JP2012068178A - Device for detecting acceleration and angular acceleration - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a low profile and small device for detecting acceleration and angular acceleration having higher vibration resistance while being stably mounted on a mounting board without causing an angular shift and positional shift.SOLUTION: The device 8 for detecting acceleration and angular acceleration includes a semiconductor element 1 for detecting the acceleration and angular acceleration, a plurality of terminals 2 connected to the semiconductor element 1, and a packaged body 4 formed by integrally molding a part of the plurality of terminals 2 and the semiconductor element 1. The plurality of terminals 2 are aligned along one side of the packaged body 4. A length dimension L2 of the packaged body 4 in a direction perpendicular to the direction along the one side is shorter than a length dimension L2 in the direction along the one side.

Description

  The present invention relates to an acceleration and angular velocity detection device, and is particularly suitable for application to a vehicle-mounted acceleration and angular velocity detection device that requires vibration resistance, mounting stability, and the like.

  In recent years, development of sensors that detect various physical quantities such as pressure, acceleration, and angular velocity has been accelerated. Physical quantity sensors are often sensors that convert and detect physical quantities such as angular velocity and acceleration into electrical signals.

  For example, in the angular velocity sensor, vibration type, rotation type, gas type, and optical type sensors have been developed. In particular, in recent years, for the purpose of improving mass productivity and downsizing, development of vibration type and rotational type angular velocity sensors using silicon microfabrication technology has become mainstream.

  The vibration-type angular velocity sensor is a sensor that vibrates a vibrating body at a predetermined resonance frequency and detects a displacement of the vibrating body accompanying external angular velocity application as an electrical signal.

  As described above, many sensors using silicon microfabrication technology detect displacement of a structure included in a semiconductor element for detecting each physical quantity.

  Therefore, when the sensor is assembled to the mounting substrate, if an angle shift or a position shift occurs, the sensor detects the shift amount as a displacement of the structure of the semiconductor element. It becomes an error and reduces the reliability of the sensor.

  Therefore, it is indispensable for a sensor using a silicon microfabrication technique to have a structure that can be stably mounted on a mounting substrate so as not to cause an angular shift or a positional shift.

  Further, when such a detection device is mounted on an automobile, it is indispensable to have a highly durable mounting structure so that it can be mounted in a severe environment such as an engine room. In particular, it is very important to have a mounting structure that has durability of the solder connection portion at the connection portion between the sensor and the mounting substrate and resistance to vibration generated when the vehicle travels.

  Therefore, in Patent Document 1, an auxiliary terminal is provided on the sensor body, and the terminal is pulled by the surface tension of the solder at the time of mounting and has a structure that can be assembled at an ideal position. It has a structure that can suppress the occurrence of misalignment. In Patent Document 2, an external connection terminal is provided at the end of a relay board provided in the sensor body so that the sensor and the outside such as a mounting board can be connected to stabilize vibration resistance. It has a structure that can be achieved.

JP 2009-231775 A JP 2008-139048 A

  In the mounting structure of the vehicle motion sensor described in Patent Literature 1, since the surface tension of the solder melted at the time of mounting is used, a sensor having a slightly large weight that cannot be pulled by the surface tension, Depending on the shape of the sensor, such as a sensor whose length of the side different from the side where the leads are arranged is very small, it may not be applicable. Further, in the mounting structure of the vibration type gyro sensor described in Patent Document 2, an external connection terminal is provided at the end of the sensor and is connected to the outside of a mounting board or the like without using a lead wire. It is difficult to ensure the durability and reliability due to application of thermal stress. In addition, when it is necessary to mount the vibration element perpendicularly to the control board, it is necessary to route the wiring member in a complicated manner, which increases the size of the sensor, resulting in a high-profile structure with respect to the control board. Therefore, it is difficult to stably mount the control board.

  An object of the present invention is to provide an acceleration and angular velocity detection device that can be stably mounted on a mounting substrate so as not to cause angular deviation or positional deviation, has high vibration resistance, and has a low profile and a small size. There is.

  In an acceleration and angular velocity detection device comprising a semiconductor element for detecting acceleration and angular velocity, a plurality of terminals connected to the semiconductor element, and a package body in which a part of the terminal and the semiconductor element are integrally molded, The plurality of terminals are arranged along one side of the package body, and a length dimension of the package body in a direction perpendicular to the direction along the one side is shorter than a length dimension in the direction along the one side. Configured.

  According to the present embodiment, there is provided a low-profile, small-sized acceleration and angular velocity detection device that can be stably mounted on a mounting board so as not to cause an angular deviation or a positional deviation, and has high vibration resistance. Can be provided.

1 is a side perspective view showing a mounting structure when an acceleration and angular velocity detection device according to the present invention is mounted on an ECU board. It is the perspective view which showed the mounting structure at the time of seeing the mounting structure of FIG. 1 from upper direction. It is the perspective view which showed the mounting structure at the time of seeing the mounting structure of FIG. 1 from upper direction. FIG. 2 is a perspective view showing the mounting structure when the mounting structure of FIG. 1 is viewed from the ECU board side. It is the side view which showed the mounting structure at the time of mounting the acceleration and angular velocity detection apparatus by this invention on an ECU board | substrate. It is the top view which showed the mounting structure at the time of mounting the acceleration and angular velocity detection apparatus by this invention on an ECU board | substrate. It is the enlarged top view which showed the connection part at the time of mounting the acceleration and angular velocity detection apparatus by this invention in ECU board | substrate. It is the top view which showed the mounting structure at the time of mounting on an ECU board | substrate, without providing the holding terminal of the acceleration and angular velocity detection apparatus by this invention. It is the top view which showed the mounting structure at the time of mounting on an ECU board | substrate, without providing the holding terminal of the acceleration and angular velocity detection apparatus by this invention. It is the top view which showed the mounting structure at the time of mounting the acceleration and angular velocity detection apparatus by this invention on ECU board | substrate. It is a structural schematic diagram when the acceleration and angular velocity detection device according to the present invention is mounted in a brake control unit such as an automobile. It is a structural schematic diagram when the acceleration and angular velocity detection device according to the present invention is mounted in a brake control unit such as an automobile. FIG. 3 is a perspective side view when the brake control unit 13 equipped with the acceleration and angular velocity detection device 8 according to the present invention is mounted on an automobile 26. FIG. 3 is a transparent top view when a brake control control unit 13 equipped with an acceleration and angular velocity detection device 8 according to the present invention is mounted on an automobile 26.

  Examples according to the present invention will be described below. In this embodiment, a case where an acceleration and angular velocity detection device is mounted on an ECU board used for vehicle control and the like will be described.

  FIG. 1 is a side perspective view showing a mounting structure when an acceleration and angular velocity detection device 8 according to the present invention is mounted on an ECU board 7. 2 and 3 are perspective views showing the mounting structure when the mounting structure of FIG. 1 is viewed from above. FIG. 4 is a perspective view showing the mounting structure when the mounting structure of FIG. 1 is viewed from the ECU board 7 side. FIG. 5 is a side view showing a mounting structure when the acceleration and angular velocity detection device 8 according to the present invention is mounted on the ECU board 7.

  As shown in FIGS. 1 and 2, an acceleration and angular velocity detection device 8 is mounted on an ECU board 7 used for vehicle control and the like.

  The acceleration and angular velocity detection device 8 includes a semiconductor element 1 that detects acceleration and angular velocity, an input / output lead terminal 2 that is electrically connected to the semiconductor element 1 using a metal wire 3 (for example, an Au wire), The input / output lead terminal 2 includes a package body 4 in which a part of the input / output lead terminal 2 and the semiconductor element 1 are integrally molded, and the input / output land 6 provided on the ECU board 7 is soldered to the input / output land 6. The input / output lead terminals 2 extend out of the package body 4 only from the first surface 4a of the package body 4 facing the ECU board 7, and are used for input / output of the semiconductor element 1. In the vicinity of the first side 1a close to the lead terminal 2, a plurality of pads 9 arranged along the first side 1a and electrically connected to the input / output lead terminal 2 are provided. For output The package terminal 4 is electrically connected to the card terminal 2 using a metal wire 3 (for example, an Au wire) to reduce the mounting area required for connecting the metal wire 3. The length L2 in the longitudinal direction of the surfaces 4b and 4d perpendicular to the surface 4a (the direction from the first surface 4a toward the surface 4c opposite to the first surface 4a) is the length of the first surface 4a. It is configured to be shorter than the length L1 in the direction (the direction in which the input / output lead terminals 2 are aligned (arranged) and from the surface 4b toward the surface 4d).

  In the present embodiment, the package body 4 including the semiconductor element 1 is supported and fixed to the ECU board 7 via a terminal group constituted by the input / output lead terminals 2, and all of the terminals constituting the terminal group are arranged. The terminals are drawn out of the package body 4 from the first surface 4a. For this reason, all the terminals constituting the terminal group are arranged along the first surface 4a. This means that all terminals constituting the terminal group are arranged along the side along the longitudinal direction of the first surface 4a. Here, in the terminals constituting the terminal group, in addition to the input / output lead terminal 2 described above, when a holding terminal 10 described later is provided, the holding terminal 10 is included.

  By adopting such a configuration, even when it is necessary to configure the flat semiconductor element 1 so that the plate surface is perpendicular to the first surface 4 a of the package body 4, the height direction with respect to the ECU substrate 7 Therefore, the acceleration and angular velocity detection device 8 can be provided as a small package body 4 with a low profile.

  As shown in FIG. 3, in the acceleration and angular velocity detection device 8 according to the present invention, the acceleration detection element 24 that detects only the acceleration and the angular velocity detection element 25 that detects only the angular velocity are separate, and each is integrated. It may be provided in the package body 4 molded in the above.

  The terminals constituting the terminal group are arranged along the first surface 4a, or arranged along the side along the longitudinal direction of the first surface 4a. Can be installed.

  Further, as shown in FIG. 4, there are a plurality of input / output lead terminals 2, and the first surface 4 a of the package body 4 is extended from the mutually offset position to the outside of the package body 4, so that Thus, it can be mounted more stably, and has a high vibration resistance that can suppress a swinging phenomenon or the like due to the vibration applied to the ECU board 7 as shown in FIG. It may be structured.

  Further, the input / output lead terminal 2 is drawn out of the package body 4 from the surfaces 4e and 4f contacting the surfaces 4a, 4b, 4c and 4d, and then extended to the first surface 4a side. Also good. However, in this case, there is a possibility that the dimension in the thickness direction of the package body 4 (a direction perpendicular to the longitudinal direction of the first surface 4a) increases, or the number of times the input / output lead terminal 2 is bent increases.

  FIG. 6 is a top view showing a mounting structure when the acceleration and angular velocity detection device 8 according to the present invention is mounted on the ECU board 7.

  As shown in FIG. 6, the acceleration and angular velocity detection device 8 according to the present invention includes, for example, a power supply terminal, a GND terminal, a sensor signal output terminal, etc. The input / output lead terminal 2 electrically connected to the semiconductor element 1 by the metal wire 3 is provided. The input / output lead terminal 2 is provided at the border portion of the package body 4. The semiconductor device 1 is provided with a holding terminal 10 that does not need to be electrically connected. In this embodiment, the holding terminals 10 are arranged at both ends in the longitudinal direction of the first surface 4a, and are arranged so as to form a pair in a direction perpendicular to the longitudinal direction of the first surface 4a. If such mechanical strength is not required, a total of two holding terminals 10 may be arranged on the diagonal of the first surface 4a. Furthermore, it is possible to use one holding terminal 10, in which case the width direction dimension and the thickness direction dimension of the holding terminal 10 are devised, or the positional relationship with the input / output lead terminal 2 is devised. Thus, the support strength can be increased.

  On the mounting surface of the ECU board 7 on which the acceleration and angular velocity detection device 8 according to the present invention is mounted, the respective terminals are electrically connected to the input / output lead terminals 2 and the holding terminals 10 by soldering or the like. In order to enable mechanical connection, an input / output land 11 connected to the wiring pattern 18 of the ECU board 4 is provided at a position corresponding to the input / output lead terminal 2. At corresponding positions, holding lands 12 that are not connected to the wiring pattern 18 of the ECU board 7 or are connected to a location that is not related to input / output and performance of the sensor such as the GND wiring pattern 19 are provided. Yes.

  FIG. 7 is an enlarged top view showing a connection portion when the acceleration and angular velocity detection device 8 according to the present invention is mounted on the ECU board 7.

  As shown in FIGS. 7A and 7B, the holding terminal width dimension 22 is designed to be larger than the input / output lead terminal width dimension 20, but the thickness is the same. Since a single metal plate (for example, 42 alloy plate) can be punched out by pressing or the like, it can be processed at low cost, and processing accuracy (parallelism, flatness, etc.) can be easily secured. It is configured.

  When the input / output lands 11 are provided on the ECU board 7 and the like and electrically connected with solder or the like, as shown in FIG. 7A, the input / output land width dimension is used to ensure high connection reliability. 21 is larger than the input / output lead terminal width dimension 20 to be connected, but the holding terminal 10 of the acceleration / angular velocity detection device 8 of the present invention secures connection reliability as much as the input / output lead terminal 2. Since there is no need, as shown in FIG. 7B, the holding land width dimension 23 for fixing the holding terminal 10 is substantially the same as that of the holding terminal 10. For this reason, when the acceleration and angular velocity detection device 8 of the present invention is mounted on the ECU board 7, the holding terminals 10 can be overlapped with the holding lands 12 and fixed with the solder 5 or the like. The angular deviation and the positional deviation of the detection device 8 can be reduced and mounted on a mounting board such as the ECU board 7. It is desirable that the input / output land width dimension 21 that needs to ensure connection reliability is larger than the input / output lead terminal width dimension 20 so that high connection reliability can be ensured.

  8 and 9 are top views showing a mounting structure when the acceleration and angular velocity detection device 8 is mounted on the ECU board 7 without the holding terminal 10.

  As shown in FIG. 8, when the holding land 10 is not provided with the holding terminal 10 and the input / output lead terminal 2 is arranged at the center of the package body 4, When the acceleration / angular velocity detection device 8 is mounted on the ECU board 7, there is a difference between the width of the input / output land 11 and the width of the input / output lead terminal 2.

  As shown in FIG. 9, by arranging the input / output lead terminal 2 up to the border part of the package body 4 (near the longitudinal end of the first surface 4a), the angle is more than the central part. Although the displacement and the positional displacement can be reduced somewhat, like the acceleration and angular velocity detection device 8 of the present invention, the rectangular package body 4 in which the first surface 4a of the package body 4 facing the ECU board 7 is rectangular. The input / output lead terminal 2 and the input / output land 11 at the end of the package body 4 are electrically connected by the difference in thermal expansion coefficient between the ECU board 7, the package body 4, and the input / output lead terminal 2. It is difficult to ensure high connection reliability because stress such as strain concentrates on the solder 5 that is connected to the target and solder cracks are likely to occur.

  FIG. 10 is a top view showing a mounting structure when the acceleration and angular velocity detection device 8 according to the present invention is mounted on the ECU board 7.

  As shown in FIG. 10, the holding terminal 10 of the acceleration and angular velocity detection device 8 of the present invention can not only reduce angular deviation and positional deviation, but also is provided at the center of the first surface of the package body 4. The terminal 10 for holding and the land for holding are provided by the difference in thermal expansion coefficient between the ECU board 7, the package body 4, and the holding terminal 10. 12 has a structure in which stress such as strain is concentrated on the solder 5 that mechanically connects 12 and solder cracks 17 are likely to occur. For this reason, the input / output lead terminals 2 and the input / output lands 11 at the center of the package body 4 are electrically connected to the solder 5, and stress such as strain is difficult to concentrate and solder cracks 17 are generated. The connection between the input / output lead terminals 2 and the input / output lands 11 is configured to ensure high connection reliability. Since the connection between the holding terminal 10 and the holding land 12 does not require high connection reliability, even if a solder crack 17 or the like occurs, the characteristics of the acceleration and angular velocity detection device 8 of the present invention are affected. There is no configuration.

  FIG. 11 and FIG. 12 are schematic structural diagrams when the acceleration and angular velocity detection device 8 according to the present invention is mounted in a brake control control unit 13 such as an automobile.

  As shown in FIG. 11, the control unit 13 for brake control is provided with an ECU board 7 on which an electronic component 15 is mounted on a control unit 14, and a unit cover whose mounting surface is made of a mold resin or the like. 16 is often a covering structure. Therefore, for example, when the acceleration and angular velocity detection device 8 of the present invention is mounted on the mounting surface of the ECU board 7, the package body 4 is larger in height than the mounted electronic component 15 so that the package Since the body 4 and the unit cover 16 come into contact with each other and the mounting surface of the ECU board 7 cannot be covered, it may be necessary to increase the size of the brake control control unit 13.

  In such a case, as shown in FIG. 12, two opposing surfaces perpendicular to the first surface 4a of the package body 4 (in this embodiment, a surface substantially parallel to the ECU substrate 7 and located on the ECU substrate 7 side). The input / output lead terminals 2 and the holding terminals 10 are arranged in parallel to the longitudinal sides 4g and 4h of 4e and 4f, and the ECU board 7 has a size that allows a part of the package body 4 to be inserted. The board hole 7a is provided, and a part of the package body 4 is inserted into the board hole 7a so that the input / output lead terminal 2 and the holding terminal 10 are electrically and mechanically connected to the ECU board 7. It is good to. Thereby, the height dimension when the acceleration and angular velocity detection device 8 is mounted on the ECU board 7 is reduced, the contact between the package body 4 and the unit cover 16 is avoided, and the size of the brake control control unit 13 is not increased. The acceleration and angular velocity detection device 8 can be mounted.

  In this configuration, the package body 4 including the semiconductor element 1 is supported and fixed to the ECU board 7 via a terminal group (which may include the holding terminals 10) including the input / output lead terminals 2. All terminals constituting the terminal group are drawn out of the package body 4 from the surface 4e and the surface 4f. At this time, all the terminals constituting the terminal group are substantially parallel to the ECU board 7 and along the side along the longitudinal direction of the first face 4a which is the face on the ECU board 7 side or the first face 4a. Will be arranged.

  FIG. 13 is a transparent side view when the brake control unit 13 equipped with the acceleration and angular velocity detection device 8 according to the present invention is mounted on an automobile 26. FIG. 14 is a transparent top view when the brake control unit 13 equipped with the acceleration and angular velocity detection device 8 according to the present invention is mounted on an automobile 26.

  As shown in FIG. 13, the brake control control unit 13 uses a fixing jig 28 in an engine room 27 that is often on the front side of the automobile 26, not in the compartment 29 or the trunk room 30 of the automobile 26. The acceleration and angular velocity detection device 8 is provided in the brake control control unit 13 and is arranged so as to be perpendicular to the floor surface of the automobile 26. It is mounted on. Various parts are arranged in the engine room 27 of the automobile 26, and it is often very difficult to secure a space for mounting new parts. Therefore, it is very important and necessary to mount the acceleration and angular velocity detector 8 on the brake control unit 13 without increasing the size of the brake control unit 13.

  As shown in FIG. 14, the acceleration and angular velocity detection device 8 is provided in the brake control control unit 13 mounted on the automobile 26, and is disposed so as to be perpendicular to the floor surface of the automobile 26. It is mounted on the ECU board 7 and used to measure an applied acceleration 32 applied in the front-rear and left-right directions of the automobile 26 and an applied angular velocity 33 applied in the rotational direction of the automobile 26. The measurement result is used to detect the traveling state of the automobile 26, and by controlling the braking force applied to the four tires 31 according to the traveling state (mainly in the case of a dangerous traveling state), It is possible to maintain a stable running posture of the automobile 26.

DESCRIPTION OF SYMBOLS 1 Semiconductor element 2 Input / output lead terminal 3 Metal wire 4 Package body 5 Solder 6, 11 Input / output land 7 ECU board 8 Acceleration and angular velocity detection device 9 Pad 10 Holding terminal 12 Holding land 13 Brake control unit 14 Control unit 15 Electronic component 16 Unit cover 17 Solder crack 18 Wiring pattern 19 GND wiring pattern 20 Input / output lead terminal width dimension 21 Input / output land width dimension 22 Holding terminal width dimension 23 Holding land width dimension 24 Acceleration detecting element 25 Angular velocity detection element 26 Automobile 27 Engine room 28 Fixing jig 29 Car compartment 30 Trunk room 31 Tire 32 Applied acceleration 33 Applied angular velocity

Claims (9)

In an acceleration and angular velocity detection device comprising a semiconductor element for detecting acceleration and angular velocity, a plurality of terminals connected to the semiconductor element, and a package body in which a part of the terminal and the semiconductor element are integrally molded,
The plurality of terminals are arranged along one side of the package body, and a length dimension of the package body in a direction perpendicular to the direction along the one side is shorter than a length dimension in the direction along the one side. An acceleration and angular velocity detection device characterized by comprising the following. The acceleration and angular velocity detection device according to claim 1,
All of the plurality of terminals are pulled out of the package body from the first surface facing the other substrate when the package body is fixed to the other substrate,
The acceleration and angular velocity detection device, wherein the one side is a side along a longitudinal direction of the first surface. The acceleration and angular velocity detection device according to claim 2,
An acceleration and angular velocity detection device, wherein the semiconductor element is configured to be perpendicular to the first surface. The acceleration and angular velocity detection device according to claim 2 or 3,
The acceleration and angular velocity detection device according to claim 1, wherein the terminal is drawn out of the package body from a position offset from each other on the first surface. The acceleration and angular velocity detection device according to any one of claims 2 to 4,
The terminals include a terminal connected to the semiconductor element and a terminal not connected to the semiconductor element, and the terminal connected to the semiconductor element is disposed near the center of the first surface. The acceleration and angular velocity detection device is characterized in that a terminal not connected to the semiconductor element is arranged at a border part rather than a terminal connected to the semiconductor element. The acceleration and angular velocity detection device according to claim 5,
Terminals connected to the semiconductor element are electrically and mechanically connected using solder and lands connected to the wiring pattern of the other substrate, and terminals not connected to the semiconductor element are connected to the other substrate. An acceleration and angular velocity detection device characterized by being electrically and mechanically connected using solder and lands that are not connected to a wiring pattern. The acceleration and angular velocity detection device according to claim 6,
An acceleration and angular velocity detection apparatus, wherein a width dimension of a terminal not connected to the semiconductor element is larger than a width dimension of a terminal connected to the semiconductor element. The acceleration and angular velocity detection device according to claim 1,
The package body has a first surface that is substantially parallel to the other substrate and includes the one side when the package body is fixed to the other substrate;
A terminal connected to the semiconductor element and a terminal not connected to the semiconductor element are led out of the package body from two surfaces perpendicular to the first surface, and with respect to the one side Arranged in parallel,
A part of the package body is inserted into a substrate hole formed in the other substrate, and a terminal connected to the semiconductor element and a terminal not connected to the semiconductor element are electrically and mechanically connected to the other substrate. An acceleration and angular velocity detection device characterized by being connected. A vehicle motion control device that controls a braking force of a vehicle based on a signal from the acceleration and angular velocity detection device according to any one of claims 1 to 8.

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