CN106304627B - A kind of test pad structure and preparation method thereof - Google Patents

A kind of test pad structure and preparation method thereof Download PDF

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Publication number
CN106304627B
CN106304627B CN201510243240.9A CN201510243240A CN106304627B CN 106304627 B CN106304627 B CN 106304627B CN 201510243240 A CN201510243240 A CN 201510243240A CN 106304627 B CN106304627 B CN 106304627B
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China
Prior art keywords
main body
cover film
fpc
pad main
pad
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CN201510243240.9A
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Chinese (zh)
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CN106304627A (en
Inventor
吕晓丽
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EverDisplay Optronics Shanghai Co Ltd
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EverDisplay Optronics Shanghai Co Ltd
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Priority to CN201510243240.9A priority Critical patent/CN106304627B/en
Publication of CN106304627A publication Critical patent/CN106304627A/en
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/288—Removal of non-metallic coatings, e.g. for repairing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/099—Coating over pads, e.g. solder resist partly over pads

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

The present invention relates to display technology fields, more particularly to a kind of test pad structure and preparation method thereof, the technical solution in the non-single layer area of FPC by preparing a pad main body, the cover film of one layer of such as polyimides, exposed type ink or heat fixed type ink characteristic is covered in pad main body later, and then forms a test pad structure.Green oil windowing is not carried out to testing weld pad in the technical solution, simplifies the design of testing weld pad, saves the time, improves efficiency；Simultaneously because cover film has insulating properties, it can reduce when being assembled to product, testing weld pad and FPC is upper or other metal-back feature contacts bring short-circuit risks, raising yield, the component area space of FPC is also effectively saved to a certain extent, increases and feasibility is assessed to FPC.

Description

A kind of test pad structure and preparation method thereof
Technical field
The present invention relates to display technology fields more particularly to a kind of test pad structure and preparation method thereof.
Background technique
FPC (Flexible Printed Circuit) is also known as flexible circuit board or flexible printed circuit board, has wiring High, light-weight, thickness the is thin feature of density, makes it be widely used in existing life.And in the display of each product In screen connection circuit, it is almost be unable to do without correlation FPC flexible circuit board, this is undivided with its numerous characteristics.
Although FPC have the advantages that it is more, if the pad structure of its end face of fruit or shape-designing are not excellent enough, It will cause very big defect, for example: as shown in figure 3, electrical testing of the engineer to component for convenience in many cases, Currently used way is to carry out testing weld pad to expose copper (Cu) metal, i.e. pad main body 3；So testing weld pad must be put It is placed in the component area (Component Area) 2 of FPC1, as shown in Figure 1, being just avoided that the testing weld pad of assembling Shi Lutong With the metal-back feature contacts on mainboard and cause short circuit, and then can effectively realize to component each on substrate electrical property survey Examination.
Therefore testing weld pad in design, will not only draw the size of pad main body 3, also draw in pad main body 3 The size of green oil windowing 4, is positioned, structure as shown in Figure 2 with the design position to testing weld pad.On processing procedure, it will weld Disc main body 3 is made on trial base 7 to be measured, cover film (Cover layer) 5 avoid pad expose copper metal to substrate 7 into Row covering, is also stacked with copper 6 and another cover film 8, structure as shown in Figure 3 below substrate 7.
But structure as shown in Figure 1, conventional testing weld pad because be arranged inside the component area of FPC, The inner space in component area is occupied to a certain extent, in the limited situation in component area space, conventional testing weld pad Setting position and encapsulation design will be affected.
Therefore, how the direction that an effective technical solution is dedicated to research as those skilled in the art is provided.
Summary of the invention
In view of above-mentioned technical problem, the present invention provides a kind of novel test pad structure and preparation method thereof, the surveys Test weld dish structure is relatively simple, and its design position do not have to limited by FPC component area, can be set except single layer area with From anywhere in outer, the inner space in component area is largely released, while the test pad structure also has reduction Short-circuit risks improve the characteristics of testing yield.
The present invention solves technical solution used by above-mentioned technical problem specifically:
A kind of test pad structure, applied in the electrical testing to FPC, the FPC has non-single layer area, wherein institute Stating test pad structure includes:
Pad main body is set on the non-single layer area of the FPC；
First cover film is partially covered in the upper surface of the pad main body, to utilize the upper table of pad main body exposure Electrical testing is carried out in face of the FPC.
Preferably, above-mentioned test pad structure, wherein the upper surface of first cover film corresponds to the pad main body Position at be provided with label, by the label remove part first cover film, the pad main body is given cruelly Dew.
Preferably, above-mentioned test pad structure, wherein the material of first cover film is isolation material.
Preferably, above-mentioned test pad structure, wherein the isolation material is polyimides, exposed type ink or heat Curable type ink.
Preferably, above-mentioned test pad structure, wherein the FPC includes:
Substrate has upper surface and the lower surface above relative to this；
Copper is set to the lower surface of substrate；And
Second cover film is covered in the copper；
Wherein, the pad main body is arranged on the upper surface of the substrate.
Preferably, above-mentioned test pad structure, wherein further include adhered layer；
The adhered layer is set between the pad main body and first cover film, for pasting the pad main body With first cover film.
Preferably, above-mentioned test pad structure, wherein the adhered layer is AD glue.
A kind of preparation method of test pad structure, applied in the electrical testing to FPC, the FPC has non-single layer Area, wherein the described method includes:
Pad main body is prepared on the non-single layer area of the FPC；
A cover film is prepared on the pad main body, the pad main body is covered；
Module group assembling is carried out using the test pad structure；And
Remove the part cover film the pad main body to be exposed, with by the pad main body to described FPC carries out electrical testing.
Preferably, the preparation method of above-mentioned test pad structure, wherein covered described in being prepared on the pad main body After epiphragma further include:
A label is drawn at the position that the upper surface of the cover film corresponds to the pad main body, and then passes through the mark The note removal part cover film, the pad main body is exposed.
Preferably, the preparation method of above-mentioned test pad structure, wherein covered described in being prepared on the pad main body Before epiphragma further include:
One layer of AD glue is coated on the pad main body；And
Paste the pad main body and the cover film.
Preferably, the preparation method of above-mentioned test pad structure, wherein the cover film is polyimides, exposed type Ink or heat fixed type ink.
The invention discloses a kind of test pad structure and preparation method thereof, which passes through the non-single layer in FPC A pad main body is prepared in area, one layer is covered in pad main body later has such as polyimides, exposed type ink or thermosetting The insulation material layer of type ink characteristics, and then form a test pad structure.Therefore the technical solution has a characteristic that
1, component area space is saved, increases and feasibility is assessed to FPC；
2, simplify the design of testing weld pad, save the time, improve efficiency；
3, it reduces when being assembled to mould group, testing weld pad and FPC is upper or other metal-back feature contacts brings are short-circuit Risk improves yield.
Detailed description of the invention
Upon reading the detailed description of non-limiting embodiments with reference to the following drawings, the present invention and its feature, outer Shape and advantage will become more apparent upon.Identical label indicates identical part in all the attached drawings.Not deliberately proportionally Draw attached drawing, it is preferred that emphasis is show the gist of the present invention.
Fig. 1 is the testing weld pad schematic diagram being placed in FPC in tradition；
Fig. 2 is the schematic diagram for carrying out green oil windowing in tradition to testing weld pad；
Fig. 3 is the structural schematic diagram of testing weld pad in tradition；
Fig. 4 is the schematic diagram for carrying out silk-screen mark in the present invention to testing weld pad；
Fig. 5 is the structural schematic diagram of testing weld pad in the present invention；
Fig. 6 is preparation method flow chart in the present invention.
Specific embodiment
In the following description, a large amount of concrete details are given so as to provide a more thorough understanding of the present invention.So And it is obvious to the skilled person that the present invention may not need one or more of these details and be able to Implement.In other examples, in order to avoid confusion with the present invention, for some technical characteristics well known in the art not into Row description.
In order to thoroughly understand the present invention, detailed step and detailed structure will be proposed in following description, so as to Illustrate technical solution of the present invention.Presently preferred embodiments of the present invention is described in detail as follows, however other than these detailed descriptions, this Invention can also have other embodiments.
To solve because of testing weld pad because being arranged inside the component area of FPC, to cause to occupy first device in the prior art The inner space in part area, in the limited situation in component area space, position and encapsulation design, which is arranged, to be affected Etc. many defects, a kind of test pad structure and preparation method thereof is provided in the embodiment of the present invention, the inventive technique scheme is logical One pad main body of preparation in the non-single layer area of FPC is crossed, covering one layer in pad main body later has such as polyimides, exposes The insulating materials of light type ink or heat fixed type ink characteristic, and then form a test pad structure.Below with reference to specific reality Example is applied technical solution of the present invention is described in detail.
Implement one:
FPC, that is, flexible circuit board or flexible printed circuit board, can specifically divide two regions in FPC, i.e., single layer area and Non- single layer area (two regions are being not shown in the figure, and the non-single layer area includes component area), for single layer area depositing because of wiring layer The pad structure in the present embodiment is arranged in the non-single layer area of FPC.Specifically, structure as shown in Figure 5, test weldering Disk includes pad main body 13, the first cover film (Cover layer) 15.
In the present invention one in optional but non-limiting embodiment, it is preferred that the material of the pad main body 13 is copper (Cu), it is arranged in the non-single layer area of FPC；The material of first cover film 15 is isolation material, and first cover film 15 is then It is covered on the upper surface of pad main body 13.Wherein, after carrying out module group assembling using test pad structure, removal part first is covered Epiphragma is to be exposed pad main body, to carry out electrical testing to FPC by pad main body.Specifically, the first cover film 15 Upper surface correspond to and be provided with label (white silk-screen) 14 at the position of pad main body 13, as shown in figure 4, being removed by the label The first cover film of part 15, pad main body 13 is exposed, later in the electrical testing for carrying out FPC.
In the present invention one in optional but non-limiting embodiment, it is preferred that the first cover film 15 mainly passes through stickup Layer (not shown) is covered on pad main body 13, i.e., adhered layer setting pad main body 13 and the first cover film 15 it Between, for pasting pad main body and the first cover film, wherein the material of the adhered layer is chosen as AD glue.
As shown in figure 5, flexible circuit board is mainly made of substrate 17, copper 16 and the second cover film 18, in which: substrate 17, there is upper surface and the lower surface above relative to this；Copper 16 is arranged on the lower surface of substrate 17；Second covering Film 18 is covered on copper 16, and then forms the second cover film 18, copper 16 and the substrate for stacking gradually setting from the bottom to top 17.Wherein there is the single layer area and non-single layer area, the non-single layer area of the substrate 17 is arranged in pad main body 13 on substrate 17 Portion of upper surface on, in addition, the area of the first cover film 15 be greater than pad main body 13 area and with 17 surface area of substrate It is identical.
In an embodiment of the present invention, the first cover film 15 is in polyimides, exposed type ink or heat fixed type ink It is a kind of.Certainly, those skilled in the art can require to carry out the selection of the first cover film according to specific technique, such as: polyamides is sub- Amine has the characteristics that at low cost, precision is low, when FPC required precision is not high, can be used；Exposed type ink, with cost High, the high feature of precision, is commonly used in the more intensive component area of pad；Heat fixed type ink has the characteristics that at high cost, precision is low, often For in the static bent area of FPC.
Preferably, in an embodiment of the present invention, material of the exposed type ink as the first cover film may be selected.Certainly originally Field technical staff should be understood as that the selection of the first cover film in the embodiment of the present invention is only a preferable selection scheme, In other embodiments, all to use the other materials with polyimides, exposed type ink or heat fixed type ink characteristic not It is detached from material point of the invention.
When carrying out module group assembling by test pad structure, because first cover film 15 on test pad structure surface has There is insulation characterisitic, it is possible to which the risk for avoiding the test pad structure and other metals from being shorted effectively increases test weldering The setting position range of disk, and improve the manufacturing yield of product；On the other hand because the test pad structure does not have green oil to open Window, so the first coating is just covered by the first coating there is no need to avoid copper, testing weld pad on processing procedure, to a certain extent It has saved the preparation time of testing weld pad and has improved efficiency.Certainly, the material according to exposed type ink as the first cover film Product can then be placed under conditions of exposing and be stripped exposed type ink by material, and then by the exposure of the surface of pad, later Electrical analysis can be carried out to product by the testing weld pad.
Embodiment two:
A kind of preparation method of test pad structure is additionally provided in the embodiment of the present invention, as shown in fig. 6, this method is main Implemented based on above-mentioned test pad structure, specifically includes the following steps:
Step S1, pad main body 13 is prepared on the non-single layer area of FPC, the material of the pad main body 13 is copper (Cu).
Step S2, continue to prepare a cover film (the first cover film in corresponding embodiment one on pad main body 13 15), pad main body is covered, and it is (white to draw at the position that the upper surface of cover film corresponds to pad main body a label Color silk-screen) 14, as shown in Figure 4 and Figure 5.Wherein, after carrying out module group assembling using test pad structure, pass through the label removal portion Divide cover film to be exposed pad main body, to carry out electrical testing to FPC by pad main body.
In an embodiment of the present invention, it is preferred that the material of the cover film is polyimides, exposed type ink or heat curing type Any one in ink can carry out optimal selection according to concrete technology demand.
In an embodiment of the present invention, be coated with adhered layer in pad main body, i.e., adhered layer setting pad main body with cover Between epiphragma, for pasting pad main body and cover film, wherein the material of the adhered layer is chosen as AD glue.
In the technical solution of the present invention, because the testing weld pad does not have green oil windowing, cover film is just not required on processing procedure Copper is avoided, testing weld pad is just capped film layer and is covered, and has saved the preparation time of testing weld pad and raising to a certain extent The preparation efficiency of testing weld pad；Simultaneously as the characteristic of coating, can effectively avoid assembling product because of testing weld pad institute Bring short-circuit risks.
In conclusion the technical solution passes through in FPC the invention discloses a kind of test pad structure and preparation method thereof Non- single layer area on prepare a pad main body, later in pad main body cover one layer have as polyimides, exposed type oil The insulating materials of ink or heat fixed type ink characteristic, and then form a test pad structure.Therefore the technical solution has as follows Feature:
1, component area space is saved, increases and feasibility is assessed to FPC；
2, simplify the design of testing weld pad, save the time, improve efficiency；
3, it reduces when being assembled to product, testing weld pad and FPC is upper or other metal-back feature contacts brings are short-circuit Risk improves yield.
It should be appreciated by those skilled in the art that those skilled in the art combine the prior art and above-described embodiment can be real The existing change case, such change case do not affect the essence of the present invention, and it will not be described here.
Presently preferred embodiments of the present invention is described above.It is to be appreciated that the invention is not limited to above-mentioned Particular implementation, devices and structures not described in detail herein should be understood as gives reality with the common mode in this field It applies；Anyone skilled in the art, without departing from the scope of the technical proposal of the invention, all using the disclosure above Methods and technical content many possible changes and modifications are made to technical solution of the present invention, or be revised as equivalent variations etc. Embodiment is imitated, this is not affected the essence of the present invention.Therefore, anything that does not depart from the technical scheme of the invention, foundation Technical spirit of the invention any simple modifications, equivalents, and modifications made to the above embodiment, still fall within the present invention In the range of technical solution protection.

Claims (9)

1. a kind of test pad structure, applied in the electrical testing to FPC, the FPC has non-single layer area, and feature exists In the test pad structure includes:
Pad main body is set on the non-single layer area of the FPC；
First cover film is covered in the upper surface of the pad main body；
The upper surface of first cover film corresponds to and is provided with label at the position of the pad main body, passes through the label and removes Part first cover film, the pad main body is exposed；
Electrical testing is carried out to the FPC using the upper surface of pad main body exposure.
2. test pad structure as described in claim 1, which is characterized in that the material of first cover film is insulation material Matter.
3. test pad structure as claimed in claim 2, which is characterized in that the isolation material is polyimides, exposed type Ink or heat fixed type ink.
4. test pad structure as described in claim 1, which is characterized in that the FPC includes:
Substrate has upper surface and the lower surface relative to the upper surface；
Copper is set to the lower surface of substrate；And
Second cover film is covered in the copper；
Wherein, the pad main body is arranged on the upper surface of the substrate.
5. test pad structure as described in claim 1, which is characterized in that further include adhered layer；
The adhered layer is set between the pad main body and first cover film, for pasting the pad main body and institute State the first cover film.
6. test pad structure as claimed in claim 5, which is characterized in that the adhered layer is AD glue.
7. a kind of preparation method of test pad structure, applied in the electrical testing to FPC, the FPC has non-single layer area, It is characterized in that, which comprises
Pad main body is prepared on the non-single layer area of the FPC；
A cover film is prepared on the pad main body, the pad main body is covered；
Module group assembling is carried out using the test pad structure；
After preparing the cover film on the pad main body further include:
A label is drawn at the position that the upper surface of the cover film corresponds to the pad main body, and then is gone by the label Except the part cover film, the pad main body is exposed；
Electrical testing is carried out to the FPC by the pad main body.
8. the preparation method of test pad structure as claimed in claim 7, which is characterized in that made on the pad main body Before the standby cover film further include:
One layer of AD glue is coated on the pad main body；And
Paste the pad main body and the cover film.
9. the preparation method of test pad structure as claimed in claim 7, which is characterized in that the cover film is that polyamides is sub- Amine, exposed type ink or heat fixed type ink.
CN201510243240.9A 2015-05-13 2015-05-13 A kind of test pad structure and preparation method thereof Active CN106304627B (en)

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CN108495443A (en) * 2018-03-21 2018-09-04 友达光电（苏州）有限公司 Circuit board
CN108925060B (en) * 2018-06-29 2020-12-08 上海创功通讯技术有限公司 Touch screen display module, FPC and manufacturing method thereof

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CN101459155A (en) * 2007-12-12 2009-06-17 三星电子株式会社 Circuit board having bypass pad
CN102065643A (en) * 2009-11-17 2011-05-18 富葵精密组件(深圳)有限公司 Method for making circuit board
CN102934530A (en) * 2010-06-04 2013-02-13 揖斐电株式会社 Method for manufacturing wiring board
CN202262057U (en) * 2011-07-18 2012-05-30 惠州Tcl移动通信有限公司 Breaking-resisting structure of flexible printed circuit (FPC) pad
CN202475939U (en) * 2011-11-24 2012-10-03 惠州Tcl移动通信有限公司 Packaging structure of board-to-board connector
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Address after: 201506, building two, building 100, 1, Jinshan Industrial Road, 208, Shanghai, Jinshan District

Patentee after: Shanghai Hehui optoelectronic Co., Ltd

Address before: 201506, building two, building 100, 1, Jinshan Industrial Road, 208, Shanghai, Jinshan District

Patentee before: EverDisplay Optronics (Shanghai) Ltd.

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