JP2007243550A - Electronic apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an inexpensive electronic apparatus which is miniaturized by reducing the height of a camera module projected from the surface of a printed wiring board and eliminates the necessity of components constituting a socket or the like. <P>SOLUTION: The electronic apparatus is provided with: a lens frame into which a lens is inserted; an image sensor for converting an optical image formed through the lens into an electric signal and outputting an image signal; a flexible printed board electrically connected to the image sensor and formed so as to be extended from the lens frame to the outside; a camera module insertion hole pierced from the surface up to the rear to load the camera module; and a printed wiring board provided with a plurality of electronic components on both surfaces. The camera module is loaded into the camera module insertion hole so as to be projected from the printed wiring board on both upper and lower surfaces and the flexible printed board is mounted on the printed wiring board so as to be projected from the side face of the camera module to the outside and directly connected to a connection terminal. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an electronic device that needs to be reduced in size and thickness, such as a mobile phone or a mobile terminal provided with a camera module.

  The mobile phone includes a printed wiring board, and electronic components such as a camera module, a liquid crystal display, and other semiconductor elements are attached to the front and back surfaces of the printed wiring board. However, a component having a high height, such as an electronic device mounted with a printed wiring board on which the electronic component including the camera module is mounted, is an obstacle to making the mobile phone thinner.

  That is, when a camera module, which is generally considered to be higher than other electronic components, is directly mounted on one main surface of the printed wiring board, the thickness of the camera module, the thickness of the printed wiring board, The total thickness of the electronic components mounted on the other main surface of the printed wiring board is the thickness of the electronic device. Furthermore, in many mobile phones, the liquid crystal display for main display, the electronic device, and the liquid crystal display for sub display are stacked, so that parts inserted into the mobile phone have a greater thickness. It becomes.

  Therefore, a socket frame for mounting an electronic component such as a camera module is passed through an opening in which a socket insertion hole is opened through on the front and back of the printed wiring board, and a part of the socket frame protrudes to the back side, thereby There has been proposed an electronic component that realizes a reduction in thickness while suppressing the total height of the electronic component (see, for example, Patent Document 1).

  The configuration of an electronic device equipped with this conventional socket will be described. FIG. 4 is a cross-sectional view showing an electronic apparatus having a conventional socket.

  As shown in FIG. 4, a plurality of electronic components 7 are mounted on both the front and back surfaces of the printed wiring board 6, and a socket frame 31 passes through an opening that penetrates the front and back surfaces. A socket provided on the inner surface of the socket frame 31. The connection terminal 34 is electrically connected to the printed wiring board 6. The camera module 21 is electrically connected to a lens barrel 22 for inserting a lens, a support substrate 24 for fixing an image sensor (not shown), an image sensor frame 23 for enclosing the image sensor, and the image sensor. And a wiring board 32 having an electrode pattern.

  A camera module 21 is mounted inside the socket frame 31, and an electrode pattern provided on a wiring board 32 provided below the camera module 21 and a camera provided on the bottom of the socket frame 31 and electrically connected to a socket connection terminal. The connection terminal 33 is electrically connected. Thus, the camera module 21 is loaded into an opening provided in the printed wiring board 6, and both the upper end surface and the lower end surface of the camera module 21 are provided so as to protrude from the printed wiring board 6. Therefore, the height of this conventional electronic component can be substantially the same as that of the camera module 21, the socket frame 31, the camera connection terminal 33, and the wiring board 32. It can be made thinner than the ones.

Japanese Patent Laying-Open No. 2005-276626 (page 4-6, FIG. 2)

  However, in the conventional technique as described above, since the camera module 21 is electrically connected and fixed to the printed wiring board 6 through the socket frame 31, the space of the socket frame 31 is particularly large. Furthermore, a camera connection terminal 33 for connection to the camera module 21 is provided at the bottom of the socket frame 31 as well as a wiring board 32 for connection to the electrodes provided in the socket frame 31 at the lower part of the camera module 21. I had to. The socket frame 31, the wiring board 32, and the camera connection terminal 33 hinder the reduction of the height of the electronic device, and as a result, hinder the thinning of the mobile phone.

  Further, the presence of the socket frame 31, the wiring board 32, and the camera connection terminal 33 contributes to an increase in cost in manufacturing a conventional electronic device loaded with the camera module 21.

  Therefore, the present invention solves the above-mentioned problems and eliminates the need for a socket frame, a camera connection terminal, and a wiring board, which have been essential in the conventional configuration, and realizes space and cost reduction accordingly. An object of the present invention is to provide an electronic device that reduces the manufacturing cost while reducing the height by projecting from one side of the printed wiring board to effectively use the space on the front and back sides of the printed wiring board. And

  In order to solve the above-described problems and achieve the object, the electronic device of the present invention basically adopts the following configuration.

  An electronic apparatus according to the present invention includes a lens frame that interpolates a lens, an image sensor that is mounted integrally with the lens frame, converts an optical image formed through the lens into an electrical signal, and outputs an image signal. A camera module having a flexible printed circuit board electrically connected to the image sensor and extending from the lens frame to the outside, an opening through which the camera module is loaded, and openings on both sides of the camera module. A printed wiring board having a plurality of electronic components, and the camera module is mounted in an opening so that both an upper end surface and a lower end surface protrude from the printed wiring board. Projected outward from the side of the module and bent along the outer wall of the lens frame. And it is characterized in that it is connected to.

  According to the above invention, the camera module is directly passed through the opening provided in the printed circuit board, and the flexible printed circuit board on which the image sensor is mounted is directly connected to the printed circuit board. A member such as a socket frame or a wiring board is not necessary, and the protrusion height on the front and back sides from the printed wiring board can be minimized with a minimum area.

  In the electronic apparatus according to the present invention, the lens frame described above includes a lens barrel that interpolates the lens and a support substrate that supports and fixes the image sensor, and the flexible printed circuit board includes the lens barrel and the support substrate. It protrudes toward the outside of the lens frame from between.

  In the electronic device according to the present invention, the lens frame described above has an image sensor frame including an image sensor between the lens barrel and the support substrate, and the flexible printed circuit board includes the support substrate and the image sensor frame. It protrudes toward the outside of the lens frame from between.

  According to the above invention, since the flexible printed circuit board on which the image sensor is mounted protrudes from the lens frame and extends along the outer wall of the lens frame, the conventional configuration is used for connection to the printed circuit board. As described above, it is possible to connect the image sensor and the printed wiring board without interposing a wiring board or connection terminals.

  In the electronic device according to the present invention, the flexible printed circuit board described above is provided to protrude outside the lens frame from two directions in a plane perpendicular to the optical axis of the lens inserted in the lens frame. The image sensor frame is fixed to the printed wiring board at a position different from the two directions.

  According to the above invention, the camera module can be easily fixed to the printed wiring board at a position that does not interfere with the flexible printed board protruding from the camera module. Moreover, according to the said invention, the additional member for fixing a camera module becomes unnecessary.

  According to the electronic device of the present invention, it is possible to reduce the height of one surface and reduce the thickness of the electronic device with a small number of parts and a minimum area. In addition, according to the electronic device of the present invention, the number of components can be reduced, so that a device with reduced manufacturing cost can be easily manufactured.

  Exemplary embodiments of an electronic apparatus according to the present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 is a cross-sectional view illustrating an electronic apparatus including the camera module according to the first embodiment.

  As shown in FIG. 1, the printed wiring board 6 in the electronic apparatus of the present invention has openings 14 penetrating the front and back as in the conventional configuration, and a plurality of electronic components 7 are mounted on both sides of the board. Yes.

  Further, the camera module 1 converts a lens barrel 2 into which a lens (not shown) is inserted and an optical image formed through the lens into an electrical signal and outputs an image signal. A flexible printed circuit board 5 (hereinafter referred to as FPC 5) for inputting a signal for controlling the image sensor while outputting an image signal externally connected to the sensor and the image sensor. And a lens image sensor frame 3 covering the image sensor, and a support member 4 for fixedly arranging the image sensor. And this camera module 1 is arrange | positioned in the state which passed the opening part 14 provided in the printed wiring board 6, and the upper end surface and lower end surface of the camera module 1 protruded from the front and back both main surfaces of the printed wiring board 6. . The lens barrel 2, the image sensor frame 3, and the support member 4 correspond to the lens frame 10 in the electronic apparatus of the present invention.

  The FPC 5 electrically connected to the image sensor protrudes from the side surface of the lens frame 10, bends toward the upper side of the paper along the outer wall of the lens barrel 2, and further, near the lower surface of the printed wiring board 6. It is bent so as to be parallel to the substrate 6 and is electrically connected to an electrode pattern (not shown) provided on the lower surface of the printed wiring board 6. Connection between the electrode pattern provided on the printed wiring board 6 and the FPC 5 is simple and highly reliable by hot pressing through an ACF (anisotropic conductive seal).

The electronic apparatus of the present invention configured as described above has a socket frame 31 or the like shown in FIG. 4 for inserting the camera module 1 into the opening 14 provided in the printed wiring board 6 as in the conventional configuration. Since the camera module 1 and the printed wiring board 6 are electrically connected without providing the wiring board 32 and the camera connection terminal 33, the number of parts such as a socket frame in the conventional configuration can be reduced. In addition, a highly reliable electronic device can be obtained with a simple electrical connection. In addition, since the number of parts can be reduced as compared with the conventional configuration, a thinner electronic device can be easily manufactured.

  In the above description, the lens frame 10 includes the lens barrel 2, the image sensor frame 3, and the support substrate 4, and the image sensor frame 3 and the support substrate 4 sandwich the FPC 5 on which the image sensor is mounted. However, the electronic apparatus of the present invention is not limited to this, and the lens frame 10 is configured by only the lens barrel 2 and the support substrate 4 according to the design matters of the camera module 1, and the lens barrel Even when the FPC 5 is sandwiched between the support substrate 4 and the support substrate 4, the same effect as the above configuration can be obtained.

  Next, details of the configuration of the camera module will be described with reference to FIG. FIG. 2 is a cross-sectional view showing the configuration of the camera module 1 provided in the electronic apparatus of the present invention.

  One or more lenses 9 are incorporated in the lens barrel 2 constituting the camera module 1, and the lens barrel 2 is supported by the image sensor frame 3.

  The image sensor 7 is directly flip-chip mounted on the FPC 5 having the electrode pattern 8 on the surface, and the FPC 5 and the image sensor 7 are sandwiched between the image sensor frame 3 and the support member 4.

  The distance between the lens barrel 2 and the image sensor frame 3 is adjusted so that the optical image condensed by the lens 9 is formed on the image sensor 7, and the image sensor 7 based on the formed optical image. Thus, the image signal converted into an electric signal is taken out through the electrode pattern 8 in the FPC 5.

  In the present embodiment, a lens barrel 2 in which four lenses 9 are inserted, an image sensor frame 3, a lens frame 10 including a support substrate 4, an image sensor 7 having 3 million pixels, The camera module 1 composed of the FPC 5 was produced with a height from the upper end surface to the lower end surface of 6 mm and a thickness of the printed wiring board 6 of 0.5 mm. By using the camera module 1 and the printed wiring board 6 and attaching the camera module 1 to each side of the printed wiring board 6 by 2.75 mm, the electronic device having a total thickness of 6 mm could be obtained. Also, by incorporating the camera module 1 having a total thickness of 6 mm, an ultra-thin mobile phone could be realized.

  Next, a method for fixing the lens frame 10 and the printed wiring board 6 described above will be described. FIG. 3 is a view showing a fixing means for the camera module and the printed wiring board in the electronic apparatus of the present invention. This drawing is a cross-sectional view of FIG. 1 cut in a direction perpendicular to the paper surface.

As shown in FIG. 3, the image sensor frame 3 constituting the camera module 1 is provided with a fixing member 13 having a length sufficient to overlap the lower surface of the printed wiring board 6. As shown in this drawing, the fixing member 13 is provided at a position different from the FPC 5 in a plane perpendicular to the optical axis of the lens inserted in the lens barrel 2. In this manner, the fixing member 13 is provided on the side surface of the image sensor frame 3 and is brought into contact with the lower surface of the printed wiring board 6 so that the fixing member 13 and the printed wiring board 6 are fixed with an adhesive material (not shown). The optical axis of the lens 9 in the camera module 1 and the printed wiring board 6 can be easily aligned and fixed securely. Further, the fixing of the fixing member 13 to the printed wiring board 6 not only easily aligns and securely fixes the two members, but also has a function of reducing stress on the FPC 5 due to the weight of the camera module 1. Have.

  In FIG. 1, the connection between the FPC 5 and the printed wiring board 6 is not limited to the means using the fixing member 13, but may be connected by screws, anisotropic conductive rubber, soldering, or connectors. Absent. In the above description, the fixing unit 13 is fixed on the lower surface of the printed wiring board 6. However, the fixing unit 13 may be fixed on the upper surface of the printed wiring board 6.

  The electronic device according to the present invention is a technique that can be applied to all electronic devices equipped with a camera module, and in particular, a digital camera module, an electronic device equipped with a movie camera module, a car, etc., which are mounted on a mobile phone It is suitable for an electronic device equipped with a camera module that is mounted on the camera and used for a rear confirmation monitor, an electronic device equipped with a camera module for an endoscope, and the like.

It is sectional drawing which shows an electronic device provided with the camera module which concerns on this invention. It is sectional drawing which shows the camera module which concerns on this invention. It is sectional drawing which shows the fixing means of the camera module which concerns on this invention. It is sectional drawing which shows the electronic device provided with the conventional socket frame.

Explanation of symbols

1 Camera module
2 Lens barrel 3 Image sensor frame 4 Support member 5 Flexible printed circuit board (FPC)
6 Printed Circuit Board 7 Image Sensor 8 Electrode Pattern 9 Lens 10 Lens Frame 13 Fixing Member 14 Opening

Claims (4)

A lens frame that interpolates a lens, an image sensor that is mounted integrally with the lens frame, converts an optical image formed through the lens into an electrical signal, and outputs an image signal; and the image sensor includes: A camera module having a flexible printed circuit board mounted and extended from the lens frame to the outside;
An opening for penetrating the front and back for loading the camera module, and a printed wiring board having a plurality of electronic components on both sides,
The camera module is loaded in the opening so that both the upper end surface and the lower end surface protrude from the printed wiring board,
The flexible printed circuit board protrudes outward from the side surface of the camera module and is bent along the outer wall of the lens frame, and is directly connected to a connection terminal provided on the printed circuit board. Electronic equipment characterized by The lens frame includes a lens barrel that interpolates the lens, and a support substrate that supports and fixes the image sensor,
The electronic apparatus according to claim 1, wherein the flexible printed circuit board is provided so as to protrude toward the outside of the lens frame from between the lens barrel and the support substrate. The lens frame has an image sensor frame containing an image sensor between the lens barrel and the support substrate,
The electronic device according to claim 2, wherein the flexible printed circuit board is provided so as to protrude toward the outside of the lens frame from between the support substrate and the image sensor frame. The flexible printed circuit board is provided to project toward the outside of the lens frame from two directions in a plane perpendicular to the optical axis of the lens inserted in the lens frame,
The electronic apparatus according to claim 3, wherein the image sensor frame is fixed to the printed wiring board at a position different from the two directions.

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