JP4233249B2 - Electronic circuit module for imaging apparatus and camera apparatus - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic circuit module for an imaging device and a camera device, and more particularly to an electronic circuit module for an imaging device and a camera device included in an imaging device such as a camera.
[0002]
[Prior art]
2. Description of the Related Art In recent years, many electronic camera devices (so-called digital cameras) that do not require photographic films such as negative films have been commercially available as camera devices for photographing subjects. Many of these digital camera devices have a built-in display device in order to display a captured image in real time. Generally, an image sensor that captures an image of a subject, a display element that displays a captured image, and the like. A control circuit for controlling the image sensor and the display element is provided.
[0003]
Such a camera device includes at least an image sensor, a display element, a control circuit, and the like, which are manufactured separately. For example, an image sensor, a display element, and a control circuit are manufactured as separate modules, which are connected using a flexible cable or the like, and then accommodated in a camera device (see Japanese Patent Laid-Open No. 10-336696).
[0004]
[Problems to be solved by the invention]
However, the pursuit of contradictory functions, such as higher functionality, smaller size, and lower price, has been sought for electronic camera devices. For example, the degree of integration of the camera device is increasing such that the number of pixels is increased, the display density is improved, and various functions can be provided on the camera device. When an element, a control circuit, and the like are manufactured separately and are to be connected with a flexible cable or the like, the reliability is reduced and the manufacturing cost is increased.
[0005]
In view of the above facts, an object of the present invention is to obtain an electronic circuit module for an imaging apparatus and a camera apparatus that have a simple configuration and can improve reliability.
[0006]
[Means for Solving the Problems]
In order to achieve the above object, an electronic circuit module for an imaging apparatus according to the present invention includes an imaging device configured with a plurality of predetermined pixel regions for capturing an image and a plurality of predetermined for displaying an image. A display element configured by a display area and an electroluminescence element; a control circuit layer for controlling each of the imaging element and the display element; and a plurality of pixel areas of the imaging element and a plurality of displays of the display element A multilayer substrate including at least a connection layer that connects the regions with a predetermined correspondence relationship, and the multilayer substrate is formed of a flexible substrate that can be bent at least, and the display element can be bent at least. In addition, the image pickup device, the display device, and the control circuit layer are integrally configured so as to be displayed in a curved state .
[0007]
The electronic circuit module for an image pickup apparatus of the present invention is formed as an integral structure including an image pickup element, a display element, and a multilayer substrate. The imaging element is for capturing an image, and is configured of a plurality of pixel regions that are determined in advance so as to output pixel signals of the plurality of pixels. The display element is for displaying an image such as a stored image when a captured image or a memory element is provided, and is configured by a plurality of predetermined display areas. Each of these image sensor and display element is mounted on a multilayer substrate, and a module is formed with an integrated structure of the image sensor, display element, and multilayer substrate. Thus, since the module is formed with an integral structure, the assembly work of the camera device is facilitated. Each of the imaging element and the display element is controlled by a control circuit in a control circuit layer included in the multilayer substrate. The multilayer substrate includes a connection layer that connects a plurality of pixel regions of the image sensor and a plurality of display regions of the display element according to a predetermined correspondence relationship. That is, since the module is formed in an integrated structure with a multilayer substrate, the imaging element and the display element can be connected without an external connection cable. For this reason, the analog signal output from the image sensor can be used as it is and provided to the display element. Therefore, it is possible to construct a circuit configuration with the shortest distance without constructing a circuit configuration that bypasses using an external cable. Thus, since conversion processing such as analog-digital conversion is not required, signal reliability can be improved.
[0008]
The image sensor can be composed of a CCD element or a CMOS element. In the case of a CCD element or a CMOS element, these elements can be directly connected to the multilayer substrate, and the module can be simplified.
[0010]
The display element can employ an electroluminescence element. An example of the electroluminescence element (EL element) is an organic EL element. An organic EL element is suitable for image display because it can be easily formed into a sheet.
[0011]
The multilayer substrate includes at least an analog circuit layer and a digital circuit layer. Control circuits are generally divided into analog circuits that process signals themselves, and digital circuits that process digital signals obtained by digitizing analog signals and process commands and digital data. Since an analog circuit often handles weak signals and high voltage signals, it is preferably separated from a digital circuit. Therefore, in order to configure an analog circuit and a digital circuit, the analog circuit layer and the digital circuit layer are included in a multilayer substrate, and by separating them by layering each layer, the characteristics of each circuit can be fully extracted. It becomes possible. Note that a power supply circuit layer can be further added to the circuit layer.
[0012]
The multilayer substrate including the control circuit layer is composed of at least a flexible substrate that can be bent, and the display element is configured to be at least bendable and displayable in a curved state, the imaging element, the display element, and When the control circuit layer is integrally formed, the electronic circuit module for the imaging device can be bent, and the influence of the assembly accuracy can be minimized.
[0013]
By providing the electronic circuit module for an imaging device in the camera device, the structure of the camera device is simplified, and the manufacturing procedure and cost can be suppressed. .
[0014]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an example of an embodiment of the present invention will be described in detail with reference to the drawings. In this embodiment, the present invention is applied to a module including various electronic elements incorporated in a digital camera device.
[0015]
First, the module 10 built in the digital camera device will be described. FIG. 1 shows an outline of the module 10.
[0016]
As shown in FIG. 1A, the module 10 includes a multilayer substrate 16, and a CCD element 12 is attached to the front side 10 </ b> A of the multilayer substrate 16. Perforations 18 for fixing to the camera device are provided in four directions around the CCD element 12. As shown in FIG. 1B, a liquid crystal display element (LCD) 14 as a display element is attached to the back side 10B of the multilayer substrate 16, and a terminal 20 for connecting the module 10 to an external device or element. Is provided.
[0017]
In the above description, the case where the CCD element 12 is used as an image sensor has been described. However, the present invention is not limited to this, and a CMOS image sensor or another image sensor may be used. In the above description, the liquid crystal display element (LCD) 14 is used as the display element. However, the present invention is not limited to this, and any element capable of displaying an image may be used. An organic electroluminescence element (organic EL element) can be used as an example of an element capable of displaying an image. This organic EL element is an element having a laminated structure in which both sides of an organic compound layer including a light emitting layer are sandwiched between electrode layers, and a light emitting layer included in the organic compound layer by applying electric power according to an image to the electrode layer Emits light and an image is displayed.
[0018]
The multilayer substrate 16 is not limited to a multilayer substrate in which circuit wiring is simply laminated. For example, a circuit portion equivalent to a state in which electronic components for constituting one electronic circuit are mounted is constituted by one or more layers. That is, one or a plurality of circuit chips are provided, and these are three-dimensionally stacked and wired to constitute one package (one layer). A multilayer substrate may be configured by stacking a plurality of such packages. In this way, the multilayer substrate 16 can be configured as a circuit substrate including an electronic circuit by the substrate itself.
[0019]
As shown in FIG. 2, the multilayer substrate 16 of the module 10 is configured by laminating a first layer 16A, a second layer 16B, a third layer 16C, and a fourth layer 16D in this order. The opposite side of the first layer 16 </ b> A to the second layer 16 </ b> B corresponds to the front side 10 </ b> A of the multilayer substrate 16. The opposite side of the fourth layer 16 </ b> D to the third layer 16 </ b> C corresponds to the back side 10 </ b> B of the multilayer substrate 16. The CCD element 12 is attached to the first layer 16A, and the liquid crystal display element 14 is attached to the fourth layer 16D.
[0020]
Further, the terminal 20 includes a power supply unit 34 for supplying power to the module 10, an operation unit 36 such as a switch or a key used when operating the camera such as a release switch, and a connection device 44 for connecting the camera as an external device. It is connected.
[0021]
The first layer 16A is an electronic circuit layer including an analog control circuit that processes and transmits an analog signal from the CCD element 12 as it is, controls the CCD element 12. The second layer 16B includes a function of analog / digital (A / D) conversion of the analog signal from the CCD element 12, and a memory circuit function of temporarily storing the converted digital signal (that is, image data). An electronic circuit layer. The third layer 16C is an electronic circuit layer that has a large-capacity memory circuit function for storing a large number of image data and a signal transmission / reception function for transmitting / receiving electrical signals to / from other devices such as an IC card. The fourth layer 16D includes a display control circuit that includes a function of digital / analog (D / A) conversion for converting a digital signal into an analog signal for image display on the liquid crystal display element 14, and controls the liquid crystal display element 14. An electronic circuit layer including
[0022]
Note that in this embodiment, the case where the multilayer substrate including the four layers is used is described, but the present invention is not limited to this. For example, the multilayer substrate 16 may be configured by the above-described at least one layer, and other functions may be provided by an IC placed on the multilayer substrate 16.
[0023]
FIG. 3 is a block diagram showing a main part for achieving the main functions of the camera device 42 including the module 10. The camera device 42 includes a module 10 including a CCD element 12, a liquid crystal display element 14, and a multilayer substrate 16. The camera device 42 includes a lens 22 for forming an object on the CCD element 12.
[0024]
The multilayer substrate 16 includes an analog control circuit 50 corresponding to the function of the first layer 16A, a first storage circuit 52 corresponding to the function of the second layer 16B, a second storage circuit 56 corresponding to the function of the third layer 16C, The display control circuit 54 corresponds to the function of the four layers 16D and the terminal 20 which is an interface portion with the outside of the module 10. The terminal 20 is bus-connected to each of the analog control circuit 50, the first memory circuit 52, the display control circuit 54, and the second memory circuit 56.
[0025]
FIG. 3 shows an example of a configuration that can transfer image data to and from the second storage circuit 56 with respect to the IC card 46. In this case, as the connection device 44, an IC card / read / write device is connected to the terminal 20 (or a function layer is added to the multilayer substrate 16), and the IC card 46 is inserted into the connection device 44. Then, the image data is read from the IC card 46 and stored in the second memory circuit 56 or the first memory circuit 52 by the operation of the operation unit 36, or the image stored in the second memory circuit 56 or the first memory circuit 52. Data can be written to the IC card 46.
[0026]
In the present embodiment, an analog signal (image signal) output from the CCD element 12 is output to at least one of the first storage circuit 52 and the display control circuit 54. This is because the signal for displaying an image on the liquid crystal display element 14 is an analog signal, and the analog signal output from the CCD element 12 is used as it is. That is, the display control circuit 54 displays an image on the liquid crystal display element 14 using the analog signal from the CCD element 12 output from the analog control circuit 50.
[0027]
In this case, the wiring from the CCD element 12 to the liquid crystal display element 14, that is, the wiring on the multilayer substrate 16, is not limited to one-to-one connection between the pixels of the CCD element 12 and the elements in the display area of the liquid crystal display element 14. . For example, a ratio and resolution at the time of display may be determined in advance, and the CCD element 12 and the liquid crystal display element 14 corresponding to the ratio and resolution may be connected. This corresponds to the process of thinning out the imaging signal by the CCD element 12.
[0028]
Further, the wiring from the CCD element 12 to the liquid crystal display element 14 can be provided by wiring on the multilayer substrate 16 for displaying images. For this reason, image display is possible without requiring processing such as A / D conversion and D / A conversion. In addition, since the wiring can be covered by the wiring on the multilayer substrate 16, a bypass circuit configuration in which the wiring is extended to the outside is not necessary, and the circuit can be configured with the wiring with the shortest distance. Can be improved.
[0029]
The first memory circuit 52 is connected to the display control circuit 54 and the second memory circuit 56. The first storage circuit 52 converts the analog signal from the CCD element 12 into a digital signal and temporarily stores it. The digitized image data is stored in the second storage circuit 56 or converted into an analog form by the display control circuit 54 and displayed. As described above, the display control circuit 54 has a basic function of outputting an analog signal from the analog control circuit 50 to the liquid crystal display element 14 as it is to display an image. As another function, the image data temporarily stored in the first storage circuit 52 is obtained as it is or the resolution is changed, and an analog signal is obtained and output to the liquid crystal display element 14. As another function, the image data stored in the second storage circuit 56 is selected, and the selected image data is obtained as it is or the resolution or the like is changed to obtain an analog signal and output it to the liquid crystal display element 14.
[0030]
As described above, since the module 10 that enables various functions of the camera device 42 to be constructed on the multilayer substrate 16 is provided, the configuration of the camera device 42 is simplified.
[0031]
Next, a specific configuration and assembly of 42 having the above-described module 10 will be described with reference to FIGS. 4 and 5.
[0032]
In the module 10, the CCD element 12 is attached to the front side 10 </ b> A of the multilayer substrate 16, and the liquid crystal display element 14 is attached to the back side 10 </ b> B of the multilayer substrate 16. The multilayer substrate 16 of the module 10 is provided with perforations 18. A pin 28 is fixed inside the rear cover 30 in a positional relationship corresponding to the positional relationship of the perforations 18.
[0033]
The rear cover 30 is provided with a display window 32. The display window 32 is an opening having a size corresponding to the display area of the liquid crystal display element 14 mounted on the module 10, and it is preferable to insert a transparent member such as acrylic for dust prevention. Further, the opening position of the display window 32 is provided away from the pin 28 in the same positional relationship as the positional relationship between the perforations 18 on the module 10 and the liquid crystal display element 14.
[0034]
Accordingly, the module 10 can be easily fixed on the rear cover 30 by fitting the hole 18 of the module 10 into the pin 28 with the pin 28 fixed on the rear cover 30 as a reference. At the same time, by this fixing, the display area of the liquid crystal display element 14 can be fixed to a position where it can be visually observed to the outside, that is, a position matching the display window 32.
[0035]
An image of the subject needs to be formed on the CCD element 12. In the present embodiment, a lens 22 for forming an image of a subject on the CCD element 12 is fixed with a pin 28 provided on the rear cover 30 as a reference. That is, the lens 22 is fixed to the pedestal 24. The pedestal 24 is provided with perforations 26 at four positions that coincide with the positional relationship of the pins 28. Thus, after mounting the module 10 with the pin 28 as a reference, that is, on the pin 28 with the pin 28 as a reference, the four perforations 26 are fitted.
[0036]
In this way, the optical system can be easily assembled without requiring adjustment of the optical axis of the lens 22 by merely fitting the perforation 26 of the pedestal 24 to which the lens 22 is attached to the pin 28 of the rear cover 30 (FIG. 5). be able to.
[0037]
As shown in FIG. 5, the module 10 is attached with the pin 28 of the rear cover 30 as a reference, and after the lens 22 is further attached, the front cover 40 that covers them is attached. The rear cover 30 and the front cover 40 are configured so that the front cover 40 is fitted to the rear cover 30.
[0038]
The front cover 40 includes a power supply unit 34, a flash device 37, and an operation unit 36 (release switch in the example of FIG. 5). Further, since the flash device 37 temporarily uses a large amount of electric power, a capacitor 35 for holding the electric power of the power supply unit 34 is necessary, and this capacitor 35 is also attached to the front cover 40. The front cover 40 is also provided with an opening 38 for allowing the lens 22 to escape when fitted to the rear cover 30. The power supply unit 34, the capacitor 35, the operation unit 36, and the flash device 37 are connected to the module 10 by a cable (not shown).
[0039]
The front cover 40 thus configured is fitted to the rear cover 30 including the module 10 and the lens 22 to assemble the camera device 42.
[0040]
In order to eliminate the need for a cable (not shown) for connection, an electrode portion that is in contact with the rear cover 30 when the rear cover 30 is fitted is provided at the position of the terminal 20 when the rear cover 30 is fitted to the front cover 40. It is only necessary to provide a connection line for the power supply unit 34, the capacitor 35, the operation unit 36, and the flash device 37 to the electrode unit. By doing so, the camera device 42 is completed only by fitting the rear cover 30 and the front cover 40 together.
[0041]
As described above, in this embodiment, the CCD element 12 and the liquid crystal display element 14 can be connected on the module 10, so that the wiring can be configured with the shortest length. Thereby, the speed until image display can be improved. In addition, since the wiring can be shortened, the amount of heat generated can be necrotized, and the heat generation as the camera device 42 can be suppressed. Further, since there is no need to connect a plurality of units, reliability is improved.
[0042]
In the present embodiment, since the CCD element 12 and the liquid crystal display element 14 can be connected on the module 10, the correspondence relationship between the number of effective pixels of the image sensor and the number of pixels of the display element is represented by the multilayer substrate 16. Can be set above. This setting may be set at a predetermined ratio or may be switched by a wiring changeover switch (for example, an analog switch). This makes it possible to freely set the relationship between imaging and display without depending on the operation of the control device.
[0043]
In the present embodiment, the pin 28 is attached to the rear cover 30, the perforations 18 of the multilayer substrate 16 are fitted with the pin 28 as a reference, thereby positioning the display area of the liquid crystal display element 14, and the pedestal to which the lens 22 is attached. By fitting the perforations 26 at the four positions 24, the optical axis of the lens 22 can be easily positioned on the CCD element 12. Therefore, it is possible to assemble each unit (module 10, rear cover 30, front cover 40) without requiring positioning adjustment when assembling. This makes it possible to easily assemble a highly accurate camera.
[0044]
In the above embodiment, the case where a plate-like stable substrate is used as the multilayer substrate 16 has been described. However, the present invention is not limited to this and can be easily applied to a multilayer substrate having curvature. It is applicable to.
[0045]
FIG. 6 shows an outline of a module that can be incorporated in a digital camera device as another embodiment. In addition, since the structure of other embodiment is the same structure except the multilayer substrate 17 comprised with a flexible substrate, the same code | symbol is attached | subjected to the same part and detailed description is abbreviate | omitted.
[0046]
As shown in FIG. 6A, a module according to another embodiment includes a multilayer substrate 17 made of a flexible substrate, and a CCD element 12 is attached to the front side of the multilayer substrate 17. A liquid crystal display element 14 is provided on the back side of the multilayer substrate 17. As the liquid crystal display element 14, it is preferable to use a display device such as an electroluminescence element that can display even if it is curved. By using a display device such as this electroluminescence element, even if the display device is curved by bending the multilayer substrate 17, the display device can be curved in accordance with the curvature, An image can be displayed.
[0047]
Therefore, it can be mounted in a curved state without being limited to the flatness of the substrate, and the degree of freedom in designing increases.
[0048]
Further, as shown in FIG. 6B, a multilayer substrate 17 made of a flexible substrate can be bent and used. In this case, the CCD element 12 and the liquid crystal display element 14 are provided at different positions on the front side of the multilayer substrate 17 (that is, both sides centering on the bending position). As the liquid crystal display element 14, it is preferable to use a display device such as an electroluminescence element that can display even if it is curved. By using the multilayer substrate 17 in such a manner, the area occupied by the module can be reduced.
[0049]
As described above, in another embodiment, the module can be used in a curved state or bent, so that the degree of freedom of the arrangement shape can be increased or the installation space can be made worse.
[0050]
In the above embodiment, the case where the present invention is applied to a camera with a built-in strobe device has been described. However, the present invention is not limited to this and can be easily applied to a camera device having only a photographing function. Applicable.
[0051]
【The invention's effect】
As described above, according to the present invention, the module is formed with an integral structure including the imaging element, the display element, and the multilayer substrate, so that the assembling work of the camera device is facilitated. In addition, since the imaging element and the display element that are integrally formed on the multilayer substrate can have a connection relationship without using an external connection cable, the analog signal output from the imaging element can be used as it is. An effect that can be provided to a display element, and it is possible to construct a circuit configuration at the shortest distance without constructing a circuit configuration bypassed by using an external cable, thereby improving signal reliability. There is.
[Brief description of the drawings]
FIG. 1 is a perspective view showing a module according to an embodiment of the present invention.
FIG. 2 is an image diagram showing an example of a configuration around a module according to an embodiment of the present invention.
FIG. 3 is a block diagram showing a schematic configuration of a camera apparatus according to an embodiment of the present invention.
FIG. 4 is a perspective view for explaining a process of attaching a module and a lens attached to a rear cover when assembling a camera device.
FIG. 5 is a perspective view illustrating a configuration of a rear cover and a front cover when the camera device is assembled.
6A and 6B show a module according to another embodiment of the present invention, in which FIG. 6A is a perspective view and FIG. 6B is a perspective view showing a bent state.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10 ... Module 12 ... CCD element 14 ... Liquid crystal display element 16 ... Multilayer substrate 18, 26 ... Perforation 20 ... Terminal 22 ... Lens 24 ... Base 28 ... Pin 30 ... Rear cover 32 ... Display window 34 ... Power supply 35 ... Capacitor 36 ... Operation unit 37 ... Flash device 40 ... Front cover 42 ... Camera device 46 ... IC card 50 ... Analog control circuit 52 ... First storage circuit 54 ... Display control circuit 56 ... Second storage circuit

Claims (4)

An image sensor composed of a plurality of predetermined pixel areas for capturing an image;
A display element composed of a plurality of predetermined display areas for displaying an image and composed of an electroluminescence element ;
A multilayer including at least a control circuit layer that controls each of the image sensor and the display element, and a connection layer that connects a plurality of pixel areas of the image sensor and a plurality of display areas of the display element according to a predetermined correspondence relationship. A substrate,
Equipped with a,
The multilayer substrate is composed of at least a flexible substrate that can be bent, and the display element is configured to be at least bendable and displayable in a curved state, and includes the imaging element, the display element, and the control circuit layer. Integrated
An electronic circuit module for an image pickup apparatus.   The electronic circuit module for an imaging apparatus according to claim 1, wherein the imaging element is configured by a CCD element or a CMOS element. The electronic circuit module for an imaging apparatus according to claim 1 , wherein the multilayer substrate includes at least an analog circuit layer and a digital circuit layer . The camera apparatus containing the electronic circuit module for imaging devices of any one of Claim 1 thru | or 3 .

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