CN105208788A - Method for improving aligning precision of solder masks - Google Patents
Method for improving aligning precision of solder masks Download PDFInfo
- Publication number
- CN105208788A CN105208788A CN201510489855.XA CN201510489855A CN105208788A CN 105208788 A CN105208788 A CN 105208788A CN 201510489855 A CN201510489855 A CN 201510489855A CN 105208788 A CN105208788 A CN 105208788A
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- China
- Prior art keywords
- solder mask
- welding resistance
- exposure
- ink
- time
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/166—Alignment or registration; Control of registration
Abstract
The invention discloses a method for improving the aligning precision of solder masks. The method comprises a first soldering process and a second soldering process. The first soldering process comprises the steps that a1) pre-operation; b1) pre-processing; c1) silk screen of the solder mask; d1) pre-baking; e1) exposure in which an external etching target services as an exposure aligning point and an exposure film is pasted onto the board for exposure; f1) development; and g1) post solidification through which the first solder mask is obtained. The second soldering process comprises the steps that a2) pre-operation; b2) pre-processing; c2) silk screen of the solder mask; d2) pre-baking; e2) exposure in which a target of solder mask window design in the step e1 serves as an exposure aligning point, and an exposure film is pasted onto the board for exposure; f2) development; and g2) post solidification through which the first solder mask is obtained. The aligning diffidence between the first solder mask and the second solder masker is reduced under 25 micron, the yield rate can be improved to 90% or higher from 10-20% in the prior art, the quality of PCB is substantially improved, and the production cost is greatly reduced.
Description
Technical field
The invention belongs to printed circuit board and make field, specifically design a kind of method improving solder mask and solder mask aligning accuracy.
Background technology
PCB (PrintedCircuitBoard), Chinese is printed circuit board, and owing to adopting electron printing to be prepared from, being also called printed circuit board (PCB), is a kind of important electronic unit.Printed circuit board is made up of pad, via hole, solder mask, character layer, copper cash and various element usually; wherein solder mask is structure important on circuit board; it is the mode of being printed by silk-screen; by the figure consistent with egative film that printing ink transfer to wiring board is formed by image transfer; solder mask can play the effect producing bridge joint phenomenon when preventing wave-soldering; improve welding quality, save solder; solder mask is also the permanent protective layer of printed circuit board simultaneously, can play the effects such as protection against the tide, anticorrosion, mildew-resistant and anti-mechanical abrasion.
Portioned product solder mask all needs by repeatedly welding resistance preparation, and in prior art, repeatedly welding resistance process is generally: welding resistance for the first time: front operation → pre-treatment → welding resistance silk-screen (or spraying) → pre-baked → use the rear target exposure → development → Post RDBMS of outer etching; Second time welding resistance: target exposure → development → Post RDBMS after front operation → pre-treatment → welding resistance silk-screen (or spraying) → outer etching of pre-baked → use.Said method all uses the rear target of outer etching in double exposure process, and in actual production, because sheet material harmomegathus causes welding resistance contraposition deviation large after a front welding resistance, thus before causing once with a rear welding resistance contraposition deviation too large (> 35um), in performance or all cannot meet the requirement of user in appearance.
Summary of the invention
For this reason, technical problem to be solved by this invention is that the preparation method of existing solder mask to exist repeatedly in welding resistance process sheet material harmomegathus after a front welding resistance and causes contraposition deviation large, cause twice solder mask contraposition deviation large, thus propose a kind of method improving solder mask and solder mask aligning accuracy.
For solving the problems of the technologies described above, technical scheme of the present invention is:
The invention provides a kind of method improving solder mask and solder mask aligning accuracy, it comprises first time welding resistance and second time welding resistance flow process, wherein, described first time welding resistance comprise the steps:
Operation before a1;
B1 pre-treatment, removes plate face impurity and oxidation;
C1 welding resistance silk-screen ground floor ink;
D1 prebake conditions, makes described ink tentatively harden;
E1 exposes, and adopts outer etching target as exposure aligning point, exposure film is attached on plate face and exposes; Described exposure film need have copper regional location to do corresponding welding resistance to window target producing product edges of boards;
F1 develops, and is washed out by the ink in lightproof area in exposure film described in described step e1;
G1 Post RDBMS, improves described ink pellet surface hardness, obtains the first solder mask;
Described second time welding resistance comprises the steps:
Operation before a2;
B2 pre-treatment, removes plate face impurity and oxidation;
C2 welding resistance silk-screen second layer ink;
D2 prebake conditions, makes described ink tentatively harden;
E2 exposes, and adopts welding resistance in step e1 to window target as exposure aligning point, exposure film is attached on plate face and exposes;
F2 develops, and is washed out by the ink exposed in exposure film lightproof area described in described step e2;
G2 Post RDBMS, improves described ink pellet surface hardness, obtains the second solder mask.
As preferably, the circle of described skin etching target to be diameter that the position of edges of boards in exposure film is offered be 2mm is windowed; Described welding resistance on film target diameter of windowing is 1mm, and described welding resistance target of windowing respectively arranges a pair on the long limit of the described film and minor face.
As preferably, in described first time welding resistance technique, described circle window the band of position first time silk-screen time lid oil processing.
As preferably, in described second time welding resistance technique, to described circle window the band of position second time silk-screen time lid oil processing.
As preferably, in described step c1, described welding resistance ink for screen printing step also can be spraying ink.
As preferably, described exposure is adopt product surface described in UV-irradiation.
As preferably, the position deviation between described first solder mask and described second solder mask is less than 25 μm.
Technique scheme of the present invention has the following advantages compared to existing technology, the method of raising solder mask provided by the invention and solder mask aligning accuracy, the circle that diameter 2mm is offered in edges of boards position on the exposure aligning film when first time welding resistance is windowed as the target of exposure, does lid oil processing when targeting regions welding resistance silk-screen or spraying; Second time welding resistance adopts first time film welding resistance to window target exposure, gear oil processing need be done during second time targeting regions welding resistance silk-screen, the contraposition deviation of welding resistance and second time welding resistance is for the first time made to drop to minimum, success is reduced to first time solder mask within 25 μm with the deviation of second time solder mask spacing, yield can be increased to more than 90% from the 10-20% of prior art, significantly reduces production cost while significantly improving the quality of PCB.
Embodiment
Embodiment
The present embodiment provides a kind of method improving solder mask and solder mask aligning accuracy, and it comprises first time welding resistance and second time welding resistance flow process, wherein, described first time welding resistance comprise the steps:
Operation before a1;
B1 pre-treatment, removes the impurity such as plate face grease, oxide, strengthens the adhesive force in green oil and plate face;
C1 adopts the mode of welding resistance silk-screen or spraying, and described green oil is coated on plate face;
D1 prebake conditions, makes described green oil preliminarily dried harden;
E1 exposes, adopt outer etching target as exposure aligning point, exposure film to be attached on described plate face and described plate face is exposed under ultraviolet light, the circle of described skin etching target to be diameter that the position of edges of boards in exposure film is offered be 2mm is windowed, to window band of position welding resistance silk-screen or spray lid oil processing constantly, also need copper regional location be had to do corresponding diameter be that the welding resistance of 1mm is windowed target producing product edges of boards in described exposure film;
F1 develops, and is washed out by the ink in exposure film lightproof area described in described step e1, exposes copper face;
G1 Post RDBMS, improves described green oil case hardness, strengthens thermal endurance and chemical property, obtains the first solder mask;
Described second time welding resistance comprises the steps:
Operation before a2;
B2 pre-treatment, removes the impurity such as plate face grease, oxide, strengthens the adhesive force in green oil and plate face;
C2 adopts the mode of welding resistance silk-screen, and described green oil is coated on plate face;
D2 prebake conditions, makes described green oil preliminarily dried harden;
E2 exposes, and adopts the target described in described step e1 as exposure aligning point, exposure film to be attached on described plate face and to be exposed under ultraviolet light in described plate face, and described circular windowed regions does gear oil processing when welding resistance silk-screen or spraying;
F2 develops, and is washed out by the green oil in exposure film lightproof area described in described step e2, exposes copper face;
G2 Post RDBMS, improves described green oil case hardness, strengthens thermal endurance and chemical property, obtains the second solder mask.
Described first solder mask obtained after twice welding resistance technique and the position deviation of described second solder mask are less than 25 μm, and yield can be increased to more than 90% from the 10-20% of prior art, significantly reduces production cost while significantly improving the quality of PCB.
Obviously, above-described embodiment is only for clearly example being described, and the restriction not to execution mode.For those of ordinary skill in the field, can also make other changes in different forms on the basis of the above description.Here exhaustive without the need to also giving all execution modes.And thus the apparent change of extending out or variation be still among the protection range of the invention.
Claims (7)
1. improve a method for solder mask and solder mask aligning accuracy, it is characterized in that, comprise first time welding resistance and second time welding resistance flow process, wherein, described first time welding resistance comprise the steps:
Operation before a1;
B1 pre-treatment, removes plate face impurity and oxidation;
C1 welding resistance silk-screen ground floor ink;
D1 prebake conditions, makes described ink tentatively harden;
E1 exposes, and adopts outer etching target as exposure aligning point, exposure film is attached on plate face and exposes, and described exposure film need have copper regional location to do corresponding welding resistance to window target producing product edges of boards;
F1 develops, and is washed out by the ink in lightproof area in exposure film described in described step e1;
G1 Post RDBMS, improves described ink pellet surface hardness, obtains the first solder mask;
Described second time welding resistance comprises the steps:
Operation before a2;
B2 pre-treatment, removes plate face impurity and oxidation;
C2 welding resistance silk-screen second layer ink;
D2 prebake conditions, makes described ink tentatively harden;
E2 exposes, and adopts welding resistance in step e1 to window target as exposure aligning point, exposure film is attached on plate face and exposes;
F2 develops, and is washed out by the ink exposed in exposure film lightproof area described in described step e2;
G2 Post RDBMS, improves described ink pellet surface hardness, obtains the second solder mask.
2. the method for raising solder mask according to claim 1 and solder mask aligning accuracy, is characterized in that, the circle of described skin etching target to be diameter that the position of edges of boards in exposure film is offered be 2mm is windowed; Described welding resistance on film target diameter of windowing is 1mm, and described welding resistance target of windowing respectively arranges a pair on the long limit of the described film and minor face.
3. the method for raising solder mask according to claim 2 and solder mask aligning accuracy, is characterized in that, in described first time welding resistance technique, described circle window the band of position first time silk-screen time lid oil processing.
4. the method for raising solder mask according to claim 3 and solder mask aligning accuracy, is characterized in that, in described second time welding resistance technique, to described circle window the band of position second time silk-screen time lid oil processing.
5. the raising solder mask according to any one of claim 1-4 and the method for solder mask aligning accuracy, is characterized in that, in described step c1, described welding resistance ink for screen printing step also can be spraying ink.
6. the method for raising solder mask according to claim 5 and solder mask aligning accuracy, is characterized in that, described exposure is for adopting product surface described in UV-irradiation.
7. the method for raising solder mask according to claim 6 and solder mask aligning accuracy, is characterized in that, the position deviation between described first solder mask and described second solder mask is less than 25 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510489855.XA CN105208788B (en) | 2015-08-11 | 2015-08-11 | It is a kind of to improve solder mask and the method for solder mask aligning accuracy |
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| CN201510489855.XA CN105208788B (en) | 2015-08-11 | 2015-08-11 | It is a kind of to improve solder mask and the method for solder mask aligning accuracy |
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| CN105208788A true CN105208788A (en) | 2015-12-30 |
| CN105208788B CN105208788B (en) | 2018-04-03 |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107148159A (en) * | 2017-07-20 | 2017-09-08 | 深圳中富电路有限公司 | The method for manufacturing printed substrate |
| CN109298595A (en) * | 2018-11-14 | 2019-02-01 | 大连崇达电路有限公司 | For boring the exposure film of the above welding resistance single layer opening of nozzle aperture 0.8mm |
| CN109511231A (en) * | 2018-12-27 | 2019-03-22 | 深圳市确保电子有限公司 | A kind of anti-short circuit design of IC pad welding resistance |
| CN112087883A (en) * | 2019-06-12 | 2020-12-15 | 群翊工业股份有限公司 | Substrate surface feeding method and substrate surface feeding equipment |
| CN112672533A (en) * | 2020-12-09 | 2021-04-16 | 惠州市特创电子科技股份有限公司 | Circuit board, board body and windowing processing method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008294251A (en) * | 2007-05-25 | 2008-12-04 | Cmk Corp | Printed wiring board and its manufacturing method |
| CN203015278U (en) * | 2012-12-27 | 2013-06-19 | 广州兴森快捷电路科技有限公司 | Printed circuit board used to determine solder resist film contraposition effect quickly |
| CN103200777A (en) * | 2013-04-22 | 2013-07-10 | 景旺电子（深圳）有限公司 | Manufacture method of thick copper plate fine solder resist bridge |
| CN104883818A (en) * | 2014-02-28 | 2015-09-02 | 深圳崇达多层线路板有限公司 | Printed circuit board contraposition method |
-
2015
- 2015-08-11 CN CN201510489855.XA patent/CN105208788B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008294251A (en) * | 2007-05-25 | 2008-12-04 | Cmk Corp | Printed wiring board and its manufacturing method |
| CN203015278U (en) * | 2012-12-27 | 2013-06-19 | 广州兴森快捷电路科技有限公司 | Printed circuit board used to determine solder resist film contraposition effect quickly |
| CN103200777A (en) * | 2013-04-22 | 2013-07-10 | 景旺电子（深圳）有限公司 | Manufacture method of thick copper plate fine solder resist bridge |
| CN104883818A (en) * | 2014-02-28 | 2015-09-02 | 深圳崇达多层线路板有限公司 | Printed circuit board contraposition method |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107148159A (en) * | 2017-07-20 | 2017-09-08 | 深圳中富电路有限公司 | The method for manufacturing printed substrate |
| CN109298595A (en) * | 2018-11-14 | 2019-02-01 | 大连崇达电路有限公司 | For boring the exposure film of the above welding resistance single layer opening of nozzle aperture 0.8mm |
| CN109511231A (en) * | 2018-12-27 | 2019-03-22 | 深圳市确保电子有限公司 | A kind of anti-short circuit design of IC pad welding resistance |
| CN112087883A (en) * | 2019-06-12 | 2020-12-15 | 群翊工业股份有限公司 | Substrate surface feeding method and substrate surface feeding equipment |
| CN112672533A (en) * | 2020-12-09 | 2021-04-16 | 惠州市特创电子科技股份有限公司 | Circuit board, board body and windowing processing method thereof |
| CN112672533B (en) * | 2020-12-09 | 2022-09-09 | 惠州市特创电子科技股份有限公司 | Circuit board, board body and windowing processing method thereof |
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| Publication number | Publication date |
|---|---|
| CN105208788B (en) | 2018-04-03 |
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