CN206575675U - Integral type dual camera circuit substrate - Google Patents
Integral type dual camera circuit substrate Download PDFInfo
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- CN206575675U CN206575675U CN201720276261.5U CN201720276261U CN206575675U CN 206575675 U CN206575675 U CN 206575675U CN 201720276261 U CN201720276261 U CN 201720276261U CN 206575675 U CN206575675 U CN 206575675U
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- hardboard
- section
- soft board
- copper
- dual camera
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Abstract
Integral type dual camera circuit substrate that a kind of cost is low, manufacture craft is simple and quality is high and preparation method thereof.It uses the rigid-flexible laminated construction of hardboard+FPC+hardboard sandwich style, its outer likeness in form is "T"-shaped, respectively chip section, interlude and wiring section, chip section is set up in parallel two microscope bases being mounted on optical chip, chip section is constituted by multilayer hardboard and soft board are stacked, solid copper part on each soft board and hardboard upper surface of this section is designed to grid copper, make to be less than 20% between the residual copper rate on the positive and negative of respective panels, the flatness of this section of plate face is ensured with this, namely ensure that the axiality requirement of two microscope bases.Its processing procedure is shorter, without entering the secondary assembling between andante and plate again, and line signal is transmitted in soft board, and the loss of signal is few, and anti-electromagnetic interference capability is strong, and with entering to make, the running algorithm of dual camera is more directly efficient.The circuit substrate, every price is at 5 yuan or so.
Description
Technical field
The utility model is related to the manufacture field of the wiring board of the digital products such as mobile phone, flat board, computer, more particularly to double
Camera circuit substrate and preparation method thereof.
Background technology
Camera is increasingly widely used in each electronic product, and especially the industry such as mobile phone, flat board is quick
Development, has driven the rapid growth of camera industry.Currently, good and bad turned into smart mobile phone one of the performance of camera is important
Attraction, each manufacturer constantly releases the camera of performance upgrade version in new architecture, to lift the competitiveness of product.
Compared with traditional single camera, dual camera (referred to as double to take the photograph) has in image quality, imaging capability, treatment of details
The lifting of matter.Each current mobile phone vendor commercial city is actively being taken the photograph for new product configuration is double, and market is undergoing a ripple camera by one
Become many tides.In two flagship mobile phone of Huawei's issue in 2016, Huawei P9, honor V8 rear camera are all by a change
Into two.The iPhone7Plus that autumn in this year is released also is equipped with dual camera camera model.The vivoX9 that will be issued will be double
Take the photograph with being also an invention on preposition camera lens, it appear that effect based on " first shoot and focus again " " large aperture mould
Formula " blurs effect there is provided more remarkable auto heterodyne.This perhaps can turn into following manufacturer apply flexibly one of dual camera technology it is new
Direction.Rearmounted double take the photograph has become industry mainstream configuration, and it has not only been lifted in imaging image quality, it is often more important that be mobile phone
Photography provides more playing methods and supported.
Dual camera is not that simple 1+1 (is not so simply that simple conventional method installs two cameras i.e.
Can), it is related to algorithm, encapsulation, the influence of Dutch treatment journey.It is reported that, the axiality requirement of IPhone 7plus dual camera
Within 0.35 μm.Domestic module factory temporarily can not also manufacture the double of such high-precision alignment request and take the photograph circuit substrate at present.
Axiality herein refers to：Two microscope bases (including camera and camera bracket) on circuit substrate
The distance between central axis deviates the difference of setpoint distance.I other words, when the central axis of two microscope bases is parallel to each other,
Radial distance and the absolute value of the difference of setpoint distance therebetween is less than 0.35 μm；When the central axis of two microscope bases is not parallel
When, along the ultimate range or the difference of minimum range and designed distance between two upper corresponding live parts of central axial direction
Absolute value be less than 0.35 μm.
Axiality is excessive, i.e., when more than 0.35 μm, and camera can be made to produce image blur after assembling, and focusing is inaccurate to ask
Topic.The reason for causing double photography/videography head axialities excessive substantially has following two：
1) caused by rigging error
In the case where the circuit substrate for installing microscope base is in same plane, although the central axis of two microscope bases is flat
It is capable, but because installation site deviation it is excessive caused by.
2) two installation microscope base circuit substrate is not in same level and bends therebetween
When circuit substrate warpage occurs because of processing reason, the central axis for two microscope bases being installed on it is not parallel, when
When warpage is serious, i.e., axiality can be caused to increase.
The market status：The dual camera circuit substrate of main flow has following two structures in the market：
1) dual camera of IPhone 7plus formulas, it uses two single photographing module split-type structurals (referring to Fig. 1 institutes
Show), belong to simple 1+1 cooked modes.The dual camera circuit substrate processing of the structure is relatively simple, but in shooting head mould
Group assembling stages operating difficulty is larger, and main cause is to be difficult to be adjusted to same plane, i.e. axiality by dual camera to be difficult to adjust
It is whole to arrive prescribed limit.
2) dual camera (such as Huawei P9 is double to be taken the photograph) of Huawei's formula, it is that two microscope bases are mounted on to integrally formed circuit substrate
On, it is integral type structure.
Shown in Figure 2, at present, the double circuit substrates taken the photograph of Huawei's formula are determined by a FPC with a Japan-funded enterprises
The Metal Substrate pcb board (pcb board is the hard plate for being pasted with resolution element) of system is constituted, and a side of FPC is set
Two microscope bases (referred to as the side be chip section) for being fitted on optical chip, (the referred to as side is connects to another side placing connectors
Line segment), afterwards, then that by hot pressing the Metal Substrate pcb board is pressed together on into that opposite face of microscope base described in chip Duan Shangyu is flexible
On wiring board, the flatness of chip section FPC is ensured with this, so that the axiality of two cameras is effectively controlled
In prescribed limit.The double circuit substrate processing taken the photograph of Huawei's formula are more complicated (to be mainly reflected in the processing of Metal Substrate pcb board, at present
Only Japan-funded enterprises sell the product), but later stage module packaging is then relatively simple.Though the structure is good, the Metal Substrate pcb board
Costliness, every price is at 20 yuans or so.And Metal Substrate pcb board and FPC will be subjected to secondary assembling
(to be press-fited by viscose glue), this not only increased procedure but also production efficiency and yield have all declined.
So, research and develop the dual camera electricity that a kind of manufacture craft is simple, cost is low, conveniently encapsulates and meets axiality requirement
Base board is very urgent.
Utility model content
The technical problems to be solved in the utility model is to provide the one that a kind of cost is low, manufacture craft is simple and quality is high
Formula dual camera circuit substrate and preparation method thereof.
In order to solve the above-mentioned technical problem, the technical solution adopted in the utility model is：
Integral type dual camera circuit substrate of the present utility model, including be arranged on the substrate one end and contain two microscope bases
Chip section, be arranged on the substrate other end wiring section and between chip section and wiring section between serving conduct and be it is soft
Property wiring board interlude, each microscope base be mounted on chip section on an optical chip connect, wiring section placing connectors,
The corresponding substrate of chip section is hardboard, soft board and the stacked crimping of hardboard and at least three layers of MULTILAYER COMPOSITE being structure as a whole
Plate, the corresponding substrate of wiring section is soft board or is that soft board is stacked the Rigid Flex crimped with hardboard；The chip section
In every layer of hardboard and/or soft board front on remaining copper residual copper rate with its reverse side more than copper residual copper rate difference absolute value it is small
In 20%.
The copper in gridding that the remaining copper-clad is included after conductive wires and etching is remained.
Soft board in the chip section is two layers.
The soft board of the wiring section is single or double non-gel flexible copper-clad plate.
On the corresponding substrate of the wiring section reinforcement steel disc is pasted with the another side opposite with the connector.
The preparation method of integral type dual camera circuit substrate of the present utility model, comprises the following steps：
1) tailor according to a conventional method and meet double at least one soft boards and hardboard for taking the photograph circuit substrate shape of integral type；
2) routinely technique is processed to the soft board and hardboard respectively；
3) the DES etching work procedures in soft board and hardboard processing procedure, by wiring board design professional software GENESIS to add
Residual copper rate comprising the remaining copper including normal distribution and solid copper on the soft board and hardboard tow sides of work is analyzed, and foundation should
Remaining copper on each surface for solid copper is carried out gridding processing or grid copper is adjusted by analysis result；
4) difference of the residual copper rate of the remaining copper on correspondence soft board or hardboard tow sides is arranged within 20%；
5) hardboard conventionally made is crimped together the formula of being integrally formed pair with soft board by design requirement again
Camera circuit substrate.
In method of the present utility model, being shaped as the soft board is "T"-shaped, and "T"-shaped " horizontal stroke " portion is chip section, " perpendicular " portion
Divide the wiring section of interlude and end；The shape of the hardboard is adapted to chip section and is rectangle.
In the utility model method, the soft board is two layers, and the hardboard is two layers, the circuit substrate of chip section by
Constituted in the way of hardboard, soft board, soft board and hardboard are sequentially stacked.
In the utility model method, the soft board is single or double non-gel flexible copper-clad plate.
Integral type dual camera substrate in the utility model, using stiff board material+flexible circuitry plate material+stiff board material
The rigid-flexible laminated construction of sandwich style.Its outer likeness in form is "T"-shaped, respectively chip section, interlude and wiring section, and chip section is set side by side
Put two microscope bases being mounted on optical chip, chip section is constituted by multilayer hardboard and soft board are stacked, each soft board of this section and
Solid copper part on hardboard upper surface is designed to grid copper, makes to be less than 20% between the residual copper rate on the positive and negative of respective panels,
The flatness of this section of plate face is ensured with this, namely ensure that the axiality requirement of two microscope bases.Interlude uses FPC,
To meet the bending requirement of finished product installation.Wiring section be installs connector region, can by demanding terminal, select stiff board material or
Flexible circuitry plate material.Dual camera circuit substrate integrative-structure of the present utility model, processing procedure is shorter, without entering andante and plate again
Between secondary assembling, and line signal be by be folded in the soft board between top layer hardboard and bottom hardboard transmit, signal damage
Mistake is few, and anti-electromagnetic interference capability is strong, and with entering to make, the running algorithm of dual camera is more directly efficient.Integrative-structure of the present utility model
Dual camera circuit substrate, every price is at 5 yuan or so.
Brief description of the drawings
Fig. 1, which is that prior art IPhone 7plus formulas are double, takes the photograph combination diagram.
Fig. 2, which is that prior art Huawei formula is double, takes the photograph combination diagram.
Fig. 3 takes the photograph circuit substrate schematic diagram for of the present utility model pair.
Fig. 4 is the enlarged diagram of solid copper on each soft board or hardboard in chip of the prior art section.
The grid copper enlarged diagram that Fig. 5 designs for the utility model.
Embodiment
As shown in Fig. 3,4,5, the profile of integral type dual camera circuit substrate of the present utility model is in " T " font, and it is wrapped
Include the wiring section of the chip section, the interlude in vertical part stage casing and vertical part bottom of " T " font transverse part.
1st, the chip section is at least three layers of composite plate, is followed successively by the hardboard of top layer, the hardboard of bottom and is folded in top
Soft board between layer and bottom, wherein, the soft board between the hardboard of top layer, the hardboard of bottom and top, bottom uses heat pressing process
It is crimped together.The utility model preferably soft board be FPC (be single or double non-gel flexible copper-clad plate,
Similarly hereinafter) and be at least two layers, in order to improve its electromagnetism interference, metal is set in the hardboard of top layer and the hardboard outer surface of bottom
Screen layer, all control signals are transmitted by middle soft board layer.
Two optical chips are pasted with side by side on the top layer hardboard of chip section, are pasted again on each optical chip afterwards
Fill a microscope base.
Hardboard and soft board on to chip section are carried out during hot pressing, in copper foil, fiberboard and soft board thereon
Insulated substrate can produce incorgruous distortion or deformation [copper foil (including the normal distribution on especially each laminate because of coefficient of thermal expansion difference
Accumulated with the remaining copper face of residual) skewness when], this incorgruous distortion or deformation can cause chip section out-of-flatness, make chip section
On two optical chips be in different planes on, thereby result in the microscope base being mounted on two optical chips and coaxially spend
Greatly, ultimately result in camera and produce image blur, the problem of focusing is inaccurate after assembling.Therefore, in order to solve the problem, this reality
With the residual copper rate of remaining copper on every layer of hardboard in the new section by the chip and/or the front of soft board with its reverse side more than copper it is residual
The absolute value of the difference of copper rate is adjusted to be less than 20%, and it adopts with the following method to realize：
1) tailor according to a conventional method and meet the double soft boards and hardboard for taking the photograph circuit substrate shape of integral type.
The FPC of core material is first made, then adjusts by customer requirement the impedance of HW High Way.
2) routinely technique is processed to the soft board and hardboard respectively.
3) the DES etching work procedures in soft board and hardboard processing procedure, by wiring board design professional software GENESIS to add
Residual copper rate comprising the remaining copper including normal distribution and solid copper on the soft board and hardboard tow sides of work is analyzed, and foundation should
Solid copper foil on each surface for full slice system is carried out gridding processing by analysis result.
4) by the residual copper rate of the remaining copper on correspondence soft board or hardboard tow sides, (residual copper rate refers in certain area, copper
Accumulation area account for the ratio of the region gross area, wherein, the accumulation area of copper includes the residual of normal distribution part and gridding
Stay copper part) difference be arranged within 20%.
Then the heavy copper of through hole, copper facing and cover layer (cover-lay) layer is done by normal FPC flow to fit, it is necessary
When using anti-welding (solder mask) make pad at open a window, formed core material.Then corona or plasma-based (plasma) are passed through
Etc. mode, cover layer surface is roughened, the adhesion with stiff board material is increased.
5) hardboard made according to conventional method and soft board are crimped together into the formula of being integrally formed pair by design requirement again to take the photograph
As head circuit substrate.
The above method can make the metallic copper on the tow sides of soft board or hardboard be evenly distributed and close to equivalent, so,
When carrying out hot pressing to hardboard and soft board, although copper foil layer is different from the thermal coefficient of expansion of described fibrous layer or insulated substrate,
But the uniform nearly equivalent distribution on the positive and negative of correspondence soft board or hardboard because of metallic copper, therefore, for corresponding soft board or hardboard
For, uniform force in the cooling procedure of its positive and negative after hot-pressing hardly produces incorgruous distortion or deformation, so that, make
Chip section is smooth, even if two microscope bases thereon are in same level, it is ensured that the axiality of two optical chips is in rule
In fixed scope.
The difference of residual copper rate and the flatness of respective panels of each hardboard of core segment area or soft board positive and negative have large effect,
The residual copper rate of each layer of dual camera is tried one's best before circuit etching and is adjusted to difference minimum, to reduce the warpage of the plate face in increasing layer
(i.e. foregoing incorgruous distortion or deformation), makes chip section substrate smooth, with this, it is ensured that obtain the imaging definition of dual camera.
Annotation：Layer increasing method refers to the idea gradually pressed using conventional multilayer plate, based on double-deck or four laminates
Outside the plate of core substrate, gradually increase insulating barrier and conductor layer, conductor line is manufactured on the insulating layer, and increasing layer is used as using micropore
Between interconnection, and the blind hole (Blind Hole) connected between the level of part and buried via hole (Buried Hole) can save lower through-hole and exist
Space-consuming in plate face, makes limited outer layer area to try one's best to connect up and soldering part.
Rigid Flex device weld or Reflow Soldering temperature be up to 260 DEG C -300 DEG C high temperature (duration be several seconds
By more than ten seconds), and general Tg pcb board material is more than 130 degree, medium Tg is approximately more than 150 degree, and high Tg is generally higher than 170 degree of (bases
Plate is melted the critical-temperature for rubbery state liquid by solid-state, is Tg points i.e. fusing point.Tg points are that base material keeps rigid maximum temperature
(℃).That is common PCB substrate material at high temperature, can produce the phenomenons such as softening, deformation, melting).
Rigid Flex substrate can cause Rigid Flex substrate because of the factor such as wiring and residual copper face product, welding resistance design
Each layer convergent force is inconsistent, and the stress intensity of plate face is not equal, so, at high temperature, scleroma plywood substrate is easily deformed, stuck up
It is bent.If flatness warpage is excessive after device welding, the optical axis of lens group and the off-centring of image sensor increase, and influence mould
The quality of picture is constituted, if the influence of large aperture is more serious.Therefore, the deformation warpage of integral type dual camera substrate is very big
Ground have impact on the quality stability of integral type dual camera camera module.
2nd, the interlude is at least double-layer flexible wiring board, and it is that chip section is electrically connected with wiring section that it, which is acted on,.
3rd, the wiring Duan Kewei double-layer flexible wiring boards, or the soft or hard combination that FPC is combined with hardboard
Plate, connector is pasted with wiring section, and the dual camera circuit installed in chip section passes through the connector and external control
Circuit connects.
On the corresponding substrate of the wiring section reinforcement steel disc is pasted with the another side opposite with the connector.
Claims (5)
1. a kind of integral type dual camera circuit substrate, including be arranged on the substrate one end and chip section containing two microscope bases,
The wiring section and serving between chip section and wiring section for being arranged on the substrate other end conduct and are FPC
Interlude, each microscope base connects with an optical chip being mounted in chip section, wiring section placing connectors, and its feature exists
In：The corresponding substrate of chip section is hardboard, soft board and the stacked crimping of hardboard and at least three layers of multilayer being structure as a whole
Composite plate, the corresponding substrate of wiring section is soft board or is that soft board is stacked the Rigid Flex crimped with hardboard；The core
Every layer of hardboard in fragment and/or on the front of soft board the residual copper rate of remaining copper with its reverse side more than copper residual copper rate difference it is absolute
Value is less than 20%.
2. integral type dual camera circuit substrate according to claim 1, it is characterised in that：The remaining copper-clad includes conduction and matched somebody with somebody
The copper in gridding after line and etching is remained.
3. integral type dual camera circuit substrate according to claim 2, it is characterised in that：Soft board in the chip section
For two layers.
4. the integral type dual camera circuit substrate according to any one of claim 1-3, it is characterised in that：It is described to connect
The soft board of line segment is single or double non-gel flexible copper-clad plate.
5. integral type dual camera circuit substrate according to claim 4, it is characterised in that：It is corresponding in wiring section
Reinforcement steel disc is pasted with substrate on the another side opposite with the connector.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720276261.5U CN206575675U (en) | 2017-03-21 | 2017-03-21 | Integral type dual camera circuit substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720276261.5U CN206575675U (en) | 2017-03-21 | 2017-03-21 | Integral type dual camera circuit substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206575675U true CN206575675U (en) | 2017-10-20 |
Family
ID=60055063
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720276261.5U Active CN206575675U (en) | 2017-03-21 | 2017-03-21 | Integral type dual camera circuit substrate |
Country Status (1)
| Country | Link |
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| CN (1) | CN206575675U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106851982A (en) * | 2017-03-21 | 2017-06-13 | 深圳华麟电路技术有限公司 | Integral type dual camera circuit substrate and preparation method thereof |
-
2017
- 2017-03-21 CN CN201720276261.5U patent/CN206575675U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106851982A (en) * | 2017-03-21 | 2017-06-13 | 深圳华麟电路技术有限公司 | Integral type dual camera circuit substrate and preparation method thereof |
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Legal Events
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PP01 | Preservation of patent right |
Effective date of registration: 20221118 Granted publication date: 20171020 |
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| PP01 | Preservation of patent right |