JP2008288518A - Mounting structure for electronic component module on small-sized electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To secure the supporting strength and securing the conductivity of a member for mounting a camera module that is passed into a hole of a circuit substrate for thinning. <P>SOLUTION: This mounting structure of a camera module is for use in small-sized electronic equipment wherein the camera module 3 is passed into a hole 21 formed at a circuit substrate 2, and the camera module 3 is mounted to a metal chassis 1. Concretely, the camera module 3 has a primary substrate 31 projecting laterally to the camera 30, and a secondary substrate 4 is mounted to the lateral projection of the camera 30 of the primary substrate 31. Further, in a camera module mounting place 11 of the metal chassis 1, there is formed a recess 12 that corresponds to the lateral projection of the primary substrate 31. To the secondary substrate 4, DSP5 is mounted and a flexible substrate 6 is mounted that is connected to the circuit substrate 2. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a structure for mounting an electronic component module such as a camera in a portable electronic device.

For example, as known from Patent Document 1, a camera in which an optical structure is disposed on an element substrate on which a solid-state image sensor is mounted, and a lens for introducing external light into the solid-state image sensor is disposed at the center of the optical structure. The module is mounted on an electronic device.
If such a camera module is placed directly on a circuit board of a small electronic device, it is not suitable for thinning.

Therefore, for example, as described in the embodiment of Patent Document 2, in a camera module in which a camera IC is mounted and a lens is incorporated in a ceramic substrate and a flexible cable is connected, the ceramic substrate is used as a portable electronic device. There is known a structure that is housed in a camera mounting portion by a recess formed in the device main body. In this structure, the camera module is inserted into a hole formed in the circuit board of the device body from the drawing.
In paragraph 0015 of Patent Document 2, there is a description that the bottom surface and the side wall of the camera mounting portion are subjected to conductive plating for the purpose of obtaining an electromagnetic shielding effect.
Further, Patent Document 2 discloses a structure in which a buffer member provided so as to wrap the ceramic substrate of the camera module is fitted in a hole formed in the main substrate on the apparatus main body side as a conventional example.

  Further, for example, as described in paragraph 0020 and FIG. 4 of Patent Document 3, there is known a structure in which a camera module is arranged in a notch provided in a circuit board of a mobile phone terminal.

As described above, by passing the camera module through the hole or notch formed in the circuit board of the device main body, the camera module mounting portion can be reduced in thickness, and as a result, the device main body can be reduced in size and thickness.
JP 2005-175971 A JP 2004-172790 A Japanese Patent Laying-Open No. 2005-157107 (paragraph 0020, FIG. 4)

  However, in order to ensure the support strength of the member that mounts the camera module that has been passed through the hole (including the cutout) of the circuit board in order to reduce the thickness, for example, a reinforcing rib or a stainless steel plate is required. For example, the casing shape of the device main body is increased in size and complexity.

  An object of the present invention is to secure a supporting strength and a conductivity as a member for mounting an electronic component module that is passed through a hole of a circuit board in order to reduce the thickness.

  In order to solve the above problems, an invention according to claim 1 is an electronic component module mounting structure in a small electronic device, wherein the electronic component module is passed through a hole formed in a circuit board, and the electronic component module is made of metal. It is mounted on a case.

  Invention of Claim 2 is an electronic component module mounting structure in the small electronic device of Claim 1, Comprising: The said electronic component module is equipped with the 1st board | substrate which protrudes to the side of the electronic component, This A second substrate is mounted on a side protrusion of the electronic component of the first substrate.

  The invention according to claim 3 is the electronic component module mounting structure in the small electronic device according to claim 1 or 2, wherein the electronic component module mounting portion of the metal case is arranged on the side of the first substrate. A concave step corresponding to the side protrusion is formed.

  According to a fourth aspect of the present invention, there is provided an electronic component module mounting structure in the small electronic device according to any one of the first to third aspects, wherein the electronic component module is a camera module.

  Invention of Claim 5 is an electronic component module mounting structure in the small electronic device of Claim 4, Comprising: While a DSP (digital signal processor) is mounted in the said 2nd board | substrate, the said A flexible board connected to the circuit board is mounted.

  According to the present invention, the strength of the circuit board and the metal case used for the shield are used for mounting the electronic component module that is passed through the hole of the circuit board in order to reduce the thickness. Can be secured.

Hereinafter, the best mode for carrying out the present invention will be described in detail with reference to the drawings.
FIG. 1 shows a configuration of an embodiment in which the present invention is applied to a mobile phone as a small electronic device. 1 is a metal case, 2 is a circuit board, 3 is a camera module (electronic component module), and 4 is a second board. 5 is a DSP, and 6 is a flexible substrate.

  As shown in the figure, the metal case 1 is made of, for example, magnesium, which is used for the strength and shielding of the circuit board 2 by screwing the circuit board 2. A square hole 21 through which the electronic component module, in the illustrated example, the camera module 3 is passed, is formed on one end side of the circuit board 2, and a connector 23 is mounted in the vicinity thereof.

  The camera module 3 includes a first substrate 31 and a camera 30 that includes a solid-state imaging device, a lens, a lens barrel, a case, and the like. The first substrate 31 has a portion protruding to the side of the camera 30, and the connector 32 and other electronic components are mounted on the side protruding portion. The square hole 21 of the circuit board 2 has a shape that allows the first board 31 of the camera module 3 to pass through.

  On the second substrate 4, a DSP 5 is mounted and a flexible substrate 6 is connected and provided. A connector 42 (see FIG. 3) and many other electronic components are mounted under the second substrate 4.

  A camera module mounting portion 11 is formed on one end side of the metal case 1. That is, this camera module mounting portion 11 corresponds to the first substrate 31 of the camera module 3 that passes through the hole 21 of the circuit board 2, and the portion corresponding to the side protrusion of the first substrate 31 with respect to the camera 30 The recessed step 12 that is lower by about 0.2 mm to 0.3 mm, for example, than the mounting surface is formed.

In the above, the circuit board 2 is fixed to the metal case 1 with screws.
The lower surface of the first substrate 31 of the camera module 3 is a ground surface. The connector 42 below the second substrate 4 is connected to the connector 32 on the first substrate 31, and the second substrate 4 having the flexible substrate 6 mounted with the DSP 5 is integrated with the camera module 3.

  In this way, the camera module 3 in which the DSP 5 is mounted and the second substrate 4 including the flexible substrate 6 is integrated, the first substrate 31 is passed through the square hole 21 of the circuit substrate 2 and the camera module mounting portion of the metal case 1. 11 Overlay. Thereafter, the flexible board 6 extending from the second board 4 is connected to the connector 23 on the circuit board 2.

  The above assembled state is shown in cross section in FIGS. 2 and 3, and 7 and 8 are external cases. That is, the outer cases 7 and 8 constitute a casing, and are joined together by screwing the metal case 1 inside.

  As described above, according to the mounting structure of the camera module 3 of the embodiment, the first substrate 31 of the camera module 3 is mounted on the camera module mounting portion 11 of the metal case 1 by being passed through the square hole 21 of the circuit board 2. Thus, the mounting portion of the camera module 2 can be reduced in thickness, which can contribute to the reduction in size and thickness of the device main body.

In order to reduce the thickness, the camera module 3 that is passed through the rectangular hole 21 of the circuit board 2 is mounted with a simple structure by using the existing metal case 1 used for the strength and shielding of the circuit board 2. Support strength and conductivity can be reasonably ensured.
In addition, since the ground surface under the first substrate 31 of the camera module 3 is superimposed on the metal surface of the camera module mounting portion 11 of the metal case 1, the camera drive circuit can be securely grounded.

  Further, the camera module 3 is integrated by mounting the DSP 5 and the second substrate 4 including the flexible substrate 6 on the side protrusions of the camera 30 of the first substrate 31 by connecting the connectors 32 and 42. As an arrangement in which the DSP 5 and the flexible substrate 6 are separated from the camera 30 and the first substrate 31, the DSP 5 and the flexible substrate 6 are not easily affected by noise.

Further, since the concave step portion 12 corresponding to the side protruding portion of the first substrate 31 of the camera module 3 is formed in the camera module mounting portion 11 of the metal case 1, for example, a mobile phone falls, When an impact is input to the side surfaces of the outer cases 7 and 8, it is possible to effectively avoid the impact from being transmitted from the metal case 1 to the first substrate 31 of the camera module 3.
That is, if the camera module mounting portion 11 of the metal case 1 is in the same plane, slight distortion occurs in the metal case 1 due to impact from the side, and the first substrate 31 is cracked due to slight distortion of the camera module mounting portion 11. There is a concern that this may occur.
In this respect, the camera module mounting portion 11 of the metal case 1 is slightly distorted in the concave step portion 12 due to the impact from the side, so that the concern that the first substrate 31 is cracked may be solved. it can.

In the above embodiment, the present invention is applied to a mobile phone. However, the present invention is not limited to this, and other small electronic devices including portable devices such as PDAs, notebook computers, wearable computers, and electronic notebooks. It may be.
Moreover, although it was set as the camera module in embodiment, if it is an electronic component which requires a ground on an attachment surface, another electronic component module may be sufficient.
Furthermore, the shape of the hole formed in the circuit board is arbitrary, for example, the hole includes a notch, and the material of the metal case is not limited to magnesium and is arbitrary.
In addition, it is needless to say that other specific detailed structures can be appropriately changed.

BRIEF DESCRIPTION OF THE DRAWINGS The structure of one Embodiment which applied this invention to the mobile telephone as a small electronic device is shown, It is a disassembled perspective view of a metal case, a circuit board, an electronic component module, etc. It is sectional drawing in the assembly | attachment state along the arrow AA of FIG. It is sectional drawing along the arrow BB line of FIG.

Explanation of symbols

1 Metal case 11 Camera module mounting part (electronic component module mounting part)
12 Concave Step 2 Circuit Board 21 Hole 23 Connector 3 Camera Module (Electronic Component Module)
30 Camera (electronic parts)
31 First board 32 Connector 4 Second board 42 Connector 5 DSP
6 Flexible substrate 7 External case 8 External case

Claims (5)

Pass the electronic component module through the hole formed in the circuit board,
An electronic component module mounting structure in a small electronic device, wherein the electronic component module is mounted on a metal case. The electronic component module includes a first substrate protruding to the side of the electronic component,
2. The electronic component module mounting structure in a small electronic device according to claim 1, wherein a second substrate is mounted on a side projecting portion of the electronic component on the first substrate.   The electron in the small electronic device according to claim 1, wherein a concave step portion corresponding to the side protruding portion of the first substrate is formed in a mounting portion of the electronic component module of the metal case. Component module mounting structure.   The electronic component module mounting structure in a small electronic device according to any one of claims 1 to 3, wherein the electronic component module is a camera module.   5. The electronic device according to claim 4, wherein a DSP (digital signal processor) is mounted on the second substrate, and a flexible substrate connected to the circuit substrate is mounted. Component module mounting structure.

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