexible printed circuit board to form an outer wall of the camera module package by bringing the lower end of the housing into close contact with the housing.

The object of the present invention, the IR sensor and the image sensor is bonded to the upper and lower surfaces, the image sensor module is formed in the four edges of the substrate portion of the flexible printed circuit board is bent downward, and is mounted on the upper substrate portion of the image sensor module The lower end is composed of a camera module package including a housing in close contact with the upper surface of the bent portion of the substrate portion, and a lens barrel coupled to the upper portion of the housing.

In the image sensor module, a reinforcing material and an IR filter are sequentially attached to an upper surface of a substrate of a flexible printed circuit board in which a light receiving region is formed at a center thereof, and an image sensor is bonded to a flip chip such that the light receiving unit is exposed through the light receiving region at the bottom thereof. Closely fixed by the method.

The reinforcing material attached to the substrate portion of the flexible printed circuit board is cut into the same shape as the substrate portion and tightly coupled to the upper surface thereof, and an incision line is formed to distinguish the attachment portion of the bent portion extending in all directions of the substrate portion. One of the bent portions is formed by cutting both sides except the flexible portion extension portion of the flexible printed circuit board.

The flexible printed circuit board is bent downwardly around the cut line of the reinforcement to form a wall to protect the side of the image sensor module and the bent substrate portion of the flexible printed circuit board and the reinforcement, the upper surface of the bending point of the reinforcement The lower end of the housing is tightly coupled.

Therefore, since the lower portion of the housing is shorter than that of the related art, the lower portion of the housing may be in close contact with the upper surface of the bending point, and thus the injection molding may be easily performed, and the limitation of mold design for injection molding may be overcome. have.

In addition, the lower extension portion of the housing and the bent portion of the substrate portion are in close contact with each other is formed as a wall of the shape that surrounds the entire side of the image sensor module.

On the other hand, another object of the present invention is the step of attaching a reinforcing material on the upper surface of the substrate portion of the printed circuit board, the bent portion is extended to the four corners, the step of flip chip bonding the image sensor on the inner lower surface of the bent portion of the substrate, Mounting an IR filter on an inner upper surface of the bent portion of the substrate portion, bending the bent portion of the substrate portion downwardly around the incision line of the reinforcing material, and coupling a housing having an upper end of the lens barrel mounted on the substrate portion Camera module package assembly method comprising a.

Matters relating to the operational effects including the technical configuration of the camera module package and the assembly method according to the present invention will be clearly understood by the following detailed description with reference to the drawings showing preferred embodiments of the present invention.

Camera module package

First, Figure 4 is a perspective view of the camera module package according to the present invention, Figure 5 is a cross-sectional view of the camera module package according to the present invention.

As shown, the camera module package 100 of the present invention and the image sensor module 110 having a substrate portion 112 is bent downward portion except the mounting portion of the IR filter 117 and the image sensor 116 and The housing 120 is mounted on the substrate 112 of the image sensor module 110, and the lens barrel 130 is coupled to the housing 120.

The image sensor module 110 may include a printed circuit board having a flexible part 114 having a connector (not shown) connected to one end of a substrate part 112 having a light receiving region 112a formed at a center thereof. 111, an IR filter 117 mounted on an upper surface of the substrate 112, and an image sensor 116 flip chip bonded to a lower surface of the substrate 112.

A reinforcement 115a is interposed between the IR filter 117 and the upper surface of the substrate 112 to form a rigid substrate 112.

The substrate portion 112 of the flexible printed circuit board 111 maintains a quadrangular shape according to the shape of the image sensor 116, and the bent portion 113 is formed on each side of the substrate portion 112 by a predetermined length. Is formed extending.

In addition, each side of the flexible portion 114 of the side of the substrate portion 112 is extended, the bent portion 113 is formed on both sides except the flexible portion 114 forming portion.

The bent portion 113 may be formed to have a length such that a side surface of the image sensor 116, which is flip-chip bonded to the bottom surface of the substrate portion 112, may be opened when downwardly bent. The reinforcement member 115a of the upper surface of the substrate 112 and the reinforcement member 115b divided into the cut line 115c are closely coupled to the upper surface.

The bent portions 113 formed at each side surface of the substrate portion 112 are bent downwardly around the incision line 115c together with the reinforcing material 115b attached to the upper surface thereof, and the bottom surface of the bent portion 113 is formed on the substrate. The lower surface of the unit 112 is bent at right angles to be in close contact with the side of the image sensor 116 flip-bonded.

That is, the bent portion 113 bent from all sides of the substrate portion 112 forms a wall covering each side surface of the image sensor 116 attached to the lower surface of the substrate portion 112.

On the other hand, in the state in which the bent portion 113 formed on all sides of the substrate 112 is bent downward, the housing 120 in which the lens barrel 130 is screwed to the upper opening is seated on the upper portion of the substrate 112. The lower wall 121 of the housing 120 and the upper portion of each bent portion of the substrate 112 are closely coupled.

Therefore, the wall 121 extended to the lower portion of the housing 120 and the bent portion 113 of the substrate portion 112 are integrally coupled to the upper and lower stages to form a close coupling of the image sensor module 110. According to the present invention, the side wall of the image sensor module 110 may be protected without extending the lower wall 120 of the housing 120 to the lower side of the image sensor module 110. There is a characteristic.

At this time, it is preferable that the end surface of the lower wall 121 of the housing 120 and the upper surface of the bent portion 113 is tightly coupled by the application of an adhesive.

In addition, the lens barrel 130 and the image sensor module 110 in the lens barrel 130 are screwed to the upper end of the housing 120 by screwing the lens barrel 130 in which a plurality of lenses L are stacked and coupled therein. The focus adjustment is performed by adjusting the distance from the image sensor 116 flip-bonded to ().

The camera module package 100 having the structure as described above is formed by forming the thickness of the lower wall 121 of the housing 120 in a significantly thinner state than before, and seating the upper surface of the image sensor module 110 as a whole. The effect of reducing the package size is exerted.

How to assemble the camera module package

On the other hand, Figure 6 is a perspective view showing the assembly process of the camera module package according to the present invention, as shown in the camera module package assembly method of the present invention, first, the light receiving area 112a is perforated in the center and bent to each side The reinforcing member 115a is provided on the upper surface of the substrate portion 112 having the extended portion 113 and has the same shape as that of the light receiving region 112a and is cut into the same shape as the substrate portion 112. 115b) is attached to form a ridge printed circuit board (RF-PCB).

At this time, the reinforcing member (115a) (115b) attached to the upper surface of the substrate portion 112 distinguishes the portion adhesively fixed to the substrate portion 112 and the portion adhesively fixed to the bent portion 113 extending to the side portion An incision 115c is provided.

Next, an IR filter 117 is mounted on an upper surface of the substrate 112 to block infrared rays of external incident light on a central portion except for the bent portion 113, and a light receiving portion provided on the center portion is provided on the lower surface thereof. Image sensor 116 is flip chip bonded to expose through 112a.

The bent portion 113 is bent downward by bending the bent portion 113 extending to each side of the substrate portion 112 to which the IR filter 117 and the image sensor 116 are bonded. Wrap each side of the image sensor 116 adhesively fixed to the lower surface.

In this case, the bent portion 113 is preferably bent at a right angle with respect to the substrate portion 112, the outer surface of the reinforcing member 115b adhesively fixed to the bent portion 113 is the upper portion of the substrate portion 112 It is formed in the same plane as the bottom wall 121 of the housing 120 coupled to.

Here, bending is formed on each side of the substrate portion 112 by the pressing force applied through the lower wall 121 of the housing 120 when the housing 120 is seated without first bending the bent portion 112. The portion 113 may be formed to be bent.

Therefore, after the image sensor 116 and the IR filter 117 are bonded to the substrate portion 112 of the flexible printed circuit board 111, the housing in which the lens barrel 130 is coupled to the upper portion of the substrate portion 112. As the bent portion 113 is bent to form a wall only by mounting of the 120, continuity of the automation process for manufacturing the camera module package 100 is achieved.

Next, as shown in FIG. 6E, the housing 120 is seated on the upper portion of the substrate 112 of the image sensor module 110. In this case, the bottom surface of the wall 121 extending downward of the housing 120 is the substrate. While being in close contact with the upper surface of the bent portion of the part 112, it is fixed to be integrally fixed by applying and curing the adhesive therebetween.

Then, the lens barrel 130 is screwed to the upper portion of the housing 120, the assembly of the final camera module package 100 as shown in Figure 6f is completed.

At this time, by adjusting the height of the barrel 130, the focus adjustment is performed by adjusting the distance between the lens (L) in the barrel 130 and the image sensor 116 of the lower housing 120.

Preferred embodiments of the present invention described above are disclosed for the purpose of illustration, and various substitutions, modifications, and changes within the scope without departing from the spirit of the present invention for those skilled in the art to which the present invention pertains. It will be possible, but such substitutions, changes and the like should be regarded as belonging to the following claims.

As described above, the camera module package of the present invention and a method of assembling the same may be used to form a wall of the image sensor module by bending the bent portion downward to the outside of the substrate portion of the image sensor module, and the lower wall of the housing seated on the substrate portion. The bent part is formed to be a part of the lower wall of the camera module package by being closely coupled to the bent part, so that the thickness of the wall of the housing can be made thin, thereby reducing the overall size of the camera module.

In addition, according to the present invention, as a part of the wall is formed as the bent portion extended to the outside of the substrate portion is bent downward by the pressing force of the housing when the substrate portion of the housing is seated, assembly productivity is ensured as the continuity of the camera module package automation process is secured. This has the advantage of being improved.

Claims (10)

An image sensor module on which an IR filter and an image sensor are bonded and fixed to upper and lower surfaces of a flexible printed circuit board, and a bent portion extending to each side of the substrate is bent downward to cover each side of the image sensor; A housing seated on an upper portion of a substrate portion of the image sensor module and tightly coupled to a lower surface of the image sensor module to an upper surface of a bent portion of the substrate portion; And A lens barrel coupled to an upper portion of the housing; Camera module package comprising a. The method of claim 1, The flexible printed circuit board is a camera module package, characterized in that the flexible portion is formed extending to one side of the substrate portion in which the light receiving region is formed in the center, the bent portion is extended to each side of the substrate portion. The method of claim 2, The substrate unit, the camera module package, characterized in that the bent portion of the side extending from the flexible portion for connecting the connector of each side formed with the bent portion formed on both sides of the flexible portion. The method of claim 1, The substrate unit is a camera module package, characterized in that consisting of a rigid line printed circuit board interposed between the reinforcing material between the IR filter bonded to the upper surface. The method of claim 4, wherein The reinforcing material attached to the upper surface of the substrate portion, the camera module package, characterized in that the cut line is formed to distinguish between the portion fixed to the substrate portion and the portion fixed to the bent portion extending from the substrate portion. The method of claim 5, The bent portion, the camera module package, characterized in that bent downward at a right angle with respect to the incision line. The method of claim 2, The bent portion bent downward on each side of the substrate portion, the camera module package, characterized in that the bottom surface of the wall extending to the lower portion of the housing close to the upper surface of the bent portion in close contact with the adhesive. Attaching a reinforcing material to the upper surface of the substrate of the printed circuit board in which the bent portion extends to the four edge portions; Flip chip bonding an image sensor on an inner bottom surface of the bent portion of the substrate; Mounting an IR filter on an inner upper surface of the bent portion of the substrate; Bending the substrate part downwardly at a right angle with respect to the incision line of the reinforcing material; And Mounting a housing having a lens barrel coupled to an upper opening on the substrate; Camera module package assembly method comprising a. The method of claim 8, In the step of attaching a reinforcement to the upper surface of the substrate portion, The reinforcing material, the camera module package assembly, characterized in that further comprising the step of forming a cut line for separating and fixing the portion to be attached and fixed to the bent portion extending from the substrate portion to each side portion fixed to the substrate portion; Way. The method of claim 8, In the step of mounting the housing, A bottom end surface of the wall extending downward of the housing is tightly coupled with an adhesive interposed on an upper portion of the bent portion of the substrate; Camera module package assembly method characterized in that it further comprises a.

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